JP2012044199A - Resin sealing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin sealing device which achieves accurate gate breaking while shortening cycle time of the resin sealing device by enabling a molded item to enter the gate break process after being sufficiently cooled.SOLUTION: A resin sealing device includes sealing means 300 for sealing an item to be molded such as a semiconductor chip with resin, and gate breaking means 400 removing unnecessary resin of the molded item which is resin sealed by the sealing means 300. Further, the resin sealing device includes cooling means 100 for cooling the molded item before gate breaking, and transfer means 600 transferring the cooled molded item from the cooling means 100 to the gate breaking means 400.

Description

  The present invention relates to a technical field of a resin sealing device for sealing a semiconductor product with a resin.

  Conventionally, a semiconductor mold apparatus (resin sealing apparatus) 1 shown in FIG. 9 is known (see Patent Document 1).

  The semiconductor molding apparatus 1 includes a molding apparatus 11 for resin-molding a semiconductor chip, a take-out means 25 for taking out a work 19 resin-molded by the forming apparatus 11 from the molding apparatus 11, and a work (molding) taken out by the take-out means 25. Article) 19, a support 27 that receives the support 19, a cooling means 31 that cools the work 19 received by the support 27, and the work 19 is pressed between the support 27 and cooperates with the support 27. Based on a presser means (gate break means) 30 for folding the gate from the work 19, an infrared camera 32 for photographing the work 19 when the work 19 is cooled by the cooling means 31, and an image photographed by the infrared camera 32. And a determination means 33 for determining whether the work 19 is good or bad.

  In the resin sealing device, the molded product resin-sealed in the mold is taken out before being completely cooled (as soon as it is cooled to the extent that it can be taken out from the mold), and prepared for the next sealing. Preparations are made. This is done to improve the cycle time of the apparatus. In addition to the original molded product (package portion) formed around the semiconductor chip, the molded product immediately after sealing includes a cull portion and a runner portion that serve as a resin passage in the sealing process. The gate resin (unnecessary resin) in which the existing resin is cooled and hardened is integrated. Therefore, a process (gate break process) for removing the gate portion resin is provided.

  On the other hand, the molded product immediately after resin sealing (molded product just taken out of the mold) is still at a very high temperature as described above, and a part of the gate part that should be removed when the gate break process is inadvertently performed. Inconveniences such as remaining or a part that should originally remain is removed together with the gate part. This is due to the fact that the resin has not been sufficiently cooled, and can be avoided by sufficient cooling.

  In this respect, also in the semiconductor mold apparatus 1, prior cooling is performed before the gate break process by the cooling means 31 integrally formed with the holding means (portion for performing the gate break process) 30.

JP-A-7-58137

  However, in such a configuration, it is possible to cool the molded product only immediately before entering the gate break process, and the molded product is sufficiently cooled although it is disposed at a position where the gate break can be performed. It is necessary to wait for a reasonable time. This cooling time (the waiting time of the gate break means) directly affects the cycle time of the apparatus, and therefore becomes an impediment to cycle time reduction.

The present invention has been made to solve such a problem, and after sufficiently cooling the molded product, entering the gate break step eliminates the waiting time of the gate break means and cycles the resin sealing device. An object of the present invention is to provide a resin sealing device that enables accurate gate break while reducing time.

  The present invention comprises a sealing means for sealing a molded article such as a semiconductor chip with a resin, and a gate break means for removing unnecessary resin from the molded article resin-sealed by the sealing means, And a cooling means for cooling the molded article before the molded article is gate-breaked, and a conveying means for conveying the cooled molded article from the cooling means to the gate break means. Thus, the said subject is solved by comprising a resin sealing device.

  In this way, the cooling means dedicated to cooling (high cooling effect) is interposed between the sealing means and the gate break means, and is conveyed to the gate break means via the conveyance means, so that the molded product is gate-breaked. It becomes possible to cool the molded product to a degree sufficient for a gate break when it is conveyed to the means. As a result, as soon as the molded article is supplied to the gate break means, the gate break process can be started, and the “cooling time” of the molded article in the gate break means can be excluded from the cycle time controlling factor of the apparatus. In addition, since the gate is broken after being sufficiently cooled, it is possible to prevent the gate from being left and broken.

  In particular, in the case of a sealing device (so-called multi-press type) in which a plurality of sealing means are provided in parallel with respect to a specific gate break means, because of its configuration, one gate break means One after another, molded products are carried. As a result, there is a “waiting time for cooling” in addition to the cooling time. If the present invention is realized by such a multi-press type resin sealing device, cooling can be performed by utilizing this “waiting time for cooling”, and an independent cooling unit (that is, via a conveying unit) is provided. However, this does not affect the direction of extending the cycle time of the apparatus. Furthermore, if the cooling means is configured so that a plurality of molded articles can be cooled at the same time (a molded article conveyed from a plurality of sealing means can be simultaneously cooled), a molded article that has been sufficiently cooled more quickly can be obtained. It becomes possible to supply to the gate break means.

  Further, various configurations can be adopted as the cooling means, and for example, the following configurations can be considered.

  For example, a set portion in which the molded product is set, a cooling medium passage provided adjacent to the molded product set in the set portion, and a cooling medium supplied to the cooling medium passage are provided. With this configuration, the cooling means can be realized with a simple configuration.

  Further, if the cooling medium is air, and the air jet hole for guiding the air to the molded product set from the cooling medium passage is provided in the set portion, the air that is the cooling medium is provided. It can be directly injected onto the molded product, and the molded product can be efficiently cooled. Furthermore, the desired temperature air (cold air) can be adjusted easily and freely at the desired timing, and it is possible to flexibly respond to the optimum conditions according to the size of the molded product and the type of resin. Become.

  Furthermore, if a clamp structure is provided that can hold the molded product set in the set part in the set part at the time of air ejection, stronger air can be injected, shortening the cooling time and further Cooling to a low temperature is possible.

  Moreover, if the set portion is provided with a cover that can cover the molded product in a state where the molded product is set, the cooling efficiency by the cooling medium can be further improved. For example, when cooling is performed by ejecting air, the molded product can be effectively cooled without the ejected air (cold air) scattering around.

  Further, if the molded product is set in the set portion and the set portion is provided with a set portion moving mechanism capable of contacting and separating from the cover, the molded product is generated during cooling. The possible warpage can be minimized.

  In addition, if a cooling medium passage is also provided in the cover, it is possible to simultaneously cool from both sides of the molded product, and the cooling efficiency can be further improved.

  Further, if the cover is divided into two parts and can be opened and closed at a predetermined timing, it is possible to facilitate the delivery of the molded product by the transport mechanism.

  By applying the present invention, the molded product can be sufficiently cooled in a short period of time, and it is possible to prevent a gate break failure (gate remaining, gate breakage, adhesion remaining, etc.) due to insufficient cooling, and it is easy to adopt a dedicated cooling structure. If necessary, warping of the molded product can be minimized.

Schematic configuration diagram of a resin sealing device which is an example of an embodiment of the present invention Top view of the cooling means 100 Same side view (viewed from the direction of arrow III in FIG. 2) Same as above, front view (viewed from the direction of arrow IV in FIG. 2) Top view of another configuration example of cooling means (cooling means 200) Same as above, right side view (direction of arrow VI in Fig. 5) The same right side view with the set cover closed Same as above, front view (viewed from the direction of arrow VIII in FIG. 7) Semiconductor mold device (resin sealing device) described in Patent Document 1

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

A resin sealing device JS according to the present invention includes a sealing means 300 for sealing a molded product such as a semiconductor chip with a resin, and a resin sealing device by a sealing means 300 as shown in FIG. The cooling means 100 for cooling the molded product stopped, the gate break means 400 for removing unnecessary resin from the molded product cooled by the cooling means 100, and the cooled molded product from the cooling means 100 to the gate break means 400. And a conveying means 600 that conveys to the outside. The resin sealing device JS is a so-called multi-press type resin sealing device in which a plurality of sealing means 300 are provided in parallel to one gate break means 400. In the resin sealing device JS, the molded product is transferred from each sealing means 300 to the cooling means 100 by the first transfer means 500, and the transfer from the cooling means 100 to the gate break means 400 is the second transfer means. 600. In the present embodiment, the first transfer unit 500 and the second transfer unit 600 are configured as independent units. However, transfer from the sealing unit 300 to the cooling unit 100 is performed using the same transfer unit. In addition, a configuration in which conveyance from the cooling unit 100 to the gate break unit 400 may be employed.

  Next, the cooling means 100 will be described with reference to FIGS. 2 is a top view of the cooling means 100, FIG. 3 is a right side view thereof, and FIG. 4 is a front view thereof.

  The cooling means 100 includes a set portion 102 for placing a molded product after resin sealing, and four leg portions 130 that support the set portion 102. The set part 102 is connected and fixed integrally with the leg part 130 by a set part fixing bolt 120.

  The set part 102 includes a jig part 102A and a base part 102B, and a jig part 102A having the same size as the base part 102B is hierarchically arranged on a flat plate-like base part 102B. It is set as the arrangement. The jig portion 102A is positioned and fixed with respect to the base portion 102B by the positioning pins 103. An adjustment valve 110 is provided on the right side surface of the base portion 102 </ b> B, and a cooling medium pipe 111 extends from the adjustment valve 110. The amount of the cooling medium that passes through the adjustment valve 110 can be adjusted by the adjustment valve 110. The cooling medium pipe 111 is connected to a cooling medium supply device (not shown). An air passage 112 is formed in the base portion 102B, and the air passage 112 and the adjustment valve 110 communicate with each other.

  On the other hand, the surface of the jig portion 102A (the upper surface in FIG. 3) has a shape corresponding to the shape of the molded product 180 (for example, a shape imitated along the shape of the molded product 180). Is done. The molded product 180 includes a package portion 180A in which a semiconductor chip or the like is sealed with a resin, and an unnecessary resin corresponding to a runner portion or a cull portion that becomes a resin passage in the sealing process (hereinafter referred to as an unnecessary resin). This is simply referred to as a runner portion 180B or a cull portion 180C). The jig portion 102A is provided with an air ejection hole 114 at the position of the cull portion 180C and the position of the runner portion 180B when the above-described molded product 180 is set. The air ejection hole 114 communicates with the air passage 112 described above, and the cooling medium (air) supplied to the air passage 112 via the cooling medium pipe 111 and the regulating valve 110 can be ejected to the molded product 180. It is said that. This air may be air that has been cooled in advance, or may be air at about room temperature. Moreover, you may utilize not only air but inert gas, such as nitrogen, for example.

  In addition, clamp claws 160 capable of gripping the molded product 180 conveyed to the cooling means 100 are provided at substantially four corners of the jig portion 102A. The clamp claw 160 is rotatably supported with respect to the jig portion 102A, and a molded product 180 conveyed to the set portion 102 can be held on the surface of the set portion 102 by a spring 162. . In addition, the code | symbol 170 shown in drawing is part of the 1st conveyance means 500 (resin | tip of the nail | claw part of a conveyance means) in the resin sealing apparatus JS, and is not components which comprise the said cooling means 100.

  The set portion 102 is provided with four guide pins 116, and the guide pin 116 penetrates a guide hole (not shown) provided in the lead frame of the molded product 180, so that the set portion 102 is molded. The product 180 can be positioned.

  Next, the operation of the cooling means 100 will be described.

  In the resin sealing device JS, the molded product 180 is sequentially formed by a plurality of sealing means 300 provided in parallel. The molded product 180 is taken out from the sealing means 300 by the first conveying means (for example, unloader) 500 and is simultaneously conveyed toward the cooling means 100. When the molded product 180 is conveyed to the upper part of the cooling means 100, it is subsequently set in the setting unit 102. At this time, the clamp claw 160 provided in the set unit 102 is opened at a predetermined timing, and the set (placement) of the molded product 180 on the set unit 102 is allowed. Furthermore, when the molded product 180 is set in the set portion 102, the clamp claw 160 is closed by the action of the spring 162, whereby the molded product 180 is clamped (gripped).

  On the other hand, air (cooling medium) is supplied from the cooling medium pipe 111 at a predetermined timing. The temperature of the air is optimally adjusted as appropriate depending on the type of molded product 180, the type of resin, and the like. Also, the amount of air supplied to the air passage 112 can be adjusted optimally by the adjusting valve 110 as appropriate. The air supplied to the air passage 112 is ejected from the air ejection hole 114 to the cull portion 180C of the molded product 180 and the runner portion 180B. Thereby, especially the temperature of the cull part 180C and the runner part 180B of the molded product 180 is rapidly cooled. At this time, the molded product 180 set in the setting unit 102 is securely held and fixed by the clamp claws, and the molded product 180 is not scattered or displaced by air injection. In addition, since it is possible to inject air vigorously, it is possible to shorten the cooling time and cool to a lower temperature. In the gate break process in the gate break means 400, the gate residue, gate breakage, adhesion remaining, etc. caused by insufficient cooling of the resin occur in the cull portion 180C and the runner portion 180B. Is very effective.

  When the molded product 180 is sufficiently cooled, the molded product 180 is transported to the gate break unit 400 by the second transport unit 600. Here, unnecessary resin portions (the cull portion 180C and the runner portion 180B) of the molded product 180 are removed.

  As described above, the cooling unit 100 is disposed between the sealing unit 300 and the gate break unit 400 via the second transfer unit 600, so that the molded product 180 is transferred to the gate break unit 400 when the molded product 180 is transferred to the gate break unit 400. It becomes possible to cool it enough to break. As a result, as soon as the molded product 180 is supplied to the gate break means 400, the gate break process can be started, and the "cooling time" for cooling the molded product can be excluded from the cycle time controlling factor of the apparatus. In addition, since the gate is broken after being sufficiently cooled, it is possible to prevent the gate from being left and broken.

  In particular, in the case of a sealing device (so-called multi-press type) in which a plurality of sealing means 300 are provided in parallel with respect to a specific gate break means, because of its configuration, with respect to one gate break means One after another, the molded product 180 is carried. As a result, there is a “waiting time for cooling” in addition to the cooling time. It is possible to cool using this “waiting time for cooling”, and even if an independent cooling means (that is, interposing the conveying means) is provided, it does not affect the direction of extending the cycle time of the apparatus. Absent. Further, although not shown, if the cooling unit 100 is configured so that a plurality of molded products 180 can be cooled at the same time (the molded products 180 conveyed from the plurality of sealing units 300 can be cooled simultaneously), The molded article 180 that has been sufficiently cooled more quickly can be supplied to the gate break means 400.

  For example, without providing the air ejection holes 114, air is circulated in the set portion by a closed air passage so that the surface of the set portion 102 is cooled and the molded product 180 is further cooled. It can also be configured as “cooling”. By configuring in this way, it becomes possible to cool down more slowly than injecting the cooling medium directly onto the molded product, and therefore, preventing “warping and cracking due to rapid cooling” that may occur depending on the type of resin. It is possible to prevent scattering of resin burrs and the like. In the case of such indirect cooling, the cooling medium does not necessarily need to be air, and it is possible to use a liquid such as water that cannot be directly injected onto the molded product. Further, in the case of indirect cooling, not only a part of the molded product is extremely cooled, but the entire molded product is gradually cooled through the surface of the set part, and this point also occurs partially in the molded product. It is possible to prevent warping and cracking due to a temperature difference.

  Next, another embodiment of the cooling means will be described with reference to FIGS.

  5 is a top view of the cooling means 200, FIG. 6 is a right side view of the same, FIG. 7 is a right side view of the cooling unit 200, and shows a state where the set cover is closed, and FIG. 8 is a front view (arrow of FIG. 7). VIII direction).

  The cooling unit 200 is characterized in that the surface side (that is, the molded product) of the set unit 202 is covered with the set unit cover 240 at a predetermined timing compared to the cooling unit 100 described above. The configuration of the set unit 202 in the cooling unit 200 is substantially the same as the configuration of the set unit 102 in the cooling unit 100 described above. Therefore, the same or similar parts are denoted by the same reference numerals in the last two digits. The description of the duplicated configuration and operation will be omitted.

  As shown in FIG. 6, the set portion 202 in the cooling means 200 moves up and down at a predetermined timing in the vertical direction (vertical direction in FIG. 6) by the first cylinder (set portion moving mechanism) 250 via the leg portion 230. It is possible. A set cover 240 is provided on the left and right sides (left and right sides in FIG. 6) of the leg portion 230.

  The set portion cover 240 is connected to the turning shaft 244 via a joint 256. The turning shaft 244 is supported on the base 290 by a shaft fixing block 254 including a bearing 245. That is, the set portion cover 240 is supported so as to be rotatable about the axis of the turning shaft 244. The turning shaft 244 is provided with an open / close sensor 258 (see FIG. 8) so that the open / close state of the set portion cover 240 can be detected. When viewed from the side, the set portion cover 240 is configured to have a substantially “U” shape (see FIGS. 6 and 7), and is connected to the turning shaft 244 at the bottom portion of the “U”. A cushioning material 249 is attached to the inner side (first cylinder 250 side) of the connecting portion with the turning shaft 244 in the set portion cover 240. When the cushioning material 249 contacts the stopper 246, the closing position of the set portion cover 240 is determined. On the other hand, the outer side (on the side opposite to the first cylinder 250) of the connecting portion with the turning shaft 244 in the set portion cover 240 is connected to the second cylinder 252 (cylinder connecting portion 248). When the cylinder connecting portion 248 is driven up and down by the second cylinder 252, the set portion cover 240 is opened and closed. The portion corresponding to the upper surface of the “U” is a cover portion 241 that covers the set portion 202, and this cover portion 241 is integrated with the bottom surface side of the “U” via the arm portion 242. Yes. The cover portion 241 has a configuration similar to that of the set portion 202, and a base portion 241B is placed on a substantially plate-shaped jig portion 241A. Further, an air passage 247 is provided in the base portion 241B, and an air ejection hole 243 is provided in the jig portion 241A. That is, the cover portion 241 is similar to the configuration in which the vertical direction of the set portion 202 is reversed. Further, a cooling medium pipe (not shown) is also connected to the air passage 247 provided in the cover portion 241 via the adjustment valve 260 so that air can be supplied from a cooling medium supply mechanism (not shown).

  Delivery of the molded product 280 to the cooling means 200 is performed in the state shown in FIG. 6, that is, in a state where the set portion cover 240 is opened and the set portion 202 is raised by the first cylinder (set portion moving mechanism) 250. . In this state, the molded product 280 is received by the setting unit 202. In the present embodiment, the set portion cover 240 has a two-part structure and can be opened and closed at a predetermined timing, so that the molded product 280 can be easily delivered.

  Subsequently, the set portion 202 is lowered (lower side in FIG. 6) by the action of the first cylinder 250, and the set portion cover 240 is closed, resulting in the state shown in FIG. Thereafter, the set part 202 is raised again, and the molded product 280 set on the set part 202 is raised in the direction of the cover part 241 (the jig part 241A). At this time, whether or not the molded product 280 is directly brought into contact with the cover portion 241 (the jig portion 241A) is appropriately determined according to the shape of the molded product 280, the allowable amount of warpage, the material, and the like. change. As a result, the set part 202 and the molded product 280 are covered with the set part cover 240 (the cover part 241 thereof). In this state, by blowing air to the molded product, it becomes possible to actively cool from both sides of the molded product 280, and it is possible to further improve the cooling efficiency by the cooling medium. That is, it is possible to reliably cool only the molded product without the jetted air (cold air) scattering around.

  The opening / closing structure of the set portion cover 240 is not limited to the above-described configuration, and may be opened and closed, for example, as long as the set portion can be effectively covered.

  The present invention is particularly effective for a so-called multi-press type resin sealing apparatus, but application to a single press type resin sealing apparatus is not excluded.

100, 200 Cooling means 102, 202 Set part 102A, 202A Jig part 102B, 202B Base part 103, 203 Positioning pin 110, 210, 260 Adjusting valve 111 Cooling medium pipe 112, 212, 247 Air passage 114, 214, 243 Air Jet hole 116, 216 Guide pin 120, 220 Set part fixing bolt 130, 230 Leg part 160, 260 Clamp claw 162, 262 Spring 180, 280 Molded product 240 Set part cover 241 Cover part 242 Arm part 244 Swing shaft 245 Bearing 246 Stopper 248 Cylinder engagement portion 249 Buffer material 250 First cylinder 252 Second cylinder 254 Shaft fixing block 256 Joint 258 Open / close sensor 290 Base

Claims (10)

Sealing means for sealing a molded product such as a semiconductor chip with a resin;
Gate break means for removing unnecessary resin from the molded product resin-sealed by the sealing means, and
Cooling means for cooling the molded product before the molded product is gate-breaked;
A resin sealing device comprising: a conveying unit that conveys the molded product after cooling from the cooling unit to the gate break unit. In claim 1,
A plurality of the sealing means are provided in parallel to the specific gate break means. In claim 1 or 2,
The cooling means includes a set part for setting the molded product,
A cooling medium passage provided so as to be adjacent to the molded article set in the set portion;
And a cooling medium supplied to the cooling medium passage. In claim 3,
The cooling medium is air;
The resin sealing device, wherein the set portion includes an air ejection hole that guides the air from the cooling medium passage to the molded product set. In claim 4,
Furthermore, the resin sealing apparatus characterized by including the clamp structure which can hold | maintain the said molded product set to the said set part to the said set part at the time of air ejection. In any of claims 3 to 5,
Furthermore, a cover is provided that can cover the molded product in a state where the molded product is set in the set part.
A resin sealing device characterized by that. In claim 6,
The resin sealing device further comprising: a set part moving mechanism capable of contacting and separating the set part from the cover in a state where the molded product is set in the set part. In claim 6 or 7,
A cooling medium passage is provided in the cover. In any of claims 6 to 8,
The resin sealing device, wherein the cover has a two-part structure and can be opened and closed at a predetermined timing. In any one of Claims 1 thru | or 9,
The resin sealing device, wherein the cooling means can simultaneously cool a plurality of the molded products.