KR20230170030A - Resin molding device and manufacturing method of resin molded products - Google Patents

Abstract

A resin molding device capable of suppressing adverse effects on a resin molded product and suppressing warping of the resin molded product, and a method for manufacturing a resin molded product are provided. The resin molding device is configured to resin mold a molded object by using a thermosetting resin. This resin molding device is equipped with a mold, a mold clamping mechanism, and a temperature control mechanism. The mold clamping mechanism is configured to clamp the mold. The temperature control mechanism is configured to control the temperature of the mold. The temperature control mechanism is configured to heat the mold in a state in which mold clamping is completed during resin molding, and to cool the mold in a state in which the mold clamping is completed after resin molding.

Description

Resin molding device and manufacturing method of resin molded products

The present invention relates to a resin molding device and a method of manufacturing a resin molded product.

Japanese Patent Laid-Open No. 2012-045839 (Patent Document 1) discloses a transport device for a resin-encapsulated substrate. In this transfer device, the resin-sealed substrate is transferred while the resin-sealed substrate is adsorbed to a cooling plate. As a result, the resin-sealed substrate is cooled and warping of the resin-sealed substrate is prevented (see Patent Document 1).

[Patent Document 1] Japanese Patent Publication No. 2012-045839

In the transfer device disclosed in Patent Document 1, during transfer of the resin-sealed substrate, the resin-sealed substrate is cooled while adsorbed on a cooling plate. However, since cooling of the resin-sealed substrate has not been completed when transport of the resin-sealed substrate begins, there is a possibility that warping of the resin-sealed substrate cannot be sufficiently prevented. For example, when resin molding of a molded object is performed using a thermosetting resin, it is also conceivable that the resin molded molded object (hereinafter also referred to as “resin molded product”) bends immediately after the start of transport. For example, when the object to be molded includes a soft member such as a wafer, clamping and straightening a once bent resin molded product may have a negative effect on the resin molded product.

The present invention was made to solve this problem, and its purpose is to provide a resin molding device capable of suppressing adverse effects on the resin molded article and suppressing warping of the resin molded article, and a method for manufacturing the resin molded article.

A resin molding apparatus according to one aspect of the present invention is configured to perform resin molding of a molded object by using a thermosetting resin. This resin molding device is equipped with a mold, a mold clamping mechanism, and a temperature control mechanism. The mold clamping mechanism is configured to clamp the mold. The temperature control mechanism is configured to control the temperature of the mold. The temperature control mechanism is configured to heat the mold in a state in which mold clamping is completed during resin molding, and to cool the mold in a state in which the mold clamping is completed after resin molding.

A method of manufacturing a resin molded product according to another aspect of the present invention is a method of manufacturing a resin molded product using the above-described resin molding apparatus. This method of manufacturing a resin molded product includes the steps of supplying a molding object to a molding mold, performing resin molding by clamping a mold heated by a temperature control mechanism, and maintaining the completed state of mold clamping after resin molding. and cooling the forming mold by a temperature control mechanism in the state.

According to the present invention, a resin molding device capable of suppressing adverse effects on a resin molded product and suppressing warping of the resin molded product, and a method for manufacturing a resin molded product can be provided.

[Figure 1] A diagram schematically showing the plane of a resin molding device.
[Figure 2] A diagram schematically showing the side of the discharge mechanism.
[Figure 3] A diagram schematically showing the side of a portion of the compression molding module.
[FIG. 4] A diagram partially including a diagram schematically showing the IV-IV cross section of FIG. 3.
[FIG. 5] A diagram schematically showing the side of a portion of the compression molding module during compression molding.
[FIG. 6] A diagram showing an example of temperature transition of a forming mold.
[Figure 7] is a flowchart showing an example of the operation sequence of the resin molding device.
[FIG. 8] A diagram schematically showing a cross section of the first upper mold member in the first modification example.
[FIG. 9] A diagram schematically showing a configuration connected to a pipe in the second modification.

Hereinafter, an embodiment related to one aspect of the present invention (hereinafter also referred to as “this embodiment”) will be described in detail using the drawings. Identical or significant portions of the drawings are assigned the same reference numerals and their descriptions are not repeated. In addition, each drawing is schematically depicted with objects appropriately omitted or exaggerated for ease of understanding.

[One. [Configuration of resin molding device]

FIG. 1 is a diagram schematically showing a plan view of the resin molding device 10 according to the present embodiment. The resin molding apparatus 10 is configured to manufacture a resin molded product by resin-sealing the molding object using a thermosetting resin. An example of an object to be molded is a resin pre-molded substrate 144A (substrate 144) on which electronic components such as semiconductor chips are mounted. For example, in the resin molding apparatus 10, the side of the substrate 144A on which the electronic component is mounted is resin-sealed before resin molding. In this embodiment, the substrate 144 before resin molding is called the substrate before resin molding 144A, and the substrate 144 after resin molding is called the substrate 144B after resin molding.

The substrate 144 is made of, for example, a semiconductor substrate such as a silicon wafer, a lead frame, a printed wiring board, a metal substrate, a resin substrate, a glass substrate, or a ceramic substrate. The substrate 144 may be made of a carrier used for, for example, FOWLP (Fan Out Wafer Level Packaging) or FOPLP (Fan Out Panel Level Packaging). In the substrate 144, wiring may already be provided, or wiring may not be provided.

As shown in FIG. 1, the resin molding device 10 includes a lower mold film cutting module 110, a resin material supply module 120, a compression molding module 130, and a conveyance module ( 140) and a control unit 150. Each module is configured to be removable from and attached to adjacent modules.

A release film 11 of a desired shape is produced in the release film cutting module 110, and a liquid resin (thermosetting resin) is supplied as a resin material to the release film 11 in the resin material supply module 120. The viscosity of the liquid resin is not particularly limited, but in this embodiment, a liquid resin with a relatively high viscosity is used.

In the compression molding module 130, the pre-resin molding substrate 144A transported by the transport module 140 and the release film 11 supplied with the liquid resin are placed at a predetermined position in the molding mold 231. Compression molding is performed. In this way, a resin molded product (resin molded substrate 144B) is manufactured. In this specification, “predetermined” means set in advance. For example, “predetermined position” means a preset position. The manufactured resin molded product is transported by the transport module 140 and stored in a predetermined position (molded substrate storage unit 146). Hereinafter, each module will be described in detail.

The release film cutting module 110 is configured to cut and separate the circular release film 11 from the long release film. The release film 11 is used to prevent the resin from adhering to the mold 231 after compression molding in the compression molding module 130 and to facilitate the removal of the resin molded product from the mold 231. . As a material for the release film, a resin material having properties such as heat resistance, release property, flexibility, and extensibility is used, for example, PTFE (polytetrafluoroethylene) and ETFE (ethylene tetrafluoroethylene copolymer). , PET (polyethylene terephthalate), FEP (tetrafluoroethylene/hexafluoropropylene copolymer), polypropylene, polystyrene, or polyvinylidene chloride are used.

The release film cutting module 110 includes a film fixture moving mechanism 111, a roll-type release film 112, and a film gripper 113. The film fixing base moving mechanism 111 is located between the roll-shaped release film 112 and the film gripper 113 in the arrow Y direction.

The film fixing table moving mechanism 111 is configured to move between the release film cutting module 110 and the resin material supply module 120. The film fixing table moving mechanism 111 is movable in, for example, the arrow X direction and the arrow Y direction, respectively.

A table 12 is disposed on the upper surface of the film fixture moving mechanism 111. The table 12 is a fixture for fixing the release film 11. On the table 12, the release film pulled out from the roll-shaped release film 112 is fixed. The film gripper 113 is configured to pull out the release film from the roll-type release film 112 and to fix the tip of the pulled out release film. On the film fixture moving mechanism 111, the release film is cut by a cutter (not shown) to produce the circular release film 11. For example, even if the release film 11 is fixed to the upper surface of the table 12 by performing suction using a suction mechanism (not shown) such as a pressure reducing pump from a suction hole (not shown) formed on the upper surface of the table 12. good night.

The resin material supply module 120 is configured to supply liquid resin onto the release film 11 and to transport the release film 11 supplied with the liquid resin to a predetermined position in the mold 231. The resin material supply module 120 includes a discharge mechanism 17, a resin loader 121, and a post-processing mechanism 122.

FIG. 2 is a diagram schematically showing the side surface of the discharge mechanism 17. As shown in FIG. 2, the discharge mechanism 17 includes a dispenser 13 and a nozzle 14 attached to the tip of the dispenser 13. The discharge mechanism 17 is configured to discharge the liquid resin toward the release film 11 placed on the table 12 with the film fixing table moving mechanism 111 (table 12) positioned below. . The liquid resin is discharged from the tip of the nozzle 14 and supplied onto the release film 11.

The discharge mechanism 17 (dispenser 13 and nozzle 14) is movable, for example, in the arrow X direction and arrow Y direction, respectively. For example, the discharge position of the liquid resin on the release film 11 is adjusted by moving the discharge mechanism 17 during discharge of the liquid resin. Additionally, the discharge position of the liquid resin on the release film 11 may be adjusted by moving the film fixture moving mechanism 111 (table 12) during discharge of the liquid resin.

Referring again to FIG. 1, the resin loader 121 and the post-processing mechanism 122 are, for example, integrated. The resin loader 121 and the post-processing mechanism 122 are configured to move between the resin material supply module 120, the compression molding module 130, and the conveyance module 140 via the rail 142.

The resin loader 121 holds the release film 11 by suctioning the peripheral portion of the release film 11 to which the liquid resin is supplied from above, and also moves the release film 11 through a film holding table moving mechanism. It is configured to move from 111 to a predetermined position (inside the lower mold cavity 132) of the forming mold 231. The post-processing mechanism 122 is configured to clean the mold 231 and remove the release film 11 from the mold 231 after compression molding using the mold 231 .

The transport module 140 transports the pre-resin molding substrate 144A accommodated in the pre-molding substrate receiving portion 145 to a predetermined position in the mold 231 and molds the resin manufactured in the compression molding module 130. It is configured to transport the finished substrate 144B (resin molded product) to the molded substrate storage section 146. The transfer module 140 includes a substrate loader 141, a rail 142, a robot arm 143, a pre-molded substrate accommodating portion 145, and a molded substrate accommodating portion 146. In the transfer module 140, for example, the substrate loader 141 holding the substrate 144 (the substrate before resin molding 144A or the substrate after resin molding 144B) moves on the rail 142. The substrate 144 is transported.

The pre-molded substrate accommodating portion 145 is configured to accommodate the pre-resin molded substrate 144A, and the molded substrate accommodating portion 146 is configured to accommodate the resin molded substrate 144B. The robot arm 143 takes out the substrate before resin molding 144A from the substrate before resin molding storage unit 145, reverses the front and back of the substrate before resin molding 144A, and loads the substrate 144A before resin molding into a substrate loader ( 141) and is supported on the lower surface. Accordingly, the substrate 144A before resin molding is held by the substrate loader 141 with the mounting surface of the electronic component facing downward.

In addition, the robot arm 143 takes out the resin molded substrate 144B from the substrate loader 141 after compression molding using the mold 231, reverses the front and back of the resin molded substrate 144B, and performs resin molding. The finished substrate 144B is accommodated in the molded substrate receiving portion 146. Accordingly, the molded resin substrate 144B is accommodated in the molded substrate storage portion 146 with the resin molded surface facing upward.

The rail 142 extends over each area of the conveyance module 140, compression molding module 130, and resin material supply module 120. The substrate loader 141 is configured to transport the substrate 144 by moving on the rail 142. For example, the substrate loader 141 transports the substrate 144A before resin molding from a predetermined position near the robot arm 143 to a predetermined position in the mold 231, and molds the resin molded substrate 144B. It is configured to transport from a predetermined position of the mold 231 to a predetermined position near the robot arm 143.

The control unit 150 is configured to control the entire resin molding apparatus 10. The control unit 150 controls, for example, each of the release film cutting module 110, the resin material supply module 120, the compression molding module 130, and the transfer module 140. The control unit 150 includes a hardware processor, such as a CPU (Central Processing Unit), RAM (Random Access Memory), and ROM (Read Only Memory), and is configured to perform information processing based on programs and various data. The control unit 150 may be placed anywhere within the resin molding apparatus 10 and may be configured by a plurality of computers.

FIG. 3 is a diagram schematically showing a partial side of the compression molding module 130. The compression molding module 130 is configured to manufacture a resin molded product (resin molded substrate 144B) by using a so-called compression molding method (compression molding method).

1 and 3, the compression molding module 130 includes a base 213, a tie bar 214, a fixed platen 211, a movable platen 212, and a mold clamping mechanism 215. It includes a mold 231 and a temperature controller 133.

The base 213 is a rectangular plate-shaped member in plan view. Each of the plurality (four) tie bars 214 is a rod-shaped member extending in the vertical direction. A plurality of tie bars 214 are respectively fixed to the four corners of the base 213. The fixed pressure plate 211 is a rectangular plate-shaped member in plan view, and is fixed to the upper part of the plurality of tie bars 214. The movable pressure plate 212 is a rectangular plate-shaped member in plan view, and is attached to the tie bar 214 between the base 213 and the fixed pressure plate 211 in a vertically movable state. The movable pressure plate 212 faces both the fixed pressure plate 211 and the base 213 in the compression molding module 130.

The mold clamping mechanism 215 is fixed to the upper surface of the base 213 and the lower surface of the movable pressure plate 212, respectively. The mold clamping mechanism 215 includes a drive source 216 and a transmission member 217 that transmits the driving force of the drive source 216. The drive source 216 is fixed to the upper surface of the base 213, and the transmission member 217 is fixed to the lower surface of the movable pressure plate 212.

The driving force of the drive source 216 is transmitted to the movable pressure plate 212 through the transmission member 217, and the movable pressure plate 212 rises to clamp the mold 231. In addition, the driving force of the drive source 216 is transmitted to the movable pressure plate 212 through the transmission member 217, and the movable pressure plate 212 is lowered, thereby opening the mold 231. The mold clamping mechanism 215 is configured to raise and lower the movable pressure plate 212 for clamping and opening the mold 231. That is, the mold clamping mechanism 215 is configured to clamp and open the mold 231.

For example, the drive source 216 may be comprised of an electric motor such as a servo motor, and the transmission member 217 may be comprised of a ball screw. Additionally, the drive source 216 may be comprised of a hydraulic cylinder, and the transmission member 217 may be comprised of a rod. Additionally, the mold clamping mechanism 215 may be configured by using a toggle link mechanism.

The forming mold 231 includes a metal upper mold 201 and a metal lower mold 202 opposing the upper mold 201. The upper mold 201 is fixed to the lower surface of the fixed pressure plate 211 via a plurality of (for example, four) insulating mechanisms 210, and the lower mold 202 is a plurality of (for example, four) insulating mechanisms 210. ) is fixed to the upper surface of the movable pressure plate 212 via an insulating mechanism 209.

The upper mold 201 includes a first upper mold member 203 and a second upper mold member 205 connected to the lower surface of the first upper mold member 203. The first upper mold member 203 is a rectangular metal member in plan view, and is fixed to the lower surface of the fixed pressure plate 211 via a plurality of heat insulating mechanisms 210. Each heat insulating mechanism 210 is, for example, made of metal and has a pillar shape. For example, the heat insulating mechanism 210 is disposed near each of the four corners of the upper surface of the first upper mold member 203. Additionally, a pipe 204 is disposed inside the first upper mold member 203.

FIG. 4 is a diagram partially including a diagram schematically showing the IV-IV cross section of FIG. 3. As shown in FIG. 4, a pipe 204 connected to the temperature controller 133 is disposed inside the first upper mold member 203.

The temperature controller 133 supplies a heat medium to the pipe 204 (or pipe 207 (FIG. 3)) and circulates the heat medium in the pipe 204 (or pipe 207) to heat the upper mold 201. ) (or the lower mold 202) is configured to control the temperature. The heating medium may be a liquid such as water or oil, or may be a gas. For example, the temperature controller 133 raises the temperature of the upper mold 201 by making the temperature of the heating medium higher than the temperature of the upper mold 201 and circulating the heating medium in the pipe 204. In addition, the temperature controller 133 lowers the temperature of the upper mold 201 by, for example, lowering the temperature of the heating medium to a lower temperature than the temperature of the upper mold 201 and circulating the heating medium through the pipe 204. . In the compression molding module 130, the temperature of the substrate 144 is indirectly controlled by controlling the temperature of the mold 231.

The temperature sensor 250 is configured to detect the temperature of the second upper mold member 205 connected to the first upper mold member 203, for example. For example, the control unit 150 controls the temperature controller 133 based on the detection result by the temperature sensor 250. Since a plurality of heat insulating mechanisms 210 are disposed between the first upper mold member 203 and the fixed pressure plate 211, a space is formed between the first upper mold member 203 and the fixed pressure plate 211. do. Since this space functions as a heat insulating layer, heat conduction between the upper mold 201 and the fixed pressure plate 211 is suppressed. As a result, temperature control of the upper mold 201 becomes relatively easy.

Referring again to FIG. 3, the second upper mold member 205 is a metal member that is circular in plan view and is connected to the lower surface of the first upper mold member 203. The second upper mold member 205 is configured to hold the substrate 144 . Before compression molding, a pre-resin molding substrate 144A is attached to the lower surface of the second upper mold member 205.

The lower mold 202 includes a first lower mold member 206 and a second lower mold member 208 connected to the upper surface of the first lower mold member 206. The first lower mold member 206 is a rectangular metal member in plan view, and is fixed to the upper surface of the movable pressure plate 212 via a plurality of heat insulating mechanisms 209. Each heat insulation mechanism 209 may be the same as or different from the heat insulation mechanism 210, for example. For example, heat insulating mechanisms 209 are disposed near each of the four corners of the lower surface of the first lower mold member 206.

Additionally, a pipe 207 is disposed inside the first lower mold member 206. Like the pipe 204, a temperature controller 133 is connected to the pipe 207. The temperature of the lower mold 202 is controlled by the temperature controller 133 like the upper mold 201. For example, the control unit 150 controls the temperature controller 133 based on a detection result of a temperature sensor (not shown) that detects the temperature of the second lower mold member 208. Since a plurality of heat insulating mechanisms 209 are disposed between the first lower mold member 206 and the movable pressure plate 212, a space is formed between the first lower mold member 206 and the movable pressure plate 212. do. Since this space functions as a heat insulating layer, heat conduction between the lower mold 202 and the movable pressure plate 212 is suppressed. As a result, temperature control of the lower mold 202 becomes relatively easy.

The second lower mold member 208 is a circular metal member in plan view and is connected to the upper surface of the first lower mold member 206. A lower mold cavity 132 is formed on the upper surface of the second lower mold member 208. Before compression molding, a release film 11 supplied with liquid resin is placed in the lower mold cavity 132. The forming mold 231 is formed in a state in which a liquid resin is disposed in the lower mold cavity 132 of the second lower mold member 208 and a pre-resin molding substrate 144A is attached to the lower surface of the second upper mold member 205. ) is clamped and compression molding is performed.

[2. Suppression of warpage of resin molded products]

As described above, in the resin molding apparatus 10, compression molding is performed using a liquid resin having thermosetting properties. That is, in the resin molding apparatus 10, compression molding is performed by heating and curing the liquid resin.

FIG. 5 is a diagram schematically showing a partial side of the compression molding module 130 during compression molding (some of which include cross sections). As shown in FIG. 5, the resin pre-molding substrate 144A on which the chip 15 is mounted is held in the upper mold 201, and the liquid phase is held in the lower mold 202 with the release film 11 interposed therebetween. With the resin 16 disposed, the mold 231 is clamped. For example, when the forming mold 231 is clamped, each of the upper mold 201 and the lower mold 202 is heated. By clamping the mold using the heated upper mold 201 and lower mold 202, the liquid resin 16 is hardened, and the molded resin substrate 144B (resin molded product) is manufactured.

For example, let's say that the forming mold 231 is opened immediately after the liquid resin 16 is hardened. In this case, while the resin molded substrate 144B is at a high temperature, the clamping (hereinafter, simply referred to as “clamping”) of the resin molded substrate 144B by the mold 231 is released. “Clamping” refers to fixing the substrate 144 by clamping it between the upper mold 201 and the lower mold 202. For example, consider the case where the substrate 144 is made of a silicon wafer. In this case, since the heat shrinkage rate of the resin is greater than that of the silicon wafer, the silicon wafer is stretched in the bending direction as the resin heat shrinks. That is, when the clamping is released while the resin molded substrate 144B is at a high temperature, bending occurs in the resin molded substrate 144B due to force generated due to thermal contraction of the resin.

In order to suppress warping of the resin-molded substrate 144B, the temperatures of the upper mold 201 and the lower mold 202 during compression molding are not set to high temperatures (e.g., 120°C or higher), but are set to relatively low temperatures (e.g., For example, 100℃~120℃) can be considered. However, in this case, since curing of the resin requires a long time, as a result, a long time is required to manufacture the resin molded product.

To solve this problem, in the resin molding apparatus 10 according to the present embodiment, the control unit 150 heats the mold 231 in a molded state during compression molding, After compression molding, the temperature controller 133 is controlled to cool the mold 231 while the mold 231 continues to be clamped. That is, the temperature controller 133 heats the mold 231 while the mold 231 is clamped during compression molding, and the mold 231 continues to be clamped after compression molding. The forming mold 231 is cooled.

In the resin molding apparatus 10 according to the present embodiment, cooling of the mold 231 is performed while the mold clamping of the mold 231 continues after compression molding. Since the resin molded substrate 144B is cooled while the resin molded substrate 144B is clamped by the mold 231, even if compression molding is performed at a high temperature, the resin molded substrate 144B is not formed due to heat shrinkage of the resin. The occurrence of bending of (144B) is suppressed. Additionally, since compression molding is performed at a high temperature, the resin hardens in a short time, thereby improving the manufacturing speed of the resin molded substrate 144B.

In addition, since the curvature of the resin-molded substrate 144B does not straighten after the resin-molded substrate 144B is bent once, adverse effects occurring in the resin-molded substrate 144B due to the bending being straightened are suppressed. . For example, the occurrence of failure of the resin molded substrate 144B due to the bending being straightened is suppressed. Additionally, since the resin molded substrate 144B is transported after cooling, the heat resistance requirements of the transport module 140 are relaxed. As a result, transport of the resin-molded substrate 144B becomes easy, making it possible to speed up transport.

FIG. 6 is a diagram showing an example of temperature transition of the forming mold 231 (upper mold 201 and lower mold 202). Referring to FIG. 6, the horizontal axis represents time, and the vertical axis represents the temperature of the forming mold 231. Line L1 represents the temperature transition of the molding mold 231 in the resin molding apparatus 10 according to the present embodiment, and line L2 represents the temperature transition of the molding mold in the comparison object. In Figure 6, the specific values for time and temperature are only examples.

Referring to the transition of the line L1, from time 0 to time t1, for example, the substrate 144A before resin molding is conveyed to the mold 231. Then, the substrate 144A before resin molding is attached to the upper mold 201. From time 0 to time t1, the temperature of the forming mold 231 is H1. An example of temperature (H1) is 50°C. The lower limit of the temperature H1 is not particularly limited, but the upper limit of the temperature H1 is, for example, preferably 60°C or lower, more preferably 50°C or lower, and more preferably 40°C or lower.

From time t1 to time t2, for example, the temperature controller 133 raises the temperature of the forming mold 231 (upper mold 201 and lower mold 202). The temperature controller 133 adjusts the temperature of the heating medium so that the temperature of the forming mold 231 becomes the target temperature H3. Temperature H3 is higher than temperature H1. An example of temperature (H3) is 180°C. The temperature (H3), for example, is preferably 120°C or higher and 200°C or lower, more preferably 160°C or higher and 200°C or lower, and more preferably 160°C or higher and 180°C or lower.

From time t2 to time t3, for example, the release film 11 supplied with the liquid resin is conveyed to the forming mold 231. Then, the release film 11 supplied with liquid resin is placed on the lower mold 202 (in the lower mold cavity 132). The liquid resin placed on the lower mold 202 is heated and its viscosity decreases. After the liquid resin is placed on the lower mold 202, mold clamping is performed by raising the lower mold 202 using the mold clamping mechanism 215. When the mold fastening is completed, a predetermined force is applied to the upper mold 201 and the lower mold 202, and the lower mold 202 stops rising. After the liquid resin is placed on the lower mold 202 and until mold clamping is completed, the gas present in the liquid resin may be removed by depressurizing the inside of the mold 231.

The time from time t3 to time t4 is the so-called cure time. Cure time refers to the time from when mold clamping is completed until the liquid resin hardens to the extent that the resin molded product can be properly released, at least when the mold is opened. From time t2 to time t4, the temperature controller 133 continues heating the mold 231 so that the temperature of the mold 231 is maintained at H3. Since the temperature of the mold 231 is high, the resin hardens in a relatively short time, and as a result, the compression molding is completed in a short time. The cure time start point may not strictly be the point in time when mold fastening is completed, and may be, for example, the time immediately after mold fastening is completed.

After time t4 (after compression molding), for example, while the mold clamping completion state of the mold 231 is maintained, the temperature controller 133 lowers the temperature of the mold 231. The temperature controller 133 adjusts the temperature of the heating medium so that the temperature of the forming mold 231 becomes the target temperature H1. The target temperature during cooling of the forming mold 231 does not necessarily need to be H1. The target temperature during cooling may be, for example, a temperature higher than H1 or a temperature lower than H1. When the temperature of the mold 231 drops to the target temperature, the mold 231 is opened and the molded resin substrate 144B is transported.

Meanwhile, referring to the transition of the line L2, in the comparison object, for example, the temperature of the mold 231 is kept constant at H2 (for example, 120°C). For example, in this embodiment, when mold clamping is completed while the temperature of the mold 231 is 175°C, the cure time (time t3 to time t4) is about 120 seconds. On the other hand, when the mold clamping is completed while the temperature of the mold 231 is 120°C, the cure time is about 600 seconds. That is, when the temperature of the mold 231 is 120°C, the cure time is about 5 times longer than when the temperature of the mold 231 is 175°C. As a result, when the temperature of the mold 231 is kept constant at 120°C, the time required for manufacturing a resin molded product (the time required to raise the temperature of the mold 231, transport, mold clamping, and cooling) is, It is about 1.5 times longer than the time required for manufacturing a resin molded product in the resin molding device 10 according to the present embodiment.

[3. [Operation of resin molding device]

FIG. 7 is a flowchart showing an example of the operation sequence of the resin molding device 10. The processing shown in this flowchart is executed in a predetermined cycle by the control unit 150, for example.

Referring to FIG. 7 , the control unit 150 controls the transfer module 140 to transfer the object to be molded (the substrate 144A before resin molding) to a predetermined position in the mold 231 (step S100). The control unit 150 controls the temperature controller 133 to start heating the forming mold 231 (step S110). The control unit 150 determines whether the temperature of the forming mold 231 (upper mold 201 and lower mold 202) has risen to the first predetermined temperature based on the detection results of the temperature sensor 250 and the like. (step S120). The first predetermined temperature (for example, temperature H3 in FIG. 6) is, for example, a temperature at which liquid resin (thermosetting resin) hardens relatively smoothly.

When it is determined that the temperature of the forming mold 231 has not risen to the first predetermined temperature (NO in step S120), the control unit 150 operates the temperature controller 133 to increase the temperature of the forming mold 231 at a predetermined speed. Continue control.

Meanwhile, when it is determined that the temperature of the mold 231 has risen to the first predetermined temperature (YES in step S120), the control unit 150 operates a temperature controller ( In addition to continuing the control of 133), the resin material supply module 120 is controlled to convey the release film 11 supplied with the liquid resin to a predetermined position in the forming mold 231 (step S130). The liquid resin is supplied to the release film 11, for example, in the resin material supply module 120, in parallel with the processing shown in this flow chart.

Thereafter, the control unit 150 controls the mold clamping mechanism 215 to start clamping the mold 231 (step S140). Even in the mold clamping completed state of the mold 231 (during compression molding), heating of the mold 231 by the temperature controller 133 continues, and the temperature of the mold 231 is set to, for example, the first It is maintained at a predetermined temperature. In addition, each of the “mold clamping completed state”, “mould clamping completed state”, and “mould clamping completed state” are, for example, opposing states constituting the molding mold (for example, the molding mold 231). Two molds (for example, the upper mold 201 and the lower mold 202) move relatively in a direction to approach each other, and a predetermined force is applied to these two molds to stop the relative movement of these two molds. It is in a state of being

The control unit 150 determines whether a predetermined time has passed since completion of mold fastening (step S150). The predetermined time is the time for the liquid resin (thermosetting resin) to sufficiently harden, when heated to the first predetermined temperature, at least to the extent that the mold can be opened and the resin molded product can be properly released. If it is determined that the predetermined time has not elapsed (NO in step S150), the control unit 150 controls the mold clamping mechanism 215 to maintain the completed state of mold clamping, and the temperature of the mold 231 is adjusted to 1 Control the temperature controller 133 to maintain the predetermined temperature.

On the other hand, when it is determined that the predetermined time has elapsed (YES in step S150), the control unit 150 controls the mold clamping mechanism 215 to maintain the completed state of mold clamping and cools the forming mold 231. The temperature controller 133 is controlled to start (step S160). For example, the control unit 150 controls the temperature controller 133 so that the temperature of the mold 231 decreases at a predetermined rate.

The control unit 150 determines whether the temperature of the mold 231 has decreased to the second predetermined temperature based on the detection results of the temperature sensor 250 and the like (step S170). The second predetermined temperature (for example, temperature H1 in FIG. 6) is, for example, a temperature at which heat shrinkage of the resin or the like hardly occurs. When it is determined that the temperature of the forming mold 231 has not decreased to the second predetermined temperature (NO in step S170), the control unit 150 controls the mold clamping mechanism 215 to maintain the completed state of mold clamping. , the temperature controller 133 is controlled so that the temperature of the forming mold 231 continues to decrease.

On the other hand, when it is determined that the temperature of the mold 231 has decreased to the second predetermined temperature (YES in step S170), the control unit 150 controls the mold clamping mechanism 215 to open the mold 231. (Step S180). When mold opening is completed, the control unit 150 controls the transfer module 140 to transfer the manufactured resin molded product (resin molded substrate 144B) (step S190).

[4. characteristic]

As described above, in the resin molding apparatus 10 according to the present embodiment, the control unit 150 heats the mold 231 in a state in which mold clamping of the mold 231 is completed during compression molding, and performs compression molding. Later, the temperature controller 133 is controlled to cool the mold 231 while maintaining the mold fastening state of the mold 231. That is, the temperature controller 133 heats the mold 231 in a state in which the mold 231 has been completely clamped during compression molding, and the mold clamped state of the mold 231 is maintained after compression molding. The forming mold 231 is cooled in this state.

In this way, in the resin molding apparatus 10, cooling of the mold 231 is performed after compression molding while the mold clamping completed state of the mold 231 is maintained. Therefore, according to the resin molding apparatus 10, since the resin molded substrate 144B is cooled while the resin molded substrate 144B is clamped by the mold 231, even if compression molding is performed at a high temperature, The occurrence of warping of the molded resin substrate 144B due to heat shrinkage of the resin can be suppressed.

The resin molding device 10 is an example of the “resin molding device” of the present invention. The forming mold 231 is an example of the “forming mold” of the present invention. The mold clamping mechanism 215 is an example of the “mold clamping mechanism” of the present invention. The configuration consisting of the temperature controller 133 and the pipes 204 and 207 is an example of the “temperature control mechanism” of the present invention. The liquid resin 16 is an example of the “thermosetting resin” of the present invention. The substrate 144A before resin molding is an example of a “molding object” of the present invention. The pipes 204 and 207 are examples of “piping” of the present invention. The transfer module 140 is an example of the “transfer mechanism” of the present invention.

[5. Other Embodiments]

The idea of the above embodiment is not limited to the embodiment described above. Hereinafter, an example of another embodiment to which the spirit of the above embodiment can be applied will be described.

<5-1>

In the resin molding apparatus 10 according to the above embodiment, pipes 204 and 207 are respectively disposed inside the upper mold 201 and the lower mold 202, and a temperature controller 133 controls a heating medium within each pipe. By supplying, each of the upper mold 201 and lower mold 202 was heated. However, the method of heating the upper mold 201 and the lower mold 202 is not limited to this.

FIG. 8 is a diagram schematically showing a cross section of the first upper mold member 203A in the first modification example. As shown in FIG. 8, a plurality of heaters 300 are disposed inside the first upper mold member 203A in addition to the pipe 204. The heater 300 is a heater for heating metal. By disposing the heater 300 in addition to the pipes 204 and 207 inside the upper mold and the lower mold, the temperature increase rate of the upper mold and the lower mold can be further increased.

<5-2>

In the resin molding apparatus 10 according to the above embodiment, the temperature of the heat medium supplied to the pipes 204 and 207 was lowered by the temperature controller 133. However, the method of lowering the temperature of the heat medium is not limited to this.

FIG. 9 is a diagram schematically showing the configuration connected to the pipes 204 and 207 in the second modification example. As shown in FIG. 9, a temperature controller 133 and an oil cooler 350 are connected to the pipes 204 and 207. That is, the heat medium flowing in the pipes 204 and 207 is cooled by the temperature controller 133 and the oil cooler 350. As a result, the rate of temperature decrease of the upper mold and lower mold can be further increased.

<5-3>

In the resin molding apparatus 10 according to the above embodiment, resin molding was performed according to a compression molding method (compression molding method). However, the resin molding method is not limited to this. For example, resin molding may be performed according to a transfer molding method. Even when resin molding is performed according to the transfer molding method, the bending of the substrate is suppressed by cooling the mold while the mold clamping is completed. Additionally, since the substrate after cooling is transported, the heat resistance requirements in the transport module 140 are relaxed. As a result, transport of the resin molded product becomes easy, and high-speed transport is possible.

<5-4>

In the resin molding device 10 according to the above embodiment, the heat insulating mechanisms 209 and 210 do not need to be pillar-shaped and may be plate-shaped. In this case, the heat insulating mechanisms 209 and 210 may be made of, for example, a heat insulating material. The heat insulating mechanisms 209 and 210 may be made of, for example, a metal material and a ceramic material. As a ceramic material, for example, zirconium oxide, alumina, etc. may be used.

<5-5>

In the resin molding apparatus 10 according to the above embodiment, resin molding was performed using liquid resin. However, the resin used in resin molding is not limited to liquid resin. For example, in the resin molding apparatus 10 according to the above embodiment, resin molding may be performed using powdered resin (granular resin).

<5-6>

In the resin molding apparatus 10 according to the above embodiment, heating of the mold 231 was started before conveying the release film 11 supplied with the liquid resin and clamping the mold 231. However, the timing of starting heating of the forming mold 231 is not limited to this. For example, the transfer of the release film 11 to which the liquid resin is supplied is performed before the start of heating of the mold 231, the clamping of the mold 231 is started before the start of heating of the mold 231, and the molding is performed before the start of heating of the mold 231. Heating of the forming mold 231 may be started while the mold 231 is being clamped. In addition, the release film 11 supplied with the liquid resin is transported before the start of heating of the mold 231, and then the heating of the mold 231 is started, and the temperature of the mold 231 is set to the target temperature. Clamping of the forming mold 231 may be started before the temperature rises to (the first predetermined temperature).

<5-7>

The resin molding apparatus 10 according to the above embodiment included one compression molding module 130. However, the number of compression molding modules 130 included in the resin molding apparatus 10 is not limited to this. For example, the resin molding apparatus 10 may include two or more compression molding modules 130.

<5-8>

In the resin molding apparatus 10 according to the above embodiment, each of the discharge mechanism 17 and the film fixing table moving mechanism 111 may be movable in the arrow X direction, arrow Y direction, and arrow Z direction, respectively.

<5-9>

In the resin molding apparatus 10 according to the above embodiment, the first upper mold member 203 and the second upper mold member 205 may be formed integrally, and the first lower mold member 206 and the second upper mold member 205 may be integrally formed. The lower mold member 208 may be formed integrally.

Above, embodiments of the present invention have been exemplarily described. That is, for illustrative purposes, the detailed description and accompanying drawings are disclosed. Therefore, among the components described in the detailed description and attached drawings, components that are not essential for solving the problem may be included. Therefore, just because such non-essential components are described in the detailed description and attached drawings, such non-essential components should not be immediately recognized as essential.

In addition, the above embodiment is merely an example of the present invention in all respects. The above embodiments can be variously improved or changed within the scope of the present invention. That is, when implementing the present invention, specific configurations can be appropriately adopted depending on the embodiment.

10 resin molding device, 11 release film, 12 table, 13 dispenser, 14 nozzle, 15 chip, 16 liquid resin, 17 discharge mechanism, 110 release film cutting module, 111 film fixture moving mechanism, 112 roll type release film, 113 film gripper, 120 Resin material supply module, 121 resin loader, 122 post-processing mechanism, 130 compression molding module, 132 lower mold cavity, 133 temperature controller, 140 transfer module, 141 substrate loader, 142 rail, 143 robot arm, 144 substrate, 144A resin molding Previous substrate, 144B Resin molded substrate, 145 Before molding substrate receiving portion, 146 Molding completed substrate receiving portion, 150 Control unit, 201 Upper mold, 202 Lower mold, 203, 203A First upper mold member, 204, 207 Piping, 205 2 upper mold member, 206 first lower mold member, 208 second lower mold member, 209, 210 insulation mechanism, 211 fixed pressure plate, 212 movable pressure plate, 213 base, 214 tie bar, 215 mold clamping mechanism, 216 drive source, 217 transmission Members, 231 forming mold, 250 temperature sensor, 300 heater, 350 oil cooler, L1, L2 lines.

Claims (4)

A resin molding device configured to perform resin molding of a molded object by using a thermosetting resin,
forming mold,
a mold clamping mechanism configured to clamp the forming mold;
Equipped with a temperature control mechanism configured to control the temperature of the forming mold,
The temperature control mechanism is configured to heat the mold in a state in which the mold clamping is completed during the resin molding, and to cool the mold in a state in which the mold clamping is completed after the resin molding. Resin molding device. In claim 1,
Piping is disposed inside the forming mold,
The resin molding device, wherein the temperature control mechanism is configured to regulate the temperature of the mold by supplying a heat medium to the pipe. In claim 1 or 2,
A resin molding apparatus further comprising a transport mechanism configured to transport the resin-molded molded object. A method for manufacturing a resin molded product using the resin molding device according to any one of claims 1 to 3,
supplying the molding object to the molding mold;
performing the resin molding by clamping the mold heated by the temperature control mechanism;
A method of manufacturing a resin molded product, including the step of cooling the mold using the temperature control mechanism while maintaining the completed state of the mold clamping after the resin molding.