KR19980019577A - BOAT UNIT OF A SEALING APPARATUS FOR PRODUCING IC PACKAGE - Google Patents

Abstract

The present invention discloses a boat unit for transferring a lead frame while heating the lead frame to a predetermined temperature required for curing of an epoxy in a sealing process for sealing an exhaust hole of a semiconductor package.

According to the present invention, a frame (100) arranged to be elongated in a predetermined direction, a boat (200) mounted on the lead frame (1) and moving along the frame (100), and a conveying means (300) for moving the boat (200) And the sensor 400 and the boat 200 for detecting the loading or unloading of the lead frame 1 with respect to the boat 200 and selectively driving the transfer means 300 in the forward or reverse direction, respectively. It is comprised by providing the heater 500 which heats the frame 1 to predetermined temperature.

Accordingly, the present invention can apply epoxy while constantly heating the lead frame to a predetermined temperature necessary for curing the epoxy during the sealing process of sealing the exhaust hole of the semiconductor package, thereby allowing the epoxy to be cured simultaneously with the application.

Description

Boat unit of sealing device for manufacturing semiconductor package

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the manufacture of a semiconductor package, and more particularly, to a boat unit for transferring a lead frame while maintaining a lead frame in a sealing device for sealing an exhaust hole of a cap. (boat unit).

The semiconductor chip is an ultra thin type fabricated to operate perfectly by forming an electric circuit by photolithography on a fine wafer (one side about 0.5 to 10 mm) made of a semiconductor material such as silicon (Si). Since it is a super-shaped device, it is not only easy to be damaged by the external environment, but also difficult to guarantee the reliability of operation, and moreover, it is very difficult to mount a printed circuit board (PCB) as a product.

Accordingly, the semiconductor chip is shaped on the chip for ease of use, protecting the chip from external mechanical, physical and chemical shocks, and protecting its operation function to improve reliability and mounting on a printed circuit board (PCB). It is common to package as much as possible.

In this method of packaging a semiconductor chip, the chip is usually bonded by die bonding on a pad of the lead frame, and the lead of the lead frame and the electrode of the chip are made of fine metal wires. After connection by wire bonding, sealing is performed by resin, ceramic or plastic, and then trimming and forming the lead frame.

1 illustrates a plastic package as an example of such a semiconductor package. As shown in FIG. 2, the pad 2 of the lower lead frame 1a and the lead 3 of the upper lead frame 1b, which serve as a heat sink, are bonded to each other by an adhesive 7 such as epoxy, and thus the side wall ( By forming the wall 4, a cavity 6 in which the chip 5 is seated is formed. The chip 5 is die-bonded on the pad 2 of the lower lead frame 1a, and the lead 3 of the upper lead frame 1b and the electrode (not shown) of the chip 5 are bonded wires. (8) interconnects by wire bonding. Then, the cap 9 is bonded to the opening of the cavity 6 with an adhesive 7 such as epoxy to seal the cavity 6 in which the chip 5 is seated, and then the lead frame 1 is trimmed and formed. do.

On the other hand, when the cap 9 is mounted, air compression in the cavity 6 may adversely affect the chip 5 or the like. The cap 9 has an exhaust hole 9a for discharging air in the cavity 6 to the outside. ) Is formed. Accordingly, after the cap 9 is mounted, a sealing step of sealing the exhaust hole 9a is performed.

In the sealing operation of the exhaust hole 9a, the lead frame 1 on which the cap 9 is mounted is usually transferred to the sealing process, and then the exhaust hole of the cap 9 is discharged by a dispenser unit (not shown). 9a) is filled with epoxy and cured.

However, this epoxy is a so-called thermosetting resin which is hardened by heating, and in order to seal the exhaust hole 9a reliably and smoothly, the lead frame 1 is required for curing the epoxy during or immediately after application of epoxy. It must be heated to temperature.

For example, after the epoxy is applied to the exhaust hole 9a of the cap 9, when the lead frame 1 is heated, the epoxy filled in the exhaust hole 9a before reaching the curing process. Is likely to flow into the cavity 6 and contaminate the chip 5 or the like. Accordingly, it is preferable to maintain the lead frame 1 at a predetermined temperature during the application of epoxy so that the epoxy can be applied and cured at the same time.

Therefore, the present invention provides a sealing apparatus for manufacturing a semiconductor package that can be cured simultaneously with the application of epoxy by transferring the lead frame while maintaining the lead frame at a predetermined temperature required for curing the epoxy during the sealing process of sealing the exhaust hole of the cap with epoxy. The purpose is to provide a boat unit.

In order to achieve the above object, the boat unit of the sealing apparatus for manufacturing a semiconductor package according to the present invention includes a frame disposed to be elongated in a predetermined direction; A boat mounted on the lead frame and moving along the frame; Transfer means for moving the boat; A sensor that detects whether the lead frame is loaded or unloaded with respect to the boat, respectively, and selectively drives the conveying means forward and backward; And a heater installed on the boat and heating the lead frame to a predetermined temperature.

According to one preferred feature of the present invention, the boat includes a sliding plate movably mounted to the frame; A boat base having a heater built therein and assembled on a sliding plate and having a seating groove in which a lead frame is seated on an upper surface thereof; Clamping means for fixing the lead frame in the seating groove of the boat base.

According to another preferred feature of the present invention, the conveying means includes a pair of drive and driven pulleys disposed at predetermined intervals along the longitudinal direction of the frame; A belt to which the drive and the driven pulley are electrically connected to each other, and to which the boat is connected and fixed; A motor mounted to the frame and intermittently driving the driving pulley in the forward or reverse direction; Guide means for guiding the movement of the boat.

According to another preferred feature of the invention, there is further provided a stopper which is installed at the exit of the boat and limits the movement of the lead frame loaded onto the boat.

Accordingly, in the sealing process of sealing the exhaust hole of the cap, the present invention can apply epoxy while constantly heating the lead frame to a predetermined temperature necessary for curing the epoxy, so that the epoxy can be cured simultaneously with the application of the semiconductor package. It will have a great effect on productivity, reliability and cost reduction.

1 is a cross-sectional view showing an example of a semiconductor package;

2 is a plan view of a lead frame schematically showing a process of manufacturing a semiconductor package;

Figure 3 is a front view showing the configuration of the boat unit according to the present invention,

4 is a plan view thereof;

5 is a side view thereof;

6 is an exploded perspective view of the boat taken along the VI of FIG.

7 is an exploded perspective view thereof;

8 is a cross-sectional view taken along the line VII-VII of FIG. 6,

9 is a cross-sectional view taken along the line VII-VII of FIG. 6,

10 is a cross-sectional view taken along the line VII-VII of FIG. 6,

11 is a side view showing the operation of the stopper;

FIG. 12 is a cross-sectional view taken along the line?-? Of FIG.

<Description of the code | symbol about the principal part of drawing>

1: lead frame 5: chip (in semiconductor package)

9: cap (of semiconductor package) 9a: exhaust hole (of cap)

100: frame 200: boat

220: boat base 221: seating groove

222: Guide groove (of boat base) 224: Inclined surface (of boat base)

230: glass plate 241: gripper pair

245: first air cylinder 250: stopper

251: stop plate

252: guide plate (of stopper)

253: second air cylinder (of stopper)

310, 320: driven and driven pulley 330: timing belt

340: servo motor 361: guide rail

362: guide block 370: idle roller

400: sensor 500: heater

Such specific features and other advantages of the present invention will become more apparent from the following description of the preferred embodiments with reference to the accompanying drawings.

3 to 10, the boat unit of the sealing device for manufacturing a semiconductor package according to the present invention is a frame that is installed in the conveying direction of the lead frame 1 on the base plate (base) (601) of the mount (not shown) elongated (100), a boat (200) mounted on the lead frame (1) and freely reciprocating along the frame (100), a conveying means (300) for moving the boat (200) in forward and reverse directions, and a boat ( The sensor 400 and the boat 200 for detecting the loading and unloading of the lead frame 1 with respect to the 200, respectively, to drive the transport means in forward and reverse directions are installed at a predetermined temperature required for curing the lead frame 1 with epoxy. It is provided with a heater 500 for heating.

The boat 200 has a heater base 500 built into the upper surface of the sliding plate 210 that is movably mounted to the frame 100 so that the boat base 220 for seating and supporting the lead frame 1 is assembled in a layered manner. It is composed. A glass plate 230 is preferably interposed between the boat base 220 and the sliding plate 210, which is provided by the heater 500 so that the lead frame 1 can be accurately maintained at a predetermined temperature. The heat is conducted to the sliding plate 210 to block the loss.

On the upper surface of the boat base 220, a seating groove 221 for accurate loading and seating of the lead frame 1 is formed in the traveling direction of the lead frame 1.

In addition, both edges of the lead frame 1 are clamping means 240 for fixing the lead frame 1 to both sides of the upper surface of the boat base 220, for example, both edge portions of the seating groove 221. A pair of grippers 241 that press and support the portion against the boat base 220 are rotatably assembled by hinge pins 243, respectively. To this end, a plurality of springs 244 are interposed between the boat base 220 and each gripper 241 so that each gripper 241 is opposite to each other, that is, toward the seating groove 221 of the boat base 220. elastic bias). In addition, the sliding plate 210 of the boat 200 rotates the grippers 241 in the anti-elastic direction when loading and unloading the lead frame 1 with respect to the boat base 220. A plurality of first air cylinders 245 which release the restraint of 1) are properly arranged and mounted through the brackets 247, and the rods 246 of the respective first air cylinders 245 correspond to each other. Is assembled to lugs 242 of grippers 241.

Preferably, as shown in FIG. 10, at the entrance of the boat base 220 and the grippers 241, the lead frame 1 transferred from the previous process by the loader 910 is placed on the boat 200. Inclined surfaces 224 and 241a which are inclined downward and upward at an appropriate angle are formed to be easily supplied to the inlet end thereof. At the exit of each gripper 241, the lead frame 1, which is taken out by the unloader 920, can be easily taken out to transfer the lead frame 1 having completed the sealing operation to a subsequent process. An inclined surface 241b inclined upward at an appropriate angle toward the end is formed.

Meanwhile, the lead frame 1 having completed sealing the exhaust hole 9a is taken out to the aforementioned unloader 920 by a separate pusher unit 800, and thus the seating groove 221 of the boat base 220 is provided. 8 and 10, the lead frame includes a pair of guide grooves 222 for guiding the pusher unit 800 to accurately transfer the lead frame 1 to the unloader 920, as shown in FIGS. 8 and 10. It is preferable to form in the advancing direction of (1).

A pair of drive and driven pulleys 310 and 320 are disposed at predetermined intervals along the traveling direction of the lead frame 1 on one side of the frame 100 as the conveying means 300. 330 is connected so as to be mutually rotatable. The boat 200 is connected to the timing belt 330 through the belt bracket 350 to be reciprocated along the frame 100. Accordingly, the timing belt 330 should always be maintained in an appropriate tension. As shown in FIG. 12, the timing belt 330 contacts the lower portion of the timing belt 330 at idle on one side of the frame 100. A plurality of idle rollers (370) for maintaining the tension of the (330) is arranged at an appropriate interval.

In addition, a motor for driving the timing belt 330 is installed on the other side of the frame 100, preferably, a servo motor 340 is installed for precise control and connected to the driving pulley 310 so as to connect the timing belt 330. ) Is selectively driven in the forward or reverse direction.

In addition, as a guide means 360 for guiding the transport of the boat 200 on one side of the frame 100, a linear guide rail (361) is installed long in the transport direction of the boat 200, The lower surface of the sliding plate 210 of the boat 200 is provided with a guide block (362) that is movably assembled to the guide rail 361.

As shown in FIG. 9, the sensor 400 is supported by the lower surface of the boat 200 through the sensor bracket 410 and inserted into the sensor hole 260 vertically penetrating near the exit of the boat 200. The mounting groove 221 of the base 220 is exposed. The sensor 400 may be configured in various ways, and preferably, an optical sensor having excellent operability.

The heater 500 only needs to be able to heat the boat base 220 to maintain the lead frame 1 mounted in the seating groove 221 on the upper surface thereof at a temperature necessary for curing the epoxy, for example, as shown in FIG. As the cylindrical electric heater is inserted into the heater holes 223 formed at appropriate intervals in the boat base 220, respectively. Each of the heaters 500 is preferably provided with a temperature controller 510, so that the heating temperature can be properly adjusted to the required temperature according to the type of the lead frame 1 mounted on the boat base 220, etc. do.

On the other hand, as shown in Figure 11, at the exit of the boat 200 is provided with a stopper 250 for limiting the movement of the lead frame (1) loaded onto the boat 200, such a stopper 250 is a boat It also serves to accurately set the relative position of the lead frame 1 with respect to the base 220.

This stopper 250 is required to be selectively operated so as not to interfere during the unloading of the lead frame (1) after the sealing operation is completed, for example, is installed perpendicular to the exit end of the boat 200 as shown A guide plate (252) and a stop plate (251) for stopping the lead frame (1) loaded into the boat base (220) by being guided to and lowered by the guide plate (252) and a bracket (on the boat 200). The second air cylinder 253 is installed through 254 to lift the stop plate 251.

The remaining code C is a cable-veyor that bundles and supports the wiring of each component.

Operation of the boat unit according to the present invention configured as described above is as follows.

First, in the working standby state, as shown by the solid line in FIG. 3, the boat 200 is positioned at an approximately middle portion of the frame 100.

When the work is started in this state, the servo motor 340 is reversely rotated so that the boat 200 is moved toward the inlet of the frame 100 along the timing belt 330. At this time, the first and second air cylinders 245 and 253 of the boat 200 are operated so that the grippers 241 are rotated in the semi-elastic direction to be opened and at the same time the stop plate 251 of the stopper 250 is lowered. do.

In addition, power is applied to each heater 500 to heat the heater 500 to heat the boat base 220 to a predetermined temperature for curing of the epoxy, wherein the heating temperature of the heater 500 is a temperature controller 510. Precisely controlled by As such, the heat generated from the heater 500 is effectively blocked by the glass plate 230 under the boat base 220 so that most of the heat is concentrated only in the boat base 220.

Subsequently, as shown in FIG. 10, the lead frame 1 is taken out from the loader 910 and loaded onto the seating groove 221 of the boat base 220. At this time, the lead frame 1 is guided to the inclined surfaces 224 and 241a formed at the entrance of the boat base 220 and the grippers 241 to be smoothly moved onto the boat 200.

As such, when the lead frame 1 is loaded into the seating groove 221 of the boat base 220 and the front end reaches the sensor hole 260 of the boat 200, the sensor 400 detects this and the servo motor ( 340 is driven in the forward direction. At this time, the first and second air cylinders 245 and 253 are simultaneously operated by the signal of the sensor 400.

Then, the stop plate 251 of the stopper 250 is raised to block the exit of the boat 200, so that the front end of the lead frame 1 is in contact with the stop plate 251 of the stopper 250 to prevent further transportation. In addition, the relative position with respect to the boat 200 is set correctly. At the same time, the grippers 241 are rotated in the initial direction by the restoring elasticity of the spring 244 to press and fix the lead frame 1 with respect to the boat base 220.

Next, the boat 200 is moved along the timing belt 330 toward the rear end by a predetermined distance so that the boat 200 is positioned in the middle of the frame 100, that is, the lower part of the dispenser unit 700, wherein the lead frame 1 is a heater. By the conductive heat of the boat base 220 by the 500 is appropriately heated to maintain a predetermined temperature.

When the boat 200 is stopped at the working position, the dispenser unit 700 applies a predetermined amount of epoxy to the exhaust hole 9a of each semiconductor package located on the lead frame 1. Is rapidly cured at the same time as the application by the lead frame 1 heated to a predetermined temperature to seal the exhaust hole 9a of the semiconductor package. Therefore, it is possible to effectively prevent the defect that the epoxy applied to the exhaust hole 9a flows into the cavity 6 of the semiconductor package as in the related art.

When the sealing of the exhaust hole 9a is completed as described above, the servo motor 340 is rotated again in the forward direction as shown by a virtual line in FIG. 3 to transfer the boat 200 to the rear end of the frame 100.

Subsequently, the first and second air cylinders 245 and 253 are operated to stop the stop plate 251 of the stopper 250 so as to open the exit of the boat 200 and at the same time the grippers 241 in the semi-elastic direction. Rotate to release the position fixing of the lead frame (1).

Next, the pusher unit 800 is operated, and the ejecting pin 810 is inserted into the guide groove 222 of the boat base 220 and moved to the rear end to push the lead frame 1 located on the boat 200 to unload. 920 is taken out. At this time, the unloaded lead frame 1 is smoothly taken out of the boat 200 by the inclined surface 241b formed at the exit side of each gripper 241.

After the lead frame 1 is unloaded as described above, the sensor 400 senses the front end of the lead frame 1 to drive the servo motor 340 in the reverse direction again, so that the boat 200 reframes as described above. It is moved to the front end of 100 to repeat the same operation.

As described above, according to the present invention, during the sealing process of sealing the exhaust hole of the semiconductor package with epoxy, epoxy is applied to the exhaust hole of the lead frame while the lead frame is constantly heated and maintained at a predetermined temperature required for curing the epoxy. Therefore, the epoxy can be cured at the same time as the coating.

Accordingly, it is possible to reliably prevent the possibility that the epoxy applied to the exhaust hole is introduced into the cavity of the semiconductor package due to the delay of the curing time, thereby contaminating the chip or the like.

In addition, the semiconductor package manufacturing process can be simplified, the sealing work time of the exhaust hole can be greatly reduced, and the manufacturing defect rate can be minimized.

Therefore, this invention has the very outstanding effect which can aim at cost reduction, while greatly improving productivity, reliability, etc. of a semiconductor package.

Claims (13)

A boat unit for transporting a lead frame while maintaining a predetermined temperature in a sealing process of sealing an exhaust hole of a semiconductor package with epoxy, A frame disposed to be elongated in a predetermined direction; A boat mounted on the lead frame to move freely along the frame; Transfer means for moving the boat in the forward or reverse direction; A sensor for sensing whether the lead frame is loaded or unloaded with respect to the boat, respectively, and selectively driving the transfer means forward and backward; And a heater installed on the boat to heat the lead frame to a predetermined temperature. The method of claim 1, wherein the boat, A sliding plate movably mounted to the frame; A boat base having the heater built therein and assembled on the sliding plate and having a seating groove on which the lead frame is seated; And a clamping means for fixing the lead frame in a seating groove of the boat base. The method of claim 2, wherein the clamping means, A pair of grippers arranged side by side in a predetermined direction on both sides of the upper surface of the boat base so as to be rotatably supported, respectively, elastically biased in opposite directions by elastic means to press both edge portions of the lead frame against the boat base; , And a plurality of first actuators for selectively rotating the gripper pair in its semi-elastic direction to release the restraint of the lead frame. The sealing device for manufacturing a semiconductor package according to claim 3, wherein an inclined surface inclined downward toward an edge thereof is formed at an inlet of the boat base, and an inclined surface inclined upward toward an edge thereof is formed at an entrance and exit of each gripper, respectively. Boat unit. 3. The boat unit of claim 2, wherein a heat shielding glass plate is further provided between the sliding plate and the boat base. The semiconductor package according to any one of claims 2 to 5, wherein a guide groove for guiding a movement of the extraction pin of the pusher unit for unloading the lead frame is formed on a bottom surface of the seating groove of the boat base. Boat unit of sealing device for manufacturing. The boat unit of claim 1, further comprising a temperature controller for controlling the driving of the heater so that the boat is constantly maintained at a predetermined temperature. The method of claim 1, wherein the transfer means, A pair of drive and driven pulleys disposed in the frame at predetermined intervals along the longitudinal direction thereof; A belt to which the drive and the driven pulley are electrically connected to each other and to which the boat is connected and fixed; A motor mounted to the frame to drive the drive pulley intermittently in a forward or reverse direction; Guide unit for guiding the movement of the boat; Boat unit of the sealing device for manufacturing a semiconductor package, characterized in that consisting of. The method of claim 8, wherein the guide means, A guide rail installed on one side of the frame in a moving direction of the boat; And a guide block fixed to the boat so as to be movable to the guide rail. 10. The boat unit of claim 8 or 9, further comprising a plurality of idle rollers arranged at a predetermined interval in the frame between the drive and the driven pulley to support the belt. . 10. The boat unit of claim 8, wherein the belt is a timing belt and the motor is a servo motor. 2. The boat unit of claim 1, further comprising a stopper installed at the exit of the boat to limit the movement of the lead frame loaded onto the boat. The method of claim 12, wherein the stopper, A guide plate installed at an exit end of the boat; A stop plate for stopping the lead frame during the loading by being guided and lifted by the guide plate; And a second actuator mounted on the boat to lift the stop plate.