CN102756454B - The manufacture method of resin-seal molding product - Google Patents
The manufacture method of resin-seal molding product Download PDFInfo
- Publication number
- CN102756454B CN102756454B CN201210139105.6A CN201210139105A CN102756454B CN 102756454 B CN102756454 B CN 102756454B CN 201210139105 A CN201210139105 A CN 201210139105A CN 102756454 B CN102756454 B CN 102756454B
- Authority
- CN
- China
- Prior art keywords
- resin
- downside
- sleeve pin
- components
- metal pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The object of the invention is to, a kind of manufacture method just guaranteeing the resin-seal molding product of the quality of outer shape and the electronic devices and components specified without the need to the operation of complexity with once-forming operation is provided.Comprise end face with the distance do not abutted against with electronic devices and components (11) will be outstanding to the central side of metal pattern cavity than formed products external surface (A) sleeve pin (12) and utilize cold-producing medium to carry out the centrepin (13a ~ 13d) cooled, material (14a, 14b) and upside is kept to keep material (15a, 15b) to cool, to make dimensional contraction by inserting downside.Owing to there is dimensional contraction, therefore, utilize the thermal expansion after resin seal to cause keeping the boundary face between material (14a, 14b, 15a, 15b) and sealing resin (40) to become tightly embedding, the clinging force of boundary face increases.
Description
Technical field
The present invention relates to a kind of method manufacturing resin-seal molding product, the method will to insert as the electronic devices and components of plug-in type components and parts and after being fixed on metal pattern, used around sealing resin overlay electronic components and parts by ester moulding, thus form described resin-seal molding product.
Background technology
Figure 11 represents the manufacture method of the resin-seal molding product described in patent document 1.
When being filled with a sealing resin, in metal pattern 5, maintain insertion components and parts 1.Metal pattern 5 is made up of counterdie 5a and patrix 5b.Insertion components and parts 1 are by will carrying out the electronic devices and components 3 of resin seal and making segmented shape in advance and the once-forming product 2 electronic devices and components 3 being carried out insulating wrapped formed.On once-forming product 2, be provided with multiple maintenance projection 4.Also sometimes with bonding agent, maintenance projection 4 is fixed on once-forming product 2.
Inserted by these insertion components and parts 1 and after being fixed on metal pattern 5, the cavity 50 to metal pattern 5 is filled with a sealing resin, afterwards, as shown in figure 12, by the demoulding, can obtain electronic devices and components 3 the resin-seal molding product 41 that seal by sealing resin 40.
Patent document 1: Japanese Patent Laid-Open 11-254476 publication
Summary of the invention
Component number and worker ordinal number in this existing structure, insertion components and parts 1 must be made before resin-seal molding, in any case all can increase.
If electronic devices and components 3 are directly inserted and is fixed on metal pattern 5, by the once-forming sealing resin that utilizes, electronic devices and components 3 are sealed, then maintenance projection 4 must be inserted and be fixed on metal pattern 5 before forming.But when when resin-seal molding, maintenance projection 4 is relative to electronic devices and components 3 fixing insecure, there is following problem: namely, when being filled with a sealing resin to metal pattern 5, the position of electronic devices and components 3 can be moved.
In addition, if the clinging force of the maintenance projection 4 after resin-seal molding and the boundary face between sealing resin is more weak, then because the moisture that enters from boundary face or foreign matter likely can be attached to electronic devices and components, therefore, also exist and dysgenic problem is caused to the quality of electronic devices and components 3.
The object of the invention is to, a kind of manufacture method just guaranteeing the resin-seal molding product of the quality of outer shape and the insertion components and parts specified without the need to the operation of complexity with once-forming operation is provided.
The feature of the manufacture method of resin-seal molding product of the present invention is, supporting the insertion components and parts that carry out resin seal with maintenance material and under being configured at the state in the cavity of metal pattern, make the centrepin of described maintenance material and cooling offset to fetch and cool, and start to inject sealing resin to described cavity.
Specifically, the insertion components and parts carrying out resin seal are clamped with maintenance material.In addition, utilize the sleeve pin that can freely exit relative to described cavity to support described maintenance material.
In addition, described sleeve pin is utilized to support the described maintenance material being provided with described insertion components and parts.
In addition, the feature of the manufacture method of resin-seal molding product described above is, while the described sealing resin of injection, described sleeve pin is retreated.
The size of the maintenance material cooled owing to utilizing centrepin shrinks, the thermal expansion after resin seal is utilized to cause keeping the boundary face between material and sealing resin to become tightly embedding, therefore, without the need to the operation of complexity, the outer shape specified and the quality inserting components and parts just can be guaranteed with once-forming operation.
Accompanying drawing explanation
Fig. 1 is the front sectional view of the metal pattern before and after the resin that is filled with a sealing in embodiments of the present invention 1.
Fig. 2 is the sectional view of resin-seal molding product.
Fig. 3 is the top view of the cavity in embodiments of the present invention 1.
Fig. 4 is the front sectional view of the metal pattern before and after the resin that is filled with a sealing in embodiments of the present invention 2.
Fig. 5 is the top view of the cavity in embodiments of the present invention 2.
Fig. 6 is the sectional view of resin-seal molding product.
Fig. 7 is horizontal cross and the front sectional view of metal pattern before the potting resin in embodiments of the present invention 3.
Fig. 8 is horizontal cross and the front sectional view of metal pattern after the potting resin in embodiments of the present invention 3.
Fig. 9 is the front sectional view of metal pattern before the potting resin in embodiments of the present invention 4 and the vertical view cutaway drawing of cavity.
Figure 10 is the front sectional view of metal pattern after the potting resin in embodiments of the present invention 4 and the vertical view cutaway drawing of cavity.
Figure 11 is the front sectional view of the metal pattern in the existing manufacture method described in patent document 1.
Figure 12 is with the sectional view of the resin-seal molding product manufactured by existing manufacture method.
Detailed description of the invention
Below, based on concrete each embodiment, the manufacture method of resin-seal molding product of the present invention is described.
(embodiment 1)
Fig. 1 (a), Fig. 1 (b), Fig. 2 and Fig. 3 represent embodiment 1.
Fig. 1 (a) is the sectional view of the metal pattern before resin of being filled with a sealing.
In metal pattern 5, counterdie 5a maintenance as insert components and parts electronic devices and components 11 position on, be provided with sleeve pin 12a, 12b.On the position relative with sleeve pin 12a, 12b of patrix 5b, be provided with sleeve pin 12c, 12d.Centrepin 13a, 13b, 13c, 13d is configured with in the inner side of sleeve pin 12a, 12b, 12c, 12d.
The end face of sleeve pin 12a, 12b, 12c, 12d is positioned at more outstanding and on position that is that do not abut against with electronic devices and components 11 to cavity center side than the formed products external surface A of metal pattern 5.The height of the end face of centrepin 13a, 13b, 13c, 13d is identical with the formed products external surface A of metal pattern 5.
The downside of inserting the inside diameter of sleeve pin 12a, 12b keeps the front end of material 14a, 14b to be formed with protuberance 14o, is kept downside the protuberance 14o of material 14a, 14b to insert the hole 11b of the location of electronic devices and components 11.Downside keeps the bottom of material 14a, 14b and centrepin 13a, 13b to abut against.Downside keeps material 14a, 14b to be resinous.
The upside of inserting the inside diameter of sleeve pin 12c, 12d keeps the front end of material 15a, 15b and the upper surface of electronic devices and components 11 to abut against.Upside keeps the bottom of material 15a, 15b and centrepin 13c, 13d to abut against.Upside keeps material 15a, 15b to be resinous.
Here, the front end geometry of centrepin 13a, 13b, 13c, 13d is flat shape, and the bearing surface abutted against with centrepin 13a, 13b that downside keeps material 14a, 14b is formed as flat shape, makes to abut against with larger area and centrepin 13a, 13b.The bearing surface abutted against with centrepin 13c, 13d that upside keeps material 15a, 15b is also formed as flat shape, makes to abut against with larger area and centrepin 13c, 13d.
The downside formed like this keeps material 14a, 14b and upside to keep material 15a, 15b via centrepin 13a, 13b, 13c, 13d, and cooled dose cooled.
According to said structure, kept downside material 14a, 14b and upside to keep material 15a, 15b to embed the inside diameter of sleeve pin 12a, 12b, 12c, 12d, thus can guarantee that downside keeps material 14 and upside to keep the positional precision of material 15.
When utilizing automation to insert downside maintenance material 14a, 14b and upside maintenance material 15a, 15b, because sleeve pin 12a, 12b, 12c, 12d are more outstanding than formed products external surface A, therefore, can with sleeve pin 12a, 12b, 12c, 12d for inserting benchmark.
Can insert downside keeps material 14a, 14b and upside keep material 15a, 15b and can guarantee the size of positional precision to wish the internal diameter of sleeve pin 12a, 12b, 12c, 12d and downside to be kept material 14a, 14b and upside to keep the external diameter of material 15a, 15b to be set as.
Fig. 1 (b) is the sectional view of the metal pattern after resin of being filled with a sealing.
In Fig. 1 (b), actuator can be utilized to retreat sleeve pin 12 to formed products external surface A.
Closing metal pattern 5 be filled with a sealing in the process of resin to cavity 50, utilizing the cylinder be connected to be retreated by sleeve pin 12 to formed products external surface A, in the space produced because of retrogressing, add the resin that is filled with a sealing.
For the size protruded from formed products profile of sleeve pin 12, as long as due to downside can be kept to keep material 14 and upside to keep material 15, therefore, bulge size is less, more favourable to the filling of sealing resin.
As shown in Figure 2, by being filled with a sealing resin carry out the demoulding to metal pattern 5, can obtain electronic devices and components 11 the resin-seal molding product 41 that seal by sealing resin 40.
In addition, in the present embodiment, the drive source of sleeve pin 12 is set to cylinder, but also can uses the actuators such as hydraulic cylinder, motor, solenoid and cam.
Fig. 3 is the top view of the cavity 50 of metal pattern 5 in embodiments of the present invention 1.
Downside keep material 14a and upside keep material 15a be configured at from cast gate 16 to the central portion of the flow distance 18 of the sealing resin of filling end 17a, flow distance 18 1/2 scope 19 in.Downside keep material 14b and upside keep material 15b be also configured at from cast gate 16 to the central portion of the flow distance of the sealing resin of filling end 17b, flow distance 18 1/2 scope in.
In the inside of cavity 50, due to the sealing resin of molten condition cool by metal pattern while flow, therefore, near cast gate 16, resin keeps higher temperature.Thus, the periphery after sleeve pin 12a ~ 12d retreats easily produces bubble.In addition, because the pressure putting on sealing resin near cast gate 16 is also higher, therefore, the position of electronic devices and components 11 easily offsets because of forming pressure.Forming pressure is especially easily applied to the straight line of the flow direction of the sealing resin flowed into from cast gate 16.On the other hand, because near filling end 17, sealing resin just solidifies, therefore, resin temperature is lower, and the pressure putting on sealing resin is also lower.Thus, sleeve pin 12a ~ 12d is difficult to potting resin after retreating, thus easily produces weld mark.
According to Temperature Distribution and the distribution of interior pressure of the sealing resin of cavity 50, the straight line of the flow direction of the sealing resin flowed into from cast gate 16 is avoided in the position of sleeve pin 12a, 12b under overlooking, and be configured at from cast gate 16 to the central portion of the flow distance 18 of the sealing resin of filling end 17, flow distance 18 1/2 scope 19 in.Consider the deviation in the filling moment of sealing resin, wish that the position relationship of the sleeve pin 12a ~ 12d at two places is at a distance of the equidistant position of cast gate 16.The position of sleeve pin 12c, 12d too.
In order to prevent that position skew occurs because of the forming pressure in the filling process of sealing resin 40, the moment that sleeve pin 12a ~ 12d is retreated also is important key element.The moment that sleeve pin 12a ~ 12d is retreated must be in electronic devices and components 11, downside keeps material 14a, 14b and upside keeps the surrounding of material 15a, 15b to be filled with the state of sealing resin 40.In addition, in order to make sealing resin be filled in the space produced because sleeve pin 12a ~ 12d retreats, resin must be made to be in not completely crued state, therefore, from complete sealing resin is filled to cavity 50 completely before to pressurize operation terminates during, sleeve pin 12a ~ 12d is retreated.
Utilize these structures, can obtain meet external surface do not remain the outer shape of the regulation of spill, electronic devices and components 11 are positioned assigned position and the surrounding of electronic devices and components 11 by the coated resin-seal molding product 41 of sealing resin.
In addition, centrepin 13a ~ 13d is directly cooled with cold-producing mediums such as water.Therefore, downside keeps material 14a, 14b and upside keep material 15a, 15b also cooled and dimensional contraction occurs.In this state, keep material 14a, 14b and upside to keep the surrounding of material 15a, 15b to be filled with a sealing resin to downside.Under normal temperature after forming, because the downside that there occurs dimensional contraction keeps material 14a, 14b and upside to keep material 15a, 15b to expand, therefore, downside keep material 14a, 14b and upside to keep material 15a, 15b and boundary face between sealing resin become tightly embedding.In addition, downside keeps material 14a, 14b and upside to keep material 15a, 15b expand and clamp electronic devices and components 11 securely.
Utilize these structures, because downside keeps material 14a, 14b and upside to keep the clinging force of the boundary face between material 15a, 15b and sealing resin comparatively large, moisture or foreign matter can not enter boundary face, therefore, can guarantee the quality of electronic devices and components 11.
In addition, in order to improve the cooling effect of centrepin 13a ~ 13d, make a part of internal diameter size of sleeve pin 12a, 12b larger than the external diameter of centrepin 13a, 13b, to utilize gap 51 heat insulation to carry out.In addition, also there is the method for the material use thermal conductivity of sleeve pin 12a, 12b material lower than metal pattern 5.Specifically, when metal pattern 5 is frame for movement carbon steel, stainless steel and alloy tool steel etc., the material as sleeve pin 12a, 12b uses the materials such as titanium.
In addition, make upside keep the external diameter of material 15a, 15b larger than the internal diameter of sleeve pin 12c, 12d, thus kept upside material 15a, 15b to be pressed into sleeve pin 12c, 12d, and upside keeps material 15a, 15b to fall.
In addition, retreat owing to making sleeve pin 12a ~ 12d in formation, to be kept upside material 15a, 15b to decontrol from sleeve pin 12c, 12d, therefore, also can prevent that upside occurs when opening metal pattern 5 and keep material 15a, 15b not residual situation wherein from the patrix 5a demoulding.Keep material 14a, 14b and sleeve pin 12a ~ 12d can prevent situation about remaining too for downside.
Because electronic devices and components 11 have the hole 11b of two location, places, insert and be fixed with the protuberance 14o of downside maintenance material 14a, 14b, therefore, the positional precision of electronic devices and components 11 can be guaranteed relative to metal pattern 5.
And, the material of material 15a, 15b is kept to use insulative resin owing to keeping material 14a, 14b and upside for downside, sleeve pin 12a ~ 12d does not abut against with electronic devices and components 11, therefore, such as, when needing the electric insulation guaranteeing electronic devices and components 11, even if there is electrode section and by under the state of charging at electronic devices and components 11, also can not abut against with metal pattern, thus electrical short can not occur.
In addition, in the present embodiment, the outer shape of sleeve pin 12a ~ 12d is set to circle, but also can is quadrangle.In addition, material 14a, 14b and upside is kept downside to keep the profile of material 15a, 15b to be set to circle, but when needing restriction direction of rotation when the locating hole of electronic devices and components 11 is set to the shapes such as quadrangle, also downside can be kept material 14a, 14b and upside to keep the profile of material 15a, 15b to be set to the polygons etc. such as quadrangle, to prevent from offseting along direction of rotation.
Keep material 14a, 14b and upside to keep material 15a, 15b as the sealing resin 40 injected, downside, can the synthetic resin such as polyamide-based PUR be used.
(embodiment 2)
Fig. 4 (a), Fig. 4 (b), Fig. 5 and Fig. 6 represent embodiment 2.
In embodiment 1, the hole 11b being kept downside the protuberance 14o of material 14a, 14b to insert electronic devices and components 11 positions, but in present embodiment 2, non-providing holes 11b on electronic devices and components 11.In addition, in present embodiment 2, the corner of electronic devices and components 11 is kept material and upside to keep clamped by material by downside.Other basic structure is identical with embodiment 1.
Fig. 4 (a) is the sectional view of the metal pattern before resin of being filled with a sealing, and Fig. 5 is the top view of the metal pattern before resin of being filled with a sealing.In counterdie 5a, be provided with downside keep material 20a, 20b, 20c, 20d, keep material 14a, 14b to replace the downside of embodiment 1.Downside keeps the material etc. of material 20a ~ 20d to keep material 14a, 14b identical with downside.
Downside keep material 20a ~ 20d by sleeve pin 30a, 30b, 30c, 30d support.Sleeve pin 30a ~ 30d is identical with sleeve pin 12a, 12b.In the inner side of sleeve pin 30a ~ 30d, be provided with centrepin 31a ~ 31d that front end keeps material 20a ~ 20d to abut against with downside respectively.In Figure 5, go out centrepin 31a ~ 31d although not shown, but centrepin 31c, 31d are also identical with centrepin 31a, the 31b shown in Fig. 4.Centrepin 31a ~ 31d all identically with centrepin 13a, 13b cool by cold-producing mediums such as water.
In patrix 5b, be provided with upside keep material 21a, 21b, 21c, 21d, keep material 15a, 15b to replace the upside of embodiment 1.Upside keeps material 21c, 21d although not shown, but with to be kept upside material 21a, 21b and downside to keep material 20a, 20b to be relatively configured identical, is also kept upside material 21c, 21d and downside to keep material 20c, 20d to be relatively configured.Upside keeps the material etc. of material 21a ~ 21d to keep material 15a, 15b identical with upside.
Upside keep material 21a ~ 21d by sleeve pin 32a, 32b, 32c, 32d support.Sleeve pin 32a ~ 32d is identical with sleeve pin 12c, 12d.
In the inner side of sleeve pin 32a ~ 32d, be provided with centrepin 33a ~ 33d that front end keeps material 21a ~ 21d to abut against with upside respectively.In Figure 5, go out centrepin 31a ~ 31d although not shown, but centrepin 31c, 31d are also identical with centrepin 33a, the 33b shown in Fig. 4.Centrepin 33a ~ 33d all identically with centrepin 13a, 13b cool by cold-producing mediums such as water.
Downside keeps the front end of material 20a, 20b, 20c, 20d to be formed with the recess 34 overlapped with the angle of electronic devices and components 11 when overlooking.
At least linearly depression of the abutment portion keeping material 20a ~ 20d to abut against with downside of centrepin 31a ~ 31d, downside is made to keep the inner side of recess 34 towards electronic devices and components 11 of material 20a ~ 20d, the cutting of D shape is carried out to the flange of root, makes it have the function of spline.Downside keeps the outer shape of material 20a ~ 20d also to have the shape identical with the front end of centrepin 31a ~ 31d, downside can be kept material 20a ~ 20d be inserted in the leading section of centrepin 31a ~ 31d and limit direction of rotation.
As shown in Fig. 4 (a), corner for downside is arranged at the electronic devices and components 11 that downside keeps the recess 34 of material 20a ~ 20d, due to upper surface corner by upside keep material 21a ~ 21d press, make electronic devices and components 11 can not depart from recess 34, thus limit the movement of electronic devices and components 11, therefore, even without embodiment 1 when the hole for positioning electronic devices and components 11, also can the electronic devices and components 11 in cavity 50 be positioned.
Then, as shown in Fig. 4 (b) He Fig. 5, sealing resin 40 is injected cavity 50 from cast gate 16.While injection sealing resin 40, sleeve pin 30a ~ 30d, 32a ~ 32d are retreated, and this point is identical with embodiment 1.
In addition, as shown in Figure 5, the downside in cavity 50 is kept the position of material 20a ~ 20d be configured at central portion from the cast gate 22 of central authorities to the flow distance 24 of the sealing resin of filling end 23, flow distance 24 1/2 scope 25 in.In addition, as shown in Figure 5, downside is kept the position of material 20a ~ 20d be configured at from the cast gate 26 of end face to the central portion of the flow distance 28 of the sealing resin of filling end 27, flow distance 28 1/2 scope 29 in.
According to said structure, setting downside keeps the position of material 20a ~ 20d, be located at from cast gate 22 to the central portion of the flow distance 24 of the sealing resin of filling end 23, flow distance 24 1/2 scope 25 in, thus can improve the position produced because downside keeps the forming pressure of material 20a ~ 20d and offset and the fillibility of the resin that is filled with a sealing to the space after sleeve pin 30a ~ 30d, 32a ~ 32d retrogressing.If cast gate 22 can be configured at the central portion everywhere that downside keeps material 20a ~ 20d, as long as then cast gate 22 is configured at everywhere in equidistant central part, but there is cast gate 22 on electronic devices and components 11 thus forming pressure and resin temperature likely can affect electronic devices and components 11, setting cast gate 26, make downside keep the position of material 20a ~ 20d be positioned at from cast gate 26 to the central portion of the flow distance 28 of the sealing resin of filling end 27, flow distance 28 1/2 scope 29.Be arranged at when downside being kept material 20a ~ 20d to cause downside to keep the position of material 20a ~ 20d to offset within the scope of this thus because of forming pressure space periphery generation bubble after sleeve pin 30a ~ 30d, 32a ~ 32d retreat or weld mark, by changing the moment making sleeve pin 30a ~ 30d and sleeve pin 32a ~ 32d retreat, can, according to the filling moment of the sealing resin 40 at each position, sleeve pin 30a ~ 30d, 32a ~ 32d be retreated.
As shown in Figure 6, by being filled with a sealing resin carry out the demoulding to metal pattern 5, can obtain electronic devices and components 11 the resin-seal molding product 41 that seal by sealing resin 40.
Utilize these structures, even if electronic devices and components 11 do not have locating hole, the external surface that yet can meet formed products does not remain the outer shape of the regulation of spill, thus can obtain and electronic devices and components are positioned assigned position and make resin-seal molding product coated by sealing resin around it.In addition, because the clinging force of the boundary face between the maintenance material of resin-seal molding product and sealing resin is improved, thus moisture or foreign matter can not enter boundary face, therefore, can guarantee the quality of electronic devices and components.
(embodiment 3)
Fig. 7 (a), Fig. 7 (b), Fig. 8 (a) and Fig. 8 (b) represent embodiment 3.
Fig. 7 (a), Fig. 7 (b) are horizontal cross and the front sectional view of battery resin seal metal pattern before resin filling.
Due in the battery resin seal metal pattern of the resin-seal molding product for making battery, battery 63 being configured at the rear side as the substrate 62 inserting components and parts, therefore, needing the environmental seal resin at substrate 62 under the state being configured with battery 63.
In metal pattern 103, form cavity 104 by counterdie 103a and patrix 103b.In metal pattern 103, corresponding with keeping the position of substrate 62, in counterdie 103a, be provided with sleeve pin 66a, 66b, corresponding with keeping the position of substrate 62, in patrix 103b, be provided with sleeve pin 66c, 66d.Centrepin 67a, 67b, 67c, 67d is configured with in the inner side of each sleeve pin 66a ~ 66d.The end face of sleeve pin 66a ~ 66d is positioned at more outstanding but on position that is that do not abut against with substrate 62 to the cavity center side of metal pattern than formed products external surface.The height of the end face of centrepin 67a, 67b, 67c, 67d is identical with formed products external surface.Downside maintenance material 64a, 64b that material is resin is inserted with at the inside diameter of sleeve pin 66a, 66b.Upside maintenance material 65a, 65b that material is resin is inserted with at the inside diameter of sleeve pin 66c, 66d.Keep a part for the front end of material 64a, 64b to have recess 105 in downside.Upside keeps the front end of material 65a, 65b to be flat shape.The recess 105 of material 64a, 64b is kept to aim at substrate 62 and downside carrying out insertion to fix.Cooled dose of centrepin 67a ~ 67d cooled.
According to said structure; due under the state before potting resin; machinery is utilized to keep material 64a, 64b automatically to insert the inside diameter of sleeve pin 66a, 66b downside; the profile of substrate 62 and downside is made to keep the recess 105 of material 64a, 64b to aim to carry out insertion to be fixed; therefore, the positional precision of substrate 62 relative to metal pattern 103 can be guaranteed on left and right directions and fore-and-aft direction.And, keep material 65a, 65b to clamp substrate 62 with upside, thus also can guarantee the positional precision of the above-below direction of substrate 62.
In addition, because downside keeps material 64a, 64b and upside to keep the material of material 65a, 65b to use the resin of insulating properties, sleeve pin 66a ~ 66d does not abut against with substrate 62, therefore, electrical short can not occur.
Fig. 8 is the sectional view of the battery resin seal metal pattern after the potting resin in embodiments of the present invention 3.Closing metal pattern 103 be filled with a sealing in the process of resin 40 to cavity 104, because sleeve pin 66a ~ 66d retreats to formed products external surface, and just at potting resin, therefore, sealing resin 40 can add in the space that is filled to and produces because of retrogressing.
Utilize these structures, the external surface that can meet formed products does not remain the outer shape of the regulation of spill, can by the position of substrate orientation in regulation, thus can obtain around substrate, between substrate and battery by battery resin-seal molding product that resin is coated.
In addition, due to centrepin 67a ~ 67d cool by water, therefore, downside keeps material 64a, 64b and upside to keep material 65a, 65b also cooled and dimensional contraction occurs.Owing to expanding after potting resin, therefore, downside keeps material 64a, 64b and upside to keep the boundary face between material 65a, 65b and sealing resin to become tightly embedding.
If it is small concavo-convex to make downside keep material 64a, 64b and upside to keep the lateral surface of material 65a, 65b to have, then because the boundary face between sealing resin can become more firm, thus moisture or foreign matter can not enter boundary face, therefore, higher-quality battery resin-seal molding product can be obtained.
(embodiment 4)
Fig. 9 (a), Fig. 9 (b), Figure 10 (a) and Figure 10 (b) represent embodiment 4.
In the respective embodiments described above, material 14a is kept with downside, 14b and upside keep material 15a, 15b, or downside keeps material 20a ~ 20d and upside to keep material 21a ~ 21d, or downside keeps material 64a, 64b and upside keep material 65a, 65b clamps insertion components and parts, to position the insertion components and parts in cavity, but in present embodiment 4, not keep material and upside to keep material to clamp insertion components and parts with downside, and just by being installed on metal pattern side by being arranged at the maintenance material inserting components and parts, insertion components and parts in cavity are positioned.
Fig. 9 (a) is the horizontal cross of the battery resin seal metal pattern before the potting resin in embodiments of the present invention 4.Fig. 9 (b) is the front sectional view of the cavity of battery resin seal metal pattern before potting resin.In Fig. 9 (a), (b), identical label is used to the structural element identical with Fig. 7, omits the description.
In fig .9, due in battery resin-seal molding product, battery 63 is configured at the rear side of substrate 62, therefore, needs the environmental seal resin at substrate 62 under the state being configured with battery 63.
Metal pattern 106 has sleeve pin 66a, 66b in the position of maintenance substrate 62, is configured with centrepin 67a, 67b within it.Be not provided with sleeve pin 66c, the 66d and centrepin 67c, 67d that can see in embodiment 3.
The end face of sleeve pin 66a, 66b is positioned at more outstanding but on position that is that do not abut against with substrate 62 to the cavity center side of metal pattern 106 than formed products external surface.The height of the end face of centrepin 67a, 67b is identical with formed products external surface.Maintenance material 68a, 68b that material is resin is inserted with at the inside diameter of sleeve pin 66a, 66b.
Material 68 is kept to have recess 107 at central portion.Substrate 62 has cut portion 62a at end face, can embed cut portion 62a by keeping the recess 107 of material 68a, 68b.Cooled dose of centrepin 67a, 67b cooled.
According to said structure, under the state before potting resin, by the cut portion 62a keeping the recess 107 of material 68a, 68b to embed substrate 62.Then, when being inserted into metal pattern 106, maintenance material 68a, 68b of being provided with substrate 62 are inserted and be fixed on the inside diameter of sleeve pin 66a, 66b.In addition, because battery 63 abuts against with keeping material 68a, 68b, therefore, can guarantee that substrate 62 is relative to the positional precision of metal pattern 106 on left and right directions, fore-and-aft direction and above-below direction.
In addition, due to the resin keeping the material of material 68a, 68b to use insulating properties, sleeve pin 66a, 66b do not abut against with substrate 62, therefore, electrical short can not occur.
Figure 10 (a) is the battery resin seal metal pattern horizontal cross after the potting resin in embodiment 4.Figure 10 (b) is the longitudinal sectional view of the resin-seal molding product in embodiment 4.
In Figure 10 (a), closing metal pattern 106 be filled with a sealing in the process of resin 40 between substrate 62, battery 63 and metal pattern 106, because sleeve pin 66a, 66b retreat to formed products external surface, and just at potting resin, therefore, sealing resin 40 can add in the space that is filled to and produces because of retrogressing.
Utilize this structure, the external surface that can meet formed products does not remain the outer shape of the regulation of spill, can by the position of substrate orientation in regulation, thus can obtain around substrate, between substrate and battery by battery resin-seal molding product that resin is coated.
In addition, because cooled dose of centrepin 67a, 67b cooled, therefore, keep material 68a, 68b also cooled and dimensional contraction occurs.Owing to expanding after potting resin, therefore, the boundary face between material 68a, 68b and sealing resin 40 is kept to become tightly embedding.
If it is small concavo-convex to make the lateral surface of maintenance material 68a, 68b have, then because the boundary face between sealing resin can become more firm, thus moisture or foreign matter can not enter boundary face, therefore, can obtain higher-quality battery resin-seal molding product.
Industrial practicality
The present invention is also applicable to the purposes of the seal molding of the various electronic devices and components such as electric substrate, electrode, lead-in wire, battery and connection components and parts etc.
Label declaration
5 metal patterns
5a counterdie
5b patrix
11 electronic devices and components
11b hole
12a ~ 12d, 30a ~ 30d, 32a ~ 32d sleeve pin
13a ~ 13d, 31a ~ 31d, 33a ~ 33d centrepin
Material is kept on the downside of 14a, 14b, 20a ~ 20d
The protuberance of material is kept on the downside of 14o
Material is kept on the upside of 15a, 15b, 21a ~ 21d
16,22 cast gates
17a, 17b fill end
18 flow distances
19 flow distances 18 1/2 scope
23,27 end is filled
24 flow distances
25 flow distances 24 1/2 scope
28 flow distances
29 flow distances 28 1/2 scope
The recess of material 20a, 20b, 20c, 20d is kept on the downside of in the of 34
40 sealing resins
41 resin-seal molding product
50 cavitys
51 gaps
62 substrates
62a cut portion
63 batteries
Material is kept on the downside of 64a, 64b
Material is kept on the upside of 65a, 65b
66a, 66b sleeve pin
66c, 66d sleeve pin
67a, 67b, 67c, 67d centrepin
103,106 metal patterns
103a counterdie
103b patrix
104 cavitys
The recess of material 64a, 64b is kept on the downside of in the of 105
The recess of 107 maintenance material 68a, 68b
A formed products external surface
Claims (5)
1. a manufacture method for resin-seal molding product, is characterized in that,
Supporting the insertion components and parts that carry out resin seal with maintenance material and under being configured at the state in the cavity of metal pattern, make the centrepin of described maintenance material and cooling offset to fetch and cool, and start to inject sealing resin to described cavity.
2. the manufacture method of resin-seal molding product as claimed in claim 1, is characterized in that,
The insertion components and parts carrying out resin seal are clamped with maintenance material.
3. the manufacture method of resin-seal molding product as claimed in claim 2, is characterized in that,
Utilize the sleeve pin that can freely exit relative to described cavity to support described maintenance material.
4. the manufacture method of resin-seal molding product as claimed in claim 1, is characterized in that,
Inserted and be supported on the inside diameter of sleeve pin by the described maintenance material being provided with described insertion components and parts, described sleeve pin is supported on described metal pattern.
5. the manufacture method of the resin-seal molding product as described in claim 3 or 4, is characterized in that,
While the described sealing resin of injection, described sleeve pin is retreated.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011098828 | 2011-04-27 | ||
| JP2011-098828 | 2011-04-27 | ||
| JP2012-031193 | 2012-02-16 | ||
| JP2012031193A JP5672456B2 (en) | 2011-04-27 | 2012-02-16 | Manufacturing method of resin-encapsulated molded product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102756454A CN102756454A (en) | 2012-10-31 |
| CN102756454B true CN102756454B (en) | 2016-03-09 |
Family
ID=47051209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210139105.6A Expired - Fee Related CN102756454B (en) | 2011-04-27 | 2012-04-26 | The manufacture method of resin-seal molding product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102756454B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7298085B2 (en) | 2019-07-04 | 2023-06-27 | 三桜工業株式会社 | Manufacturing method and mold for piping joint |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1601711A (en) * | 2003-09-26 | 2005-03-30 | 株式会社瑞萨科技 | Method of manufacturing a semiconductor device |
| CN101124075A (en) * | 2005-04-22 | 2008-02-13 | 三菱电机株式会社 | Method for manufacturing molded body of embedded member |
| CN101501829A (en) * | 2006-08-07 | 2009-08-05 | 住友重机械工业株式会社 | Resin sealing apparatus |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11254476A (en) * | 1998-03-13 | 1999-09-21 | Mitsubishi Eng Plast Corp | Production of resin-sealed molded product of electric/ electronic part |
| JP3661843B2 (en) * | 2000-07-13 | 2005-06-22 | 住友電装株式会社 | Molded coil and manufacturing method thereof |
-
2012
- 2012-04-26 CN CN201210139105.6A patent/CN102756454B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1601711A (en) * | 2003-09-26 | 2005-03-30 | 株式会社瑞萨科技 | Method of manufacturing a semiconductor device |
| CN101124075A (en) * | 2005-04-22 | 2008-02-13 | 三菱电机株式会社 | Method for manufacturing molded body of embedded member |
| CN101501829A (en) * | 2006-08-07 | 2009-08-05 | 住友重机械工业株式会社 | Resin sealing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102756454A (en) | 2012-10-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100541926C (en) | Composite moulded parts | |
| JP5996986B2 (en) | Manufacturing method of insert molded product | |
| CN105750491A (en) | Hollow blade wax mould forming die and hollow blade wall thickness control method | |
| US20160214296A1 (en) | Hot runner system including thermal expansion compensation device | |
| CN102905870A (en) | Clip, method for producing clip, and device for producing clip | |
| CN102756454B (en) | The manufacture method of resin-seal molding product | |
| KR101417621B1 (en) | Injection mold having rapid heating and cooling flow path | |
| CN201644706U (en) | Core shooting combined mold | |
| JP2009214532A (en) | Resin molded component and its manufacturing process | |
| KR20070110990A (en) | Die assembly | |
| CN101276920B (en) | A manufacturing method of membrane electrode assembly, membrane electrode assembly and manufacturing device thereof | |
| JP2010094937A (en) | Side valve gate type hot runner system | |
| CN103181718A (en) | Aluminum boiler with compound bottom and manufacturing method thereof | |
| KR20000063840A (en) | Manifold of injection molding machine | |
| JP2012236404A (en) | Method for manufacturing of resin sealing molded article | |
| KR101982024B1 (en) | Door Latch Terminal Assembly | |
| JP4605141B2 (en) | Insert molding die and method for producing molded product | |
| JP2015042463A (en) | Injection mold | |
| KR100971479B1 (en) | Susceptor method and susceptor thereof of casting type susceptor using in the liquid crystal display | |
| CN1962243A (en) | Automobile brake liquid tank production process | |
| JP2009023260A (en) | Resin mold die | |
| CN221935303U (en) | Mould for manufacturing valve body | |
| CN217144729U (en) | Fixed panel heat insulation structure of fixed template or movable template | |
| JP2014008685A (en) | Molding tool and molding method for resin molded body | |
| KR200463800Y1 (en) | Sheath heater for manifold |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20151224 Address after: Osaka Japan Applicant after: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co.,Ltd. Address before: Osaka Japan Applicant before: Matsushita Electric Industrial Co.,Ltd. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160309 Termination date: 20190426 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |