JP5672456B2 - Manufacturing method of resin-encapsulated molded product - Google Patents

Description

  The present invention relates to a method of manufacturing a resin-sealed molded product in which an electronic component as an inserted component is inserted and fixed in a mold and then the periphery of the electronic component is covered with a sealing resin by resin molding.

FIG. 11 shows a method for manufacturing a resin-sealed molded article described in Patent Document 1.
When the sealing resin is filled, the insert part 1 is held in the mold 5. The mold 5 includes a lower mold 5a and an upper mold 5b. The insert component 1 is formed of an electronic component 3 to be resin-sealed and a primary molded product 2 that is manufactured in advance in a divided shape and covers the electronic component 3 with insulation. The primary molded product 2 is provided with a plurality of holding projections 4. The holding protrusion 4 may be fixed to the primary molded product 2 with an adhesive.

  After the insert part 1 is inserted and fixed in the mold 5, the sealing resin is filled in the cavity 50 of the mold 5, and then the mold is released, whereby the electronic part 3 is sealed as shown in FIG. A resin-sealed molded product 41 sealed with the resin 40 can be obtained.

JP-A-11-254476

In this conventional configuration, the insert part 1 must be manufactured before the resin sealing molding, and the number of parts and the number of manufacturing steps are inevitably increased.
If the electronic component 3 is directly inserted and fixed in the mold 5 and the electronic component 3 is sealed with a sealing resin by one molding, the holding projection 4 must be inserted and fixed in the mold 5 before molding. I must. However, when the holding projection 4 is insufficiently fixed to the electronic component 3 during resin sealing molding, there is a problem that the position of the electronic component 3 moves when the mold 5 is filled with the sealing resin. .

  In addition, if the adhesion force between the holding projection 4 and the sealing resin after the resin sealing molding is weak, moisture and foreign matter entering from the boundary surface may adhere to the electronic component. It also has the problem of adversely affecting quality.

  An object of this invention is to provide the manufacturing method of the resin sealing molded product which does not require a complicated process and can ensure the predetermined external shape and the quality of an insertion part by one shaping | molding process.

  The method for producing a resin-sealed molded product according to the present invention is a method in which an insert part to be resin-sealed is supported by a holding material and placed in a cavity of a mold, and a cooled center pin is brought into contact with the holding material for cooling. And injecting sealing resin into the cavity.

Specifically, the insertion part to be resin-sealed is sandwiched between holding members. Further, the holding material is supported by a sleeve pin which can be freely moved in and out of the cavity.
The holding material on which the insertion part is set is supported by the sleeve pin.

  In the above, the sleeve pin is retracted with the injection of the sealing resin.

  Since the holding material cooled by the center pin is contracted in size and the interface between the holding material and the sealing resin is an interference fit due to thermal expansion after resin sealing, a complicated process is not required. The predetermined outer shape and the quality of the inserted part can be ensured by a single molding process.

Front sectional view of a mold before and after filling with sealing resin in Embodiment 1 of the present invention Cross section of resin-sealed molded product Plan view of cavity in embodiment 1 of the present invention Front sectional view of a mold before and after filling with sealing resin in Embodiment 2 of the present invention Cavity plan view in Embodiment 2 of the present invention Cross section of resin-sealed molded product Horizontal sectional view and front sectional view of a mold before resin filling in Embodiment 3 of the present invention Horizontal sectional view and front sectional view of the mold after resin filling in Embodiment 3 of the present invention Front sectional view of the mold before resin filling and planar sectional view of the cavity in the fourth embodiment of the present invention Front sectional view of mold after resin filling and plan sectional view of cavity in embodiment 4 of the present invention Front sectional view of a mold in the conventional manufacturing method described in Patent Document 1 Sectional view of a resin-sealed molded product manufactured by a conventional manufacturing method

Hereinafter, the manufacturing method of the resin-sealed molded product of the present invention will be described based on specific embodiments.
(Embodiment 1)
1A, 1B, 2 and 3 show the first embodiment.

Fig.1 (a) is sectional drawing of the metal mold | die before filling with sealing resin.
In the mold 5, sleeve pins 12 a and 12 b are provided on the lower mold 5 a at positions for holding an electronic component 11 as an insertion component. The upper mold 5b is provided with sleeve pins 12c and 12d at positions facing the sleeve pins 12a and 12b. Center pins 13a, 13b, 13c, 13d are arranged inside the sleeve pins 12a, 12b, 12c, 12d.

  The top surfaces of the sleeve pins 12 a, 12 b, 12 c, 12 d protrude from the molded product outer surface A of the mold 5 toward the center of the cavity and are not in contact with the electronic component 11. The top surfaces of the center pins 13 a, 13 b, 13 c, and 13 d are the same height as the molded product outer surface A of the mold 5.

  Convex portions 14o are formed at the tips of the lower holding members 14a and 14b inserted into the inner diameter portions of the sleeve pins 12a and 12b, and the convex portions 14o of the lower holding members 14a and 14b are used for positioning the electronic component 11. Is inserted into the hole 11b. The base ends of the lower holding members 14a and 14b are in contact with the center pins 13a and 13b. The lower holding members 14a and 14b are made of resin.

  The tips of the upper holding members 15 a and 15 b inserted into the inner diameter portions of the sleeve pins 12 c and 12 d are in contact with the upper surface of the electronic component 11. The base ends of the upper holding members 15a and 15b are in contact with the center pins 13c and 13d. The upper holding members 15a and 15b are made of resin.

  Here, the distal ends of the center pins 13a, 13b, 13c, and 13d are planar, and the contact surfaces of the lower holding members 14a and 14b with the center pins 13a and 13b are in contact with the center pins 13a and 13b over a wide area. It is formed in a planar shape so as to contact. The contact surfaces of the upper holding members 15a and 15b with the center pins 13c and 13d are also formed in a planar shape so as to contact the center pins 13c and 13d in a wide area.

The lower holding members 14a and 14b and the upper holding members 15a and 15b formed in this way are cooled by the refrigerant via the center pins 13a, 13b, 13c and 13d.
According to such a configuration, the lower holding member 14 and the upper holding member 15 are fitted by fitting the lower holding members 14a and 14b and the upper holding members 15a and 15b into the inner diameter portions of the sleeve pins 12a, 12b, 12c and 12d. Position accuracy can be secured.

  When the lower holding members 14a, 14b and the upper holding members 15a, 15b are inserted by an automatic machine, the sleeve pins 12a, 12b, 12c, 12d protrude from the outer shape surface A of the molded product. 12b, 12c, and 12d can be used as insertion criteria.

  The inner diameters of the sleeve pins 12a, 12b, 12c and 12d and the outer diameters of the lower holding members 14a and 14b and the upper holding members 15a and 15b are positioned so that the lower holding members 14a and 14b and the upper holding members 15a and 15b can be inserted. Dimension setting that can ensure accuracy is desirable.

FIG.1 (b) is sectional drawing of the metal mold | die after filling with sealing resin.
In FIG.1 (b), the sleeve pin 12 can be retracted to the molded article outer surface A by an actuator.

  In the process in which the mold 5 is closed and the cavity 50 is filled with the sealing resin, the sleeve pin 12 is moved back to the molded product outer surface A by the connected air cylinder, The sealing resin is additionally filled.

  Since the convex dimension from the outer shape of the molded product of the sleeve pin 12 only needs to be able to hold the lower holding member 14 and the upper holding member 15, the smaller convex dimension is advantageous for filling the sealing resin.

By filling the mold 5 with the sealing resin and releasing, a resin-sealed molded product 41 in which the electronic component 11 is sealed with the sealing resin 40 as shown in FIG. 2 can be obtained.
In the present embodiment, the drive source of the sleeve pin 12 is an air cylinder, but an actuator such as a hydraulic cylinder, a motor, a solenoid, or a cam may be used.

FIG. 3 is a plan view of the cavity 50 of the mold 5 according to Embodiment 1 of the present invention.
The lower holding material 14a and the upper holding material 15a are arranged in a range 19 that is ½ of the flow distance 18 at the center of the flow distance 18 of the sealing resin from the gate 16 to the filling end 17a. The lower holding material 14b and the upper holding material 15b are also arranged in the range of ½ of the flow distance 18 at the center of the flow distance of the sealing resin from the gate 16 to the filling end 17b.

  Inside the cavity 50, the molten sealing resin flows while being cooled in the mold, so that the resin temperature is kept high in the vicinity of the gate 16. For this reason, it becomes easy to generate a void in the periphery after the sleeve pins 12a to 12d are retracted. Further, since the pressure applied to the sealing resin is high in the vicinity of the gate 16, the electronic component 11 is likely to be displaced due to the molding pressure. In particular, molding pressure tends to be applied on the straight line in the flow direction of the sealing resin flowing from the gate 16. On the other hand, since the sealing resin is solidified near the filling end 17, the resin temperature is low and the pressure applied to the sealing resin is also low. For this reason, it is difficult to fill the resin after the sleeve pins 12a to 12d are retracted, and a weld line is likely to occur.

  From the temperature distribution and the internal pressure distribution of the sealing resin in the cavity 50, the position of the sleeve pins 12a and 12b in a plan view avoids a straight line in the flow direction of the sealing resin flowing from the gate 16 and from the gate 16 to the filling end 17. In the center of the flow distance 18 of the sealing resin up to, it is arranged in a range 19 that is ½ of the flow distance 18. The positional relationship between the two sleeve pins 12a to 12d is preferably a position equidistant from the gate 16 in consideration of variations in the filling timing of the sealing resin. The positions of the sleeve pins 12c and 12d are the same.

  In order to prevent displacement due to the molding pressure during the filling process of the sealing resin 40, the timing of retracting the sleeve pins 12a to 12d is also an important factor. The timing for retracting the sleeve pins 12a to 12d must be such that the sealing resin 40 is filled around the electronic component 11, the lower holding members 14a and 14b, and the upper holding members 15a and 15b. Further, since the sealing resin is filled in the space formed by retreating the sleeve pins 12a to 12d, the resin must be in a state of not completely solidified, so that the sealing resin is completely filled in the cavity 50. The sleeve pins 12a to 12d are retracted immediately before the completion of the pressure holding process.

  With these configurations, it is possible to obtain a resin-encapsulated molded product 41 that satisfies a predetermined outer shape that does not leave a concave shape on the outer surface, that is, the electronic component 11 is positioned at a predetermined position and that is covered with a sealing resin. it can.

  Furthermore, the center pins 13a to 13d are directly cooled by a refrigerant such as water. Therefore, the lower holding members 14a and 14b and the upper holding members 15a and 15b are also cooled and contracted in size. In this state, sealing resin is filled around the lower holding materials 14a and 14b and the upper holding materials 15a and 15b. Since the lower holding members 14a and 14b and the upper holding members 15a and 15b, which have been dimensionally shrunk at room temperature after molding, expand, the lower holding members 14a and 14b and the upper holding members 15a and 15b are bounded with the sealing resin. The surface is an interference fit. In addition, the lower holding members 14a and 14b and the upper holding members 15a and 15b expand to firmly sandwich the electronic component 11.

  With these configurations, the adhesion between the lower holding material 14a, 14b, the upper holding material 15a, 15b, and the sealing resin is increased, and moisture and foreign matter do not enter the boundary surface. Can be secured.

  In order to increase the cooling effect of the center pins 13a to 13d, the inner diameters of the sleeve pins 12a and 12b are partially larger than the outer diameters of the center pins 13a and 13b and are insulated by the gap 51. In addition, there is a method in which the sleeve pins 12 a and 12 b are made of a material having a lower thermal conductivity than that of the mold 5. Specifically, when the mold 5 is carbon steel for mechanical structure, stainless steel, alloy tool steel or the like, a material such as titanium is used as the material of the sleeve pins 12a and 12b.

  Further, by making the outer diameters of the upper holding members 15a and 15b larger than the inner diameters of the sleeve pins 12c and 12d, the upper holding members 15a and 15b are press-fitted into the sleeve pins 12c and 12d, and the upper holding members 15a and 15b. Will not fall.

  Further, since the sleeve pins 12a to 12d retreat during molding and the upper holding members 15a and 15b are released from the sleeve pins 12c and 12d, when the mold 5 is opened, the upper holding members 15a and 15b are removed from the upper die 5a. It is also possible to prevent remaining without being released. This can be similarly prevented by the lower holding members 14a and 14b and the sleeve pins 12a to 12d.

  Since the electronic component 11 has two positioning holes 11b and is inserted into and fixed to the convex portions 14o of the lower holding members 14a and 14b, the positional accuracy of the electronic component 11 with respect to the mold 5 is fixed. Can be secured.

  Furthermore, the lower holding members 14a and 14b and the upper holding members 15a and 15b are made of insulating resin, and the sleeve pins 12a to 12d do not contact the electronic component 11, so that the electronic component 11 is electrically When insulation is required, for example, even when the electronic component 11 has an electrode portion and is charged, it does not come into contact with the mold, and an electrical short circuit does not occur.

  In the present embodiment, the outer shape of the sleeve pins 12a to 12d is circular, but may be rectangular. The outer shape of the lower holding members 14a and 14b and the upper holding members 15a and 15b is circular. However, when the positioning hole of the electronic component 11 is a square or the like and the rotation direction needs to be regulated, the lower holding material is used. The outer shapes of 14a and 14b and the upper holding members 15a and 15b can also be polygonal shapes such as a quadrangle so as not to be displaced in the rotation direction.

As the sealing resin 40, the lower holding members 14a and 14b, and the upper holding members 15a and 15b to be injected, a synthetic resin such as polyamide hot melt can be used.
(Embodiment 2)
4 (a), 4 (b), 5 and 6 show the second embodiment.

  In the first embodiment, the convex portions 14o of the lower holding members 14a and 14b are inserted and positioned in the holes 11b of the electronic component 11, but in the second embodiment, the electronic components 11 are not provided with the holes 11b. . Furthermore, in the second embodiment, the four corners of the electronic component 11 are sandwiched between the lower holding material and the upper holding material. Other basic structures are the same as those of the first embodiment.

  FIG. 4A is a cross-sectional view of the mold before filling with the sealing resin, and FIG. 5 is a plan view of the mold before filling with the sealing resin. The lower mold 5a is provided with lower holding members 20a, 20b, 20c, and 20d in place of the lower holding members 14a and 14b of the first embodiment. The materials of the lower holding members 20a to 20d are the same as those of the lower holding members 14a and 14b.

  The lower holding members 20a to 20d are supported by sleeve pins 30a, 30b, 30c, and 30d. The sleeve pins 30a to 30d are all the same as the sleeve pins 12a and 12b. Inside the sleeve pins 30a to 30d, there are provided center pins 31a to 31d whose tips abut against the lower holding members 20a to 20d, respectively. Although the center pins 31a to 31d are not shown in FIG. 5, the center pins 31c and 31d are the same as the center pins 31a and 31b shown in FIG. The center pins 31a to 31d are all cooled by a coolant such as water in the same manner as the center pins 13a and 13b.

  The upper mold 5b is provided with upper holding members 21a, 21b, 21c, and 21d instead of the upper holding members 15a and 15b of the first embodiment. Although the upper holding members 21c and 21d are not shown, the upper holding members 21c and 21d are also held on the lower side in the same manner as the upper holding members 21a and 21b are arranged to face the lower holding members 20a and 20b. It arrange | positions facing material 20c, 20d. The upper holding members 21a to 21d are made of the same material as the upper holding members 15a and 15b.

  The upper holding members 21a to 21d are supported by sleeve pins 32a, 32b, 32c, and 32d. The sleeve pins 32a to 32d are all the same as the sleeve pins 12c and 12d.

  Inside the sleeve pins 32a to 32d, center pins 33a to 33d whose tips are in contact with the upper holding members 21a to 21d are provided. Although the center pins 31a to 31d are not shown in FIG. 5, the center pins 31c and 31d are the same as the center pins 33a and 33b shown in FIG. The center pins 33a to 33d are all cooled by a coolant such as water in the same manner as the center pins 13a and 13b.

At the tip of the lower holding members 20a, 20b, 20c, and 20d, a recess 34 that matches the corner of the electronic component 11 in plan view is formed.
The contact portions of the center pins 31a to 31d with the lower holding materials 20a to 20d are concave at least on one side so that the concave portions 34 of the lower holding materials 20a to 20d face the inside of the electronic component 11. The root ridge is D-cut and has a detent function. The outer shapes of the lower holding members 20a to 20d have the same shape as the tips of the center pins 31a to 31d, and the lower holding members 20a to 20d regulate the rotation direction at the tip portions of the center pins 31a to 31d. Can be inserted.

  As shown in FIG. 4 (a), the lower four corners are set in the recesses 34 of the lower holding members 20a to 20d. The upper four corners are upper holding members 21a to 21d and the electronic component 11 is recessed. Since the movement of the electronic component 11 is restricted so as not to come off from the position 34, the electronic component 11 in the cavity 50 can be positioned even if the electronic component 11 in the first embodiment has no positioning hole.

  Then, as shown in FIGS. 4B and 5, the sealing resin 40 is injected from the gate 16 into the cavity 50. The sleeve pins 30a to 30d and 32a to 32d are retracted in accordance with the injection of the sealing resin 40 as in the first embodiment.

  Note that the positions of the lower holding members 20a to 20d in the cavity 50 are the central part of the flow distance 24 of the sealing resin from the central gate 22 to the filling end 23 as shown in FIG. 2 in a range 25. Alternatively, the positions of the lower holding members 20a to 20d are within a range 29 that is ½ of the flow distance 28 at the central portion of the flow distance 28 of the sealing resin from the gate 26 to the filling end 27 as shown in FIG. Is arranged.

  According to this configuration, the positions of the lower holding members 20a to 20d are in the range 25 that is ½ of the flow distance 24 at the center of the flow distance 24 of the sealing resin from the gate 22 to the filling end 23. Therefore, the position shift due to the molding pressure of the lower holding members 20a to 20d and the filling property of the sealing resin into the space after the sleeve pins 30a to 30d and 32a to 32d are retracted can be improved. If the gates 22 can be arranged at the four central parts of the lower holding members 20a to 20d, the gates 22 may be arranged at the central part where the four parts are equidistant. If there is a concern about the influence of molding pressure and resin temperature on the electronic component 11, the position of the lower holding members 20 a to 20 d is the flow distance 28 of the sealing resin from the gate 26 to the filling end 27. The gate 26 is set so as to be in a range 29 that is ½ of the flow distance 28 at the center of the center. The lower holding materials 20a to 20d cannot be installed within this range, and the positions of the lower holding materials 20a to 20d due to the molding pressure and the space around the space after the sleeve pins 30a to 30d and 32a to 32d have retreated. When voids or welds are generated, the sleeve pins 30a to 30d and 32a are adjusted in accordance with the filling timing of the sealing resin 40 at the respective locations by changing the timing of retracting the sleeve pins 30a to 30d and the sleeve pins 32a to 32d. ~ 32d can be retracted.

By filling the mold 5 with the sealing resin and releasing it, a resin-sealed molded product 41 in which the electronic component 11 is sealed with the sealing resin 40 as shown in FIG. 6 can be obtained.
With these configurations, even if the electronic component 11 does not have a positioning hole, a predetermined outer shape that does not leave a concave shape on the outer surface of the molded product is satisfied, the electronic component is positioned at a predetermined position, and the periphery is sealed. A resin-sealed molded article coated with a stop resin can be obtained. In addition, the boundary surface between the holding material of the resin-sealed molded product and the sealing resin has increased adhesion, and moisture and foreign matter do not enter the boundary surface, so that the quality of the electronic component can be ensured.

(Embodiment 3)
7 (a), 7 (b), 8 (a), and 8 (b) show the third embodiment.
FIG. 7A and FIG. 7B are a horizontal sectional view and a front sectional view of the battery resin-sealed mold before resin filling.

  In a battery resin-sealed mold for making a resin-molded molded product of a battery, the battery 63 is disposed on the back side of the substrate 62 as an insertion part, so that the battery 63 is disposed around the substrate 62. It is necessary to seal the resin.

  In the mold 103, a cavity 104 is formed by a lower mold 103a and an upper mold 103b. In the mold 103, sleeve pins 66a and 66b are provided on the lower mold 103a corresponding to positions where the substrate 62 is held, and sleeve pins 66c and 66d are provided on the upper mold 103b corresponding to positions where the substrate 62 is held. Yes. Center pins 67a, 67b, 67c, 67d are arranged inside the sleeve pins 66a-66d. The top surfaces of the sleeve pins 66 a to 66 d protrude from the outer shape of the molded product toward the cavity center side of the mold, but are not in contact with the substrate 62. The top surfaces of the center pins 67a, 67b, 67c, and 67d have the same height as the outer shape surface of the molded product. The lower holding members 64a and 64b made of resin are inserted into the inner diameter portions of the sleeve pins 66a and 66b. Upper holding members 65a and 65b made of resin are inserted into the inner diameter portions of the sleeve pins 66c and 66d. A recess 105 is formed at a part of the tip of the lower holding members 64a and 64b. The tips of the upper holding members 65a and 65b have a planar shape. The substrate 62 is inserted and fixed in accordance with the recesses 105 of the lower holding members 64a and 64b. The center pins 67a to 67d are cooled by the refrigerant.

  According to such a configuration, the lower holding members 64a and 64b are automatically inserted into the inner diameter portions of the sleeve pins 66a and 66b by the machine before the resin is filled, and the substrate is placed in the recess 105 of the lower holding members 64a and 64b. Since the outer shape of 62 is inserted and fixed, the positional accuracy of the substrate 62 with respect to the mold 103 can be ensured in the left-right direction and the front-rear direction. Furthermore, the positional accuracy in the vertical direction of the substrate 62 can be ensured by sandwiching the upper holding members 65a and 65b.

  The lower holding members 64a and 64b and the upper holding members 65a and 65b are made of insulating resin, and the sleeve pins 66a to 66d do not come into contact with the substrate 62, so that an electrical short circuit occurs. Never do.

  FIG. 8 is a cross-sectional view of the battery resin-sealed mold after resin filling in Embodiment 3 of the present invention. In the process in which the mold 103 is closed and the sealing resin 40 is filled in the cavity 104, the sleeve pins 66a to 66d are retracted to the outer surface of the molded product, and the resin is being filled, so that it is retracted. The space is additionally filled with sealing resin 40.

  With these configurations, a battery resin seal in which a predetermined outer shape that does not leave a concave shape on the outer surface of the molded product is satisfied, the substrate is positioned at a predetermined position, and the periphery of the substrate and the space between the substrate and the battery are covered with resin. A stop-molded product can be obtained.

  Further, since the center pins 67a to 67d are cooled with water, the lower holding members 64a and 64b and the upper holding members 65a and 65b are also cooled and contracted in size. Due to the expansion after the resin is filled, the lower holding members 64a and 64b and the upper holding members 65a and 65b have an interference fit with the sealing resin.

  By providing minute irregularities on the outer surfaces of the lower holding members 64a and 64b and the upper holding members 65a and 65b, the boundary surface with the sealing resin becomes stronger and moisture and foreign matter do not enter the boundary surfaces. A higher quality battery resin encapsulated molded product can be obtained.

(Embodiment 4)
9 (a), 9 (b), 10 (a), and 10 (b) show a fourth embodiment.
In each of the above embodiments, the lower holding members 14a and 14b and the upper holding members 15a and 15b, or the lower holding members 20a to 20d and the upper holding members 21a to 21d, or the lower holding members 64a and 64b are inserted. The upper holding bodies 65a and 65b are used to position the insertion part in the cavity. However, the insertion part is not sandwiched between the lower holding material and the upper holding body. By simply attaching the holding material set on the part to the mold side, the insertion part is positioned in the cavity.

  FIG. 9A is a horizontal cross-sectional view of the battery resin-sealed mold before resin filling in Embodiment 4 of the present invention. FIG.9 (b) is front sectional drawing of the cavity of the battery resin sealing metal mold | die before resin filling. 9A and 9B, the same components as those in FIG. 7 are denoted by the same reference numerals, and the description thereof is omitted.

In FIG. 9, in the resin-sealed molded product of the battery, since the battery 63 is disposed on the back side of the substrate 62, it is necessary to seal the resin around the substrate 62 in a state where the battery 63 is disposed.
The mold 106 has sleeve pins 66a and 66b at positions where the substrate 62 is held, and center pins 67a and 67b are arranged inside. The sleeve pins 66c and 66d and the center pins 67c and 67d found in the third embodiment are not provided.

  The top surfaces of the sleeve pins 66a, 66b protrude from the outer shape of the molded product toward the cavity center of the mold 106, but are not in contact with the substrate 62. The top surfaces of the center pins 67a and 67b are the same height as the outer shape surface of the molded product. Holding members 68a and 68b made of resin are inserted into the inner diameter portions of the sleeve pins 66a and 66b.

  The holding material 68 has a recess 107 at the center. The substrate 62 has a notch 62a on the end surface, and the recesses 107 of the holding members 68a and 68b can be fitted into the notch 62a. The center pins 67a and 67b are cooled by the refrigerant.

  According to such a configuration, the concave portions 107 of the holding members 68a and 68b are fitted into the notches 62a of the substrate 62 in a state before being filled with the resin. When inserting into the mold 106, the holding members 68a and 68b on which the substrate 62 is set are inserted and fixed to the inner diameter portions of the sleeve pins 66a and 66b. Further, since the battery 63 is in contact with the holding members 68a and 68b, the substrate 62 can ensure the positional accuracy with respect to the mold 106 in the left-right direction, the front-rear direction, and the up-down direction.

Further, the holding materials 68a and 68b are made of an insulating resin, and the sleeve pins 66a and 66b do not come into contact with the substrate 62, so that an electrical short circuit does not occur.
FIG. 10A is a horizontal cross-sectional view of the battery resin-sealed mold after resin filling in the fourth embodiment. FIG.10 (b) is a longitudinal cross-sectional view of the resin sealing molded product in Embodiment 4. FIG.

  In FIG. 10A, the sleeve pins 66a and 66b are formed in the process of closing the mold 106 and filling the sealing resin 40 between the substrate 62, the battery 63, and the mold 106. Since the resin is being filled, the space formed by the receding is additionally filled with the sealing resin 40.

  This configuration satisfies a predetermined external shape that does not leave a concave shape on the external surface of the molded product, and the substrate is positioned at a predetermined position, and the battery resin sealing in which the periphery of the substrate and the space between the substrate and the battery are covered with resin A molded product can be obtained.

  Further, since the center pins 67a and 67b are cooled by the refrigerant, the holding materials 68a and 68b are also cooled and the dimensions are contracted. Due to the expansion after the resin filling, the holding materials 68a and 68b have a tight fit at the boundary surface with the sealing resin 40.

  If the outer surfaces of the holding materials 68a and 68b have minute irregularities, the boundary surface with the sealing resin becomes stronger, and moisture and foreign matter do not enter the boundary surface. A molded product can be obtained.

  The present invention can also be applied to sealing molding applications of various electronic components such as electronic substrates, electrodes, lead wires, batteries, and connector components.

5 Mold 5a Lower mold 5b Upper mold 11 Electronic component 11b Holes 12a-12d, 30a-30d, 32a-32d Sleeve pins 13a-13d, 31a-31d, 33a-33d Center pins 14a, 14b, 20a-20d Lower holding Material 14o Lower holding material projections 15a, 15b, 21a-21d Upper holding material 16, 22 Gates 17a, 17b Filling end 18 Flowing distance 19 Range 1/2 of flow distance 18 23, 27 Filling end 24 Flowing distance 25 Range 1/2 of flow distance 24 Flow range 29 Range of 1/2 flow distance 28 Recess 40 of lower holding material 20a, 20b, 20c, 20d 40 Sealing resin 41 Resin sealing molded product 50 Cavity 51 Gap 62 Substrate 62a Notch 63 Battery 64a, 64b Lower holding material 65a, 65b Upper holding material 66a, 66b Three Pins 66c, 66d Sleeve pins 67a, 67b, 67c, 67d Center pins 103, 106 Mold 103a Lower mold 103b Upper mold 104 Cavity 105 Recessed portions of lower holding materials 64a, 64b 107 Recessed portions of holding materials 68a, 68b A Molded product outer shape surface

Claims (5)

With the insertion part to be sealed with resin supported by the holding material and placed in the cavity of the mold, the cooling center pin is brought into contact with the holding material for cooling, and injection of the sealing resin into the cavity is started. A method for producing a resin-sealed molded product. The method for producing a resin-sealed molded product according to claim 1, wherein the insertion part to be resin-sealed is sandwiched between holding members. The method for producing a resin-sealed molded product according to claim 2, wherein the holding material is supported by a sleeve pin that is freely retractable with respect to the cavity. The method for manufacturing a resin-sealed molded product according to claim 1, wherein the holding material on which the insertion part is set is supported by the sleeve pin. The method for producing a resin-sealed molded product according to claim 3 or 4, wherein the sleeve pin is retracted in accordance with the injection of the sealing resin.

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