JP5996986B2 - Manufacturing method of insert molded product - Google Patents

Description

  The present invention relates to a method of manufacturing an insert molded product such as a switch pole board.

  Conventionally, as a method of manufacturing this type of insert-molded product, for example, as described in Patent Document 1 below, a presser pin attached to an upper die is inserted into an insert member placed on a support piece provided in a lower die. The resin material was injected between the upper mold and the lower mold while being pressed and positioned, and the presser pin was retracted before the injected resin material was cured and pressed with the presser pin. A method is known in which a resin material is poured into a portion and shielded.

JP 2012-125931 A

  However, according to the prior art according to Patent Document 1, the insert member placed on the support piece provided in the lower mold is positioned by pressing with the presser pin attached to the upper side. The portion in contact with the lower mold support piece cannot be shielded with a resin material, and the entire insert member cannot be shielded with a resin material, so that there is a problem that higher waterproofness and insulation are not easy. .

  Therefore, the present invention aims to solve the above-mentioned problems in the prior art, and to provide a method for manufacturing an insert molded product that can shield the entire insert member with a resin material and can easily ensure higher waterproofness and insulation. And

In order to solve this problem, the present invention according to claim 1 is an insert molded product in which an insert member is installed in a mold, and a molten resin material is injected into the mold to insert-mold the insert member. A mold clamping step of positioning an insert member installed in the mold by a pressing pin; an injection step of injecting the resin material into the mold; and Is filled with the resin material, and before the resin material is cured, a pin moving step of retracting the presser pin to a position along the inner surface of the mold, and a mold with the resin material cured open to and a taking-out step of taking out the insert molding in which the insert member is insert-molded, the mold has an inlet for injecting the resin material, provided continuously to the inlet port A molding space for molding the insert-molded product, and an introduction space that is continuously provided in the molding space and retracts the presser pin with the pressure of the resin material to be filled, and the pin moving step In this case, after the filling of the resin material into the molding space is completed, the presser pin is moved backward by the pressure of the resin material introduced from the molding space into the introduction space .

Positioning claim 2 is the method according to claim 1 Symbol placement of the insert molding, the mold clamping step, across the insert member by a pair of the pressing pin mounted for reciprocating in opposite directions to each other and, the pin moving step, said retracting the respective pressing pin distal end face of each presser pin to a position along the inner surface of the mold to release the positioning of the insert member and the mold and the insert member wherein to form a gap for pouring a resin material, characterized in that during.

  According to the present invention, after the insert member installed in the mold is positioned by pressing with a presser pin, the resin material is injected into the mold and before the resin material is cured, the inner surface of the mold Then, the presser pin is retracted to a position along, and the mold is opened in a state where the resin material is cured, and an insert molded product in which the insert member is insert-molded is taken out. In other words, in order to retract the presser pin to a position along the inner surface of the mold, the resin material flows into the gap between the retracted presser pin and the insert member, and the portion where the insert member is pressed by the presser pin is It can be shielded with resin material as well as the part not pressed by the pin. Therefore, the entire insert member can be shielded with the resin material, and higher waterproofness and insulation can be easily ensured.

  Also, after injecting a resin material into the mold inlet and filling the mold molding space with the resin material, press the presser pin with the pressure of the resin material introduced from the molding space into the introduction space. Retreat. That is, since the resin material is introduced into the introduction space after the molding space is filled, the presser pin is moved backward by the resin material introduced into the introduction space after the molding space is reliably filled with the resin material. Therefore, the timing of retracting the presser pin can be adjusted only by the design of the mold while the resin material can be more reliably filled into the molding space.

  Furthermore, the resin material is injected in a state where the insert member is positioned with a pair of presser pins attached so as to be able to advance and retreat in directions facing each other, and the tip of each presser pin is in a state before the resin material is cured. Each presser pin is retracted to a position where the surface is along the inner surface of the mold, the positioning of the insert member is released, and a gap for pouring a resin material is formed between the insert member and the mold. As a result, each portion where the insert member is pressed and positioned by each presser pin can be shielded by the resin material in the same manner as the portion not pressed by this presser pin. Therefore, since the entire insert member can be similarly shielded with the resin material, higher waterproofness and insulation can be easily ensured.

It is a schematic sectional drawing which shows the clamping state of the metal mold | die used for the manufacturing method of the insert molded product by 1st Embodiment of this invention. It is a schematic sectional drawing which shows the state which injected the resin material in the said metal mold | die. It is a schematic sectional drawing which shows the state which retracted the pressing pin of the said metal mold | die. It is a schematic plan view which shows the shaping | molding space and introduction space of the said metal mold | die. It is a schematic sectional drawing which shows the shaping | molding space and introduction space of the said metal mold | die. It is a schematic sectional drawing which shows the insert molded product manufactured with the said metal mold | die. It is a figure which shows the insert member used for the manufacturing method of the insert molded product by 2nd Embodiment of this invention, (a) is a top view, (b) is AA sectional drawing of (a). It is a schematic sectional drawing which shows the state which injected the resin material in the metal mold | die for insert-molding the said insert member. It is a schematic sectional drawing which shows the state which retracted the pressing pin of the said metal mold | die.

[First Embodiment]
A method for manufacturing an insert-molded product according to a first embodiment of the present invention will be described with reference to FIGS.

<Overall configuration>
The manufacturing apparatus 1 used for the manufacturing method of the insert molded product A is a two-plate type insert molding apparatus, and is a highly waterproof conductive plate B as an insert member (terminal) to be insert-molded in the insert molded product A. The purpose is to ensure performance and insulation performance. Here, the conductive plate B is a conductive plate formed of, for example, a conductive metal material such as copper, and serves as a part serving as a switch pole board, terminal, fixed contact, or the like. Specifically, after the conductive plate B is insert-molded into the insert-molded product A, as shown in FIG. 6, the entire conductive plate B is entirely shielded with an insulating resin C, It is structured to ensure waterproofness and insulation.

  The manufacturing apparatus 1 includes a mold 4 composed of an upper mold 2 and a lower mold 3. And this manufacturing apparatus 1 installs these conductive plates B in the molding space 5 as a molding part which is a resin filling area between the upper mold 2 and the lower mold 3 of the mold 4, In a state where the upper mold 2 and the lower mold 3 are clamped, an insulating resin C, which is a resin material, is injected and injected into a molding space 5 between the upper mold 2 and the lower mold 3, thereby providing a conductive plate. An insert molded product A in which B is insert-molded is manufactured. Specifically, the mold 4 includes an upper mold 2 that constitutes about a half of the upper side of the mold 4 and a lower mold 3 that constitutes about a half of the lower side of the mold 4. Become.

<Upper mold>
On the molding surface 2a as a parting line, which is the lower surface of the upper mold 2 of the mold 4, an upper mold space 21 serving as a molding area having a substantially concave cross section opened downward is provided. A pin insertion hole 22 penetrating from the upper mold space 21 toward the outside of the upper mold 2 is formed in the bottom portion 21 a of the upper mold space 21. For example, about three of these pin insertion holes 22 are provided at a predetermined interval. As shown in FIG. 5, a resin injection port 23 as an introduction port for injecting the insulating resin C into the upper mold space 21 is provided at the opening edge of the upper mold space 21 of the upper mold 2. ing.

As shown in FIGS. 4 and 5, the resin injection port 23 is provided along the vertical direction of the upper mold 2, and a gate that is bent at the lower end side of the resin injection port 23 and communicates with the upper mold space 21. 23a is provided. The gate 23a is in communication with the upper mold space 21 distal end, an insulating resin C emitted from the resin injection port 23, to introduce into the molding space 5 from the resin Inlet 23.

  Further, each pin insertion hole 22 of the upper mold 2 is attached with an elongate columnar presser pin 24 inserted therein, and these presser pins 24 are inserted through the pin insertion holes 22 and penetrated. These pin insertion holes 22 are attached so as to be able to advance and retract along the axial direction. Further, a horizontal pressing surface 24a orthogonal to the axial direction is formed at the tip of each pressing pin 24, and these pressing surfaces 24a are positioned by pressing the upper surface side of the conductive plate B accommodated in the mold 4. It is supposed to be a part to do.

  And the base end side which protrudes from the upper mold | type 2 of each of these presser pins 24 is attached and fixed to the moving plate 25 for making these presser pins 24 move forward and backward simultaneously. The moving plate 25 is mounted in parallel along the upper surface 2b located on the upper side of the upper mold 2, and a spring 27 as an elastic member is mounted between the moving plate 25 and a support plate 26 installed facing the moving plate 25. The spring 27 is biased toward the upper surface 2b of the upper mold 2. A plurality of, for example, two springs 27 are installed between the support plate 26 and the moving plate 25 at a predetermined interval. The axial direction of each of the springs 27 extends in the thickness direction of the moving plate 25. It is attached along.

  Here, the support plate 26 is attached and fixed in parallel with a predetermined distance D between the support plate 26 and the upper surface 2 b of the upper mold 2. Specifically, the predetermined distance D is larger than the protruding distance from the bottom portion 21a of the upper mold 2 when the conductive plate B is positioned by each pressing pin 24. The moving plate 25 is attached so as to be movable in the vertical direction at the predetermined distance D, and a spring 27 is attached between the moving plate 25 and the support plate 26. Further, the upper plate pinning mechanism 28 is attached to the moving plate 25 to move the presser pins 24 forward and backward by moving the moving plate 25 in the vertical direction.

As shown in FIGS. 4 and 5, the pinning mechanism 28 has a gate surface 28 a having a concave cross section provided continuously in the upper mold space 21 of the upper mold 2. The gate surface 28a is provided in communication with a position that forms an angle of about 90 degrees from the position where the gate 23a is formed toward the circumferential direction of the molding space 5. The gate surface 28a is linearly formed on the lower surface of the upper mold 2, and the distal end portion of the gate surface 28a communicates with the upper mold space 21, and the base end portion of the gate surface 28a has upper and lower ends. A cylinder portion 28b is provided as an introduction space having an axial direction along the direction. The cylinder portion 28b is formed in a cylindrical shape, and the bottom surface, which is the lower surface of the cylinder portion 28b, is closed by the upper surface of the lower mold 3 when the mold is clamped. Further, a piston portion 28c whose upper end is connected to the moving plate 25 is inserted and attached to the cylinder portion 28b so as to be slidable in the vertical direction, and an insulating resin C introduced into the cylinder portion 28b. The moving plate 25 is moved upward against the elastic force of the spring 27 with the pressure of.

  That is, the pinning mechanism 28 is configured so that the piston portion is pressed by the pressure of the insulating resin C introduced into the cylinder portion 28b through the gate surface 28a after the molding space 5 of the mold 4 is filled with the insulating resin C. The moving plate 25 is moved upward against the elastic force of the spring 27 by pressing 28c. Therefore, the pin pulling mechanism 28 opens the mold 4 after molding the insert molded product A, and the insulating resin C filled in the gate surface 28a and the cylinder portion 28b of the upper mold 2 together with the insert molded product A. By removing, the piston portion 28c is pressed together with the moving plate 25 by the elastic force of each spring 27 and moves downward, and the pressing surface 24a of the pressing pin 24 protrudes from each pin insertion hole 22 by a predetermined distance. Return.

<Lower mold>
On the other hand, the lower mold 3 is configured in the same manner as the upper mold 2, and a lower mold space 31 serving as a molding region having a substantially concave cross section formed on a molding surface 3 a as a parting line that is an upper surface of the lower mold 3. Are attached to the upper mold 2 in a state of facing the upper mold space 21. Specifically, a pin insertion hole 32 penetrating from the lower mold space 31 toward the outside of the lower mold 3 is formed in the bottom 31 a of the lower mold space 31 of the lower mold 3. For example, about three pin insertion holes 32 are provided so as to face each pin insertion hole 22 of the upper mold 2 so as to communicate with each other in a concentric manner.

Furthermore, each pin insertion hole 32 of the lower mold 3 is attached with an elongate cylindrical presser pin 34 inserted therethrough, and these presser pins 34 are inserted through the respective pin insertion holes 32 and penetrated. These pin insertion holes 32 are attached so as to be able to advance and retract along the axial direction. These presser pins 34 are formed to have the same outer diameter as the presser pins 24 inserted and attached to the respective pin insertion holes 22 of the upper die 2, and the upper die 2 is placed in the lower die space 31 of the lower die 3. In a state where the space 21 is faced and clamped, the space 21 is attached to a position facing each of the presser pins 24, and attached so as to be able to advance and retreat in a direction facing the presser pins 24. In addition, a horizontal press surface 34 a orthogonal to the axial direction is formed at the tip of each presser pin 34. These pressing surfaces 34 a are portions for pressing and positioning the conductive plate B placed in the lower mold space 31 of the lower mold 3.

  And the base end side which protrudes from the lower mold | type 3 of each of these presser pins 34 is attached and fixed to the moving plate 35 for making these presser pins 34 interlock | cooperate simultaneously, and to move forward and backward. The moving plate 35 is mounted in parallel along the lower surface 3b located on the lower side of the lower mold 3, and a spring as an elastic member is provided between the moving plate 35 and a support plate 36 that is installed facing the moving plate 35. 37 is attached, and is urged toward the lower surface 3 b side of the lower mold 3 by the spring 37. A plurality of, for example, two springs 37 are installed between the support plate 36 and the moving plate 35 at a predetermined interval. The axial direction of each spring 37 is set in the thickness direction of the moving plate 35. It is attached along.

  Here, the support plate 36 is attached and fixed in parallel with a predetermined distance E between the lower plate 3 and the lower surface 3b. The predetermined distance E is larger than the protruding distance from the bottom portion 31a of the lower mold 3 when the conductive plate B is positioned by each pressing pin 34. The moving plate 35 is attached so as to be movable in the vertical direction at the predetermined interval E, and a spring 37 is attached between the moving plate 35 and the support plate 36. Further, a pin releasing mechanism 38 for a lower mold that moves the presser pins 34 forward and backward by moving the moving plate 35 in the vertical direction is attached to the moving plate 35.

As shown in FIGS. 4 and 5, the pinning mechanism 38 has a gate surface 38 a having a concave cross section provided continuously in the lower mold space 31 of the lower mold 3. The gate surface 38a is a position that forms an angle of about 90 degrees from the position where the gate 23a is formed toward the circumferential direction of the molding space 5, and is the position where the gate surface 28a of the upper mold 2 is formed. It is provided in communication with the opposite position on the opposite side. The gate surface 38a is linearly formed on the upper surface of the lower mold 3, and the distal end portion of the gate surface 38a communicates with the lower mold space 31, and the base end portion of the gate surface 38a has upper and lower ends. A cylinder portion 38b is provided as an introduction space having an axial direction along the direction. The cylinder portion 38b is formed in a cylindrical shape, and the bottom surface, which is the upper surface of the cylinder portion 38b, is closed by the lower surface of the upper die 2 when the mold is clamped. Further, this cylinder portion 38b, the lower end side are connected to a piston portion 38c is attached is inserted slidably in the vertical direction to the moving plate 35, an insulating resin that is introduced into the cylinder portion 38 b The moving plate 35 is moved downward against the elastic force of the spring 37 with the pressure of C.

  That is, the pinning mechanism 38 is configured so that the piston portion 38c is pressed by the pressure of the insulating resin C introduced into the cylinder portion 38b through the gate surface 38a after the molding space 5 of the mold 4 is filled with the insulating resin C. To move the moving plate 35 upward against the elastic force of the spring 37. Therefore, the pinning mechanism 38 opens the mold 4 after molding the insert molded product A, and the insulating resin C filled in the gate surface 38a and the cylinder portion 38b of the lower mold 3 together with the insert molded product A. By removing, the piston portion 38c is pressed together with the moving plate 35 by the elastic force of each spring 37 to move upward, and the pressing surface 34a of the pressing pin 34 protrudes by a predetermined distance from each pin insertion hole 32. Return.

<Manufacturing method>
Next, the manufacturing method of the insert molded product A using the said manufacturing apparatus 1 is demonstrated.

<Installation process>
First, the mold 4 is opened mold, predetermined from the respective pin insertion holes 32 of the lower mold 3 to respective pressing surfaces 34a of the retaining pin 34 in the lower mold space 31 from the bottom 31a of the lower mold space 31 of the lower mold 3 The conductive plate B is installed in the center of the lower mold space 31 of the lower mold 3 in a state of protruding by a distance. At this time, the lower surface of the conductive plate B is placed on the pressing surface 34 a of each pressing pin 34. On the other hand, each presser pin 24 inserted through each pin insertion hole 22 of the upper mold 2 is urged by the elastic force of the spring 27 so that the moving plate 25 contacts the upper surface 2b of the upper mold 2. pressing face 24a of the pressing pin 24 is in a state such as to project to the upper mold space 21 from the bottom 21a of the upper mold space 21 of the upper mold 2 a predetermined distance.

<Clamping process>
In this state, the lower mold 3 and the upper mold 2 are relatively moved in the approaching direction, the molding surface 3a of the lower mold 3 and the molding surface 2a of the upper mold 2 are brought into contact with each other, and the mold is clamped. At this time, as shown in FIG. 1, the presser surfaces 24 a of the presser pins 24 protruding into the upper mold space 21 from the pin insertion holes 22 of the upper mold 2 enter the lower mold space 31 of the lower mold 3. The installed conductive plate B is pressed from above and sandwiched between the pin insertion holes 32 of the lower mold 3 and the presser pins 34 protruding into the lower mold space 31 to be positioned and fixed.

  Further, by clamping the lower mold 3 and the upper mold 2, the gate surface 28a of the upper mold 2 and the lower surface of the cylinder portion 28b are closed on the upper surface of the lower mold 3, as shown in FIGS. In addition to being sealed, the lower surface of the upper die 2 is closed and sealed with the gate surface 38a of the lower die 3 and the upper surface of the cylinder holder 8b.

<Injection process>
Thereafter, the molten insulating resin C is gradually injected into the mold 4 from the resin injection port 23 of the upper mold 2, and this insulating resin C is supplied to the gate of the upper mold 2 as shown in FIG. 2. It injects into the shaping | molding space 5 in the metal mold | die 4 through 23a. At this time, the insulating resin C fills the molding space 5 excluding the portion where the presser pins 24 and 34 are located, covers the periphery of the presser pins 24 and 34, and the inside of the molding space 5. The filling of the insulating resin C into the is completed.

<Pin moving process>
Then, after this insulating resin C is injected into the molding space 5 in the mold 4 and the molding space 5 is filled with the insulating resin C, the insulating resin C is transferred from the molding space 5 to each gate surface 28a. , 38a through the cylinder portions 28b, 38b. The piston 28c is pushed upward by the increase in pressure of the insulating resin C introduced and filled in the cylinders 28b, 38b, and the pressing surface 24a of each pressing pin 24 becomes the upper mold 2 The movable plate 25 is moved upward against the elastic force of the spring 27 until the position along the bottom portion 21a of the space 21, that is, the flush position, and the presser pins 24 are moved backward. At the same time, the pressure of the insulating resin C filled in the cylinder portion 38b increases the piston portion 38c downward, and the pressing surface 34a of each pressing pin 34 moves to the bottom portion 31a of the lower mold space 31 of the lower mold 3. The moving plate 35 is moved downward against the elastic force of the spring 37 until it reaches a position along the surface, that is, a flush position, and the presser pins 34 are moved backward.

  At this time, the presser pins 24 and 34 are in a state before the insulating resin C is cured (change in state from liquid to solid), that is, in the gaps between the pressed presser pins 24 and 34 and the conductive plate B. The insulating resin C is rotated and moved backward while being filled. The speed at which the presser pins 24 and 34 are retracted is determined by releasing the positioning of the conductive plate B by the presser pins 24 and 34 and moving the presser pins 24 and 34 upward or downward. The conductive resin B is adjusted so as not to deviate from a predetermined position in the molding space 5 of the mold 4 by the insulating resin C flowing around between the presser pins 24 and 34.

  Further, the insulating resin C injected into the molding space 5 of the mold 4 is retracted and pulled out by the presser pins 24 and 34, and at the same time, the space in which the presser pins 24 and 34 are located. And the gaps formed between the holding surfaces 24a and 34a of the holding pins 24 and 34 and the conductive plate B are filled. Here, since the insulating resin C is filled in the molding space 5 of the mold 4, the conductive plate B is positioned by the pressure (pressurization) by the insulating resin C in the molding space 5. Even when the presser pins 24 and 34 are retracted, the conductive plate B is positioned and held by the pressure of the insulating resin C.

<Removal process>
Then, in a state after the insulating resin C injected into the molding space 5 of the mold 4 is cured (solidified), the upper mold 2 and the lower mold 3 of the mold 4 are relatively moved so as to be separated from each other. The mold is opened, and the insert molded product A in which the entire part of the conductive plate B is shielded and coated with the insulating resin C is taken out from the molding space 5 of the mold 4. At this time, when the insert molded product A is taken out from the molding space 5 of the mold 4, together with the insert molded product A, the resin injection port 23 and the cylinder portions 28b, 38b through the gate 23a and the gate surfaces 28a, 38a. The insulating resin C filled and cured is removed.

  Further, the insulating resin C filled in the gate surface 28a and the cylinder portion 28b of the upper mold 2 together with the insert molded product A is removed, whereby the piston portion 28c together with the moving plate 25 is moved by the elastic force of each spring 27. It is pressed and moved downward, and the pressing surface 24a of the pressing pin 24 is returned to a state where it protrudes by a predetermined distance from each pin insertion hole 22. Similarly, by removing the insulating resin C filled in the gate surface 38a and the cylinder portion 38b of the lower mold 3 together with the insert molded product A, the piston portion 38c together with the moving plate 35 by the elastic force of each spring 37 is removed. Is pressed and moved upward, and the pressing surface 34a of the pressing pin 34 is returned to a state where it protrudes by a predetermined distance from each pin insertion hole 32.

<Effect>
As described above, using the holding pins 24 and 34 attached to the pin insertion holes 22 and 32 of the upper mold 2 and the lower mold 3 of the mold 4, the conductive plate B installed in the molding space 5 of the mold 4. In a state where the upper surface and the lower surface are clamped and fixed by the presser pins 24, 34, the molten insulating resin C is injected into the molding space 5, and in a state before the insulating resin C is cured, Each presser pin 24, 34 is retracted. Further, after the insulating resin C is cured, the upper mold 2 and the lower mold 3 of the mold 4 are opened, and the entire portion of the conductive plate B, that is, the whole is shielded and covered with the insulating resin C. The insert molded product A was taken out from the molding space 5 of the mold 4.

  As a result, in a state where the mold 4 is clamped, the conductive plate B installed in the molding space 5 of the mold 4 is pressed by the pressing surface 24 a of the pressing pin 24 of the upper mold 2 and the pressing pin 34 of the lower mold 3. The insulating resin C can be injected into the molding space 5 of the mold 4 in a state of being sandwiched between the pressing surface 34 a and being securely positioned and held by the pressing pins 24 and 34.

  Further, after the insulating resin C is injected into the molding space 5 of the mold 4, the pressing surfaces 24 a and 34 a of the pressing pins 24 and 34 are the upper mold 2 in a state before the insulating resin C is cured. Alternatively, the lower mold 3 is retracted to a position that is flush with the bottoms 21a and 31a. For this reason, the insulating resin C can be rotated and filled in the gaps (spaces) between the presser surfaces 24a, 24a of the presser pins 24, 34 thus retracted and the conductive plate B. Further, the insulating resin C is filled in the molding space 5 of the mold 4, so that the conductive plate B is positioned and held by the pressure of the insulating resin C in the molding space 5. The conductive plate B can be kept positioned and held by the pressure of the insulating resin C even when retracting 34.

  Therefore, by pressing the conductive plate B in the mold 4 with these presser pins 24, 34, the conductive plate B can be reliably positioned and held, and an insulating resin is applied to the portion pressed by each presser pin 24. C can be filled and coated to prevent the conductive plate B from being exposed by the pressing pin 24 and shield it, and all the conductive plate B can be shielded and coated with the insulating resin C. .

  Therefore, the portions of the conductive plate B that are pressed by the presser pins 24 and 34 can be reliably covered and insulated with the insulating resin C, and the conductive plate B is exposed by exposing a part of the conductive plate B. It is possible to reliably prevent water droplets and dust from entering the exposed part. Therefore, a higher level of waterproof performance and high insulation can be applied to the insert molded product A in which the entire conductive plate B is shielded, and the use of the insert molded product A can be limited.

Further, the presser pins 24 and 34 are retracted to positions along the bottom portions 21a and 31a of the upper die 2 and the lower die 3, and the gaps between the retracted presser pins 24 and 34 and the conductive plate B are insulated. the construction further flows sexual resins C, and each portion was holding at pins 24, 34 holding the conductive plate B, these are not pressing at the pressing pin 24, 34 portions as well as insulating resins Can be shielded flush with C. Therefore, it shields the entire conductive plate B to the same by an insulating resins C, it can be easily higher waterproof property and ensuring insulation.

  Also, cylinder portions 28b and 38b are provided via gate surfaces 28a and 38a communicating with the molding space 5 of the mold 4, and the insulating resin C is introduced into the cylinder portions 28b and 38b. The piston portions 28c and 28c are pressed by pressure to move the moving plates 25 and 35 of the upper die 2 and the lower die 3, respectively, and the presser pins 24 and 34 are driven backward. As a result, after the insulating resin C introduced from the resin injection port 23 through the gate 23a is filled in the molding space 5, each cylinder portion 28b, from the molding space 5 through each gate surface 28a, 38a. Since the insulating resin C can be introduced into 38b, it is possible to reliably maintain the filling of the insulating resin C into the molding space 5 and eliminate variations in the timing of removing the pins for retracting the presser pins 24 and 34. Can do.

  At the same time, since the filling of the insulating resin C into the molding space 5 can be reliably maintained, the displacement of the conductive plate B after the presser pins 24 and 34 are moved backward can be more reliably suppressed. Warpage and reduction of the insert molded product A in which the entire conductive plate B is covered with the insulating resin C can be prevented, and the quality of the insert molded product A can be further improved.

  In addition, by pressing the piston portions 28c and 38c with the insulating resin C covering the insert molded product A to move the moving plates 25 and 35, the presser pins 24 and 34 are moved backward, The presser pins 24 and 34 can be moved backward by the insulating resin C which is the same medium as the medium covering the insert molded product A. Therefore, it is not necessary to provide an electric mechanism such as a hydraulic mechanism or a servo motor as a drive source for moving the presser pins 24 and 34 backward. Further, in this case, it is necessary to provide a pressure detection mechanism in the mold 4 for detecting the timing for retracting the presser pins 24, 34, or to control the timing for retracting the presser pins 24, 34. There is no.

  Further, power for moving the presser pins 24 and 34 backward can be secured in one mold 4, and the cross-sectional areas and lengths of the gate surfaces 28 a and 38 a of the mold 4, or cylinders By appropriately adjusting the cross-sectional areas and the like of the portions 28b and 38b, the timing and speed for retracting the presser pins 24 and 34 can be adjusted.

[Second Embodiment]
Next, an insert molded product manufacturing apparatus 1B according to a second embodiment of the present invention will be described with reference to FIGS.

  Specifically, the conductive plate B used in the manufacturing apparatus 1B is provided with a pair of positioning through holes B1 as shown in FIG. The pair of through holes B1 are provided at positions facing each other with reference to the center of the annular conductive plate B as shown in FIG. 7A, and as shown in FIG. 7B, the conductive plate B1. The shape penetrates in the thickness direction.

  On the other hand, as shown in FIGS. 8 and 9, the presser pin 34 on the lower side of the manufacturing apparatus 1 </ b> B includes a cylindrical pin main body 34 b, and in a mounting hole 34 c provided at the center of the pin main body 34 b, An elongated cylindrical positioning pin 34d is inserted and attached so as to be slidable in the axial direction. This positioning pin 34d is formed in an elongated cylindrical shape having an outer diameter dimension substantially equal to the inner diameter dimension of the through hole B1 of the conductive plate B and having a length dimension equal to the length dimension in the axial direction of the pin body 34b. The tip of the positioning pin 34d is shaped to fit into the through hole B1 of the conductive plate B.

  Further, a spring 34e as an elastic member is attached to the base end portion of the positioning pin 34d, and the upper end side of the spring 34e is inserted into the pin main body 34b from below to enter the pin main body 34b. It is attached so that it can move forward and backward. The lower ends of these springs 34e are inserted and attached to spring accommodating recesses 34f provided on the upper surface of the moving plate 35.

  Here, these spring accommodating recesses 34f are formed to have an inner diameter that is slightly smaller than the inner diameter of the mounting hole 34c of the pin main body 34b, and the lower end side of the positioning pin 34d is locked without being inserted. . Therefore, each spring 34e is formed in a spiral shape (coil shape) having an outer diameter dimension slightly smaller than the inner diameter dimension of the spring accommodating recess 34f.

  That is, these springs 34e are adjusted to have an elastic force smaller than the pressure of the insulating resin C injected into the molding space 5 of the mold 4, and the lower end side is inserted into the spring accommodating recess 34f of the moving plate 35 and attached. The upper end side is attached between the base end portion of the positioning pin 34d and the bottom surface of the spring accommodating recess 34f while being able to be inserted into and removed from the pin body 34b of the presser pin 34.

  In the second embodiment, the upper presser pin 24 is configured to press a position different from that of the lower presser pin 34, and the configuration is omitted in each drawing according to the present embodiment. ing. In other configurations, the description of the same configuration as that of the first embodiment is omitted.

<Effect>
As shown in FIG. 8, the manufacturing apparatus 1 </ b> B of the second embodiment has the positioning pins 34 d projecting from the distal ends of the pin bodies 34 b of the presser pins 34, with the presser pins 34 protruding onto the presser pins 34. conductive plate B is installed, is positioned the tip of the positioning pin 34 d in the respective through-hole B1-fitted in the conductive plate B. In this state, when the insulating resin C is introduced from the resin injection port 23 and the inside of the molding space 5 is filled with the insulating resin C, the insulation flowing in from the upper side of each through hole B1 of the conductive plate B. 9, the positioning pin 34d of each presser pin 34 is locked on the upper surface of the moving plate 35, and the position of each presser pin 34 along the upper end surface of the pin body 34b. That is, the positioning pins 34d are moved backward against the elastic force of the springs 34e until they are flush with each other.

  At this time, the filled insulating resin C is introduced into the cylinder portions 38b from the molding spaces 5 through the gate surfaces 38a, and the piston portion 38c is moved downward by the pressure of the insulating resin C. The moving plate 35 is moved downward against the elastic force of the spring 37 until the pressing surface 34a of each pressing pin 34 moves along the bottom 31a of the lower mold space 31 of the lower mold 3 so that each pressing pin 34 is moved. Move backwards.

  From the above, the conductive plate B can be positioned more accurately and reliably in the mold 4 by positioning the distal end portion of the positioning pin 34d of the presser pin 34 in the through hole B1 of the conductive plate B. . Further, the positioning pins 34d are moved backward by the pressure of the insulating resin C introduced into the molding space 5 of the mold 4 so that the positioning pins 34d are positioned along the bottom 31a of the lower mold space 31. The portion positioned by the positioning pin 34d can be filled with the insulating resin C along the bottom portion 31a of the lower mold space 31 and covered with the insulating resin C, similarly to the other portions. be able to.

  In the second embodiment, the lower presser pin 34 is a double pin in which the positioning pin 34d is inserted into the pin main body 34b, but the upper presser pin 24 is similarly provided with the positioning pin 34d on the pin main body 34b. It may be a double pin inserted. In addition, the position where the upper mold presser pin 24 is positioned and the position where the lower mold presser pin 34 is positioned are not linearly opposed to each other, and the position where the presser pins 24, 34 are pressed is shifted. Each of the presser pins 24 and 34 may be a double pin.

[Others]
In each of the above embodiments, the insulating resin C is injected into the mold 4 in a state where the conductive plate B installed in the mold 4 is pressed and positioned by the press pins 24 and 34, and then the press pins 24 and 34 are moved. Although it was set as the method of reverse | retreating, after injecting the insulating resin C after cut | disconnecting a part of this conductive plate B in the state which positioned the conductive plate B installed in the metal mold | die 4 with the pressing pins 24 and 34, The presser pins 24 and 34 can be retracted.

  Furthermore, although the conductive plate B having conductivity is used as the insert member, the insert member used in the present invention may be a member having insulation properties. Further, as the resin material injected into the mold 4, in addition to the insulating resin material, that is, the insulating resin C, a conductive resin material or the like can be used.

  In addition, one of the upper mold 2 and the lower mold 3 of the mold 4 is a movable mold, and the other of the upper mold 2 and the lower mold 3 is a fixed mold, or each of the upper mold 2 and the lower mold 3 is used. Can also be mobile.

DESCRIPTION OF SYMBOLS 1,1B Manufacturing apparatus 2 Upper mold 2a Molding surface 2b Upper surface 3 Lower mold 3a Molding surface 3b Lower surface 4 Mold 5 Molding space 21 Upper mold space 21a Bottom part 22 Pin insertion hole 23 Resin injection port 23a Gate 24 Pressing pin 24a Holding surface 25 Moving plate 26 Support plate 27 Spring 28 Pin removal mechanism (upper side)
28a Gate surface 28b Cylinder portion 28c Piston portion 31 Lower mold space 31a Bottom portion 32 Pin insertion hole 34 Presser pin 34a Presser surface 34b Pin body 34c Mounting hole 34d Positioning pin 34e Spring 34f Spring accommodating recess 35 Moving plate 36 Support plate 37 Spring 38 Pin Extraction mechanism (lower side)
38a Gate surface 38b Cylinder part 38c Piston part A Insert molded product B Conductive plate (insert member)
B1 Through hole C Insulating resin (resin material)
D Predetermined spacing (upper side)
E Predetermined interval (lower side)

Claims (2)

An insert member is installed in a mold, and a molten resin material is injected into the mold to insert-mold the insert member.
A mold clamping step of positioning by pressing the insert member installed in the mold with a pressing pin;
An injection step of injecting the resin material into the mold;
A pin moving step of retracting the presser pin to a position along the inner surface of the mold in a state where the mold is filled with the resin material and the resin material is not cured;
Taking out the insert-molded product in which the insert member is insert-molded by opening the mold in a state where the resin material is cured, and
With
Said mold includes an inlet for injecting the resin material, the molding space for molding said insert molding is provided continuously to the inlet port, provided continuously in the molding space, filling and a introduction space retracting the pressing pin at the the pressure of the resin material,
In the pin moving step, after the filling of the resin material into the molding space is completed, the presser pin is moved backward by the pressure of the resin material introduced from the molding space into the introduction space. Manufacturing method of molded products. The manufacturing method of claim 1 Symbol placement of insert-molded article,
The mold clamping step, positioning across the insert member by a pair of the pressing pin mounted for reciprocating in opposite directions to each other,
The pin moving step, the releases the positioning of each presser pin tip surface is the insert member is retracted the respective presser pins to a position along the inner surface of the mold, between the mold and the insert member method for producing insert molded articles, characterized in that to form a gap for pouring the resin material.