JP7461043B2 - Resin sealing device - Google Patents

Description

The present invention relates to a resin sealing device that seals a workpiece with resin.

Resin sealing equipment is widely used in the manufacture of semiconductor devices and other devices, where a workpiece having electronic components mounted on a substrate is sealed with resin to create a molded product.

A transfer molding device is known as an example of a resin sealing device. This transfer molding device is equipped with an upper die and a lower die, clamps the workpiece, extrudes molten resin from the pot of the resin sealing mold with a plunger, fills the resin into the cavity, and seals it with the resin. (See Patent Document 1: Japanese Unexamined Patent Publication No. 2012-131142).

Japanese Patent Application Publication No. 2012-131142

In the resin sealing device exemplified above, in the case of thermosetting resin, the resin sealing mold is heated to about 180°C, and when the resin is poured into the resin sealing mold, the heated resin sealing Heat is taken away from the stopper mold to the resin, causing a phenomenon in which the temperature of the input section and its surroundings decreases. This phenomenon can occur not only when resin is introduced, but also when a workpiece is set in a resin-sealed mold.

When such a temperature drop occurs, a process is carried out in which the heater of the resin sealing mold is turned on to restore the temperature to the specified level. To prevent this as much as possible, one method is to preheat the resin and workpiece to around 80°C, but this creates a temperature difference with the resin sealing mold. Although this process takes several tens of seconds to restore the temperature, it is completed during the resin sealing molding cycle and therefore has little effect on the next molding.

However, in recent years, molding using large-capacity resins has become more common in semiconductor devices, such as large-capacity power devices for automobiles. In such cases, the temperature recovery process cannot be completed during the resin encapsulation molding cycle, and the next molding cycle begins before the temperature has recovered to the specified level, creating the problem that molding defects (unfilled, voids, etc.) are more likely to occur due to insufficient heat. Conversely, if the next molding cycle is started after the temperature has recovered to the specified level, the lack of heat can be resolved, but the cycle time increases, resulting in reduced productivity.

The present invention has been made in view of the above circumstances, and aims to solve the problem of a decrease in the temperature of a resin-sealing mold that occurs when molding resin is poured into a resin-sealing mold, and to provide a new structure for solving the problem. It is an object of the present invention to provide a resin sealing device that can simultaneously solve the problem of contamination of the resin holding portion that occurs.

The present invention solves the above problems by the solution described below as one embodiment.

A resin sealing device according to the present invention is a resin sealing device for processing a workpiece into a molded product by resin-sealing a workpiece using a resin-sealing mold including an upper mold and a lower mold, A loader for transporting tablet-shaped resin into a mold, the loader having a resin holding part having a holding hole for holding the resin, a resin heating device for heating the resin held in the holding hole , a first cleaning device that cleans the inside of the holding hole ; the first cleaning device includes a rod-shaped portion that moves within the holding hole; and a rod-shaped portion that is provided on the rod-shaped portion and that slides on the inner wall of the holding hole. a scraping part that scrapes off resin powder adhering to the inner wall part, and a lifting device that converts a horizontal driving force by 90 degrees to move the rod-shaped part in the vertical direction; The drop part has a brush part attached to the rod-shaped part, or an enlarged diameter part provided integrally or separately to the rod-shaped part, and the rod-shaped part has a brush part attached to the rod-shaped part. The requirement is that the lower end surface also serves as a pusher for pushing the resin .

This allows tablet-shaped resin to be held in the resin holding section of the loader and heated while being transported, etc. Therefore, even when resin is poured into the resin sealing mold, it is possible to prevent a drop in temperature at the pouring section and its surroundings caused by the resin losing heat from the resin sealing mold. Furthermore, holding and heating resin inside the resin holding section creates a new problem in that resin dirt is more likely to adhere to the inside, but the dirt can be removed by cleaning.

The loader preferably has a workpiece holding section for holding the workpiece, and a workpiece heating device for heating the held workpiece. This allows the workpiece to be heated while being transported by the loader, and can be heated to a predetermined temperature. Therefore, when the workpiece is placed on the resin sealing mold, the amount of heat that the workpiece takes from the heated resin sealing mold can be reduced, and the phenomenon of a drop in temperature of the placement section and its surroundings can be suppressed.

Further , by moving the rod-shaped portion in the vertical direction (vertical direction) within the resin holding portion, an effect is obtained in which the scraping portion moves while slidingly contacting the inner wall portion of the holding hole. Thereby, dirt (resin powder, etc.) adhering to the inner wall portion can be scraped off by the scraping section. Therefore, when sealing a workpiece with resin and processing it into a molded product, it is possible to prevent molding defects caused by dirt adhering to the resin holding part entering the pot together with the resin and being mixed in as foreign matter. . Furthermore, since the rod-shaped portion can also be used as a pusher, the lower end surface of the rod-shaped portion can have the effect of pushing the resin.

Furthermore , the height dimension of the loader on which the rod-shaped portion is installed can be made small.

The resin heating device preferably has a heater that heats the resin holding section. This makes it possible to maintain a uniform temperature inside the holding hole by heating the resin holding section. Therefore, compared to direct heating methods, it is possible to prevent the occurrence of an unbalanced state in which the surface of the resin becomes hot and the inside becomes cold, and it is possible to heat the entire resin with a more uniform temperature distribution.

It is also preferable to further include a second cleaning device that cleans the underside of the loader where the inlet and outlet for the resin to enter the resin holding portion is provided. For example, the second cleaning device can be supported by the loader so as to be movable along the underside, or can be provided midway along the path along which the loader moves. This provides the effect of removing dirt (resin powder, etc.) adhering to the underside of the loader. Therefore, when the workpiece is sealed with resin and processed into a molded product, it is possible to prevent molding defects caused by dirt adhering to the underside of the loader falling into the pot, onto the workpiece support portion, or onto the workpiece placed on the workpiece support portion and being mixed in as foreign matter.

According to the present invention, when a tablet-shaped resin is poured into a resin-sealing mold, the temperature of the charging portion and its surroundings can be reduced due to heat being taken from the resin-sealing mold to the resin. It is possible to prevent this. Therefore, in the resin sealing process, it is possible to reduce molding defects that may occur due to a decrease in the temperature of the resin, etc., without lengthening the cycle time. On the other hand, due to the structure in which resin is held and heated inside the resin holding section, a new problem arises in that resin stains tend to adhere to the inside, but this stain can be removed by cleaning. becomes possible.

1 is a plan view illustrating an example of a resin sealing apparatus according to a first embodiment of the present invention. FIG. 2 is a left side view of the resin sealing device in FIG. 1 at the II-II position. 3 is a front cross-sectional view (cross-sectional view taken along line III-III in FIG. 1 ) showing an example of a press device and a first loader of the resin sealing apparatus in FIG. 1 . 4 is a side cross-sectional view (cross-sectional view taken along line IV-IV in FIG. 3) showing an example of a first cleaning device of the resin sealing apparatus in FIG. 1; FIG. 4 is a front sectional view (enlarged view of section A in FIG. 3) showing an example of a scraping part of the first cleaning device of the resin sealing device in FIG. 1; 1. FIG. 4 is a front cross-sectional view showing another example of the scraping portion of the first cleaning device of the resin sealing apparatus of FIG. FIG. 2 is a front sectional view showing another example of the scraping section of the first cleaning device of the resin sealing device of FIG. 1; FIG. 2 is a side view showing an example of an elevating device of the first cleaning device of the resin sealing device of FIG. 1; 1. FIG. 4 is a side view showing another example of the lifting device of the first cleaning device of the resin sealing apparatus of FIG. FIG. 2 is a front cross-sectional view (cross-sectional view taken along line XX in FIG. 1) showing an example of the second cleaning device of the resin sealing device in FIG. 1; FIG. 12 is a side cross-sectional view (cross-sectional view taken along the line XI-XI in FIG. 10) showing an example of the second cleaning device of the resin sealing device in FIG. 1; FIG. 2 is a side sectional view showing another example of the second cleaning device of the resin sealing device of FIG. 1;

Below, an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic diagram (plan view) showing an example of a resin sealing apparatus 100 according to an embodiment of the present invention. Also, FIGS. 2 to 12 are schematic diagrams showing the details of each component of the resin sealing apparatus 100. For ease of explanation, arrows may be used in the drawings to explain the front-rear, left-right, and up-down directions of the resin sealing apparatus 100. Also, in all the drawings used to explain each embodiment, members having the same function are given the same reference numerals, and repeated explanations may be omitted.

The resin sealing apparatus 100 according to this embodiment is a transfer molding apparatus that performs resin sealing molding of a workpiece (molded product) W.

First, a general configuration example of the workpiece W to be molded will be described. The workpiece W has a configuration in which a second member Wb, which is mainly an electronic component, is mounted on a first member Wa, which is a base material. More specifically, examples of the first member Wa include various encapsulating members such as a resin substrate, a ceramic substrate, a metal substrate, a lead frame, a carrier, and a wafer formed in a strip shape. Further, the shape is not limited to a rectangular shape, but may be circular or square, or may be an irregular shape having an arbitrary outer shape. The second member Wb may include various members such as semiconductor chips (sometimes simply referred to as "chips"), electronic components, heat sinks, lead frames for wiring and heat dissipation, and bumps for electrical connections. An example is given. That is, the workpiece W in the present invention refers to a state in which the second member Wb is mounted on the first member Wa (by die mounting, flip-chip mounting, wire bonding mounting, etc.) and is superimposed. Therefore, the work W includes a substrate on which chips are mounted in one or more layers, a substrate on which a semiconductor device is mounted, an image sensor on the substrate, and a light-transmitting glass bonded to the light-receiving surface of the image sensor. It also includes things that have been done. Here, as a form of resin sealing, it is assumed that a plurality of mounted components mounted on a board are housed in one cavity and resin-sealed all at once. Note that the present invention can also be applied to a case where each mounted component is individually accommodated in a cavity and sealed with resin. Further, the workpiece W may have a heat dissipation structure in which a chip is sandwiched between heat dissipation plates.

Next, an overview of the resin sealing device 100 will be explained. As shown in FIG. 1, the resin sealing apparatus 100 includes a supply unit 100A that supplies a tablet-shaped (for example, cylindrical) molding resin (sometimes simply referred to as "resin") R and a workpiece W; The main components include a press unit 100B for resin-sealing the molded product Wp, and a molded product storage unit 100C for storing the resin-sealed molded product Wp.

First, the supply unit 100A is equipped with a stocker 62 that houses a magazine (not shown) that contains the workpieces W. The workpieces W sent out from each magazine by a pusher (not shown) are arranged, for example, in pairs facing each other on the set table 64. The workpieces W arranged on the set table 64 are held by a transport mechanism (first loader (inloader) 82) described below and transported to the press unit 100B.

On the side of the set table 64, there are provided a resin supply section 66 equipped with a hopper, feeder, etc. as a mechanism for supplying resin R, and a resin transfer section 68 equipped with a transport mechanism such as an elevator and transferring resin R from the resin supply section 66 to a first loader 82 described below. The resin R set in the resin transfer section 68 is held by the first loader 82 and transported to the press unit 100B.

Next, the press unit 100B includes a press device 70 that opens and closes a resin sealing mold 10, which will be described later, to clamp a preheated workpiece W and seal it with resin. The press device 70 includes a known mold clamping mechanism that pushes the resin-sealing mold 10 in the mold opening/closing direction, and a transfer drive that fills the cavity 30 from the pot 40 with the resin melted in the pot 40 of the resin-sealing mold 10. It is equipped with a mechanism (described later).

Note that the press device 70 may be configured to include a film supply mechanism and cover the mold surface (resin sealing surface) of the resin sealing mold 10 with a known release film for resin sealing (not shown). ).

Next, the molded product storage unit 100C includes a setting section 74 for setting the molded product Wp after resin sealing, a gate breaking section 76 for removing unnecessary resin such as a gate from the molded product Wp, and a molded product from which unnecessary resin has been removed. A stocker 78 for storing Wp is provided. The molded products Wp are stored in a storage magazine 80, and the magazines 80 containing the molded products Wp are sequentially stored in the stocker 78.

Next, the resin sealing apparatus 100 according to the present embodiment has a first loader that carries the resin R and the workpiece W into the resin sealing mold 10 of the press unit 100B as a mechanism for transporting between the units. 82 and a second loader (offloader) 84 for transporting the molded product Wp and unnecessary resin (culls and runners after molding) from the resin sealing mold 10 of the press unit 100B. Here, the supply unit 100A, the press unit 100B, and the molded product storage unit 100C are assembled into the resin sealing device 100 by connecting unitized frames. A guide portion 86 is provided on the back side of the device in each unit, and a guide rail is formed by assembling the guide portions 86 so as to connect them linearly. The first loader 82 and the second loader 84 are each provided so as to be movable linearly toward the supply unit 100A, the press unit 100B, and the molded product storage unit 100C from a predetermined position on the guide portion 86 along the guide rail. ing.

Next, the configuration of the press device 70 provided in the press unit 100B of the resin sealing device 100 will be explained.

As shown in FIG. 2, the press device 70 includes a resin sealing mold 10 having a first mold (here, a lower mold) 20 and a second mold (here, an upper mold) 21. . As an example of the configuration, reference numeral 22 is a movable platen, reference numeral 24 is a fixed platen, and reference numeral 42 is a post. Although a case will be described in which the lower mold 20 is a movable mold and the upper mold 21 is a fixed mold, the present invention is not limited to this configuration.

The lower mold 20 is also provided with one or more (here, multiple) cylindrical pots 40 into which the resin R is poured. The pots 40 are formed as through holes that connect to the lower mold base 34 and the lower mold chase block 36. A plunger 16 that is pushed by a known transfer drive mechanism (not shown) is disposed within the pot 40. When the plunger 16 is pushed, the resin R in the pot 40 is supplied into the cavity 30.

Here, a lower die heater 46 is provided on the lower die base 34, and heat is conducted to the periphery of the pot 40 via support pillars (not shown) and the like, so that the resin R in the pot 40 can be heated to a predetermined temperature efficiently in a short time (for example, until the temperature of the inner wall of the pot 40 reaches about 180°C) and melted. The lower die heater 46 can be a known electric wire heater, sheath heater, or the like.

A cavity 30 is provided on the underside of the upper chase block 28 to accommodate a predetermined portion of the workpiece W (the portion on which the second member Wb is mounted). In this embodiment, one cavity 30 is provided at a position corresponding to the workpiece support portion 38 of the lower chase block 36. In addition, the upper chase block 28 is provided with a resin flow path (cull, runner, etc.) 32 that communicates with the cavity 30.

Here, the upper mold base 26 is provided with an upper mold heater 47, which conducts heat around the cavity 30 and the resin flow path (cull, runner, etc.) 32 via a support pillar (not shown), etc., and heats the cavity 30. The molten resin R filled in the resin flow path 32 can be heated to a predetermined temperature. Note that the upper die heater 47 may be a known heating wire heater, sheathed heater, or the like.

Next, the first loader (inloader) 82, which is a characteristic configuration of this embodiment, will be described in detail.

The first loader 82 according to the present embodiment includes a work holding section 50 that holds a work W, as shown in FIG. As an example, the workpiece holder 50 is configured to include a chuck claw 44 that approaches and separates from the workpiece W by horizontal movement (or rotational movement).

Further, the first loader 82 includes a resin holding section 52 that holds the resin R, as shown in FIGS. 3 and 4. As an example, the resin holding part 52 includes a cylindrical holding hole 52a that holds the resin R therein, an inlet/outlet 52b that takes the resin R in and out of the holding hole 52a, and a shutter 52c that opens and closes the inlet/outlet 52b. has been done.

Examples of operations using these configurations are as follows. First, the first loader 82 is moved directly above the set table 64. Next, the setting table 64 is raised to a predetermined position (or the first loader 82 is lowered to a predetermined position) so that the workpiece W is at the same height as the chuck jaws 44. Next, the chuck claws 44 are moved to clamp the workpiece W. Next, the first loader 82 is moved directly above the resin delivery section 68. Next, the resin delivery part 68 is raised to a predetermined position (or the first loader 82 is lowered to a predetermined position), and the resin R is introduced into the holding hole 52a. Next, by moving the shutter 52c in the front-rear direction, the entrance/exit 52b is closed with a portion of the shutter 52c that is not a hole, and the resin R is held in the holding hole 52a with the entrance/exit 52b in a closed state. Next, the first loader 82 is moved directly above the lower mold 20 in the resin-sealed mold 10, and the lower mold 20 is raised to a predetermined position (or the first loader 82 is lowered to a predetermined position). Next, the chuck claws 44 are moved to release the clamping of the workpiece W, and the workpiece W is placed on the workpiece support section 38. At the same time (or before or after), the shutter 52c is moved to open the entrance/exit 52b and the resin R is dropped and placed into the pot 40. In this way, the mounting of the workpiece W on the workpiece support section 38 and the charging of the resin R into the pot 40 are completed. However, the present invention is not limited to these configurations, and various modifications may be made regarding the operations and order, such as holding the resin R before clamping the workpiece W.

Here, the first loader 82 includes a resin heating device 53 that heats the resin R held by the resin holding section 52.

As mentioned above, in conventional resin sealing equipment, when resin is poured into the resin sealing mold (here, the lower mold), heat is taken away from the heated resin mold and into the resin. , a phenomenon occurred in which the temperature of the input section and its surroundings decreased. When such a temperature drop occurs, a step is performed in which the heater of the resin-sealed mold is activated to recover the temperature to a predetermined level. However, in the case of molding using large volumes of resin, which has been increasing in recent years, the temperature recovery process cannot be completed during the resin encapsulation molding cycle, and the next molding cycle is started before the temperature has recovered to the specified temperature. Therefore, there was a problem that molding defects (unfilled, voids, etc.) were likely to occur due to insufficient heat. On the other hand, if the next molding cycle is started after waiting for the temperature to recover to a predetermined level, the lack of heat can be resolved, but there is a problem in that the cycle time increases and productivity decreases.

In order to deal with such problems, according to the above configuration according to the present embodiment, while the resin R is being conveyed from the resin delivery section 68 to the lower mold 20 (specifically, the pot 40), the resin heating device 53 The resin R can be heated to a predetermined temperature. Therefore, when the resin is poured into the resin sealing mold 10 (here, the lower mold 20), the amount of heat taken by the resin R from the heated resin sealing mold 10 can be reduced. It is possible to suppress the phenomenon in which the temperature of the part and its surroundings decreases. That is, since the temperature decrease is small, the temperature recovery step can be carried out in a short time and can be completed during the cycle of resin sealing molding. As a result, it is possible to prevent molding defects (unfilling, voids, etc.) caused by insufficient heat due to entering the next molding cycle before the temperature has recovered to the predetermined temperature, and it also increases cycle time and improves production. It is also possible to prevent a decrease in performance.

As an example, the resin heating device 53 is configured with a heater that heats the resin R from room temperature to a predetermined temperature (specifically, the temperature before the B stage, i.e., a temperature at which the resin R, which is a thermosetting resin, does not melt or harden, for example, about 120°C) by increasing the temperature of the resin holding portion 52 (specifically, the peripheral wall portion of the holding hole 52a). Examples of the heater include an electric heating wire heater and a sheath heater.

By raising the temperature of the resin holding portion 52 in this manner, the inside of the holding hole 52a can be maintained at a uniform temperature. Therefore, compared to direct heating methods such as irradiating the resin R with heat rays, it is possible to suppress the occurrence of an unbalanced state where the surface of the resin R becomes high temperature and the inside becomes low temperature, and the entire resin R becomes more uniform. It becomes possible to raise the temperature with a uniform temperature distribution.

However, the resin heating device 53 is not limited to the above configuration, and as a modified example, a heater that directly heats the resin R can be used, such as an infrared heater, a carbon heater, a laser heater, a high frequency heating device, etc. It may be provided in the resin holding portion 52 (specifically, the peripheral wall of the holding hole 52a) or the like.

Meanwhile, the phenomenon of temperature drop in the resin sealing die 10 described above occurs not only when resin R is poured into the resin sealing die 10 (here, the lower die 20), but also when the workpiece W is placed on the resin sealing die 10 (here, the lower die 20). In other words, this is because heat is absorbed from the heated resin sealing die 10 to the workpiece W, causing the temperature of the placement part (here, the workpiece support part 38) and its surroundings to drop. Therefore, similar to the above, problems of molding defects and reduced productivity arise.

In response to such a problem, the first loader 82 according to the present embodiment is provided with a work heating device 51 that heats the work W held by the work holding unit 50 to a predetermined temperature (a temperature set based on the heat resistance temperature of the first member Wa and the second member Wb that constitute the work W). As an example, the work heating device 51 may be configured to have a heater that directly heats the work W, such as an infrared heater, a halogen heater, a carbon heater, a laser heater, or a high-frequency heating device, provided in the work holding unit 50 (specifically, the part facing the work W). In addition, it is preferable that the work heating device 51 is configured to be able to set the temperature so that the temperature of the object to be heated is higher than that of the resin heating device 53. For example, if the work W and resin R have a heat sink, it is preferable to set the temperature of the resin R below a certain level even if it is heated to prevent it from melting during transport, whereas such a work W needs to be sufficiently heated during transport.

According to the above configuration, the workpiece W can be heated while being transported from the setting table 64 to the lower mold 20 (specifically, the workpiece support part 38), and the temperature can be raised to a predetermined temperature. It can be in a state where Therefore, when the workpiece W is placed on the resin-sealed mold 10 (here, the lower mold 20), the amount of heat taken by the workpiece W from the heated resin-sealed mold 10 can be reduced. , it is possible to suppress a phenomenon in which the temperature of the mounting section (here, the workpiece support section 38) and its surroundings decreases. That is, since the temperature decrease is small, the temperature recovery step can be carried out in a short time and can be completed during the cycle of resin sealing molding. As a result, it is possible to prevent molding defects (unfilling, voids, etc.) caused by insufficient heat due to entering the next molding cycle before the temperature has recovered to the predetermined temperature, and it also increases cycle time and improves production. It is also possible to prevent a decrease in performance.

As described above, during the normal cycle in which the first loader 82 transports the resin R and the workpiece W, the resin R and the workpiece W can be heated to a predetermined temperature, respectively. Cycle time does not become long and productivity does not decrease. Rather, since the melting of the resin R can be promoted, it is possible not only to improve molding defects but also to shorten the cycle time during resin sealing molding. However, if the amount of heat is insufficient even if the first loader 82 is heated while moving both into and out of the resin sealing mold 10 due to a larger amount of resin R, the cycle time will be longer. However, a configuration may be adopted in which the moving speed of the first loader 82 is reduced (that is, the transport time is lengthened) to heat the first loader 82 to a predetermined temperature. Furthermore, if the transport times are different because the distances between each of the plurality of press units 100B and the resin delivery section 68 are different, the moving speed of the first loader 82 may be adjusted to equalize the transport times. can also be considered.

By the way, as a result of intensive research by the inventor of the present application, it has been found that according to the resin sealing device 100 having the above-mentioned configuration, it is possible to solve the problem of a decrease in the temperature of the resin sealing mold 10 that occurs when resin R is introduced. Become. However, it has become clear that new challenges may arise. Specifically, the outer periphery of the resin R is heated by heating the tablet-shaped resin R to a predetermined temperature (for example, about 120° C. described above) while holding the resin R in the resin holding portion 52 (holding hole 52a). The problem is that slight melting occurs on the surface, and resin powder adheres as dirt to the resin holding portion 52 (specifically, the inner wall portion 52d of the holding hole 52a). This stain includes not only stains generated due to partial melting of the resin R, but also stains originally attached to the resin R. In any case, the dirt adhering to the inner wall 52d of the holding hole 52a will adhere to the resin R when the resin R is charged from the resin holding part 52 of the first loader 82 to the pot 40 of the lower mold 20. and gets inside the pot 40. Here, if the resin R is a thermosetting resin, there is a possibility that the dirt caused by the resin adhering to the inner wall portion 52d will accumulate, and in this case, the adhering and deposited resin is the resin after hardening. Therefore, it is not preferable for it to get mixed into the pot 40. Alternatively, there is a risk that the workpiece may fall onto the workpiece support 38 or onto the workpiece W placed on the workpiece supporter 38 during transportation. As a result, when the workpiece W is sealed with the resin R and processed into the molded product Wp, the foreign matter is mixed in and causes molding defects.

Further, the resin R, which has slightly melted on the outer circumferential surface by being heated in the resin holding part 52 (specifically, the inner wall part 52d of the holding hole 52a), Therefore, even if the shutter 52c is moved to open the entrance/exit 52b, the resin R may not fall. In this case, when the workpiece W is sealed with the resin R and processed into the molded product Wp, molding defects due to insufficient resin amount may occur.

Furthermore, if dirt (resin powder) accumulates on the inner wall 52d of the holding hole 52a, even if the shutter 52c is moved to open the entrance 52b while the resin R is held in the holding hole 52a, the resin R may get caught on the dirt (resin powder) on the inner wall 52d and not fall. In that case, when the workpiece W is sealed with the resin R and processed into the molded product Wp, this can cause molding defects due to an insufficient amount of resin.

In response to such a problem, the first loader 82 according to this embodiment is provided with a first cleaning device 54 for cleaning the inside of the resin holding portion 52 (here, the inner wall portion 52d of the holding hole 52a) as shown in Figs. 3 and 4. This first cleaning device 54 is provided with a rod-shaped portion 54a that moves inside the resin holding portion 52, and a scraping portion 54b that is provided on the rod-shaped portion 54a and slides against the inner wall portion 52d of the holding hole 52a to scrape off the resin powder adhering to the inner wall portion 52d. In this embodiment, the rod-shaped portion 54a is provided for each of the holding holes 52a that are provided in the same number as the number of pots 40 (i.e., the same number as the pots 40). In addition, the upper end of each rod-shaped portion 54a is fixed to one fixing member 54d. Therefore, by moving the fixing member 54d in the vertical direction (up and down direction), the action of moving all the rod-shaped portions 54a in the vertical direction (up and down direction) at the same time is obtained.

Here, as an example, the scraping portion 54b is configured to include a brush portion attached to the rod portion 54a as shown in Figure 5. Alternatively, as a modified example, it may be configured to include an expanded diameter portion integrally provided on the rod portion 54a as shown in Figure 6, or may be configured to include an expanded diameter portion (e.g., an annular member formed of a resin material, etc.) provided separately from the rod portion 54a as shown in Figure 7.

The first cleaning device 54 is also configured with an elevator 54c, which converts the horizontal driving force by 90 degrees to move the rod-shaped portion 54a vertically (up and down), as a mechanism for moving the rod-shaped portion 54a vertically (up and down). As an example, the elevator 54c is configured with a slide mechanism 55 as shown in FIG. 8. Alternatively, as a modified example, it may be configured with a link mechanism 56 as shown in FIG. 9. Either configuration allows the height dimension of the first loader 82 on which the rod-shaped portion 54a is installed to be small.

Here, as an example of the slide mechanism 55, a plate-shaped or rod-shaped slide member 55a that is connected to a drive mechanism (not shown) such as an air cylinder or a slider and moves in the lateral direction is provided. The slide member 55a is provided with a long hole 55b inclined at a predetermined angle, into which a pin 54e protruding from the side of the fixed member 54d is slidably inserted. According to this configuration, by moving the slide member 55a in the lateral direction, an effect is obtained in which the fixed member 54d moves in the vertical direction while the pin 54e slides within the elongated hole 56d. According to this configuration, a configuration in which the rod-shaped portion 54a is moved in the vertical direction (vertical direction) can be realized with an extremely simple structure.

On the other hand, an example of the link mechanism 56 includes a plate- or rod-shaped slide member 56a that is connected to a drive mechanism (not shown) such as an air cylinder or slider and moves laterally, and a connecting member 56b that is substantially L-shaped and rotatably fixed at a pivot point 56c and has one end rotatably connected to the slide member 56a. The other end of the connecting member 56b is provided with a long hole 56d, into which a pin 54e protruding from the side of the fixed member 54d is slidably inserted. With this configuration, by moving the slide member 56a laterally, the connecting member 56b rotates, and the pin 54e slides in the long hole 56d, while the fixed member 54d moves vertically. With this configuration, a configuration can be realized in which the height dimension of the first loader 82 on which the rod-shaped portion 54a is installed is relatively small, while the vertical movement amount of the rod-shaped portion 54a is relatively large.

According to the configuration described above, the rod-shaped portion 54a is moved vertically (up and down) within the resin holding portion 52, and the scraping portion 54b moves while sliding against the inner wall portion 52d of the holding hole 52a. This allows the scraping portion 54b to scrape off dirt adhering to the inner wall portion 52d (such as resin powder adhering to the resin R or resin powder generated by partial melting).

Therefore, when the workpiece W is sealed with resin R and processed into the molded product Wp, dirt (resin powder) adhering to the inside of the resin holding portion 52 can get into the pot 40 together with the resin R, preventing molding defects caused by contamination as foreign matter.

In addition, by heating the resin R in the resin holding portion 52 (holding hole 52a), in the unlikely event that the resin R is welded (adhered) to the inner wall portion 52d and does not fall, or that the resin R gets caught on dirt (resin powder) accumulated on the inner wall portion 52d and does not fall, the rod-shaped portion 54a, which moves vertically (up and down), can also be used as a pusher, so the resin R can be pushed by the lower end surface of the rod-shaped portion 54a.

Therefore, when the workpiece W is sealed with the resin R and processed into the molded product Wp, it is possible to prevent molding defects caused by the resin R not falling and the resin R not being put into the pot 40.

Here, as a result of intensive research by the inventors of the present application, in the resin sealing device 100 having the above configuration, by heating the resin holding portion 52 (holding hole 52a) to a predetermined temperature (for example, about 120°C as mentioned above) while holding the tablet-shaped resin R, it is possible to solve the problem that resin powder adheres to the resin holding portion 52 (inner wall portion 52d of the holding hole 52a) as dirt. On the other hand, by heating the resin R in the resin holding portion 52 or heating the workpiece W with the workpiece heating device 51, there is a risk that dirt (resin powder) removed from the resin holding portion 52 (holding hole 52a) or dust floating in the device will adhere to the lower surface 82a of the first loader 82 (the surface where the inlet/outlet 52b for the resin R is provided, including the lower surface of the shutter 52c). Dirt adhering to the underside 82a of the first loader 82 may fall into the pot 40, onto the work support portion 38, or onto the work W placed on the work support portion 38. As a result, when the work W is sealed with resin R and processed into the molded product Wp, the dirt may become mixed in as foreign matter and cause molding defects.

To address these issues, the resin sealing apparatus 100 according to this embodiment is equipped with a second cleaning device 57 that cleans the underside 82a of the first loader 82. As an example, the second cleaning device 57 (57A) is provided on the path along which the first loader 82 moves, for example, in the supply unit 100A, directly below where the first loader 82 passes, as shown in FIG. 1. However, it may also be provided in the press unit 100B, etc.

10 and 11, the second cleaning device 57 (57A) is configured to include a case 58 (58A) having an outer frame 58a and a bottom 58b with an open top, a drive mechanism 59 for moving the case 58 (58A) in the vertical direction, a tubular pipe 60 connecting the inside and outside of the case 58 (58A), and a dust collector 61 to which the pipe 60 is connected and applying suction force to the inside of the case 58 (58A). As an example of the operation of this configuration, the first loader 82 is stationary directly above the second cleaning device 57 (57A), and the drive mechanism 59 is driven to raise the case 58 (58A) to a position where the upper end 58c of the outer frame 58a of the case 58 (58A) abuts (or is close to) the lower surface 82a of the first loader 82. Next, the dust collector 61 is operated to suck air from the case 58 (58A) through the pipe 60. This allows the dirt (resin powder) adhering to the lower surface 82a (including the lower surface of the shutter 52c) of the first loader 82 to be sucked. This operation may be performed when the first loader 82 is holding the workpiece W and resin R before they are carried into the resin-sealing mold 10 (i.e., the shutter 52c is closed), or when the first loader 82 is not holding the workpiece W and resin R after carrying them into the resin-sealing mold 10 (i.e., the shutter 52c is closed (or closed)). If the operation is performed with the shutter 52c closed, a suction force can also be applied to the holding hole 52a to suck the dirt (resin powder) inside. The second cleaning device 57 (57A) may also clean the workpiece holding portion 50 (the same applies to other configurations described later).

Alternatively, as another example, the second cleaning device 57 (57B) is supported by the first loader 82 so as to be movable along the lower surface 82a of the first loader 82.

As a specific example of the configuration of the second cleaning device 57 (57B), it is configured with a case part 58 (58B) having an outer frame part 58a and a bottom part 58b and an open upper surface, a tubular pipe part 60 that communicates the inside and outside of the case part 58 (58B), and a dust collection device 61 to which the pipe part 60 is connected and which applies suction force to the inside of the case part 58 (58B). Here, the case part 58 (58B) has a moving mechanism (not shown) and is supported by the first loader 82 so as to be movable along the lower surface 82a of the first loader 82. At this time, the upper end part 58c of the outer frame part 58a is positioned so as to abut (or be close to) the lower surface 82a of the first loader 82.

As an example of the operation of this configuration, while the first loader 82 is moving or stopped, a moving mechanism (not shown) is driven to move the case portion 58 (58B) along the lower surface 82a of the first loader 82. At this time, the dust collector 61 is operated to suck air inside the case part 58 (58B) through the pipe part 60. Thereby, dirt (resin powder) attached to the lower surface 82a of the first loader 82 (including the lower surface of the shutter 52c) can be sucked. This operation may be performed while the first loader 82 is holding the workpiece W and the resin R before transporting them into the resin sealing mold 10 (that is, with the shutter 52c closed), Alternatively, the first loader 82 carries the workpiece W and the resin R into the resin sealing mold 10 and then does not hold them (that is, the shutter 52c is closed (or closed)). Good too. Note that if this is carried out with the shutter 52c closed, suction force can also be applied to the inside of the holding hole 52a to suck out dirt (resin powder) inside the holding hole 52a. Moreover, if this operation is performed while the first loader 82 is moving, the cycle time will not increase and productivity will not decrease. Further, the second cleaning device 57 (57B) is fixed to the transport mechanism side of the first loader 82 (not shown) in the left-right direction, and when the first loader 82 moves in the front-back direction, the second cleaning device 57 (57B) The lower surface 82a may be configured to be cleaned by passing over the second cleaning device 57 (57B).

According to the second cleaning device 57 described above, it is possible to obtain the effect of removing dirt (resin powder) attached to the lower surface 82a of the first loader 82 (including the lower surface of the shutter 52c). Therefore, when the workpiece W is sealed with the resin R and processed into the molded product Wp, the dirt (resin powder) adhering to the lower surface 82a of the first loader 82 is deposited inside the pot 40, on the workpiece support 38, or on the workpiece supporter. It is possible to prevent molding defects caused by foreign matter falling onto the workpiece W placed on the workpiece 38 and being mixed in as foreign matter.

As described above, the resin sealing apparatus 100 according to the present invention makes it possible to prevent a drop in temperature at the injection portion and its surroundings caused by heat being taken from the resin R by the resin R when the tablet-shaped resin R is injected into the resin sealing die 10. Therefore, in the resin sealing process, molding defects that may occur due to a drop in the temperature of the resin R can be reduced without lengthening the cycle time. On the other hand, due to the configuration in which the resin R is held and heated inside the resin holding portion 52, a new problem arises in that dirt from the resin R is easily attached to the inside, but the dirt can be removed by cleaning.

Note that the present invention is not limited to the embodiments described above, and can be modified in various ways without departing from the scope of the present invention. For example, in a compression molding type resin sealing device, there is a device that heats the workpiece during transportation by an inloader (workpiece heating device according to this embodiment), a device that cleans the bottom surface of the inloader (second cleaning device according to this embodiment), equipment) can be applied.

10 Resin sealing mold 20 Lower mold 21 Upper mold 40 Pot 50 Work holding part 51 Work heating device 52 Resin holding part 53 Resin heating device 54 First cleaning device 54a Rod-shaped part 54b Scraping part 54c Lifting device 57 Second cleaning device 70 Press device 82 First loader (inloader)
84 Second loader (offloader)
100 Resin sealing device R Mold resin W Work Wa First member Wb Second member Wp Molded product

Claims (6)

A resin sealing device for sealing a workpiece with resin and processing it into a molded product using a resin sealing mold including an upper mold and a lower mold,
comprising a loader for conveying tablet-shaped resin into the resin sealing mold,
The loader includes a resin holding section having a holding hole that holds the resin, a resin heating device that heats the resin held in the holding hole , and a first cleaning device that cleans the inside of the holding hole . death,
The first cleaning device includes a rod-shaped part that moves within the holding hole, and a scraping part that is provided on the rod-shaped part and comes into sliding contact with the inner wall of the holding hole to scrape off resin powder adhering to the inner wall. and a lifting device that converts the driving force in the horizontal direction by 90 degrees to move the rod-shaped part in the vertical direction,
The scraping part has a brush part attached to the rod-shaped part, or an enlarged diameter part provided integrally with or separately from the rod-shaped part,
The rod-shaped portion is configured to double as a pusher that pushes the resin with its lower end surface when the resin does not fall from within the holding hole.
A resin sealing device featuring: The resin sealing device according to claim 1 , wherein the loader includes a work holding section that holds the work, and a work heating device that heats the held work. 3. The resin sealing apparatus according to claim 1 , wherein the resin heating device has a heater for increasing the temperature of the resin holding portion. The resin sealing device according to any one of claims 1 to 3 , further comprising a second cleaning device that cleans a lower surface of the loader where an entrance and exit port for the resin to the resin holding portion is provided. 5. The resin sealing device according to claim 4 , wherein the second cleaning device is supported by the loader so as to be movable along the lower surface. 5. The resin sealing device according to claim 4 , wherein the second cleaning device is provided along a path along which the loader moves.

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