JP2001291731A - Mold for resin seal, semiconductor manufacturing equipment, and method of manufacturing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress a variation in molding among cavities by reducing a clamping force in a resin sealing apparatus and also reduce the size and cost of a mold. SOLUTION: The mold 10 has a cavity for storing a part of semiconductor elements out of a plurality of those on a lead frame 1, and can be transferred on a transfer path of the lead frame 1 with the lead frame 1 being held between an upper mold 10U and a lower mold 10L of the mold 10. Between the upper mold 10U and the lower mold 10L of the mold 10, there is a pressurization mechanism to supply a force working in the direction to close the mold 10. A sealing process area comprises a resin injection process area and a curing process area. In the resin injection process area, a pressurization device 151 and a plunger push-up device 152 are installed. The pressurization device 151 clamps only one mold 10 transferred to the resin injection process area.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin seal used for sealing a semiconductor element with a resin in a lead frame having a plurality of die pads and a semiconductor element mounted on each die pad. More particularly, the present invention relates to a semiconductor manufacturing apparatus provided with the mold and a method of manufacturing a semiconductor device using the mold.

[0002]

2. Description of the Related Art The structure and operation of a conventional resin sealing device 100P will be described with reference to FIGS. 22 and 23 show a conventional resin sealing device 100P, respectively.
It is a schematic side view and a longitudinal sectional view for explaining
FIG. 24 is a schematic top view for explaining the lower mold 10LP of the conventional mold 10P.

[0003] A conventional resin sealing device 100P includes a plurality of dies 10P, a press section 21P, a plunger section 14P.
, An ejector section 15P, and a cleaner section 36P. Although illustration in FIG. 22 and the like is omitted, the conventional resin sealing device 101P is connected to the mold 10P by the lead frame 1P.
And an unloader for discharging a resin-sealed molded product.

Each mold 10P has a plurality of cavities 11UP.
And a lower mold 10LP having a plurality of cavities 11LP.
P, 11LP are cavities (plurality) 11 of mold 10P
Form P. Each of multiple upper molds 10UP and lower mold 1
0LP is fixed to the press part 21P, and the press part 2
The full mold 10P is opened by the opening operation of 1P, and the full mold 10P is closed by the closing operation.

The lead frame 1 has a plurality of die pads, and a semiconductor element (not shown) is mounted on each die pad and bonded. Such a lead frame 1 is
The lower die 10LP is placed on the lower die 10LP (see FIG. 24; only the outer shape of the lead frame 1 is shown by broken lines in FIG. 24), and the upper die 10UP and the lower die 10LP are pressed by the press part 21P.
Is clamped through. At this time, lead frame 1
The mold is clamped in a state where the entire lead frame 1 is housed in the mold 10P and in a state where each semiconductor element is housed in each cavity 11P.

After the above clamping operation, the plunger portion 14P
Is the pot or chamber 12 of the lower mold 10LP.
Tablet-like resin supplied to P in advance (not shown)
Is injected into the cavity 11P via the runner 13P. The resin tablet is heated in the pot 12P, and the plunger 14P injects the molten resin. Thereby, the semiconductor element is sealed with the resin. At this time,
To prevent resin leakage, upper mold 10UP and lower mold 10L
P is clamped by a certain or more sealing surface pressure or clamping force.

After sealing, the resin is held under pressure for a certain period of time until the resin is cured, and the lead frame is held in a mold-clamped state. The pressure holding time and the time required for curing the resin are not necessarily the same. After the curing of the resin reaches a certain level, the mold 10P is opened, and the molded article sealed with the resin is ejected by the ejector unit 15P.
Release from P. Thus, the conventional resin sealing device 1
In 00P, resin injection and curing are performed in the same place. Thereafter, the cleaner unit 26 cleans the mold 10P after the molded product is taken out.

[0008]

As described above, in the conventional resin sealing device 100P, the entire lead frame 1 is housed in the mold 10P to perform mold clamping. Further, a pressing operation is performed simultaneously on the plurality of dies 10P. At this time,
As the number of semiconductor elements mounted on the lead frame 1, in other words, the number of cavities 11P and the number of dies 10P to be pressed at the same time increase, it is necessary to increase the press load. For this reason, the conventional resin sealing device 1
00P has a problem that the equipment becomes large and expensive.

Moreover, in the conventional resin sealing device 100P, it is difficult to keep the sealing surface pressures on the cavities 11P uniform due to the accumulated tolerance of the press section 21 and the mold 10P. For this reason, there is a problem that resin leakage easily occurs.

Further, since a plurality of semiconductor elements on the lead frame 1 are simultaneously sealed, it is difficult to control the flow of the resin into the individual cavities 11P. For this reason, in the conventional resin sealing device 100P, there is a problem that variations in molded products caused by variations in the flow of the resin are likely to occur.

Although the above-mentioned problem can be solved by improving the accuracy of the mold, in such a case, the cost of the mold 10P and therefore the cost of the resin sealing device 100P is increased.

SUMMARY OF THE INVENTION The present invention has been made in view of the above, and a first object of the present invention is to reduce the size and cost of a resin sealing mold.

It is a second object of the present invention to provide a resin sealing mold capable of reducing molding defects as compared with the prior art.

It is a third object of the present invention to provide a resin sealing mold capable of improving productivity or operating rate.

Further, a fourth object of the present invention is to provide a semiconductor manufacturing apparatus (resin sealing apparatus) and a method of manufacturing a semiconductor device which can realize the first to third objects.

[0016]

According to a first aspect of the present invention, there is provided a resin molding die according to the first aspect of the present invention, which has a plurality of die pads and a lead frame in which a semiconductor element is mounted on each of the die pads. In contrast, a resin sealing mold used when sealing each of the semiconductor elements with a resin, and having a cavity capable of accommodating a part of the semiconductor elements among the plurality of semiconductor elements. A first part and a second part which can be opened and closed with respect to each other;
A part, the part of the semiconductor element is housed in the cavity, and the lead frame is sandwiched between the first part and the second part, and the semiconductor element can be transferred on a transfer path of the lead frame. It is characterized by the following.

(2) The resin sealing mold according to the second aspect of the present invention is the resin sealing mold according to the first aspect, wherein a force for closing the resin sealing mold is provided. It is characterized by further comprising a preload mechanism applied between the first part and the second part.

(3) In the semiconductor manufacturing apparatus according to the third aspect of the present invention, each of the semiconductor elements is mounted on a lead frame having a plurality of die pads and a semiconductor element mounted on each of the die pads. 3. A semiconductor manufacturing apparatus for sealing with resin, wherein the resin sealing mold according to claim 1 or 2, and the opening / closing operation of the resin sealing mold, and the resin sealing mold to the transport path. A mold control unit that performs an operation of inserting a mold and an operation of escaping the resin sealing mold from the transport path, and is provided in a sealing process area on the transport path,
A sealing portion for performing a sealing operation of resin-sealing the part of the semiconductor elements housed in the cavity, and the lead frame sandwiched between the lead frame and the resin sealing mold; And a transport unit that transports the resin along the transport path, wherein the sealing operation is performed while the resin sealing mold is transported on the transport path.

(4) The semiconductor manufacturing apparatus according to the fourth aspect of the present invention is the semiconductor manufacturing apparatus according to the third aspect, wherein the mold control unit is configured to remove the resin from the transport path. It is characterized in that a tool is again put into the transport path.

(5) A semiconductor manufacturing apparatus according to a fifth aspect of the present invention is the semiconductor manufacturing apparatus according to the third or fourth aspect, wherein a plurality of the resin sealing dies are provided. .

(6) A semiconductor manufacturing apparatus according to a sixth aspect of the present invention is the semiconductor manufacturing apparatus according to any one of the third to fifth aspects, wherein the sealing process area is formed into the cavity. A resin injection step area for performing a step of injecting a resin, and a curing step area for performing a step of curing the resin after the resin injection step, provided in an area different from the resin injection step area; The unit is provided with a pressure device for clamping the resin sealing mold in the resin injection step area.

(7) A semiconductor manufacturing apparatus according to a seventh aspect of the present invention is the semiconductor manufacturing apparatus according to any one of the third to sixth aspects, wherein the sealing portion is resin-sealed. An ejector device for releasing a semiconductor element from the cavity is provided.

(8) The method of manufacturing a semiconductor device according to the invention described in claim 8, wherein each of the semiconductor devices is mounted on a lead frame having a plurality of die pads and a semiconductor element mounted on each of the die pads. A method for manufacturing a semiconductor device in which an element is sealed with a resin, the method comprising: (a) opening the resin sealing mold and using the resin sealing mold according to claim 1 or 2; Charging the lead frame with the resin sealing mold in a state where the part of the semiconductor elements is accommodated in the cavity; and (b) in the sealing process area on the transport path, Performing a sealing operation of resin-sealing the part of the semiconductor elements housed in the cavity while conveying the resin-sealing mold along the conveyance path; and (c) the step (b). After the,
Opening the resin sealing mold, releasing the resin-sealed semiconductor element from the cavity, and allowing the resin sealing mold to escape from the transport path. .

[0024]

<First Embodiment> A. First Embodiment Overall Configuration of Resin Sealing Apparatus 100 A resin sealing apparatus (semiconductor manufacturing apparatus) 100 according to Embodiment 1 will be described with reference to FIGS. In addition, a schematic side view for explaining the resin sealing device 100,
It is divided and shown in FIGS. 2 to 5 arranged in the relationship shown in FIG. Similarly, a schematic top view for explaining the resin sealing device 100 is shown in FIG.
10 to FIG. Symbol BL in FIG. 1 etc.
Reference numeral 23 indicates a boundary of a range of illustration in each drawing. 2 and 7 show the same area in the resin sealing device 100. Similarly, FIGS. 3 and 8 correspond to FIGS. 4 and 9, and FIGS. 5 and 10 correspond respectively. However, some components are not shown in the side view or the top view in order to avoid complication of the drawings. In the following description, the first direction D1 and the second direction D2 are taken in directions that are orthogonal to each other in a horizontal plane, and the vertical direction or the vertical direction is the third direction.
It is assumed that the direction is D3.

First, the lead frame 1 to be manufactured in the resin sealing device 100 will be described. The lead frame 1 has a plurality of die pads (not shown), and one or a plurality of semiconductor chips or semiconductor elements are mounted on each die pad and wire bonding is performed. In FIG. 7 and the like, these detailed illustrations are omitted,
A region (hereinafter referred to as a “sealing region”) 1A to be resin-sealed is schematically illustrated with a broken line. A plurality of semiconductor elements may be mounted on one die pad. In the following description, in such a case, the plurality of semiconductor elements will be collectively referred to as “semiconductor elements”. Here, the case where the lead frame 1 has eight and two (a total of 16) sealing regions 1A along the first direction D1 and the second direction D2 in a state where the lead frame 1 is placed on the transport path is described. An example will be described.

As shown in FIGS. 1 to 10, the resin sealing device 100 includes a transport section 110 (not shown), a lead frame supply section 120 (see FIGS. 2 and 7), and a resin tablet supply section 130. (See FIG. 7), a resin molding section 140 (see FIGS. 3 and 8), a gate break section 160 (see FIGS. 4 and 9), and a molded article discharge section 170 (see FIGS. 5 and 10).
Reference).

The transport section 110 includes a transport rail 111 laid along a predetermined transport path (here, the first direction D1) and a transport mechanism (to transport the lead frame 1 along the predetermined transport path). (Not shown).

As will be apparent from the following description, the transport unit 1
Reference numeral 10 denotes (i) the transport rail 11 from the storage magazine 121
1 is transported to the resin molding section 140, and (ii) the mold 10
Is transported (in other words, the mold 10 with the lead frame 1 sandwiched therebetween), and (i)
ii) The lead frame 1 released from the mold 10 after resin molding is transported to a transfer operation position by the transfer machine 171 of the molded article discharge section 170. At this time, the above (i) to (ii)
When each transport operation of i) is performed by a different transport mechanism, the plurality of transport mechanisms are collectively called "(transport unit 110
A) transport mechanism.

The lead frame supply section 120 includes a transfer machine (not shown), and the storage magazine 12 is moved by the transfer machine.
1 (see FIGS. 2 and 7), the lead frame 1 is extracted and transferred onto the transport rail 111.

As shown in FIG. 7, the resin tablet supply unit 130 includes a transfer machine 131, and the resin or the resin tablet 2 on the mounting table 132 is transferred by the transfer machine 131 to a resin-sealing mold (hereinafter simply referred to as a “mold”). The mold 10 is transferred onto a plunger (not shown) in a pot 12 (see FIG. 11 described later).

The resin molding section 140 uses the mold 10 to resin seal the semiconductor element on the lead frame 1. The resin molding 140 and the mold 10 will be described later in detail.

As shown in FIGS. 4 and 9, the gate breaker 160 includes a gate breaker 161 having a punch 161A and a die 161B.
Unnecessary resin 2 </ b> B, such as a bulged portion and a remaining gate, is removed.

As shown in FIGS. 5 and 10, the molded article discharging section 170 includes a transfer device 171. The transfer device 171 transfers the lead frame 1 with the semiconductor element sealed with resin to the transfer rail 111. From the storage magazine 172.

The transfer mechanism of the lead frame 1 described above, the transfer device of the lead frame supply unit 120, and the transfer devices 131, 131
As 171 or the like, various known mechanisms can be applied.

B. Before the resin molding part 140 is described in detail, the resin sealing device 100
Will be described. FIGS. 11 and 12 are a schematic perspective view and a side view (rear view) for explaining the mold 10, respectively. Note that the first direction D1 to the third direction D3 in FIGS. 11 and 12 match the posture of the mold 10 in the resin sealing device 100 (see FIG. 8 and the like).
For convenience of explanation, FIGS. 11 and 12 show a state in which the mold 10 is open.

The mold 10 is not fixed in the resin sealing device 100 but can be transported on the transport path of the lead frame 1.

More specifically, the mold 10 comprises an upper mold (first part) 10U and a lower mold (second part) 10U which can be opened and closed with each other.
L is provided. Cavities 11U and 11L are formed on the mutually facing surfaces of the upper mold 10U and the lower mold 10L, respectively, and the shape of the resin package 2A (see FIG. 3) of the semiconductor device is formed by the two cavities 11U and 11L. Is formed.

The mold 10 has two cavities 11 (generally referred to as "cavities 11A") arranged in the second direction D2, and each cavity 11 is arranged in the second direction D2 of the lead frame 1. It is formed corresponding to the two sealing regions 1A. That is, the mold 10 accommodates two of the eight semiconductor elements mounted on the lead frame 1 arranged in the second direction D2 in the cavity 11A (two cavities 11), and simultaneously accommodates these. Resin sealing. Therefore, the dimension of the mold 10 along the first direction D1 is shorter than the dimension of the lead frame 1.

The lower mold 10L has a pot 12 for accommodating the resin tablet 2, and the pot 12 and the two cavities 1
A runner 13 which is a resin injection path is formed between the runner 13 and 1L. Note that a plunger (not shown) is arranged in the pot 12.

In particular, the lower mold 10L has two bars 16A extending in the third direction D3 toward the upper mold 10U. The bars 16A move the upper mold 10U in the third direction D3. It is inserted into a through hole 16B formed therethrough. At this time, the rod 16 is inserted into the through hole 16B so that the upper mold 10U can move along the third direction D3. Rod 16
A, a spring 16C is inserted into a portion protruding from the through hole 16B, and a rod 16A on the side protruding from the through hole 16B.
The end 16AT of A is formed in an eaves shape.

At this time, the upper mold 10U is pushed toward the lower mold 10L by the restoring force of the spring 16C. That is, the rod 16
A preload mechanism including A and a spring 16C applies a force to close the mold 10 between the upper mold 10U and the lower mold 10L. Note that, instead of the spring 16C, a force for closing the above-described mold 10 may be given by another urging means or the like.

As shown in FIG. 12, the upper mold 10U
A hole 17 is formed on one side surface of the lower mold 10L in the second direction D2. Part of the opening of the hole 17 is narrowed by the eaves 17H.

C. Configuration of Resin Molding Section 140 Here, a schematic top view for explaining the resin sealing device 100 is shown in FIG. FIG. 13 corresponds to FIG. 8, and particularly illustrates each area (described later) of the resin molding section 140. The resin molding 140 will be described with reference to FIGS. 13, 3 and 8.

As shown in FIG. 13, the resin molding 140
Are roughly divided into a mold input area AR1, a sealing step area AR2, and a mold escape area AR3 in the transport path 5, and a mold standby area AR0 provided opposite to the transport path 5. The mold waiting area AR0 is provided on the side facing the hole 17 of the mold 10 placed on the transport path 5.

C-1. Die standby area AR0 Die standby area AR0 is (a) mold input area A
A charging standby area AR01 for waiting for the mold 10 to be charged into R1, and a collection area A for collecting and storing the mold 10 escaped from the mold escape area AR3 (b).
R02.

Then, a transfer rail 141 for transferring the mold 10 is laid between the loading standby area AR01 and the mold loading area AR1. Here, the case where the transport rail 141 is laid along the second direction D2 is illustrated.

A mold opening / closing device 1431 and a mold back-and-forth moving device 1432 (generically referred to as a “mold loading device 143”) are arranged at an end point of the carrying rail 141 opposite to the carrying path 5. I have.

FIG. 14 shows a mold opening / closing device 1431.
And a schematic perspective view for explaining the operation of the die longitudinal movement device 1432. As shown in FIG. 14, the mold opening / closing device 1431 includes a lower mold connecting portion 1431L and an upper mold movable portion that can move (vertically move) in the third direction D3 with respect to the connecting portion. And a connecting portion 1431U, and are arranged so as to be able to be transported on the transport rail 141 along the second direction D2.

Each of the connecting portions 1431U and 1431L is
A connecting rod 1431A arranged along the second direction D2,
A mechanism for moving the connection rod 1431A in the second direction D2 (moving forward and backward) and a mechanism for rotating the connection rod 1431A around an axis are provided. As shown in the perspective view of FIG. 15, the end 1431AT of the connecting rod 1431A has a shape that can be inserted into the hole 17 of the mold 10 and the connecting rod 1431A after being inserted into the hole 17.
When 31A is rotated by a predetermined amount (for example, 90 °) around the axis, it has a shape capable of engaging with the eaves portion 17H.

With this configuration, the mold opening / closing device 1431
Opens the mold 10 closed by the preload mechanism as follows. First, the upper mold 10U and the lower mold 10L
The connecting portion 1431U moves up and down such that the connecting rods 1431A of the connecting portions 1431U and 1431L face the holes 17 of the above. After that, each connecting part 1431U, 1431L inserts each connecting rod 1431A into each hole 17 and rotates, thereby connecting each connecting part 1431U, 1431L and the upper mold 1.
0U and the lower mold 10L are engaged. From this engagement state, the mold 10 is opened by moving (upward) the connecting portion 1431U for the upper mold away from the connecting portion 1431L for the lower mold. Mold 10
It is also possible to close.

The transfer path 5 for the mold opening / closing device 1431
The mold front-rear movement device 1432 is arranged on the side far from the side. The mold longitudinal movement device 1432 includes a shaft 1432A arranged along the second direction D2 and a mechanism for moving (moving forward and backward) the shaft 1432A along the second direction D2.
One end of the shaft 1432A is connected to the mold opening / closing device 1431. With this configuration, the mold opening / closing device 143 is moved by the mold back-and-forth moving device 1432 moving the shaft 14 back and forth.
1 can be moved back and forth.
When 1 is engaged with the mold 10, the mold 10 can be moved back and forth.

The above-described longitudinal movement and vertical movement in the mold opening / closing device 1431 and the mold longitudinal movement device 1432 can be performed by various mechanisms such as a ball screw mechanism and a cylinder mechanism.

Similarly, a transport rail 142 for transporting the mold 10 is laid between the collection area AR02 and the mold escape area AR3. And the transport rail 1
42, the mold opening and closing device 1
441 and a die back-and-forth moving device 1442 (also collectively referred to as a “die collecting device 144”) are arranged. The mold opening / closing device 1441 and the mold longitudinal movement device 1442 are respectively the above-described mold opening / closing device 1431 and the mold longitudinal movement device 1432.
And the same operation is possible.

Further, the mold standby area AR0 is provided with a mold transfer machine 145 for transferring the mold 10 from the collection area AR02 to the charging standby area AR01 (and in the opposite direction).

In the following description, the mold loading device 14
3, the configuration including the mold recovery device 144 and the mold transfer machine 145 is also referred to as a “mold control unit 140A”. That is, the mold control unit 140A performs (a) opening and closing operation of the mold 10, and (b) the mold 10 from the mold standby area AR0 to the mold input area AR1.
(C) an operation to escape and recover the mold 10 from the mold escape area AR03 to the mold standby area AR0, and (d) a movement of the mold in the mold standby area AR0.

Further, a mold cleaner 146 is provided in the mold standby area AR0 so as to face the collection area AR02. The mold cleaner 146 is movable along the first direction D1, and moves toward the mold 10 collected in the collection area AR02. The mold cleaner 146 has an ultraviolet irradiation device, a brush, and the like (not shown), decomposes the resin adhering and remaining on the mold 10 by ultraviolet irradiation, and cleans the mold 10 with a brush using a brush. I do. Dust such as resin residue generated by the washing is sucked by the suction device 146.
A sucked.

C-2. Sealing process area AR2 The sealing process area AR2 is a resin injection process area AR21.
And a curing step area AR22 located downstream of the transport path 5 from the area AR21.

In the resin injection process area AR21, a pressing device 151 (see FIG. 3), a plunger lifting device 152
(See FIG. 3) and an evacuation device 153 (see FIG. 8). Note that a “sealing portion” including the above-described pressurizing device 151 and plunger pushing-up device 152 is used to seal the semiconductor elements of the two sealing regions 1A housed in the cavity 11A in the sealing process area AR2. Stop.

The pressing device 151 is disposed above the transport rail 111, and clamps only one mold 10 by applying a load to the upper mold 10U. The plunger push-up device 152 is disposed below the transport rail 111, and includes a plunger push-up bar 152A arranged along the third direction D3, and the plunger push-up bar 152.
And a mechanism for moving A up and down along the third direction D3. The plunger push-up bar 152A is arranged at a position where the plunger of the mold 10 on the resin injection process area AR21 can be pushed up from below.

The evacuation device 153 includes a vacuum pump.
The vacuum pump is connected to the mold 10 on the resin injection process area AR21 via a pipe. Evacuation device 153
In this case, the space inside the mold 10 is evacuated by the vacuum pump to bring the lead frame 1 into close contact with the upper mold 10U and the lower mold 10L.

C-3. Mold escape area In the mold escape area AR3, an ejector device (or knockout device) is provided above and below the transport rail 111.
155 are arranged. The ejector device 155 includes an ejector rod 155A arranged along the third direction D3.
And a mechanism for moving (moving up and down) the ejector bar 155A along the third direction D3. The ejector device 155 projects the ejector rod 155 </ b> A into the cavity 11 when removing the molded product from the mold 10.

D. Operation of Resin Sealing Device 100 Next, the operation of the resin sealing device 100 will be described with reference to the flowcharts of FIGS. 16 to 20 in addition to FIGS. 1 to 15 described above. Here, to help understand the operation, 1
The following description focuses on the movement or flow of one mold 10, and FIGS. 16 to 20 show flowcharts for explaining the flow of one mold 10. 17 to 20 show steps ST10, ST20, and S in FIG.
It is a more detailed flowchart of T30 and ST40.
The operation from the state where the lead frame 1 is not mounted on the transport rail 111 will be described.

D-1. Mold input step ST10 (FIG. 1)
7) The lead frame 1 is taken out of the storage magazine 121 by the transfer machine and is transferred onto the transport rail 111. The lead frame 1 placed on the transport rail 111 is transported to the resin molding section 140 by the transport mechanism described above (step ST11). At this time, in the transport mechanism, the sealing area 1A of the lead frame 1 (the two sealing areas 1A arranged in the second direction D2) on the most downstream side in the transport direction has reached a predetermined position in the mold input area AR1. At this point, the transport of the lead frame 1 is stopped.

Then, the mold 10 previously prepared in the loading standby area AR01 is opened by the mold opening / closing device 1431, and the opened mold 10 is advanced toward the transport path 5 by the mold back-and-forth moving device 1432. Then, the mold is loaded into the mold loading area AR1 (step ST12; see the leftmost mold in FIG. 3). The resin tablet 2 on the mounting table 132 is supplied by the transfer machine 131 to the pot 12 of the mold 10 placed in the mold loading area AR1 (step ST1).
3).

Then, the mold 10 is closed by the mold opening / closing device 1431 (see the leftmost mold in FIG. 21), and the lead frame 1 is sandwiched between the upper mold 10U and the lower mold 10L. At this time, among the eight semiconductor elements mounted on the lead frame 1, the semiconductor elements in the (two) sealing areas 1A set in the mold input area AR1 are transferred into the cavities 11A (two cavities 11). (Step ST14). Thereafter, the mold input device 143 is moved backward to the mold standby area AR0 (step ST15). Specifically, the engagement between the connecting rod 1431A of the mold opening / closing device 1431 and the mold 10 is released, and the mold opening / closing device 1431 is retracted to the mold standby area AR0 by the mold longitudinal movement device 1432.

At this time, the mold opening / closing device 1431 is
0, and specifically by the action of the preload mechanism of the mold 10, specifically by the restoring force of the spring 16C.
The mold 10 can securely hold the lead frame 1.

D-2. Sealing operation step ST20 (FIG. 1
Next, the lead frame 1, in other words, the mold 10 sandwiching the lead frame 1 is transported by the transport mechanism,
The two sealing regions 1A or the mold 10 described above are transferred to the resin injection process area AR21 (step ST21).

Then, as shown in FIG.
One mold 10 is clamped by 51 (step ST).
22). At this time, mold clamping is performed with a load that applies a sealing surface pressure that does not cause resin leakage during resin injection. Thereafter, the plunger push-up device 152 raises the plunger push-up bar 152A to push up the plunger in the pot 12 (see FIG. 11). This allows
The resin in the pot 12 is injected into the cavity 11 (or 11A) (step ST23).

After a certain period of time has elapsed from the completion of the injection, the mold clamping by the pressurizing device 151 is released, and the plunger push-up rod 152A is lowered (step ST2).
4). At this time, since the holding of the lead frame 1 by the preload mechanism of the mold 10 is held, occurrence of molding defects can be suppressed.

Then, the above-described two sealing areas 1A of the lead frame 1 by the transfer mechanism, in other words, the mold 10 with the lead frame 1 sandwiched therebetween is cured by the curing process area A.
It is transported to R22 (step ST25). In the curing step area AR22, the mold 10 is left for a predetermined time (curing time) to sufficiently cure the resin after the injection (step ST26). The “sealing operation” includes the above-described resin injection and curing, and at this time, the resin sealing device 10
According to 0, the sealing operation is performed while the mold 10 is transported on the transport path 5.

In FIG. 3 and the like, the curing process area AR2
2 shows only one location, in other words, only one pitch of the lead frame 1 along the first direction D1 is shown, but the cure time, the time required in the resin injection process area AR21, and the like are shown. The curing process area AR22 may be provided for a plurality of pitches based on the operation speed of the resin sealing device 100. At this time, the number of cure process areas AR22 is set so that the total time for a plurality of pitches exceeds the cure time.

D-3. Mold escape step ST30 (FIG. 1)
9) After the curing time has passed, the transfer mechanism causes the mold 10
Alternatively, the two sealing areas 1A described above are transported to the mold escape area AR3 (step ST31).

After that, the mold collecting device 144 is moved to the mold opening / closing device 144 by the mold longitudinal movement device 1442.
1 is advanced toward the mold escape area AR3 (step ST32). Then, the connecting rod 1441A of the mold opening / closing device 1441 is engaged with the mold 10, and the mold 10 is opened. At this time, at least the ejector device 15 above the mold 10
5 protrudes the ejector rod 155A to ensure the opening operation of the mold 10. Simultaneously with or after the opening operation of the mold 10, the molded product is released from the cavity 11 by the ejector device 155 (step ST33).

Then, the mold opening / closing device 1441 and the mold 10 are retracted by the mold back-and-forth moving device 1442, and the mold 1 is moved.
0 to the collection area AR02 (step ST3)
4). In addition, the resin sealing device 100 performs a post-molding step ST50 described later on the molded product that has been released.

D-4. Mold reload preparation step ST40
(See FIG. 20) The mold 10 collected in the collection area AR02 is cleaned by the mold cleaner 146 (Step ST4).
1) Then, the cleaned mold 10 is transferred to the transfer machine 14.
Then, it is transferred to the charging standby area AR01 (step ST42).

The series of operation steps ST10 to ST40 completes the movement or flow of one mold 10 in one cycle. Note that lead frame 1
Alternatively, the lead frame 1 sandwiched between the molds 10 is provided on each of the areas AR1, AR21, AR22, AR on the transport path 5.
Each step of moving between the three units is performed by the transport mechanism of the transport unit 110.

In particular, the resin sealing device 100 repeatedly executes such one cycle,
And these molds 10 are used at the same time by shifting the operation steps. As a result, the semiconductor elements on the lead frame 1 are successively resin-sealed.

D-5. Post-Molding Step ST50 The resin sealing device 100 conveys the molded product after release to the gate break portion 160, and removes unnecessary resin 2B such as culls and remaining gate from the resin package 2A by the gate break device 161 ( Step ST51).
Then, after the step ST51 is completed for all the resin packages 2A on one lead frame 1,
The lead frame 1 is conveyed to the molded article discharge section 170, and is transferred to the storage magazine 172 by the transfer machine 171 (step ST52).

According to the resin sealing device 100, the following effects can be obtained. First, the mold 10 accommodates a part (two) of the plurality of (eight) semiconductor elements mounted on the lead frame 1 in the cavity 11A and accommodates the upper mold 10U and the lower mold. Lead frame 1 with 10L
Sandwich. Therefore, the mold 10 is small and inexpensive as compared with the conventional mold 10P in which all of the plurality of semiconductor elements are simultaneously accommodated in the cavity 11P.

Since the mold 10 does not accommodate all of the plurality of semiconductor elements at once as described above, the conventional mold 10
Compared with P, the number of cavities is small. For this reason,
Variations in the resin flow between the cavities 11 can be suppressed. Further, since the pressurized area at the time of mold clamping can be smaller than that of the conventional mold 10P due to the reduction in the number of cavities, the smoothness of the entire surface of the upper mold 10U and the lower mold 10L facing each other can be reduced. Easy to secure. Further, due to the small pressing area, variation in the mold clamping force over the entire pressing surface can be suppressed (the mold can be clamped uniformly). Therefore, the mold 10 and the resin sealing device 1
According to 00, molding defects such as resin leakage during resin injection can be reduced.

Since the pressing area is small as described above, a small clamping force is required. For this reason, the pressurizing device 15
As 1, a small and inexpensive one can be used. Further, since the number of cavities is smaller than that of the conventional mold 10P, a small and inexpensive ejector device 155 can be used. Therefore, the size and cost of the resin sealing device 100 can be reduced.

Further, since the mold 10 has a preload mechanism,
The lead frame can be securely held. For this reason, as described above, even after the mold clamping force by the pressurizing device 151 is released, the mold 10 can continue to hold the lead frame, so that molding defects can be suppressed. In addition, the mold 10 can move on the transport path with the lead frame 1 securely sandwiched.

In addition, the resin sealing apparatus 100 repeatedly uses one mold 10 and includes a plurality of molds 10 which are used simultaneously with different operation steps.
Resin sealing can be performed efficiently and at a high operation rate.

When both steps are performed in the same area as in the conventional resin sealing apparatus 100P, other semiconductor elements cannot be resin-sealed until the curing step is completed. On the other hand, in the resin sealing apparatus 100, the resin injection step and the curing step are performed in different areas, and the mold 10 is conveyed on the conveyance path, in other words, the lead frame 1 stays on the conveyance path. Without performing the sealing operation, the sealing operation (including resin injection and curing) is sequentially performed on the sealing region 1A. Therefore, resin sealing can be performed with high productivity also in such a point.

Further, since the mold 10 is not fixed to the resin sealing device 100 and can be conveyed on the conveyance path of the lead frame 1, the maintenance and replacement of the mold can be performed as compared with the conventional mold 10P. Is easy. And all the molds 1
Since all of the reference numerals 0 are not fixed to the resin sealing device 100, for example, even if a failure occurs in one mold 10, only the mold 10 can be easily replaced.
At this time, if the replacement is performed while the mold 10 is in the mold standby area AR0, the operation rate of the resin sealing device 100 does not decrease.

The mold loading area AR on the transport path 5
1 and the resin injection process area AR21 may be set as the same area.
And the mold escape area AR3 may be set as the same area. According to such an area setting, the size or installation space of the resin sealing device 100 can be reduced. Further, since the time required for moving the lead frame 1 between the respective areas can be reduced, the operation rate or productivity of the resin sealing device 100 can be improved.

A mold for clamping a part of semiconductor elements on a lead frame is disclosed in, for example, Japanese Patent Laid-Open No. 59-1595.
No. 35 and JP-A-63-184344. However, these dies do not transport the lead frame on the transport path of the lead frame with the lead frame interposed therebetween, and are different from the dies 10 in this point.

A mold that can be transported on the lead frame transport path is disclosed in, for example, Japanese Patent Application Laid-Open No. 9-45714. However, the mold has a structure that sandwiches the entire lead frame. A great difference from the mold 10 is observed. In addition, in the resin sealing device disclosed in this publication, the mold after resin injection (and thus the entire lead frame) is carried out of the pressing device in order to clamp the next mold.
Wait in a predetermined area until the cure time is reached. On the other hand, in the resin sealing device 100, the lead frame 1
Is sequentially injected into the sealing area 1A and cured (that is, a sealing operation) while being transported on the transport path. In this respect, it can be said that the resin sealing device 100 is different from the resin sealing device disclosed in the above publication.

[0089]

(1) According to the first aspect of the invention, the resin sealing mold accommodates a part of the plurality of semiconductor elements mounted on the lead frame in the cavity. The lead frame is sandwiched between the first portion and the second portion.
For this reason, it is possible to provide a small and inexpensive resin sealing mold as compared with a conventional resin sealing mold in which all of the plurality of semiconductor elements are simultaneously accommodated in the cavity.

Further, since the present resin mold does not accommodate all of the plurality of semiconductor elements at once, the number of cavities is smaller than that of the above-mentioned conventional resin mold.
For this reason, it is possible to suppress variation in the flow of the resin between the cavities. Also, since the pressure area at the time of mold clamping is smaller than that of the conventional resin molding die due to the reduction in the number of cavities, the lead frames of the first portion and the second portion of the resin molding die are not required. It is easy to ensure the smoothness of the entire sandwiching surface. Further, since the pressing area is small as described above, it is possible to suppress variation in the mold clamping force over the entire pressing surface (the mold can be uniformly clamped). Therefore, by using the present resin-sealing mold in a resin-sealing apparatus (semiconductor manufacturing apparatus), and by using the present resin-sealing mold in a resin-sealing method (semiconductor device manufacturing method), In addition, molding defects such as resin leakage during resin injection can be reduced.

Further, since the pressing area is small as described above, in other words, the clamping force is small, a small and inexpensive pressing device for clamping the resin mold is used. Accordingly, the size and cost of the resin sealing device can be reduced.

Further, since the present resin sealing mold can be transported along the lead frame transport path, the lead frame is transported, in other words, without sealing the lead frame on the transport path. An operation (including a step of injecting a resin and a step of curing) can be performed. Therefore, a semiconductor device can be manufactured with high productivity. Further, since the resin molding die can be transported on the transport path of the lead frame, in other words, since it is not fixed to the resin sealing device, maintenance and replacement of the resin molding die are easy. is there.

(2) According to the second aspect of the invention, the first
The lead frame can be reliably held between the portion and the second portion. For this reason, even after the mold clamping force at the time of resin injection is released, the resin sealing mold can continue to hold the lead frame, so that molding defects can be suppressed. In addition, the resin sealing mold can move on the lead frame transport path with the lead frame securely interposed therebetween.

(3) According to the third aspect of the present invention, since the resin sealing mold according to the first or second aspect is used, leads of the first and second parts of the resin sealing mold are used. Smoothness of the entire surface sandwiching the frame is ensured, and variation in the mold clamping force over the entire pressurized surface is suppressed (the mold is uniformly clamped), so that molding defects such as resin leakage can be reduced.

Furthermore, since the sealing operation (including the step of injecting the resin and the step of curing) is performed while the resin sealing mold is being conveyed on the conveyance path, the lead frame can be retained on the conveyance path. Absent. Therefore, a semiconductor device can be manufactured with high productivity.

(4) According to the fourth aspect of the present invention, a semiconductor device can be efficiently manufactured by repeatedly using a resin sealing mold that can be transported on the lead frame transport path.

(5) According to the invention of claim 5, a plurality of resin sealing molds are provided. In addition, in the present semiconductor manufacturing apparatus, the sealing operation is performed while the resin sealing mold is transported on the transport path. Uptime, and therefore productivity, can be improved.

Further, since a plurality of resin molding dies can be transported on the transport path of the lead frame, in other words, since they are not fixed to the semiconductor manufacturing apparatus, for example, one resin molding die Even if a failure occurs, only the resin sealing mold can be easily replaced. Moreover, if the replacement is performed before the resin-sealing mold is put into the transport path, the operation rate of the semiconductor manufacturing apparatus does not decrease.

(6) According to the sixth aspect of the present invention, since the resin sealing mold is used, a compact pressurizing device can be used, and miniaturization and cost reduction of the semiconductor manufacturing apparatus are achieved. be able to.

Further, the resin injecting step and the curing step are performed in different areas. For this reason, if both steps are performed in the same area, the other semiconductor element cannot be resin-sealed (therefore, the resin-sealing mold is closed) until the curing step is completed. According to the semiconductor manufacturing apparatus, a semiconductor device can be manufactured with high productivity.

(7) According to the seventh aspect of the present invention, since the number of cavities of the resin sealing mold is smaller than that of the conventional semiconductor device, a smaller and less expensive ejector device than the conventional semiconductor device can be used. Can be. Accordingly, the size and cost of the semiconductor manufacturing apparatus can be reduced.

(8) According to the invention of claim 8, since the resin sealing mold according to claim 1 or 2 is used, the leads of the first and second portions of the resin sealing mold are used. Smoothness of the entire surface sandwiching the frame is ensured, and variation in the mold clamping force over the entire pressurized surface is suppressed (the mold is uniformly clamped), so that molding defects such as resin leakage can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic side view for explaining a resin sealing device according to a first embodiment.

FIG. 2 is a schematic side view for explaining the resin sealing device according to the first embodiment.

FIG. 3 is a schematic side view for explaining the resin sealing device according to the first embodiment.

FIG. 4 is a schematic side view for explaining the resin sealing device according to the first embodiment.

FIG. 5 is a schematic side view for explaining the resin sealing device according to the first embodiment.

FIG. 6 is a schematic top view for explaining the resin sealing device according to the first embodiment.

FIG. 7 is a schematic top view for explaining the resin sealing device according to the first embodiment.

FIG. 8 is a schematic top view for explaining the resin sealing device according to the first embodiment.

FIG. 9 is a schematic top view for explaining the resin sealing device according to the first embodiment.

FIG. 10 is a schematic top view for explaining the resin sealing device according to the first embodiment.

FIG. 11 is a schematic perspective view for explaining a mold of the resin sealing device according to the first embodiment.

FIG. 12 is a schematic side view for explaining a mold of the resin sealing device according to the first embodiment.

FIG. 13 is a schematic top view for explaining the resin sealing device according to the first embodiment.

FIG. 14 is a schematic perspective view for explaining the operation of the resin sealing device according to the first embodiment.

FIG. 15 is a schematic perspective view for explaining a connecting rod of the mold opening / closing device of the resin sealing device according to the first embodiment.

FIG. 16 is a flowchart illustrating an operation of the resin sealing device according to the first embodiment;

FIG. 17 is a flowchart for explaining the operation of the resin sealing device according to the first embodiment.

FIG. 18 is a flowchart illustrating an operation of the resin sealing device according to the first embodiment.

FIG. 19 is a flowchart for explaining the operation of the resin sealing device according to the first embodiment.

FIG. 20 is a flowchart for explaining the operation of the resin sealing device according to the first embodiment;

FIG. 21 is a schematic side view for explaining the operation of the resin sealing device according to the first embodiment.

FIG. 22 is a schematic side view for explaining a conventional resin sealing device.

FIG. 23 is a schematic longitudinal sectional view for explaining a conventional resin sealing device.

FIG. 24 is a schematic top view for explaining a lower mold of a conventional resin sealing device.

[Explanation of symbols]

1 lead frame, 1A sealing area, 2 resin tablet, 2A resin package, 5 transport path, 10 mold (resin sealing mold), 10U upper mold (first part),
10L Lower mold (second part), 11, 11A, 11U,
11L cavity, 100 resin sealing device (semiconductor manufacturing device), 110 transfer unit, 140 resin molding unit, 14
0A Mold control unit, 151 pressurizing device, 152 plunger push-up device, 155 ejector device, AR0
Mold standby area, AR1 mold input area, AR2 sealing process area, AR21 resin injection area, AR22
Cure process area, AR3 mold escape area, ST10
Mold input step, ST20 sealing operation step, S
T30 Mold escape step, ST40 Mold re-introduction preparation step.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F202 AD03 AH33 AH37 CA12 CB01 CB12 CB17 CC03 CC10 CK42 CK90 4F206 AD03 AH33 AH37 JA02 JB12 JB17 JC01 JF05 JF35 JF36 JN32 JN41 JQ81 JQ83 JT04 5F01 DBA DA01

Claims (8)

[Claims] 1. A resin sealing mold used for sealing each semiconductor element with a resin in a lead frame having a plurality of die pads and a semiconductor element mounted on each die pad. It has a cavity capable of accommodating a part of the semiconductor element of the plurality of semiconductor elements, comprises a first part and a second part that can be opened and closed with each other, A resin-sealing mold that can be transported on a transport path of the lead frame with the lead frame being sandwiched between the first portion and the second portion. 2. The resin sealing mold according to claim 1, further comprising a preload mechanism for applying a force for closing the resin sealing mold between the first portion and the second portion. A mold for resin sealing, comprising: 3. A semiconductor manufacturing apparatus for sealing each semiconductor element with a resin in a lead frame having a plurality of die pads and a semiconductor element mounted on each of the die pads, Or the resin-sealing mold according to 2 or 3, opening and closing operation of the resin-sealing mold, operation of putting the resin-sealing mold into the transport path, and the resin-sealing mold from the transport path. A mold control unit that performs an operation of ejecting the mold, and a sealing operation that is provided in a sealing process area on the transport path and that seals a part of the semiconductor elements housed in the cavity with a resin. A sealing unit to be performed, and a transport unit that transports the lead frame sandwiched between the lead frame and the resin sealing mold along the transport path. While transporting on the transport path, And performing an operation, the semiconductor manufacturing device. 4. The semiconductor manufacturing apparatus according to claim 3, wherein the mold control unit reenters the resin sealing mold that has escaped from the transport path into the transport path. Semiconductor manufacturing equipment. 5. The semiconductor manufacturing apparatus according to claim 3, wherein a plurality of the resin sealing dies are provided. 6. The semiconductor manufacturing apparatus according to claim 3, wherein the sealing step area includes a step of injecting the resin into the cavity and a step of injecting the resin. And a curing step area for performing a step of curing the resin after the resin injection step, provided in an area different from the injection step area. A semiconductor manufacturing apparatus comprising a pressurizing device for clamping a mold. 7. The semiconductor manufacturing apparatus according to claim 3, wherein the sealing unit includes an ejector device configured to release the resin-sealed semiconductor element from the cavity. Characteristic semiconductor manufacturing equipment. 8. A method of manufacturing a semiconductor device, wherein each semiconductor element is sealed with a resin with respect to a lead frame having a plurality of die pads and a semiconductor element mounted on each of the die pads, Item (1): using the resin-sealing mold according to item 1 or 2, (a) opening the resin-sealing mold and throwing the resin-sealing mold into the transport path, and accommodating some of the semiconductor elements in the cavity. (B) resin-sealing the part of the semiconductor elements housed in the cavity in a sealing process area on the transport path; Performing a sealing operation while transporting the resin sealing mold on the transport path; and (c) after the step (b), opening the resin sealing mold and performing resin sealing. The semiconductor device that has been Was released from the I, characterized in that it comprises a step of escape the resin sealing mold from the transport path, a method of manufacturing a semiconductor device.