TW202122236A - Resin sealing device capable of accurately clamping substrates for resin sealing formation even if thicknesses of substrates are different - Google Patents

Abstract

The invention provides a resin sealing device, which is capable of clamping a plurality of independent substrates, like FCBGA, on a mold to perform resin sealing formation and may accurately clamp for uniformly performing resin sealing formation even if the thickness of each substrate is different. The resin sealing device comprises: a lower mold 3 having a plurality of substrate carrying portions 31 provided for individually carrying the plurality of substrates; and a rod 32 penetrated through the lower mold along an up and down direction and abutted against each substrate carrying portion of the plurality of substrate carrying portions 31; a thickness measurement member for measuring individual thicknesses of the plurality of substrates; a mold rack 2 for supporting the lower mold 3 to be detached and mounted; and, an adjusting mechanism 23 for pressing the rod 32 by a pressing member 22 penetrating through the mold rack 2 in correspondence to individual thicknesses of the plurality of substrates measured by the thickness measurement member and for independently adjusting the heights of the plurality of substrate carrying portions 31.

Description

Resin sealing device

The invention relates to a resin sealing device for resin sealing an independent substrate such as FCBGA (Flip Chip Ball Grid Array).

In the resin sealing and molding of semiconductors, there is an increasing demand for resin sealing and molding of individual substrates such as FCBGA (one substrate corresponds to one product (the number of wafers is one or more)) substrates. Since the FCBGA substrate is a substrate with a multilayer structure, its thickness is thicker than that of conventional BGA (Ball Grid Array) products, and because of the multilayer structure, the dimensional deviation of the substrate thickness is large. In addition, since the wafer mounted on the substrate is large and generates a lot of heat, there is also a desire to mold the surface of the wafer in an exposed state, and install the heat sink in a subsequent process. For example, Patent Document 1 discloses a resin molding mold that has a first mold and a second mold, and the first mold and the second mold sandwich the molded article to perform resin molding so as to be compatible with the mounting According to the thickness of the mounted parts of the molded object, the mounted parts are accurately clamped to perform resin molding. The first mold is equipped with: a first insert member, so that the end surface of the first insert member is placed in the molding The mounting parts of the object are opposite, the first inserting member slides in the mold opening and closing direction; and a pushing member that pushes the first inserting member along the mold opening and closing direction to adjust the position of the first inserting member in the mold opening and closing direction , The multiple pushing members assembled in the first mold have: a movable inclined panel, which is driven to advance and retreat in a direction orthogonal to the longitudinal direction of the molded article; and a fixed inclined panel, with its inclined surface facing the movable inclined panel. The pushing member installed in the second mold has: a movable inclined panel, which is driven to advance and retreat in a direction parallel to the longitudinal direction of the molded article; and a fixed inclined panel, which is arranged such that its inclined surface faces the movable inclined panel. In this resin molding mold, after measuring the thickness of the substrate to be molded and the thickness of the mounted parts of the molded object, based on the measurement result of the thickness of the mounted parts, the pushing member assembled in the first mold is controlled to set the first 1 The position of the insert member in the mold opening and closing direction, and based on the measurement result of the thickness of the substrate, the pushing member assembled in the second mold is controlled, and the position of the second insert member in the mold opening and closing direction is set to perform resin molding. system. As a result, the thickness of the molded object may vary or it may be molded in an exposed state. [Prior Technical Literature] [Patent Literature] Patent Document 1: Japanese Patent Application Publication No. 2011-11426

[The problem to be solved by the invention] In the above-mentioned existing resin molding molds, adjustment mechanisms such as inserting members and pushing members for adjusting the height of the substrate placement are assembled in the mold. If it is an existing thin lead frame or two pieces corresponding to multiple semiconductor products It’s fine if the substrates are placed in a mold for unified molding. However, in the case of unified production of many independent substrates such as FCBGA, such as 4 to 6, the number of substrates corresponding to the many substrates must be adjusted. The mechanism is built into the mold, which is difficult to achieve in space. Therefore, the object of the present invention is to provide a resin sealing device that can clamp a plurality of independent substrates such as FCBGA in a mold for resin sealing and molding. When the thickness of each substrate varies, the resin The sealing device can also be accurately clamped to collectively perform resin sealing and molding. [Means to solve the problem] The resin sealing device of the present invention has: a lower mold for clamping a plurality of substrates between the lower mold and the upper mold, and by injecting into a cavity formed between the lower mold and the upper mold Resin is used for resin sealing and molding, and the lower mold has a plurality of substrate placement portions for placing a plurality of substrates individually, and each of the plurality of substrate placement portions that penetrates the lower mold in the vertical direction and is connected to each of the plurality of substrate placement portions. Abutting rods; thickness measurement components, which measure the respective thicknesses of multiple substrates; mold bases, which support the lower mold so as to be detachable; and an adjustment mechanism, which and the thickness measurement components measure the respective thicknesses of the multiple substrates Correspondingly, the rod is pressed by the pressing member penetrating the mold base, and the heights of the plurality of substrate mounting portions are individually adjusted. With the resin sealing device of the present invention, when a plurality of substrates individually placed on the plurality of substrate placement portions of the lower mold are clamped between the lower mold and the upper mold, it can be compared with the thickness measured by the thickness measuring part. According to the thickness of each of the plurality of substrates, the rod is pushed by the pushing member penetrating the mold base, and the height of the plurality of substrate placement parts of the lower mold is individually adjusted to accurately clamp each substrate placed on it. The substrate on the mounting part. Here, it is preferable that the adjustment mechanism has: an elevating member that raises and lowers the pressing member, and the elevating member has a first inclined surface at the lower part; an elastic member that pushes the elevating member downward; and a moving member that has and The second inclined surface facing the first inclined surface of the lifting member; the sliding member, which is sandwiched between the first inclined surface and the second inclined surface; and the driving part, which advances and retreats the moving member by means of the first inclined surface, the sliding member and The second inclined surface raises and lowers the elevating member. As a result, since the sliding member is interposed between the first inclined surface of the lifting member and the second inclined surface of the moving member, the sliding member slides when the moving member is moved forward and backward, so that the lifting member can be smoothly raised and lowered. Preferably, in the resin sealing device of the present invention, a spacer member that can be detached and detached is provided at the upper end of the pressing member. Thereby, it is possible to adjust the thickness of the spacer member by replacing or processing the spacer member, and it is possible to adjust the uniform pressing force and the inclination of the substrate mounting portion by the pressing member. Preferably, in the resin sealing device of the present invention, each of the plurality of substrate mounting portions is provided with a plurality of rods, and the resin sealing device has a seat plate that is connected to the plurality of rods. The lower surface abuts to transmit the pressing force of the pressing member. Thereby, the pressing force of the pressing member can be uniformly transmitted to the plurality of rods via the seat plate, and the driving accuracy of the substrate mounting portion can be improved. Preferably, the resin sealing device of the present invention has a control unit that measures the thickness of each of the plurality of substrates using a thickness measurement component, and uses an adjustment mechanism in accordance with the thickness of each of the multiple substrates measured by the thickness measurement component. The heights of the multiple substrate placement sections are adjusted individually, and then the upper mold and the lower mold are temporarily closed to clamp the mold releases arranged on the multiple substrates respectively placed on the multiple substrate placement sections After the resin is injected into the film, the upper mold and the lower mold are further closed, and the plurality of substrate placement portions are raised by the adjustment mechanism. In this way, the thickness of each of the plurality of substrates is measured by the thickness measurement unit, and the height of the plurality of substrate placement portions is individually adjusted by the adjustment mechanism according to the thickness of each of the plurality of substrates measured by the thickness measurement unit. After that, the upper mold and the lower mold are temporarily closed to clamp the release films arranged on the plurality of substrates respectively placed on the plurality of substrate placement parts, and the resin is injected. At this time, due to the injection pressure of the resin Make the substrate placement part sink slightly, or make the mold slightly open, but by further closing the upper mold and the lower mold, and using the adjustment mechanism to raise the plurality of substrate placement parts, it is also possible to avoid excessive clamping of the release film. Damage, can control the amount of damage caused by clamping. [Effects of the invention] (1) Having: a lower mold for clamping a plurality of substrates between the lower mold and the upper mold, and by injecting resin into a cavity formed between the lower mold and the upper mold Resin sealing molding, the lower mold has: a plurality of substrate placement portions for individually placing a plurality of substrates, and a vertical direction penetrating the lower mold and abutting each of the plurality of substrate placement portions The thickness measurement component, which measures the thickness of each of the multiple substrates; the mold base, which supports the lower mold to be detachable; and the adjustment mechanism, which corresponds to the thickness of each of the multiple substrates measured by the thickness measurement component , The rod is pressed by the pressing member penetrating the mold base to individually adjust the height of the multiple substrate placement parts. With the above structure, the multiple substrate placement parts that are individually placed on the lower mold When a plurality of substrates are clamped between the lower mold and the upper mold, according to the thickness of each of the plurality of substrates measured by the thickness measuring part, the rod is pressed by the pressing member penetrating the mold base, and the lower The heights of the plurality of substrate mounting portions of the mold can be adjusted individually to absorb variations in the thickness of the substrates mounted on the respective substrate mounting portions, to accurately clamp, and to perform resin sealing molding in a unified manner. (2) The adjustment mechanism has: an elevating member that raises and lowers the pressing member, and the elevating member has a first inclined surface at the lower part; an elastic member that pushes the elevating member downward; and a moving member that has a first inclined surface on the upper part of the elevating member. 1 the second inclined surface facing the inclined surface; the sliding member, which is sandwiched between the first inclined surface and the second inclined surface; and the driving part, which advances and retreats the moving member, with the aid of the first inclined surface, the sliding member, and the second inclined surface. The elevating member is raised and lowered. With the above-mentioned structure, the sliding member slides when the moving member is moved forward and backward, so that the elevating member can be smoothly raised and lowered, and the height of the substrate placement portion can be adjusted with high precision. (3) There is a removable spacer at the upper end of the pressing member. With the above structure, the thickness of the spacer can be easily adjusted by replacing or processing the spacer, and the pressing member can be easily loaded on the substrate. Adjustment of uniform pressing force and tilt adjustment of the placement part. (4) Each of the plurality of substrate placement portions is provided with a plurality of rods and has a seat plate that abuts on the lower surfaces of the plurality of rods to transmit the pressing force of the pressing member With the above structure, it is possible to improve the driving accuracy of the substrate mounting portion. (5) It has a control unit that uses a thickness measuring component to measure the thickness of each of the plurality of substrates, and uses an adjustment mechanism to adjust the thickness of each of the plurality of substrates according to the thickness of each of the plurality of substrates measured by the thickness measuring component. The height of the dies is adjusted individually, and then the upper mold and the lower mold are temporarily closed to clamp the release films arranged on the plurality of substrates respectively placed on the plurality of substrate placement parts. After the resin is injected, The upper mold and the lower mold are further closed, and the plurality of substrate placement parts are raised by the adjusting mechanism. With the above structure, the thickness of each of the plurality of substrates is measured by the thickness measuring component, and the thickness of each of the plurality of substrates measured by the thickness measuring component is calculated. According to the thickness of the substrate, the heights of the multiple substrate placement sections are individually adjusted by the adjustment mechanism. After that, the upper mold and the lower mold are temporarily closed to clamp the multiple substrate placement sections that are respectively placed on the multiple substrate placement sections. The release film is placed on the substrate and the resin is injected. At this time, the substrate placement part is slightly sunk due to the injection pressure of the resin, or the mold is slightly opened. However, by further closing the upper mold and the lower mold, the adjustment The mechanism raises the multiple substrate placement parts, which can also prevent the release film from being damaged by excessive clamping, control the amount of damage caused by clamping, prevent the vent from being out of shape, prevent resin leakage, and prevent the release film Wrinkling.

1 is a longitudinal cross-sectional view showing a schematic structure of a lower mold part of a resin sealing device according to an embodiment of the present invention, FIG. 2 is a diagram showing a state in which the lower mold of FIG. 1 is removed, and FIG. 3 is a plan view of FIG. 4 is an explanatory diagram showing the arrangement of thickness measurement components. As shown in FIGS. 1 and 2, the resin sealing device according to the embodiment of the present invention has a mold base 2 on the mold part 1. The mold base 2 supports the lower mold 3 so as to be detachable. The lower mold 3 is used to clamp a plurality of substrates 6 between the lower mold 3 and the upper mold 5 (refer to FIG. 6), and to a cavity 51 formed between the lower mold 3 and the upper mold 5 (refer to FIG. 3) Inject resin to perform resin sealing molding. In addition, in FIG. 3, the position of the cavity 51 formed between the upper mold 5 and the lower mold 3, as well as the cold slug 57, runners 58, and gate 59 formed in the upper mold 5 are illustrated by single-dot chain lines. The location of the vent 60. The semiconductor wafer 7 mounted on the substrate 6 is accommodated in the cavity 51 (refer to FIGS. 6 and 7). The cold slug well 57, the runner 58 and the gate 59 are resin paths that communicate with the cavity 51. The vent hole 60 is an exhaust path formed on the side opposite to the side where the gate 59 is located with the cavity 51 interposed therebetween. Furthermore, the resin sealing apparatus of this embodiment has the thickness measuring member 4 (refer FIG. 4) for measuring the thickness of each of the several board|substrate 6. The thickness measurement member 4 can be constituted by, for example, a pair of laser displacement sensors 4A and 4B, which are arranged vertically so as to sandwich the substrate 6 therebetween. The thickness measurement unit 4 measures the thickness of the substrate 6 by detecting the positions of the upper surface and the lower surface of the substrate 6 by using laser displacement sensors 4A and 4B, respectively. The thickness measurement component 4 is controlled by the control unit 10. The lower mold 3 has: a plurality of substrate placing portions 31 on which the plurality of substrates 6 are individually placed; and a rod 32 which penetrates the lower mold 3 in the vertical direction and is connected to the plurality of substrates. The placing portion 31 abuts against each other. A plurality of rods 32 are provided for each of the plurality of substrate placement sections 31. In addition, a plurality of seat plates 33 are provided on the lower surfaces of the plurality of rods 32 that abut each substrate mounting portion 31. The seat plate 33 is always pushed downward by the elastic member 34, and the seat plate 33 counteracts the elastic member 34 and rises by the amount lifted by the pushing member 22 ascending. On the other hand, when the pressing member 22 descends, the seat plate 33 is pressed by the elastic member 34 to descend. A seat plate 33 is provided for each of the substrate placing sections 31 of the plurality of substrate placing sections 31, and the seat plate 33 abuts against the lower surface of the rod 32 of each of the plurality of substrate placing sections 31, and presses it as described later. The pressing force of the member 22 is transmitted to each substrate mounting portion 31 via the rod 32. The mold base 2 has: a mold holding portion 21 that holds the lower mold 3; a pressing member 22 that penetrates the mold base 2 to push the rod 32; and an adjustment mechanism 23 that is more than the thickness measured by the thickness measurement unit 4. According to the thickness of each substrate 6, the rod 32 is pressed by the pressing member 22, and the heights of the plurality of substrate mounting portions 31 are individually adjusted. The pressing member 22 presses the rod 32 via the plurality of seat plates 33 of the lower mold 3 in the mold holding portion 21. Furthermore, at the upper end of the pressing member 22, there is a spacer member 22A that can be detached and detached. The adjustment mechanism 23 has, for each substrate placement portion 31, an elevating member 24, which raises and lowers the pressing member 22; an elastic member 25, which pushes the elevating member 24 downward; and a moving member 26, which raises and lowers by advancing and retreating. The member 24 is raised and lowered; and the driving part 27 which causes the moving member 26 to advance and retreat. The lifting member 24 has a first inclined surface 24A on the lower surface. The moving member 26 moves in the horizontal direction on the base 30. In addition, the moving member 26 has a second inclined surface 26A opposed to the first inclined surface 24A of the lifting member 24 on the upper portion. A roller 28 as a sliding member is interposed between the first inclined surface 24A and the second inclined surface 26A. A roller 29 as a sliding member is interposed between the moving member 26 and the base 30. The adjustment mechanism 23 advances and retreats the moving member 26 by the drive part 27, so that the elevating member 24 is raised and lowered via the first inclined surface 24A, the roller 28, and the second inclined surface 26A. At this time, the elevating member 24 is always pushed downward by the elastic member 25, and the elevating member 24 counterbalances the elastic member 25, and rises by the amount lifted by the moving member 26 advancing. On the other hand, when the moving member 26 retreats, the elevating member 24 is pushed by the elastic member 25 to descend. The adjustment mechanism 23 is controlled by the control unit 10. In the resin sealing device of the above-mentioned structure, the control unit 10 uses the thickness measuring unit 4 to measure the thickness of the substrates 6 respectively placed on the respective substrate mounting portions 31, and compares the thickness of each of the plurality of substrates 6 measured by the thickness measuring unit 4 Accordingly, the height of each substrate mounting portion 31 is individually adjusted by the adjustment mechanism 23. Thus, for example, when a thicker substrate 6A and a thinner substrate 6B having different thicknesses are mounted on the substrate mounting portion 31 of one lower mold 3 as shown in FIG. 5, they can be combined with each substrate 6A. According to the thickness of 6B, the rod 32 is pressed by the pressing member 22, and the height of the substrate mounting portion 31 can be adjusted individually. After that, as shown in FIG. 6, each substrate 6 is placed on each substrate placement portion 31, and resin 36 is poured into the container 35 of the lower mold 3, and then placed on a plurality of substrate placement sections. The mold release film 11 is arrange|positioned on the several board|substrate 6 on the part 31, and as shown in FIG. 7, the upper mold|type 5 and the lower mold|type 3 are temporarily closed and clamped. Then, the push rod 37 is raised, and the resin 36 is injected from the container 35 into the cavity 51 through the cold slug 57, the runner 58 and the gate 59. When the resin is injected, the substrate mounting portion 31 is slightly sunk due to the injection pressure of the resin 36, or the gap between the upper mold 5 and the lower mold 3 is slightly opened (about 0.02 mm to 0.03 mm), so the control unit 10 further The upper mold 5 and the lower mold 3 are closed, and each substrate mounting portion 31 is raised by the adjustment mechanism 23. As a result, as shown in FIG. 8, it is possible to prevent the release film 11 from being damaged by excessive clamping, to control the amount of damage due to clamping, to prevent the vent hole 60 from being out of shape, to prevent resin leakage, and to prevent the release film 11's wrinkling. As described above, in the resin sealing device of this embodiment, when the plurality of substrates 6 individually placed on the plurality of substrate placement portions 31 of the lower mold 3 are sandwiched between the lower mold 3 and the upper mold 5, Corresponding to the thickness of each of the plurality of substrates 6 measured by the thickness measurement unit 4, the rod 32 is pushed by the pushing member 22 penetrating through the mold base 2, and the height of the plurality of substrate placement portions 31 of the lower mold 3 Individual adjustments can absorb variations in the thickness of the substrates 6 placed on the respective substrate placement portions 31, can accurately clamp, and collectively perform resin sealing and molding of a plurality of substrates 6. Therefore, even when the substrate 6 is a large independent multilayer structure substrate such as FCBGA, which is thicker than conventional BGA products, and the substrate thickness varies greatly, the production efficiency of resin sealing molding can be improved. Moreover, in this resin sealing device, the lower mold 3 can be detached from the mold base 2 for replacement as shown in FIG. 2. Therefore, the production of other types of products can be achieved by only replacing the mold, and is suitable for various types of production. It is also possible to reduce costs. Furthermore, in the resin sealing device of this embodiment, a roller 28 as a sliding member is interposed between the first inclined surface 24A of the lifting member 24 and the second inclined surface 26A of the moving member 26, and when the moving member 26 is moved forward and backward, This roller 28 slides, so that the lifting member 24 can be smoothly raised and lowered, and the height of the substrate mounting portion 31 can be adjusted with high precision. Furthermore, the upper end of the pressing member 22 of the present embodiment has a detachable spacer member 22A. Therefore, the thickness adjustment of the spacer member 22A can be easily performed by replacing or processing the spacer member 22A. The pressing member 22 adjusts the uniform pressing force and the inclination of the substrate mounting portion 31. Furthermore, in the resin sealing device of this embodiment, the structure is such that each of the plurality of substrate placement portions 31 is provided with a plurality of rods 32, and has a seat plate 33. Abuts against the lower surface of the plurality of rods 32 to transmit the pressing force of the pressing member 22. Therefore, the pressing force of the pressing member 22 can be uniformly transmitted to the plurality of rods 32 via the seat plate 33, and the substrate placement portion can be improved. 31 driving accuracy. In addition, it is also possible to have a structure in which, as shown in FIG. 9, a pressing plate 22B is further provided at the upper end of the pressing member 22, and the seat plate 33 is pressed by the pressing plate 22B. Thereby, the upper surface of the pressing plate 22B is parallel to the lower surface of the substrate mounting portion 31, and the pressing force of the pressing member 22 can be uniformly transmitted to the substrate mounting portion 31. Furthermore, in the resin sealing device of the present embodiment, as shown in FIG. 6, the bottom surface member 52 of each cavity 51 of the upper mold 5 can be raised and lowered. The lifting mechanism of the bottom surface member 52 has: a plurality of rods 53 which penetrate the upper mold 5 in the up and down direction and abut against the bottom surface member 52 of each mold cavity 51; and a seat plate 54 which abuts against the upper surface of the rod 53; The elastic member 55 pushes the seat plate 54 upward, and the pressing member 56 pushes the rod 53 via the seat plate 54. At the lower end of the pressing member 56, there is a spacer member 56A that can be attached and detached. The seat plate 54 is always pushed upward by the elastic member 55, and the seat plate 54 counteracts the elastic member 55, and is lowered by the amount of the pressing member 56 being pushed down due to the lowering of the pressing member 56. On the other hand, when the pressing member 56 ascends, the seat plate 54 is pressed by the elastic member 55 and ascends. A seat plate 54 is provided for each cavity 51, and the seat plate 54 transmits the pressing force of the pressing member 56 to the bottom surface member 52 via the rod 53. FIG. 10 shows a state when the bottom surface member 52 of the cavity 51 of the upper mold 5 is in the retracted position. By individually lowering the pressing member 56 of each cavity 51 from the retracted position, the bottom surface member 52 can be lowered to the molding position shown in FIG. 11 of each cavity 51 to perform resin sealing molding. Furthermore, by lowering the pressing member 56 as shown in FIG. 12, the bottom surface member 52 is pressed against the surface of the semiconductor wafer 7 mounted on the substrate 6, and molding can also be performed with the surface of the wafer exposed. [Industrial availability] The resin sealing device of the present invention is useful as a resin sealing device for resin-sealing independent substrates such as FCBGA (Flip Chip Ball Grid Array), and is particularly preferable as a resin sealing device that can accurately clamp even when the thickness of each substrate varies. This is a resin sealing device that performs resin sealing and molding in a unified way.

1: Molding department 2: formwork 3: Lower die 4: Thickness measurement parts 4A: Laser displacement sensor 5: Upper die 6, 6A, 6B: substrate 7: Semiconductor wafer 10: Control Department 11: Release film 21: Mold holding part 22: Pushing member 22A: Spacer 22B: Push plate 23: Adjust the organization 24: Lifting member 25: Elastic member 26: Moving components 27: Drive 28, 29: Roll 30: base 31: Board placement section 32: Rod 33: seat plate 34: Elastic member 35: container 36: resin 37: putter 51: Mould cavity 52: Bottom surface member 53: Rod 54: seat plate 55: Elastic member 56: Pushing member 56A: Spacer 57: cold slug well 58: runner 59: Gate 60: Vent

[Fig. 1] Fig. 1 is a longitudinal cross-sectional view showing a schematic structure of a lower mold portion of a resin sealing device according to an embodiment of the present invention. [Fig. 2] is a diagram showing a state in which the lower mold of Fig. 1 is removed. [Fig. 3] is a plan view of Fig. 1. [Fig. 4] is an explanatory diagram showing the arrangement of thickness measurement components. [Fig. 5] Fig. 5 is an explanatory diagram showing a state in which the height of the substrate mounting portion is adjusted for substrates with different thicknesses. [Fig. 6] is an explanatory diagram showing a state in which the mold is opened. [Fig. 7] is an explanatory diagram showing a state where the mold is closed. Fig. 8 is an explanatory diagram showing the state of the vent hole in a state where the release film is sandwiched. Fig. 9 is an explanatory diagram showing a form in which a pressing plate is further provided at the upper end of the pressing member. [Fig. 10] is an explanatory view showing a state when the bottom surface member of the cavity of the upper mold is in the retracted position. Fig. 11 is an explanatory diagram showing a state when the bottom surface member of the cavity of the upper mold is in the molding position. [Fig. 12] Fig. 12 is an explanatory diagram showing a state where the bottom surface member of the cavity of the upper mold is in a state of pressing the surface of the semiconductor wafer.

1: Molding department

2: formwork

3: Lower die

10: Control Department

21: Mold holding part

22: Pushing member

22A: Spacer

23: Adjust the organization

24: Lifting member

24A: 1st slope

25: Elastic member

26: Moving components

26A: 2nd slope

27: Drive

28, 29: Roll

30: base

31: Board placement section

32: Rod

33: seat plate

34: Elastic member

Claims (5)

A resin sealing device, in which, The resin sealing device has: The lower mold is used to clamp a plurality of substrates between the lower mold and the upper mold, and perform resin sealing molding by injecting resin into a cavity formed between the lower mold and the aforementioned upper mold, The lower mold has a plurality of substrate placement portions for individually placing the plurality of substrates, and a rod that penetrates the lower mold in the vertical direction and abuts each of the plurality of substrate placement portions; A thickness measurement component, which measures the thickness of each of the aforementioned multiple substrates; A mold base, which supports the aforementioned lower mold so as to be detachable; and An adjustment mechanism, which corresponds to the thickness of each of the plurality of substrates measured by the thickness measurement unit, presses the rod with a pressing member penetrating the mold base, and separates the heights of the plurality of substrate placement portions Make adjustments accordingly. Such as the resin sealing device of claim 1, wherein The adjustment mechanism includes: an elevating member that raises and lowers the pressing member, the elevating member has a first inclined surface at the lower part; an elastic member that pushes the elevating member downward; and a moving member that has an upper part that is compatible with the elevating member A second inclined surface facing the first inclined surface; a sliding member interposed between the first inclined surface and the second inclined surface; and a driving part that advances and retreats the moving member by means of the first inclined surface and the sliding The member and the second inclined surface raise and lower the lifting member. Such as the resin sealing device of claim 1 or 2, in which, At the upper end of the pressing member, there is a spacer member that can be detached and detached. Such as the resin sealing device of claim 1 or 2, in which, Each of the plurality of substrate placement portions is provided with a plurality of the aforementioned rods, The resin sealing device has a seat plate that abuts the lower surfaces of the plurality of rods to transmit the pressing force of the pressing member. Such as the resin sealing device of claim 1 or 2, in which, The resin sealing device has a control unit that uses the thickness measurement unit to measure the thickness of each of the plurality of substrates, and according to the thickness of each of the plurality of substrates measured by the thickness measurement unit, uses the adjustment mechanism to adjust The heights of the plurality of substrate placement portions are adjusted individually, and then, the upper mold and the lower mold are temporarily closed to be clamped on the plurality of substrates respectively placed on the plurality of substrate placement portions. After injecting the resin into the mold release film provided, the upper mold and the lower mold are further closed, and the plurality of substrate placement portions are raised by the adjustment mechanism.

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