SG10201900307RA - Molding die, resin molding apparatus, and method for producing a resin molded product - Google Patents

Molding die, resin molding apparatus, and method for producing a resin molded product

Info

Publication number
SG10201900307RA
SG10201900307RA SG10201900307RA SG10201900307RA SG10201900307RA SG 10201900307R A SG10201900307R A SG 10201900307RA SG 10201900307R A SG10201900307R A SG 10201900307RA SG 10201900307R A SG10201900307R A SG 10201900307RA SG 10201900307R A SG10201900307R A SG 10201900307RA
Authority
SG
Singapore
Prior art keywords
lower die
die
molding
resin
producing
Prior art date
Application number
SG10201900307RA
Inventor
Onishi Yohei
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of SG10201900307RA publication Critical patent/SG10201900307RA/en

Links

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

MOL DI NG DIE, RESI N MOLDING APPARATUS, AND METHOD FOR PRODUCING A RESIN MOLDED PRODUCT OF THE DISCLOSURE The present invention provides a molding die capable of enlarging a region to be 5 resin - molded in an object to be molded. The molding die of the present invention includes an upper die 100 and a lower die 200, the upper die 100 is capable of adsorbing an object to be molded, the lower die 200 includes a lower die bottom member 202, a lower die side member 201, and molding object drop prevention block 211, a lower die cavit y 20 3 is formed by a space surrounded by the lower die bottom member 202 and the 10 lower die side member 201, and the molding object drop prevention block 211 is provided on a part of an end portion of the lower die side member 201 facing the lower die cavit y 20 3 and is movable up and down. Fig. 7
SG10201900307RA 2018-01-22 2019-01-14 Molding die, resin molding apparatus, and method for producing a resin molded product SG10201900307RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018008487A JP6876637B2 (en) 2018-01-22 2018-01-22 Molding mold, resin molding equipment and manufacturing method of resin molded products

Publications (1)

Publication Number Publication Date
SG10201900307RA true SG10201900307RA (en) 2019-08-27

Family

ID=67365880

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201900307RA SG10201900307RA (en) 2018-01-22 2019-01-14 Molding die, resin molding apparatus, and method for producing a resin molded product

Country Status (5)

Country Link
JP (1) JP6876637B2 (en)
KR (1) KR102192243B1 (en)
CN (1) CN110065191B (en)
SG (1) SG10201900307RA (en)
TW (1) TWI718447B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112428501B (en) * 2020-10-29 2022-09-23 台州耘智科技有限公司 Energy-saving rubber forming machine

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3994705B2 (en) * 2001-09-13 2007-10-24 松下電工株式会社 Memory card manufacturing method
JP4953619B2 (en) * 2005-11-04 2012-06-13 Ｔｏｗａ株式会社 Resin sealing molding equipment for electronic parts
JP5539814B2 (en) * 2010-08-30 2014-07-02 Ｔｏｗａ株式会社 Method and apparatus for manufacturing resin-sealed molded article having substrate exposed surface
JP5237346B2 (en) * 2010-10-14 2013-07-17 Ｔｏｗａ株式会社 Semiconductor chip compression molding method and compression mold
JP5799422B2 (en) * 2011-02-14 2015-10-28 アピックヤマダ株式会社 Resin molding method and resin molding apparatus
JP5682033B2 (en) * 2011-03-14 2015-03-11 アピックヤマダ株式会社 Resin sealing device
JP5906528B2 (en) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 Mold and resin molding apparatus using the same
SG11201508166RA (en) * 2013-05-29 2015-12-30 Apic Yamada Corp Resin molding apparatus and resin molding method
JP5694486B2 (en) * 2013-11-12 2015-04-01 アピックヤマダ株式会社 Resin sealing device
JP6307374B2 (en) * 2014-07-22 2018-04-04 アピックヤマダ株式会社 Mold, molding apparatus, and method for manufacturing molded product
TWI689396B (en) * 2014-07-22 2020-04-01 日商山田尖端科技股份有限公司 Forming die, forming device, and method of manufacturing formed products
JP6525580B2 (en) * 2014-12-24 2019-06-05 Ｔｏｗａ株式会社 Resin molding apparatus and resin molding method
WO2017010319A1 (en) * 2015-07-15 2017-01-19 アピックヤマダ株式会社 Molding die and resin molding device
JP6438913B2 (en) * 2015-07-15 2018-12-19 アピックヤマダ株式会社 Mold and resin molding equipment
JP6506680B2 (en) * 2015-11-09 2019-04-24 Ｔｏｗａ株式会社 Resin sealing apparatus and resin sealing method
JP2017177554A (en) * 2016-03-30 2017-10-05 株式会社ケーヒン Circuit device, manufacturing apparatus and manufacturing method of the same
JP2017212419A (en) * 2016-05-27 2017-11-30 Ｔｏｗａ株式会社 Resin sealed product manufacturing method and resin sealing device

Also Published As

Publication number Publication date
CN110065191A (en) 2019-07-30
TW201932273A (en) 2019-08-16
JP6876637B2 (en) 2021-05-26
JP2019126927A (en) 2019-08-01
KR20190089711A (en) 2019-07-31
CN110065191B (en) 2021-12-03
KR102192243B1 (en) 2020-12-16
TWI718447B (en) 2021-02-11

Similar Documents

Publication Publication Date Title
SG10201806043PA (en) Resin molding apparatus and method for manufacturing resin molded product
MX2017014313A (en) Press molding device and press molding method.
MX2016007899A (en) Plastic moulded part and method for the production thereof.
MX2018009684A (en) Production method for composite member, and composite member.
MX2018012035A (en) Method for producing press-molded article and production line thereof.
SG10201900307RA (en) Molding die, resin molding apparatus, and method for producing a resin molded product
WO2017018712A3 (en) Injection molding apparatus
MX2016003759A (en) Method, mould insert and injection mould for producing a plastics moulding.
MY187162A (en) Mould, moulding apparatus and method for controlled overmoulding of a carrier with electronic components and moulded product
CN105235236A (en) Autoclave die for improving surface quality of workpiece and method
MX2015008781A (en) Apparatus and method usable with an injection molder for producing articles, in particular orthodontic brackets.
MY198300A (en) Mold release sheet for semiconductor compression molding and semiconductor package which is molded using same
WO2015178674A3 (en) Method and apparatus for forging heterogeneous material
EP2471643A3 (en) Method for manufacture of tray
CN205519267U (en) Detain forming die in full week
CN204604811U (en) Injection mould slide block ejecting mechanism
CN103273538B (en) The die cutting die of floating modular belt positioning inhibiting device
MX2021012786A (en) Press molding method.
CN105328872A (en) Movable type pressure injection die
KR101602737B1 (en) Injection mold having a undercut molding structure using a undercut molded ring
KR20150103876A (en) Mold for antenna module and portable device case, antenna module and portable device case, and manufacturing method thereof
MY191719A (en) Resin molded article and method for producing resin molded article
CN205021915U (en) Portable transfer mould
CN203844102U (en) Injection mould for cover cap of dust collector
CN204658806U (en) A kind of mould station arrangement for rubber pange forming machine