JP4688422B2 - Resin molding equipment - Google Patents

Description

The present invention supplies a the molded article and a resin material in the resin mold and the resin molded further improvement of the resin molding apparatus used when you eject the resin molded moldings from the mold It is about.

  Conventionally, a molding material supply unit that supplies a molded product and a resin material that resin-molds the molded product, a molding unit that molds the molding material with a resin molding mold, and resin molding with the mold In recent years, a resin molding apparatus including a molded product take-out part for taking out a molded product and a control unit for controlling the entire resin molding apparatus is widely used, and the tendency of automatic control of the apparatus has been further increased in recent years. However, operations (operation), maintenance and management (maintenance) are being performed.

Therefore, as a first device example, on both sides of a molding part (connecting part) where a plurality of molds (mold units) are detachably mounted, a molding material supply part (inload part) and a molded product take-out part (out) disposed loaded portion) and is in a spaced apart (separate) state, and the control unit (control mechanism) is that have been unit constituted by providing a state incorporated in the supply portion is known. The transfer path of the molding material (molded product / resin material) and the molded product is configured to be supplied and taken out (carrying in / out) in a substantially straight line and only in one direction by the conveying means (feeding and taking out mechanism). The The operation of supplying and taking out the molded product and the molded product into and out of the apparatus is configured to be taken out and supplied from various different sides in plan view . The first device is configured in a rectangular shape in plan view, and is configured so that a plurality of molded parts can be attached and detached in the long side direction (see, for example, Patent Document 1). .
As a second device example, as with the first device, a molding material supply unit (inloader unit) and a molded product takeout unit are provided on both sides of a molding unit (press unit) to which a mold (upper mold / lower mold) is attached. be one (unloader section) and are arranged in a separated state, further, an apparatus configured to provide an adhesive film or the release film in a mold of a molding unit that is known. In the second apparatus, similarly to the first apparatus , the article to be molded and the molded article are substantially linearly supplied and taken out only in one direction by the conveying means . Further, unlike the first apparatus , the operation of supplying and taking out the molded article and the molded article into and out of the apparatus is configured to be performed on a specific side in plan view . However, the operation of supplying the resin material into the apparatus is configured to be performed from a different side as viewed in plan from the operation of supplying and taking out the molded product and the molded product into and out of the apparatus . In addition, the film feeding and winding directions are arranged so as to be orthogonal to the molding and molding product feeding and unloading directions . And the 2nd apparatus is comprised by the substantially square instead of the rectangle by planar view (for example, refer patent document 2).
Japanese Patent Laid-Open No. 11-307561 (pages 3 to 4, FIG. 1) Japanese Patent Laid-Open No. 2001-170962 (page 4, FIG. 2)

However, according to the conventional first and second devices, when performing operations to supply and take out molding materials (molded products / resin materials) and molded products into and out of the device, The problem of maintenance) is considered to occur.
In the case of the first apparatus, when a plurality of molding parts are connected, the supply of the molding material to the molding material supply part and the removal of the molded product to the molding product extraction part are separated from each other by the supply part and the extraction part. In addition to being in the (independent) state, it is necessary to perform work from various different sides in plan view, and it is conceivable that the work efficiency is significantly reduced.
In the case of the second device, compared with the first device, the separation state between the molding material supply unit and the molded product take-out unit is alleviated, but the molded product and the resin material in the supply unit are in plan view. Therefore, it is supplied from a different side, so that it is substantially square in plan view , but is not satisfactory in improving the working efficiency. Furthermore, the mold forming unit, for example, if such Boost from one to two, since the configuration of connecting the molded part in a state aligned along a direction perpendicular to the sending-winding direction of the film Naturally, the shape is changed from a substantially square shape to a rectangular shape as seen from the plane of the second device, and there is a concern that workability (operability / maintenance property) may deteriorate.
The present invention is difficult to solve with the conventional first and second apparatuses, and the molding material supply part and the molding product take-out part are separated (independent) and from different sides in plan view. It is another object of the present invention to provide a resin molding apparatus that can efficiently solve the problem of reduced work efficiency caused by supplying and taking out molded products.

In order to solve the technical problem, the resin molding apparatus (XY) according to the present invention includes a substrate material supply unit (AS) that supplies a pre-molding substrate (1) that is a molded product , and a pre- molding device. A pre-molding substrate (1) using a resin material supply part (AR) for supplying a resin material (5) for resin-molding the substrate (1) and a resin molding die (8 (8a, 8b)) the a forming unit for resin molding (B), product removal section for taking out a molded finished substrate is a molded article molded (7) (C), and control unit for controlling the entire resin molding apparatus (X · Y) (D) and the resin-molding die (8 (8a, 8b)), the pre-molding substrate (1) and the resin material (5) are carried into the resin-molding die (8 (8a, 8b)). ) from a conveying means for unloading the molded pre substrate (7) (17) resin molding apparatus and a (X · Y), a substrate material supply section AS) and at least one of the molded product take-out part (C), the standby position (M) of the conveying means (17), and the resin material supply part (AR) are specified when the resin molding apparatus (XY) is viewed in plan view. The side (F) is arranged in a line along a straight line, and at least one of the substrate material supply part (AS) and the molded product take-out part (C) is sandwiched between the standby position (M) and the resin material supply part (AR). oppositely disposed, the substrate material supply section (aS) and product removal unit (C) a resin material supply unit (AR) and supplying extraction unit is integrated has an (E), supply extraction unit ( E) , the forming part (B), and the control part (D) are arranged in a substantially square shape in plan view and are configured to be detachable, and the conveying means (17) is provided with the supply take-out part (E) and the forming part (B). ) Is substantially orthogonal to the straight line, and the pre-molding substrate (1) is provided. And characterized in that it is carried out in particular side (F) of the supply of the resin material (5) and removal of the molded pre substrate (7).

In order to solve the technical problem, the resin molding apparatus ( X • Y ) according to the present invention includes a substrate material supply unit (AS) and a molded product extraction unit (X • Y) in the resin molding apparatus (X • Y) described above. C) is characterized by being vertically arranged side by side or vertically arranged, or arranged side by side in the horizontal direction .

In the present invention , a pre-molding substrate (1) and a resin material (5) , which are molded products , are supplied to a resin molding die (8 (8a, 8b)) to perform resin molding, and further molded by resin molding. in step be Eject the molded substrate is goods (7) from the mold (8 (8a · 8b)), using a resin molding apparatus having the following configuration (X · Y). At least one of the substrate material supply part (AS) and the molded product take-out part (C), the standby position (M) of the conveying means (17), and the resin material supply part (AR) are provided with a resin molding apparatus (XY). They are arranged in a line along a straight line on a specific side (F) in plan view. Further, at least one of the substrate material supply unit (AS) and the molded product take-out unit (C) is arranged to face the resin material supply unit (AR) with the standby position (M) of the conveying means (17) interposed therebetween. ing. Thus, the supply of the pre-molding substrate (1) and the resin material (5) and the removal of the molded substrate (7) from the specific side (F) when the resin molding apparatus (XY) is viewed in plan. It can be carried out. Therefore, it is possible to improve the work efficiency when the resin molding operation is performed using the resin molding apparatus (XY) . Further, the supply take-out part (E), the molding part (B), and the control part (D) are arranged in a substantially square shape in plan view and are detachable. Thereby, even when a shaping | molding part (B) is expanded, the increase in the length of the conveyance system path by a conveyance means (17) is suppressed. Therefore, workability in the resin molding apparatus (X / Y) is improved.

A substrate material supply unit (AS) for supplying the substrate (1) before molding , a resin material supply unit (AR) for supplying the resin material (5), and a mold for resin molding (8 (8a and 8b)) are used. forming part of the resin molding the substrate (1) before forming Te (B) and, product removal section for taking out a molded pre substrate (7) (C), and control unit for controlling the entire resin molding apparatus (X · Y) ( D) and a resin molding die (8 (8a, 8b)), and a pre-molding substrate (1) and a resin material (5) are carried into the resin molding die (8 (8a, 8b)). A resin molding apparatus (XY) including a conveying means (17) for unloading the molded substrate (7) from the substrate, and conveying with at least one of the substrate material supply unit (AS) and the molded product extraction unit (C). The standby position (M) of the means (17) and the resin material supply part (AR) are determined when the resin molding apparatus (XY) is viewed in plan view. The specific side (F) is arranged in a line along a straight line, and at least one of the substrate material supply part (AS) and the molded product take-out part (C) is a standby position (M ) And the resin material supply unit (AR), and the substrate material supply unit (AS), the molded product extraction unit (C), and the resin material supply unit (AR) are integrated. (E), the supply extraction part (E), the molding part (B), and the control part (D) are arranged in a substantially square shape in plan view and are detachable. The supply of the substrate (1), the supply of the resin material (5), and the removal of the molded substrate (7) are performed on a specific side (F).

Hereinafter, an embodiment will be described with reference to FIGS. 1 and 2.
1 and 2, a resin mold used in each resin molding apparatus according to the present invention, is a plan view showing one in Fig. 1, two in FIG. 2, the arrangement is a resin molding apparatus, respectively .

As an object to be molded article, for example, as shown in FIGS. 1 and 2, using a pre-molding substrate 1. The pre-molding substrate 1 includes a plurality of required substrates 2 (including strip-shaped lead frames) formed in an arbitrary shape that is circular or polygonal, and a plurality of columns on the substrate 2 in a required matrix. The semiconductor chip 3 is mounted or is mounted in a single row (hereinafter, referred to as chip 3), and a plurality of required wires 4 that electrically connect the substrate 2 and the chip 3 to each other . Then, at least in a portion including the chip 2 , resin molding is performed with a molten resin formed by heating and melting the resin material 5 . Here, on one side of the chip 2 is attached to form a collectively single several or required plurality of molded resin 6 (curable resin). Then, after the molding is completed , the molded substrate 7 (molded product) on which the resin molded body 6 (cured resin) is formed is completed. As the target pre-molding substrate 1, it is also possible to apply a flip chip substrate 1 on which a chip 3 without a wire 4 is mounted instead of a wire bonded chip 3 or a wafer substrate 1.

Mold 8 in the resin molding apparatus X · Y (8a · 8b) is important for molding the molded pre substrate 7 is a molded article molded by using the substrate 1 and the resin material 5 before molding a molding material It is a part . Mold 8 (8a · 8b), for example, constituted by a resin molding having a structure of two or more of the required multiple types (for transfer molding, or transfer for press forming) mold 8 (8a · 8b) Has been . One resin mold 8 is shown in the resin molding apparatus X, and two molds 8a and 8b are shown in the resin molding apparatus Y, as shown in FIGS. In this embodiment, the required plural molds in the mold 8 (8a, 8b) are respectively shown as one unit.

As shown in FIGS. 1 and 2, the resin molding apparatuses X and Y include a substrate material supply unit AS that supplies the substrate 1 before molding, a resin material supply unit AR that supplies the resin material 5 , a resin material 5 and molding. a molding unit B for resin molding by a mold 8 (8a · 8b) using the front substrate 1, and a product removal unit C to remove the molded pre substrate 7 which is molded by the mold 8 (8a · 8b) and a control unit D which controls the entire resin molding apparatus X · Y are Nde free. The resin molding apparatuses X and Y are configured in a substantially square shape in plan view . Moreover, as it is possible to improve the work efficiency when working the resin molding apparatus X · Y, in the resin molding apparatus X · Y, the substrate material supply unit AS resin material supply unit AR and product removal section C and is integrated with the supply lead-out portion E is constructed. The supply and control unit D and the take-out portion E forming portion B, that are arranged and removably configured to be substantially square in plan view. Further, it is configured such that the supply of the pre-molding substrate 1 and the resin material 5 and the removal of the molded substrate 7 can be performed from a specific side F in the supply / extraction unit E. Here, “specific side F” in the present application document means a specific side F when the devices X and Y are viewed in plan, and FIGS. 1 and 2 indicate the left side of the devices X and Y.
Accordingly, the resin molding apparatus X, as shown in FIG. 1, the supply extraction unit E, the molding unit B, the control unit D are arranged in a parallel state in the lateral direction. Moreover, in the resin molding apparatus Y, as shown in FIG. 2, the control part D is arrange | positioned above the supply extraction part E and the shaping | molding part B in the state parallel to the left-right direction . In addition , with sufficient consideration of the work efficiency in the resin molding apparatus X, Y , the supply extraction part E, the molding part B, and the control part D are detachably provided so as to be substantially square in plan view , And it is comprised so that it can rotate arbitrarily in the substantially horizontal direction of the example of a figure, and can change arrangement | positioning suitably. Similarly, each of the mechanisms to be described later in the supply take-out part E, the forming part B, and the control part D is also detachably provided and arbitrarily rotated in the substantially horizontal direction in the figure to appropriately change the arrangement. It is configured to be able to.

The free Murrell in the magazine 9 to the substrate material supply unit AS, pre-molding substrate 1 are housed. Furthermore, an in-magazine cassette 11 (hereinafter referred to as in-cassette 11) that can supply the pre-molding substrate 1 from outside the resin molding apparatus X / Y along the direction indicated by the arrow G on the specific side F of the resin molding apparatus X / Y. shown.) is provided at least. The resin material supply mechanism 10 included in the resin material supply unit AR is provided with a resin stocker 12 that stores the resin material 5 . And it is comprised so that the resin material 5 can be supplied to the resin stocker 12 from the resin molding apparatus XY along the direction of the arrow H in the specific side F. FIG.
The free Murrell out magazine 13 for product removal station C, a molded finished board 7 is housed. Further, along the direction of arrow I in particular side F, the molding pre substrate 8 out magazine cassette 14 which can Succoth Eject outside the resin molding apparatus X · Y (hereinafter, referred to as out-cassette 14.) Is Is provided .

The in magazine 9 and the out magazine 13 are arranged side by side in the vertical direction . 1 and 2, a magazine mechanism 15 ( in-magazine 9) configured so that the in-cassette 11 and the out-cassette 14 in a vertically arranged state are separately or integrated and can be moved up and down in the vertical direction. -Shown as out magazine 13). As an arrangement configuration of the magazine mechanism 15 in this case, the in magazine 9 may be arranged in the upper stage and the out magazine 13 may be arranged in the lower stage , or the arrangement arrangement may be reversed . With the configuration in which the magazine mechanism 15 is arranged in the vertical direction , the magazine mechanism 15 itself and the entire resin molding apparatus XY can be made compact . Further, the pre-molded substrate 1 and the molded substrate 7 can be easily supplied and taken out along the directions of the arrows G and I on the specific side F of the resin molding apparatus X and Y , respectively . Then, the in-cassette 11 and out the cassette 14, which houses are respectively pre-molding substrate 1 The molded substrate 7 Doo. Since the pre-molding substrate 1 and the molding pre substrate 7 is formed based on the substrate 2, the basic components of an in-cassette 11 and out the cassette 14 is provided as well. Arrangement shown in this FIG. 1 and FIG. 2, it is preferable to place in parallel in the vertical direction, parallel to the lateral or vertical direction in the figure correspond to the pre-molding substrate 1 and the molding pre substrate 7 May be arranged . The in -cassette 11 and the out-cassette 14 are configured in the shape of a slit that is placed in a separated state so that the required plurality of pre-molding substrates 1 and molded substrates 7 are not damaged. . The pre-molded substrate 1 and the molded substrate 7 accommodated in the in-cassette 11 and the out-cassette 14 correspond to the resin molding method using the mold 8 (8a, 8b) . It is configured to be placed with the portion facing upward or downward. The in-cassette 11 and the out-cassette 14 include the case where the target pre-molding substrate 1 and the molded substrate 7 are flip chip substrates or wafer substrates to which the chips 3 without wires 4 are mounted, for example, the pre-molding substrate 1 or the molded substrate 7 may be shaped configuration of stacked directly laminated respectively.

For example , the resin material supply mechanism 10 can store the resin material 5 made of granular resin in the resin stocker 12 and adjust it to a required amount , for example, from the resin stocker 12 via a hopper (not shown), The resin material 5 is configured to be put into the inside (not shown) . Measuring feeder has a function of measuring the resin material 5 with respect to the predetermined requirements and a function of supplying cut resin material 5 Resin trays accommodating jig in (not shown) at least. Then, when the metering of the resin material 5, by using the control means, based on data of the installation status of the chip 3, such as quantities and defective position of the chip 3 was tested in a substrate inspection mechanism 16 to be described later A required amount of the resin material 5 is calculated and weighed and cut out.
Then, in a state where the resin material 5 the required amount has been set is uniformly received in the receiving jig, in the direction of arrow J, the transfer means 17 to be described later of a resin material supply mechanism 10, the required amount of the resin material 5 is transferred together with the receiving jig . Therefore, for example, resin carrier resin material supply mechanism 10 (not shown) is provided. Further, in order to increase the use efficiency of the resin material 5 to the maximum , the mounting state of the chip 3 on the pre-molding substrate 1 is confirmed every time the resin is molded, and the resin material 5 is weighed based thereon. It is configured. Corresponding to the function of the resin material supply mechanism 10, as the resin material 5 other than the granular resin , for example, a powder resin, a liquid resin, a crushed resin, or a particle size larger than that of the powder is larger than that of the granule. An appropriate resin material 5 such as a fine particle resin having a small particle diameter can be used . In the case of the pre-molding substrate 1 without the wires 4, for example, a required amount of the tablet-like resin material 5 may be used .

In the press mechanism 18 (18a / 18b) and the film supply mechanism 19 (19a / 19b) included in the forming part B, the press mechanism 18 (18a / 18b) includes a required plurality of molds 8 (8a / 8b). Is installed . Also, the mold 8 (8a, 8b) is moved separately or integrally and moved in the vertical direction to perform the mold clamping / opening operation, for example, a press using any working fluid such as water, oil , gas, etc. And an electric press . The film supply mechanism 19 (19a, 19b) is a film 20 (20a, 20b) that covers a molding die surface of a resin molding cavity (not shown) formed in at least one mold 8 (8a, 8b). ) Is stretched between the feeding roller 21 (21a and 21b) and the winding roller 22 (22a and 22b) and can be supplied to the mold 8 (8a and 8b). And it is set as the structure which combined the press mechanism 18 (18a * 18b) and the film supply mechanism 19 (19a * 19b) . In the resin molding apparatus X, a set as a press mechanism 18 and the film supply mechanism 19 is shown in Figure 1. In the resin molding apparatus Y, the two sets as a press mechanism 18a · 18b and the film feed mechanism 19a · 19b is shown in FIG. In order to clarify the explanation below, the description of partial codes a and b will be omitted.
Accordingly, when the number of the press mechanism 18 and the film supply mechanism 19 in the molding part B is increased or decreased, the arrangement structure is not a rectangular arrangement in a conventional parallel state, but within the required range of the molding part B. a required plurality of sets of press mechanisms 18 and the film supply mechanism 19 by placing appropriate, can be a resin molding apparatus X · Y in substantially square in.

As for the supply path of the film 20 in the film supply mechanism 19, in the resin molding apparatus X, as shown in FIG. 1, the film 20 before resin molding is sent out from the lower side to the upper side along the direction of the arrow K. 21 is sent into the mold 8 . Further, the resin-molded film 20 is sent out of the mold 8 and wound around the winding roller 22 . In addition, the film 20 can be tensioned or relaxed using the feeding roller 21 and the winding roller 22 .
On the other hand, in the resin molding apparatus Y, as shown in FIG. 2, the films 20a and 20b before resin molding are transferred from the delivery rollers 21a and 21b to the mold 8a from the right side to the left side of the drawing along the directions of arrows La and Lb, respectively. ・ Send into 8b . Further, the films 20a and 20b after the resin molding are sent out of the molds 8a and 8b and wound around the winding rollers 22a and 22b. In addition, the films 20a and 20b can be tensioned or relaxed by using the feeding rollers 21a and 21b and the winding rollers 22a and 22b .
In addition, the direction of sending / winding the film 20 of the resin molding apparatus X / Y is not limited to the illustrated example, and can be arbitrarily changed to an appropriate direction. In addition , the arrangement configuration in which the film 20 is supplied to the mold 8 during resin molding has been described . However, the present invention is not limited to this, and if resin molding is performed without using the film 20, the film supply mechanism 19 (the film 20, the feeding roller 21, and the take - up roller 22) may be removed from the resin molding apparatus XY.

Conveying means arranged so as to be movable Oite between the supply lead-out portion E and the molding unit B 17 includes a supply of pre-molding substrate 1 and the resin material 5 is a molding material, molding pre substrate is a molded article 7 is taken out . For this purpose, in the resin molding apparatus X (FIG. 1), the conveying means 17 has a predetermined loading position N in the mold 8 from a standby position M provided between the resin material supply mechanism 10 and the magazine mechanism 15. Until it enters the direction of arrow P1 . Further, in the resin molding apparatus Y (FIG. 2) , the conveying means 17 moves in the direction of the arrow P1 up to the carry-in position O which is a predetermined position between the two sets of press mechanisms 18a and 19a and the press mechanisms 18b and 19b. Enter . The conveying means 17, from the loading position N · O of the forming section B to the standby position M, exiting in the direction of arrow P2. The conveying means 17 that performs these operations is configured at least by , for example, a mechanical chuck conveying mechanism, a robot arm conveying mechanism, or the like that has a reciprocating (entrance / retreat) function.
Oite the conveying path of the conveying means 17, transfer means 17 operates as follows. First, in the resin molding apparatus X (FIG. 1), the pre-molding substrate 1 is supplied and set to the conveying means 17 along the direction of the arrow Q, and the resin material 5 is supplied and set along the direction of the arrow J. Ru is. Next, the conveying means 17 enters from the standby position M to a predetermined position N in the mold 8 in the direction of the arrow P1 . Next, the conveying means 17 supplies the pre-molding substrate 1 and the resin material 5 to predetermined positions in the mold 8 separately and substantially simultaneously , and then returns to the standby position M. Next, after the resin molding is completed, the conveying means 17 enters in the direction of the arrow P <b> 1 and receives the molded substrate 7 that is resin-molded by the mold 8 . Next, the conveying means 17 withdraws in the direction of the arrow P2 to the standby position M in a state where the molded substrate 7 is received . Next, the conveyance means 17, after returning to the standby position M, in the direction of arrow R passes The molded substrate 7 out magazine 13.
On the other hand, in the resin molding apparatus Y (FIG. 2) , the conveying means 17 operates as follows. First, the conveying means 17, pre-molding substrate 1 is supplied set the direction of the arrow Q, and, the resin material 5 in the direction of arrow J Ru is supplied and set. Next, the transport unit 17 enters from the standby position M to the carry-in position O in the direction of the arrow P1 . Next, the conveyance means 17, using each retractably provided a slide mechanism in the direction of arrow Sa · Sb in loading position O (not shown), in one mold 8a in the direction of arrow Sa, The pre-molding substrate 1 and the resin material 5 are supplied separately and substantially simultaneously . Next, after the resin molding is complete, transfer means 17, enters into the mold 8a slide mechanism of the conveying means 17 is moved in the direction of arrow Sa, The molded substrate which is molded in a mold 8a 7 is received. Next, the transport unit 17 moves the slide mechanism along the direction of the arrow Ta and returns it to the carry-in position O of the transport unit 17 . Next, the conveying means 17 moves out from the carry-in position O to the standby position M in the direction of the arrow P2 . Next, the conveyance means 17, after returning to the standby position M, in the direction of arrow R passes The molded substrate 7 out magazine 13. In addition, in the resin molding apparatus Y (FIG. 2), the supply of the pre-molding substrate 1 and the resin material 5 to the other mold 8b and the removal of the molded substrate 7 from the other mold 8b are also performed. As in the case of the mold 8a, the conveyance means 17 can be used .
From this , compared with the conventional apparatus which arrange | positions a shaping | molding part in a parallel state, the resin molding apparatus XY which concerns on this invention has the following characteristics. In the conventional conveyance means, the pre-molding substrate 1 and the resin material 5 are supplied and the molded substrate 7 is taken out substantially linearly and substantially in only one direction . As a result, a very long transport path is required, and there has been a concern that workability may be reduced . On the other hand, according to the resin molding apparatus X · Y, by the conveying means 17, and the press mechanism 18 and the film supply mechanism 19 of the molding unit B is, for example, even if the increase in two sets of a set, the conveying means 17 It is not necessary to substantially change the conveyance path as a path that reciprocates in the directions of the arrows P1 and P2 in the figure . Therefore, according to the resin molding apparatuses X and Y, a short conveyance path can be obtained even when the press mechanism 18 and the film supply mechanism 19 are increased from one set to two sets.
Therefore, the resin molding apparatuses X and Y have the following effects. First, the installation space can be greatly reduced, and a compact device layout can be realized . Secondly, by carrying out the supply of the pre-molding substrate 1 and the resin material 5 and taking out the molded substrate 7 using a single conveying means 17 , the conveying means 17 has at least two functions. The number of parts can be reduced . Therefore, a significant cost reduction is realized. Third, it is possible to improve workability (operability / maintenance) by utilizing a short transport path .

Between the transport means 17 and the magazine mechanism 15, separately from the transfer means is provided with transport means 17. The transfer means grips (holds) the pre-molded substrate 1 stored in the in magazine 9 and / or the molded substrate 7 stored in the out magazine 13. Then, in this state, transfer means to transfer in the direction of arrow Q the pre-molding substrate 1 from in the magazine 9 to the transfer means 17. Also, transfer means to transfer in the direction of the arrow R of The molded substrate 7 from the conveying means 17 to the out-magazine 13. The transfer means is configured at least by a substrate feed mechanism (not shown), for example.
Further, while the pre-molded substrate 1 and the molded substrate 7 are transferred in the directions of arrows Q and R using the substrate feed mechanism , the mounted state of the chip 3 and the cured resin molded body 6 are inspected from the lower part in the vertical direction. substrate inspection mechanism 16 is provided. In this case, the pre-molding substrate 1 and the molded substrate 7 are inspected by appropriate inspection means such as a CCD camera (not shown) provided in the substrate inspection mechanism 16, for example . Thus, in the pre-molding substrate 1, for example, discrimination of the front and back of the substrate 2 (one surface and the other surface), or loaded quantity or bad (defective) of the chip 3 mounted chips 3 such as the position (Implementation) The situation can be grasped. That is, after performing such an inspection process, the pre-molding substrate 1 gripped by the substrate feed mechanism is delivered to the transport means 17. The operation of the resin material supply mechanism 10 and the operation of the substrate feed mechanism can be interlocked.

A working (particularly maintenance) space U is provided as a component of the other resin molding apparatuses X and Y. Specifically, in the resin molding apparatus X (FIG. 1), on the side of the delivery roller 21 in the mold 8, the working space U is provided. In the resin molding apparatus Y (FIG. 2) , a work space U is provided on the side of the two delivery rollers 21a and 21b between the two molds 8a and 8b . These working spaces U are operated (operated), maintained and managed (maintenance) in the molding part B, which is an important part for completing the molded substrate 7 by molding the pre-molded substrate 1 using the resin material 5. ) Is provided along with an increased opportunity to perform the work. The working space U, particularly when the resin molding apparatus X · in Y such that maintenance and management (maintenance), is also taken into account workability when working the operation of resin molding apparatus X · Y is stopped It is set as the arrangement configuration.

Further, although not shown, a substrate preheater mechanism (not shown) for preheating (preheater) the pre-molding substrate 1 may be provided in addition to the above-described parts and mechanisms . By the substrate preheater mechanism, a pre-molding substrate 1 can be preheated during the transport in the direction of arrow Q the pre-molding substrate 1 from in the magazine 9 to the transfer means 17. Further, when the pre-molding substrate 1 supplied and set to the conveying means 17 is fed into the mold 8 (8a, 8b) by the substrate pre-heater mechanism , the molding is performed during the transfer from the standby position M to the loading position N / O. The front substrate 1 can be preheated.
In addition , the molding part B may be provided with an appropriate evacuation mechanism (not shown) for evacuating the mold 8 with at least the cavity portion in an outside air blocking state. In this case, the vacuuming mechanism may be configured to use, for example, two vacuum pumps (not shown) for vacuuming, substrate suction, and film suction . Furthermore, in the arrangement of two-stage supply extraction unit E in the vertical direction, the resin material supply mechanism 10 and magazine mechanism 15 and transport means 17 is disposed in the upper, placing the required plurality of vacuum pumps in the lower part Thus, these may be appropriately arranged and configured. If necessary, for example, a configuration in which a reduced pressure source (not shown) such as a vacuum tank is installed alone, or a configuration in which the reduced pressure source is provided with a vacuum pump may be used. In addition to the arrangement of such a vacuum pump in the lower side in the vertical direction of the two-stage, as dust countermeasure of the resin material 5 in the resin material supply mechanism 10, for example, the structure which houses the dust collector (not shown) It may be adopted .

Control unit D in the resin molding apparatus X · Y can be different each part as described above, each mechanism or the like to the subject, controlled by setting the respective another of them alone. The control unit D has each of the aforementioned parts, in conjunction between the mechanisms can be controlled by the entire resin molding apparatus X · Y to a subject. Further, the control mechanism 23 is detachably attached to the control unit D has, and is configured to be able to place appropriately changed by rotating arbitrarily in a substantially horizontal direction in the illustrated example. As a result, the molded substrate 7 formed by resin- molding the pre-molded substrate 1 through the aforementioned parts and mechanisms is finally stored in the out magazine 13 of the magazine mechanism 15 of the supply take-out unit E. The resin molding apparatuses X and Y can be controlled so that a series of processes can be operated and stopped continuously or intermittently.

Here, a series of processes performed using the resin molding apparatuses X and Y are as follows. In the resin molding apparatus X , as shown in FIG. 1, first, the substrate 1 before molding is transferred from the in-magazine 9 to the conveying means 17 along the direction of the arrow Q, and a required amount of the resin material 5 is supplied to the resin material 5. It is transferred from the mechanism 10 to the conveying means 17 along the direction of arrow J. Next, the pre-molding substrate 1 and the resin material 5 are delivered to the conveying means 17 separately . Next, the transport means 17 enters the predetermined position N in the mold 8 from the standby position M along the direction of the arrow P1 . Next, the pre-molding substrate 1 and the required amount of the resin material 5 are supplied to the mold 8 separately and substantially simultaneously. Next, the conveying means 17 that has finished supplying the pre-molding substrate 1 and the resin material 5 exits from the predetermined position N in the mold 8 along the direction of the arrow P2 , and waits at the standby position M. Next, in order to take out the molded substrate 7 after completion of molding, the conveying means 17 enters the predetermined position N in the mold 8 along the direction of the arrow P1 and receives the molded substrate 7 . Next, the conveying means 17 that has received the molded substrate 7 moves out from the predetermined position N in the mold 8 to the standby position M along the direction of the arrow P2 . Next, the molded substrate 7 is transferred from the conveying means 17 to the out magazine 13 along the direction of the arrow R by the substrate feed mechanism (not shown), and the molded substrate 7 is stored in the out magazine 13 .
On the other hand, in the resin molding apparatus Y , as shown in FIG. 2, first, the substrate 1 before molding is transferred from the in-magazine 9 to the conveying means 17 along the direction of the arrow Q, and a required amount of the resin material 5 is transferred to the resin. transferring in the direction of arrow J from the material supply mechanism 10 to the transport means 17. Next, the pre-molding substrate 1 and the resin material 5 are delivered to the conveying means 17 separately . Next, the conveying means 17 enters from the standby position M to the carry-in position O in the molding part B along the direction of the arrow P1 . Next, the pre-molding substrate 1 and the required amount of the resin material 5 are separately supplied to the one mold 8a along the direction of the arrow Sa by the slide mechanism of the conveying means 17 .
Next, as a first case, the conveyance means 17 storing the slide mechanism that has finished supplying the pre-molding substrate 1 and the resin material 5 to the mold 8a is located at the carry-in position O, and the other mold 8b. Consider the case where the pre-molding substrate 1 and the resin material 5 are not supplied . In this case, the transport means 17, back from the loading position O along the direction of the arrow P2 to the standby position M, Ru receive the substrate 1 and the resin material 5 prior to molding to be supplied to the other mold 8b. Then, the transport means 17, as in the case against the one mold 8a, supplies along the substrate 1 and the resin material 5 prior to molding in the direction of arrow Sb in other mold 8b.
In the second case, the conveying means 17 storing the slide mechanism that has finished supplying the pre-molding substrate 1 and the resin material 5 to the mold 8a is located at the carry-in position O, and the other mold 8b Consider the case where the pre-molding substrate 1 and the resin material 5 have already been supplied. In this case, the molded substrate 7 is already completed in the other mold 8b, or the molded substrate 7 is completed after a short time. Therefore, the transport means 17 takes out the molded substrate 7 from the mold 8b using the slide mechanism, and transfers the molded substrate 7 in the direction of the arrow Tb . Next, the conveying means 17 that has received the molded substrate 7 moves out from the loading position O to the standby position M along the direction of the arrow P2 .
Next, the molded substrate 7 is transferred from the conveying means 17 to the out magazine 13 along the direction of the arrow R by the substrate feed mechanism (not shown), and the molded substrate 7 is stored in the out magazine 13 .

In addition, the resin molding apparatuses X and Y may have the following configurations even if they are not arranged as shown in FIGS. 1 and 2 . It is primarily is that a substantially square in plan view, constitute a supply extraction unit E in which the substrate material supply unit AS resin material supply unit AR and product removal unit C are integrated . Secondly, a structure as occurring in a particular side F when withdrawal Metropolitan and supply The molded substrate 7 of the pre-molding substrate 1 and the resin material 5 in the feed extraction portion E is viewed in plan. Have their configuration lever, each of the aforementioned parts may be Re change positioned appropriately to sift through mechanisms like.

From the above, the resin molding apparatus X · Y according to the present invention is to have a shape of substantially square in plan view. In addition, the substrate material supply unit AS, the resin material supply unit AR, and the molded product extraction unit C constitute a supply extraction unit E. In addition, the supply of the pre-molding substrate 1 and the resin material 5 and the removal of the molded substrate 7 in the supply take-out part E are performed on a specific side F when viewed in plan. As a result, the substrate material supply part AS and the resin material supply part AR and the molded product take-out part C, which are difficult to solve with the conventional apparatus, are separated (independent) and before molding from different sides when viewed in plan. the problem of reduction of work efficiency due to performing extraction Metropolitan and supply the molded substrate 7 of the substrate 1 and the resin material 5 can be efficiently prevented. In addition, the supply of the pre-molding substrate 1 and the resin material 5 and the removal of the molded substrate 7 are performed by a single conveying means 17. As a result, the cost can be greatly reduced by reducing the number of parts, and the workability (operability and maintainability) can be improved by taking advantage of the short transport path.

FIG. 1 is a plan view showing a resin molding apparatus in which one resin molding die is arranged and configured. FIG. 2 is a plan view showing a resin molding apparatus in which two resin molding dies are arranged and configured.

1 Pre-molding substrate 2 Substrate 3 Chip 4 Wire 5 Resin material 6 Resin molded body 7 Molded substrate 8 (8a, 8b) Mold ( mold for resin molding )
9 in magazine 10 resin material supply mechanism 11 in cassette 12 resin stocker 13 out magazine 14 out cassette
15 magazine mechanism 16 substrate inspection mechanism 17 transport means 18 (18a / 18b) press mechanism 19 (19a / 19b) film supply mechanism 20 (20a / 20b) film 21 (21a / 21b) delivery roller 22 (22a / 22b) take-up Roller 23 control mechanism
AR resin material supply section
AS substrate material supply part B Molding part C Molded product take-out part D Control part
E Supply extraction department
F Specific side M Standby position N / O Loading position U Work space X / Y Resin molding machine

Claims (2)

A substrate material supply unit that supplies a pre-molding substrate, which is a molded product , a resin material supply unit that supplies a resin material for resin molding the pre-molding substrate, and a pre-molding using a resin molding die A molded part for resin-molding the substrate , a molded product take-out part for taking out a molded substrate that is a molded product of the resin, a control unit for controlling the entire resin molding apparatus, and the pre-molded substrate in the resin molding die And the resin molding apparatus, and a conveying means for carrying out the molded substrate from the resin molding die ,
At least one of the substrate material supply unit and the molded product take-out unit, the standby position of the transfer means, and the resin material supply unit are substantially aligned along a straight line on a specific side when the resin molding apparatus is viewed in plan view. Lined up,
At least one of the substrate material supply part and the molded product take-out part is disposed to face the resin material supply part across the standby position,
Has the supply take-out portion where the substrate material supply section and the product removal section and the resin material supply unit is integrated,
The supply lead-out portion and the molding portion and the control unit is detachably configured with being arranged in substantially square in plan view,
The direction in which the conveying means conveys between the supply extraction part and the molding part is substantially orthogonal to the straight line,
2. The resin molding apparatus according to claim 1 , wherein the supply of the pre-molding substrate, the supply of the resin material, and the removal of the molded substrate are performed on the specific side . In the resin molding apparatus described in claim 1,
The resin molding apparatus, wherein the substrate material supply unit and the molded product take-out unit are arranged so as to be movable up and down in the vertical direction, or arranged in the horizontal direction .

Images