SG11201402077UA - Resin molding apparatus - Google Patents

Resin molding apparatus

Info

Publication number
SG11201402077UA
SG11201402077UA SG11201402077UA SG11201402077UA SG11201402077UA SG 11201402077U A SG11201402077U A SG 11201402077UA SG 11201402077U A SG11201402077U A SG 11201402077UA SG 11201402077U A SG11201402077U A SG 11201402077UA SG 11201402077U A SG11201402077U A SG 11201402077UA
Authority
SG
Singapore
Prior art keywords
molding apparatus
resin molding
resin
molding
Prior art date
Application number
SG11201402077UA
Inventor
Masahiko Fujisawa
Hidetoshi Oya
Shinichi Asahi
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Publication of SG11201402077UA publication Critical patent/SG11201402077UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3433—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3488—Feeding the material to the mould or the compression means uniformly distributed into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses
    • B29C2043/5883—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses ensuring cavity filling, e.g. providing overflow means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
SG11201402077UA 2011-11-08 2012-10-29 Resin molding apparatus SG11201402077UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011244378 2011-11-08
PCT/JP2012/077907 WO2013069496A1 (en) 2011-11-08 2012-10-29 Resin sealing device

Publications (1)

Publication Number Publication Date
SG11201402077UA true SG11201402077UA (en) 2014-09-26

Family

ID=48289874

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201402077UA SG11201402077UA (en) 2011-11-08 2012-10-29 Resin molding apparatus

Country Status (6)

Country Link
JP (2) JP5731009B2 (en)
KR (1) KR101950894B1 (en)
CN (1) CN103930252B (en)
SG (1) SG11201402077UA (en)
TW (1) TWI593541B (en)
WO (1) WO2013069496A1 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6049597B2 (en) * 2013-11-28 2016-12-21 Ｔｏｗａ株式会社 Resin material supply method and supply mechanism of compression molding apparatus, and compression molding method and compression molding apparatus
JP6284764B2 (en) * 2013-12-24 2018-02-28 Ｔｏｗａ株式会社 Resin-spreading method, resin-sealing method for resin-sealed parts, resin-spreading apparatus, resin-sealing apparatus for resin-sealed parts, and resin-sealed molded product manufacturing apparatus
JP6183417B2 (en) 2015-06-26 2017-08-23 トヨタ自動車株式会社 Fuel cell system
JP6499941B2 (en) * 2015-07-23 2019-04-10 アピックヤマダ株式会社 Resin molding method and resin molding apparatus
JP6499105B2 (en) * 2016-03-11 2019-04-10 東芝メモリ株式会社 Mold
JP6212609B1 (en) * 2016-08-19 2017-10-11 Ｔｏｗａ株式会社 Resin molding apparatus and resin molded product manufacturing method
JP6298871B1 (en) * 2016-10-21 2018-03-20 Ｔｏｗａ株式会社 Resin material supply device, resin material supply method, resin molding device, and resin molded product manufacturing method
JP6284996B1 (en) * 2016-11-04 2018-02-28 Ｔｏｗａ株式会社 Inspection method, resin sealing device, resin sealing method, and resin-sealed product manufacturing method
JP6270969B2 (en) * 2016-11-22 2018-01-31 Ｔｏｗａ株式会社 Resin material supply method and supply mechanism of compression molding apparatus, and compression molding method and compression molding apparatus
JP6774865B2 (en) * 2016-12-13 2020-10-28 アピックヤマダ株式会社 Frame jig, resin supply jig and its weighing method, mold resin measuring device and method, resin supply device, resin supply measuring device and method, and resin molding device and method
TWI607207B (en) * 2016-12-22 2017-12-01 矽品精密工業股份有限公司 Mold packaging apparatus
JP6522817B2 (en) * 2018-01-29 2019-05-29 Ｔｏｗａ株式会社 METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE, RESIN SEALING METHOD FOR RESIN-CAPSULATED PART, AND RESIN MOLDING APPARATUS
JP6989410B2 (en) * 2018-02-16 2022-01-05 アピックヤマダ株式会社 Resin molding device
JP6936177B2 (en) * 2018-03-23 2021-09-15 アピックヤマダ株式会社 Resin molding equipment
JP7284514B2 (en) 2020-05-11 2023-05-31 アピックヤマダ株式会社 RESIN MOLDING DEVICE AND CLEANING METHOD
JP7360364B2 (en) * 2020-07-03 2023-10-12 Ｔｏｗａ株式会社 Resin molding equipment and method for manufacturing resin molded products
JP7360365B2 (en) * 2020-07-14 2023-10-12 Ｔｏｗａ株式会社 Resin material supply device, resin molding device, and method for manufacturing resin molded products
JP2022061238A (en) * 2020-10-06 2022-04-18 アピックヤマダ株式会社 Resin sealing device and resin sealing method
JP7470982B2 (en) * 2020-11-17 2024-04-19 アピックヤマダ株式会社 Resin supplying device, resin sealing device, and method for manufacturing resin sealed product
JP7468906B2 (en) 2021-04-26 2024-04-16 アピックヤマダ株式会社 Resin sealing equipment
WO2022264374A1 (en) * 2021-06-17 2022-12-22 アピックヤマダ株式会社 Resin sealing device and resin sealing method
JP2023176671A (en) * 2022-05-31 2023-12-13 アピックヤマダ株式会社 Resin sealing device and resin sealing method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4327985B2 (en) * 2000-04-21 2009-09-09 アピックヤマダ株式会社 Resin sealing device
JP3984824B2 (en) * 2001-11-30 2007-10-03 アピックヤマダ株式会社 Liquid material discharge device and resin sealing device
KR100708600B1 (en) * 2004-04-30 2007-04-18 스미토모 베이클라이트 가부시키가이샤 Resin-sealed type semiconductor package, and production method and apparatus therefor
JP2006156796A (en) * 2004-11-30 2006-06-15 Towa Corp Resin seal molding method and device of semiconductor chip
JP4953619B2 (en) * 2005-11-04 2012-06-13 Ｔｏｗａ株式会社 Resin sealing molding equipment for electronic parts
JP4741383B2 (en) * 2006-02-17 2011-08-03 富士通セミコンダクター株式会社 Resin sealing method for electronic parts
JP2007307843A (en) * 2006-05-20 2007-11-29 Apic Yamada Corp Resin molding method/device
JP4917970B2 (en) 2007-06-08 2012-04-18 住友重機械工業株式会社 Resin sealing device
JP4990830B2 (en) 2008-03-27 2012-08-01 住友重機械工業株式会社 Resin supply mechanism
JP5153509B2 (en) * 2008-08-08 2013-02-27 Ｔｏｗａ株式会社 Electronic component compression molding method and mold apparatus
JP2010221430A (en) * 2009-03-19 2010-10-07 Elpida Memory Inc Molding resin and resin molding method
JP5320241B2 (en) * 2009-09-28 2013-10-23 住友重機械工業株式会社 Sealing apparatus and sealing method

Also Published As

Publication number Publication date
KR20140092381A (en) 2014-07-23
JPWO2013069496A1 (en) 2015-04-02
KR101950894B1 (en) 2019-04-22
TW201318810A (en) 2013-05-16
CN103930252B (en) 2016-08-17
CN103930252A (en) 2014-07-16
JP5926417B2 (en) 2016-05-25
JP5731009B2 (en) 2015-06-10
WO2013069496A1 (en) 2013-05-16
TWI593541B (en) 2017-08-01
JP2015128908A (en) 2015-07-16

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