TWI607518B - Resin molding apparatus, resin molding method, and fluid material spraying apparatus - Google Patents

Description

Resin molding device, resin molding method, and ejection device for fluid material

The present invention relates to a wafer-shaped electronic component (hereinafter, referred to as "wafer" as appropriate) using a liquid resin to a transistor, an integrated circuit (IC), and a light emitting diode (LED). A resin molding apparatus, a resin molding method, and an injection apparatus for a fluid material used in the case of resin encapsulation. In the present invention, the term "liquid" means liquid at normal temperature and has fluidity, and does not involve the degree of fluidity, in other words, the degree of viscosity.

Conventionally, a semiconductor resin mounted on a substrate is resin-sealed using a liquid resin formed of, for example, a thermosetting resin such as an fluorenone resin or an epoxy resin. Resin encapsulation technology can use resin molding techniques such as compression molding and transfer molding. In the resin molding using a liquid resin, an auxiliary liquid resin such as a curing agent is mixed in the main solvent liquid resin, and resin molding is performed by heating the mixed liquid resin.

In a resin package using a liquid resin, a liquid resin is supplied from a nozzle attached to a tip end of a dispenser as a resin injection mechanism to a cavity provided in a lower mold. The size and shape of the cavity vary depending on the resin packaged product. Therefore, it is possible to provide one cavity having a large area or a plurality of cavities having a small area or the like on the lower mold corresponding to the product. If a cavity is provided on the lower mold, a dispenser can be used to supply the liquid resin. Even in the case where a plurality of cavities are provided on the lower mold, the liquid resin can be sequentially supplied to the plurality of cavities by one dispenser. However, since the liquid resin is sequentially supplied to a plurality of cavities using one dispenser, the time required for supply becomes long and the productivity is lowered. Although it is also possible to supply the liquid resin by providing a plurality of dispensers corresponding to a plurality of cavities, the overall structure of the apparatus becomes complicated, and the cost is also increased.

In order to supply the liquid resin to a plurality of cavities, a plurality of nozzles may be provided at the front end of the dispenser. In this case, a predetermined amount of liquid resin is simultaneously supplied to each of the cavities from a plurality of nozzles. Therefore, it is important to supply the liquid resin uniformly and stably from a plurality of nozzles.

As a molding apparatus capable of compression molding using a plurality of cavities, the following molding apparatus has been proposed (for example, refer to paragraph [0005] of Patent Document 1 and FIGS. 1 to 2): "The molding apparatus is composed of a plurality of nozzle extruders. 4 is formed by a compression molding die 5, and a plurality of nozzle extruders 4 are provided with a plurality of branch paths 2 for feeding the plasticized resin molding material 6 at the front end of the extruder 1 which plasticizes and extrudes the resin molding material 6, and An extrusion nozzle 3 including a metering mechanism and an ejecting mechanism is disposed and formed on each branch path 2, and the compression molding metal mold 5 is supplied with a plasticized resin molding material 6" extruded from the extrusion nozzle 3.

Patent Document 1: Japanese Patent Application Laid-Open No. Hei 6-114867

However, the conventional molding apparatus disclosed in Patent Document 1 has the following problems. As shown in FIG. 1 of Patent Document 1, a branch path 2 branched into a plurality of branches is connected to the tip end of the delivery path 14 to which the plasticized resin molding material 6 is fed. Further, a metering and spraying unit 17 provided at the base of the extrusion nozzle 3 is connected to the tip end of each branch path 2. The plasticized resin molding material supplied to the metering and spraying unit 17 of each of the extrusion nozzles 3 is independently metered and ejected in each of the metering and spraying units 17, and the plasticized resin molding material is sprayed from the nozzles 18 of the respective extrusion nozzles 3. It is supplied and put into each cavity of the lower metal mold 5a of the compression molding metal mold 5.

In this apparatus configuration, for each of the metering and spraying units 17, the plasticized resin molding material 6 to be supplied into each cavity is metered by each unit, and then ejected toward each of the extrusion nozzles. Therefore, the injection amount of each of the metering and injection units 17 is controlled by providing the number of metering and injection units 17 corresponding to the number of cavities. Therefore, in order to perform the complex cavity operation, the device structure becomes complicated, and the cost of the device also increases.

The present invention has been made to solve the above problems, and an object of the invention is to provide a resin molding apparatus, a resin molding method, and a fluid material grease injection apparatus capable of easily reducing variations in injection amount of a fluid resin sprayed from a plurality of injection ports. .

In order to solve the above problems, the resin molding apparatus of the present invention comprises:

a molding die, wherein a cavity is disposed on at least one of an upper die and a lower die disposed opposite to each other;

a resin ejecting mechanism that ejects a fluid resin in order to supply a fluid resin to a cavity;

a clamping mechanism for clamping a molding die;

The resin injection mechanism includes:

a flow path member having a branch flow path branched between an inflow port and a discharge port of the fluid resin;

a rotating body disposed in each of the branch flow passages and rotatable in association with passage of the fluid resin;

The interlocking mechanism is configured to rotate the respective rotating bodies disposed in the branch flow path.

In order to solve the above problems, the resin molding method of the present invention comprises the following steps:

a resin spraying step of using a molding die provided with a cavity on at least one of an upper mold and a lower mold disposed opposite to each other, and ejecting the fluid resin in order to supply a fluid resin to the cavity;

a mold clamping step of clamping a molding die supplied with a resin material;

In the resin ejecting step, the rotating bodies disposed in the respective branch channels are rotated in conjunction, whereby the fluid resin is passed through the respective rotating bodies, and the branching channels are branched between the inflow port of the fluid resin and the ejection ports.

In order to solve the above problems, the injection device of the fluid material of the present invention comprises:

a flow path member having a branch flow path branched between the flow inlet and the injection port of the fluid material;

a rotating body disposed in each of the branch flow passages and rotatable with passage of the fluid material;

The interlocking mechanism is configured to rotate the respective rotating bodies disposed in the branch flow path.

According to the present invention, it is possible to easily reduce the variation in the injection amount of the fluid resin injected from the plurality of injection ports.

Embodiments of the present invention will be described below with reference to the drawings. Any of the drawings in the present invention are appropriately omitted or exaggerated for easy understanding to be schematically drawn. The same reference numerals are used for the same components, and the description is omitted as appropriate.

[Embodiment 1]

(Structure of resin molding device)

The structure of the resin molding apparatus of the present invention will be described with reference to Fig. 1 .

The resin molding apparatus 1 shown in Fig. 1 is, for example, a resin molding apparatus using a compression molding method. The resin molding apparatus 1 includes a substrate supply and storage module 2 as a component, and four molding modules 3A, 3B, 3C, and 3D and a resin supply module 4. The substrate supply storage module 2 as a component element, each of the molding modules 3A, 3B, 3C, and 3D and the resin supply module 4 can be detachably attached to each other with respect to other components, and can be replaced.

The substrate supply and storage module 2 is provided with a package front substrate supply unit 6 for supplying the package front substrate 5 and a package rear substrate storage portion 8 for accommodating the package rear substrate 7. A semiconductor wafer or the like is mounted on the package front substrate 5, for example. A loader 9 and an unloader 10 are provided in the substrate supply and storage module 2, and a guide rail 11 supporting the loader 9 and the unloader 10 is disposed in the X direction. The loader 9 and the unloader 10 move in the X direction along the guide rail 11.

The loader 9 and the unloader 10 supported on the guide rail 11 move between the substrate supply and storage module 2, the molding modules 3A, 3B, 3C, and 3D and the resin supply module 4 in the X direction. The loader 9 is provided with a moving mechanism 12 for supplying the package front substrate 5 into the upper mold in each of the molding modules 3A, 3B, 3C, and 3D. In each of the molding modules, the moving mechanism 12 moves in the Y direction. The unloader 10 is provided with a moving mechanism 13 for receiving the packaged substrate 7 from the upper mold in each of the molding modules 3A, 3B, 3C, and 3D. In each of the molding modules, the moving mechanism 13 moves in the Y direction.

Each of the molding modules 3A, 3B, 3C, and 3D is provided with a lower mold 14 (molding mold) that can be raised and lowered, and an upper mold (not shown, see FIG. 2) that is disposed to face the lower mold 14. The upper mold and the lower mold 14 together constitute a molding die. Each of the molding modules 3A, 3B, 3C, and 3D has a mold clamping mechanism 15 (a portion indicated by a chain double-dashed line in the figure) for clamping and opening the upper mold and the lower mold 14. A cavity 16 is provided in the lower mold 14, and this cavity 16 is a space for accommodating a fluid resin or a liquid resin as a fluid material and hardening it. In other words, the cavity 16 is a housing portion for accommodating the liquid resin. FIG. 1 shows a case where two cavities 16 are provided in the lower mold 14. The release film can be coated on the profile of the cavity 16. Further, a structure in which a cavity is provided on the lower mold will be described here, but the cavity may be provided on the upper mold or may be disposed on the upper mold and the lower mold.

The resin supply module 4 is provided with a resin conveying mechanism 17 for supplying a liquid resin to the cavity 16. The resin conveying mechanism 17 is supported by the guide rails 11 and moves in the X direction along the guide rails 11. The resin conveying mechanism 17 is provided with a dispenser 18 as a resin injection mechanism of a liquid resin or an injection device of a fluid material. A resin injection portion 19 for ejecting a liquid resin is provided at a distal end portion of the dispenser 18. A plurality of nozzles (see FIGS. 3 to 7) are provided in the resin ejecting portion 19 in accordance with the number of the cavities 16. In each of the molding modules 3A, 3B, 3C, and 3D, the dispenser 18 is moved in the Y direction by the moving mechanism 20, and the liquid resin is supplied to the cavity 16.

The dispenser 18 shown in Fig. 1 is a one-liquid type dispenser using a liquid resin obtained by mixing a main agent and a curing agent in advance. As the main component, for example, an anthrone resin or an epoxy resin having thermosetting properties can be used. It is also possible to use a two-liquid mixing type dispenser which is used by mixing a main agent and a hardener when ejecting a liquid resin.

A vacuuming mechanism 21 is provided in the resin supply module 4. The vacuuming mechanism 21 forcibly sucks air from the cavity 16 and discharges it in the respective molding modules 3A, 3B, 3C, and 3D immediately before the upper mold and the lower mold 14 are clamped. The control unit 22 for controlling the overall operation of the resin molding apparatus 1 is provided in the resin supply module 4. FIG. 1 shows a case where the vacuum supply mechanism 21 and the control unit 22 are provided in the resin supply module 4. Not limited to this, the vacuuming mechanism 21 and the control unit 22 may be provided in other modules.

The control unit 22 controls the ejection of the liquid resin, the conveyance of the package front substrate 5 and the packaged substrate 7, the heating of the molding die, and the opening and closing of the molding die. In other words, the control unit 22 performs control of each operation in the substrate supply and storage module 2, the molding modules 3A, 3B, 3C, and 3D and the resin supply module 4.

The control unit 22 may be disposed at any position, and the control unit 22 may be disposed in at least one of the substrate supply and storage module 2, the molding modules 3A, 3B, 3C, and 3D and the resin supply module 4. The control unit 22 can be disposed outside each module. Further, the control unit 22 may be configured to separate at least a part of the plurality of control units in accordance with an operation as a control object.

(Operation of resin molding device)

An operation of resin-packaging a wafer mounted on a substrate by the resin molding apparatus 1 will be described with reference to Figs. 1 to 2 . The case of using the molding module 3C will be described as an operation of the resin molding apparatus 1.

First, for example, the package front substrate 5 to which the wafer 23 (see FIG. 2( a )) is attached is transferred from the package front substrate supply unit 6 to the loader 9 so that the surface on which the wafer 23 is mounted faces downward. Next, the loader 9 is moved from the substrate supply and storage module 2 along the guide rail 11 to the molding module 3C in the +X direction.

Next, in the molding module 3C, the moving mechanism 12 is used to move the package front substrate 5 in the -Y direction to a predetermined position between the upper mold 24 and the lower mold 14 (see FIG. 2(a)). The package front substrate 5 on which the wafer 23 is mounted on the lower side is fixed to the lower surface of the upper mold 24 (molding mold) by suction, clamping, or the like. After the package front substrate 5 is placed on the lower surface of the upper mold 24, the moving mechanism 12 is moved back to the loader 9. The loader 9 moves to the original standby position in the substrate supply storage module 2.

Next, the resin conveying mechanism 17 is used to move the dispenser 18 from the standby position in the resin supply module 4 to the molding module 3C in the -X direction. Thereby, the resin conveying mechanism 17 moves to a predetermined position in the vicinity of the lower mold 14 in the molding die 3C. The moving mechanism 20 is used to move the dispenser 18 to a predetermined position above the lower mold 14 (see (a) of Fig. 2).

Next, as shown in FIG. 2(a), the liquid resin 25 is ejected from the resin ejecting portion 19 of the dispenser 18 to the cavity 16 provided in the lower mold 14. Thereby, the liquid resin 25 is supplied to the cavity 16.

Next, after the liquid resin 25 is supplied into the cavity 16, the moving mechanism 20 is used to move the dispenser 18 back to the resin conveying mechanism 17. The resin conveying mechanism 17 moves to the original standby position in the resin supply module 4.

Then, in the molding die 3C, the lower die 14 is raised by the mold clamping mechanism 15, and the upper die 24 and the lower die 14 are clamped (see (b) of FIG. 2). The wafer 23 mounted on the package front substrate 5 is immersed in the liquid resin 25 supplied into the cavity 16 by mold clamping. At this time, a predetermined resin pressure can be applied to the liquid resin 25 in the cavity 16 by using a cavity bottom surface member (not shown) provided in the lower mold 14.

Further, in the mold clamping process, the inside of the cavity 16 may be suctioned using the vacuuming mechanism 21. Thereby, the air remaining in the cavity 16 and the air bubbles and the like contained in the liquid resin 25 are discharged to the outside of the molding die. Further, the inside of the cavity 16 is set to a predetermined degree of vacuum.

Next, the liquid resin 25 is heated by the heater (not shown) provided in the lower mold 14 for the time required for the liquid resin 25 to be cured. Thereby, the curable resin 26 is molded by curing the liquid resin 25 (see (c) of FIG. 2). Thereby, the wafer 23 mounted on the pre-package substrate 5 is resin-sealed by the curing resin 26 molded to correspond to the shape of the cavity 16. After the liquid resin 25 is cured, the mold clamping mechanism 15 is used to mold the upper mold 24 and the lower mold 14. A molded article 27 (packaged substrate 7) after resin encapsulation is fixed to the lower surface of the upper mold 24 (see (c) of FIG. 2).

Next, the loader 9 is retracted to an appropriate position that does not prevent the unloader 10 from moving to the molding module 3C. For example, the loader 9 is retracted from the substrate supply and storage module 2 to an appropriate position in the molding module 3D or the resin supply module 4. Thereafter, the unloader 10 is moved from the substrate supply and storage module 2 in the +X direction along the guide rail 11 to the molding module 3C.

Next, in the molding die 3C, after the moving mechanism 13 is moved in the -Y direction to a predetermined position between the lower die 14 and the upper die 24, the packaged substrate 7 is received by the moving mechanism 13 from the upper die 24. After receiving the packaged substrate 7, the moving mechanism 13 returns to the unloader 10. By returning the unloader 10 to the substrate supply and storage module 2, the packaged substrate 7 is housed in the packaged substrate storage portion 8. At this point of time, the resin encapsulation of the initial package front substrate 5 is completed, thereby completing the initial packaged substrate 7.

Next, the loader 9 that has been evacuated to an appropriate position in the molding module 3D or the resin supply module 4 is moved to the substrate supply storage module 2. The next package front substrate 5 is transferred from the package front substrate supply portion 6 to the loader 9. The resin encapsulation is repeated in the above manner.

In the resin molding apparatus 1, the control unit 22 controls the supply of the package front substrate 5, the movement of the resin transfer mechanism 17 and the dispenser 18, the ejection of the liquid resin 25, the clamping of the upper mold 24 and the lower mold 14, and the mold opening. The operation of enclosing the storage of the rear substrate 7 and the like.

(structure of the dispenser)

The dispenser 18 used in the resin molding apparatus 1 will be described with reference to Fig. 3 . As shown in Fig. 3, the dispenser 18 includes a resin delivery mechanism 28 for discharging the liquid resin 25, a syringe 29 for storing the storage portion of the liquid resin 25, and a resin transfer portion 30 for transferring the liquid resin. 25; and a resin ejecting portion 19 for ejecting the liquid resin 25. In the dispenser 18, the dispenser 18 is integrally configured by the connection resin delivery mechanism 28, the syringe 29, the resin transfer portion 30, and the resin injection portion 19. Therefore, the syringe 29 or the resin ejecting portion 19 can be replaced with the other syringe 29 or the resin ejecting portion 19, respectively, depending on the application.

The resin delivery mechanism 28 includes a servo motor 31, a ball screw 32 that is rotated by a servo motor 31, and a slider 33 that is mounted on a ball screw nut (not shown) and converts the rotational motion into a linear motion; the pull rod 34, It is fixed to the front end portion of the slider 33; and the plunger 35 is attached to the front end of the tie rod 34. When the servo motor 31 rotates, the plunger 35 is moved in the Y direction via the ball screw 32, the slider 33, and the tie rod 34, respectively.

The servo motor 31 is an electric motor capable of controlling the rotation of the motor. The servo motor 31 has a rotation detector (encoder 36) for monitoring the rotation of the motor. The encoder 36 detects the rotation angle and the rotation speed of the servo motor 31 and feeds it back. By controlling the rotation of the servo motor 31, position control, speed control, torque control, and the like of the plunger 35 can be performed with high precision. Further, by monitoring the load torque of the servo motor 31, it is possible to detect whether or not an abnormality has occurred in the dispenser 18 (clogging of the liquid resin, etc.).

The dispenser 18 shown in Fig. 3 (a) is a one-liquid type dispenser using a liquid resin 25 obtained by mixing a main agent and a curing agent in advance. FIG. 3 shows a case where a resin injection portion having two resin injection ports 37 (ejection ports) is used as the resin injection portion 19. A resin injection portion having a larger number of resin injection ports can be used by replacing the resin injection portion 19 (see FIGS. 4 to 7).

(Structure of resin injection unit)

The first embodiment of the resin injection unit used in the resin molding apparatus 1 will be described with reference to Figs. 3 to 4 . As shown in FIG. 3(c), the resin injection portion 19 includes a flow path member 38 having a resin flow inlet 40 (inflow port) through which the liquid supply resin 25 flows, and a resin injection port for ejecting the liquid resin 25. A branch flow path 41 branched between 37; and two nozzles 39 are attached to both ends of the flow path member 38. A resin inflow port 40 for supplying the liquid resin 25 is provided at the center of the flow path member 38. A branch flow path 41 extending from the resin inflow port 40 toward the both sides in the horizontal direction is provided in the flow path member 38. Therefore, two branch flow paths 41 are branched in such a manner as to extend on opposite sides of each other on a single axis. A resin flow path 42 connected to the branch flow path 41 and extending in the vertical direction is disposed in the nozzle 39. A resin injection port 37 is provided at the front end of the resin flow path 42. The nozzle 39 is detachable from the flow path member 38, so that the nozzle 39 can be replaced. A nozzle having a different diameter or shape can be selected corresponding to the product or the use. Further, (b) and (c) of Fig. 3, (a) and (b) of Fig. 4, and (b) of Fig. 5, (b) of Fig. 6, and (a) to (c of Fig. 7) which will be described later. In the middle, the groove shape (direction) and the direction of rotation of the rotating body are schematically shown, which does not necessarily mean that the flow direction of the liquid resin is uniform.

A rotating shaft 43 (an interlocking mechanism) as a rotatable interlocking mechanism is provided in the branch flow path 41 of the flow path member 38. The rotating shaft 43 is supported on both ends of the flow path member 38. A rotating body 45 having a spiral groove 44 is fitted into each of the rotating shafts 43 on both sides of the resin inflow port 40. For example, the rotating body 45 is formed of a screw, a rotor, or the like. Therefore, the rotating body 45 is a rotating body that rotates together with the rotating shaft 43, and the rotating shaft 43 is a rotating shaft common to the two rotating bodies 45. The rotating bodies 45 disposed on both sides of the resin inflow port 40 are fitted into the rotating shaft 43 such that the directions of the spiral grooves 44 are opposite to each other. Therefore, the two rotating bodies 45 have spiral grooves 44 whose directions are opposite to each other. Thereby, the rotating body 45 rotates in the same direction integrally with the rotating shaft 43 by the resin pressure of the liquid resin 25 supplied to the resin inflow port 40. Further, as the rotor that can configure the rotating body 45, a rotor that is used in a single screw pump and that can be eccentrically rotated can be used. In the case of using a rotor of a single screw pump, for example, an internal thread-shaped elastic body is disposed around the rotor inside the branch flow path 41, and two universal joints are used in the rotary shaft system and the two joints are connected. The coupling rod to the coupling enables the rotor to rotate eccentrically.

The rotating body 45 can be replaced in accordance with the type, viscosity, specific gravity, and the like of the liquid resin to be used. Therefore, the material, the length, the diameter of the rotating body 45, the pitch, the height, the taper angle, and the like of the spiral groove 44 can be optimized in accordance with the liquid resin.

As shown in FIG. 4, the shape of the groove provided in the rotating body 45 may be a plurality of straight lines which are opposite to each other and are inclined with respect to the rotating shaft 43 when the two rotating bodies 45 are viewed from a direction orthogonal to the rotating shaft 43. Shaped groove 44a. Further, (a) and (b) of Fig. 4 correspond to (b) and (c) of Fig. 3, respectively. In addition, FIG. 4 shows the linear groove 44a when viewed from a direction orthogonal to the rotation axis 43, but may include at least a portion inclined with respect to the rotation axis 43 when viewed from a direction orthogonal to the rotation axis 43. Curved groove.

Instead of the groove, a hole may be provided in the rotating body 45. Specifically, the spiral groove 44 and the linear groove 44a may have a shape such as a hole, and may cover the outer circumference of the rotating body 45 as shown in FIGS.

(operation of the dispenser)

The operation of ejecting the liquid resin 25 from the dispenser 18 will be described with reference to Fig. 3 . As shown in FIG. 3(a), the ball screw 32 is rotated by the rotation of the servo motor 31. The slider 33 attached to the ball screw nut is advanced in the -Y direction by the rotation of the ball screw 32. The pull rod 34 fixed to the slider 33 is advanced in the -Y direction by the advancement of the slider 33. With the advancement of the pull rod 34 in the -Y direction in the syringe 29, the plunger 35 mounted on the front end of the pull rod 34 is advanced in the -Y direction. The plunger 35 is advanced in the -Y direction to press the liquid resin 25 stored in the syringe 29 and to extrude the liquid resin 25 in the -Y direction. The liquid resin 25 extruded by the plunger 35 is supplied to the flow path member 38 of the resin injection portion 19 via the resin transfer portion 30.

As shown in FIG. 3(b), the liquid resin 25 supplied to the flow path member 38 branches from the resin inflow port 40 along the branch flow paths 41 on both sides. In FIGS. 3 to 7, the flow direction of the liquid resin 25 is indicated by thick arrows. The branched liquid resin 25 flows to both sides along the spiral groove 44 formed in each of the rotating bodies 45. Since the rotating body 45 is disposed such that the directions of the spiral grooves 44 are opposite directions, the force of the respective rotating bodies 45 to rotate in the same direction is applied by the resin pressure of the liquid resin 25. Therefore, the liquid resin 25 flows from the resin inflow port 40 to both sides and passes through the rotating body 45 in the branch flow path 41, whereby the rotating body 45 rotates in the same direction integrally with the rotating shaft 43. In other words, each of the rotating bodies 45 rotates in conjunction with the rotation of the rotating shaft 43 at the same speed.

Since each of the rotating bodies 45 rotates at the same speed, the liquid resin 25 of the same flow rate can be sent from each of the rotating bodies 45. The rotary body 45 is rotated integrally with the rotary shaft 43 at the same speed, so that the liquid resin 25 can be uniformly fed. Therefore, the rotating body 45 including the spiral groove 44 has a function as a resin measuring unit that uniformly discharges the liquid resin 25.

The liquid resin 25 which is uniformly sent out by the rotator 45 is sequentially ejected into the cavity 16 via the branch flow path 41, the resin flow path 42, and the resin injection port 37 (see (a) of FIG. 2). Therefore, the liquid resin 25 having the same flow rate can be uniformly supplied from the two nozzles 39 to the respective cavities 16.

(Effect)

In the present embodiment, the resin supply module is configured to include a flow path member 38 having a branch flow path formed by branching the dispenser 18 between the inflow port and the ejection port of the liquid resin 25. 41. The dispenser 18 is a resin injection mechanism or an injection device that ejects the liquid resin 25 to supply the fluid resin or the liquid resin 25 as a fluid material to the cavity 16, and the rotary body 45 is disposed in each of the points. In the branch passage 41, a rotating body that is rotatable in association with the passage of the liquid resin 25, and a rotating shaft 43 that is an interlocking mechanism that rotates the respective rotating bodies 45 disposed in the branching flow passage 41 in conjunction with each other.

According to this configuration, it is possible to easily reduce the variation in the injection amount of the liquid resin 25 ejected from the plurality of ejection openings. In addition, by monitoring the load torque at the time of injection, it is possible to suppress, for example, a problem in which the liquid resin 25 is ejected only from a part of the ejection openings when one of the plurality of ejection ports is clogged.

Further, in the present embodiment, the resin supply module has a structure in which two branch flow paths 41 are branched so as to extend on opposite sides of each other on a single axis, and the two rotary bodies 45 have spirals whose directions are opposite to each other. The groove, whereby the two rotating bodies 45 are rotated in conjunction with the common rotating shaft 43.

According to this configuration, it is possible to reliably and easily reduce the variation in the injection amount of the liquid resin 25 ejected from the two injection ports.

More specifically, according to the present embodiment, two nozzles 39 are provided at both ends of the resin ejecting portion 19 of the dispenser 18. A rotatable rotation shaft 43 is provided in the branch flow path 41 of the resin injection portion 19. A rotating body 45 having a spiral groove 44 is fitted into each of the rotating shafts 43 provided on both sides of the resin inflow port 40 provided at the center of the resin ejecting portion 19. Since the rotating body 45 is fitted into the rotating shaft 43 such that the directions of the spiral grooves 44 are opposite to each other, the rotating body 45 rotates in the same direction integrally with the rotating shaft 43. Each of the rotating bodies 45 rotates in conjunction with the rotation of the rotating shaft 43 at the same speed. Thereby, the liquid resin 25 of the same flow rate is uniformly sent through the spiral groove 44 of each of the rotating bodies 45. Since the rotating body 45 having the spiral groove 44 rotates in synchronization with each other, each of the rotating bodies 45 functions as a resin measuring unit that uniformly discharges the liquid resin 25. Therefore, the liquid resin 25 having the same flow rate can be uniformly supplied to the respective cavities 16 from the two nozzles 39 provided at both ends of the resin ejecting portion 19 via the respective rotating bodies 45.

According to the present embodiment, the plurality of rotating bodies 45 having the spiral grooves 44 rotate at the same speed together with the rotating shaft 43. Since the plurality of rotating bodies 45 rotate in synchronization, the respective rotating bodies 45 function as a resin measuring unit that uniformly discharges the liquid resin 25. Therefore, it is possible to construct a resin metering portion which is very simple in structure and which suppresses cost. Further, the rotating body 45 can be replaced in correspondence with the liquid resin. The optimum rotating body 45 can be used in accordance with the type, viscosity, specific gravity, and the like of the liquid resin. Therefore, a wide variety of liquid resins can be handled with a very simple structure.

In the present embodiment, four molding modules 3A, 3B, 3C, and 3D are arranged in the X direction between the substrate supply and storage module 2 and the resin supply module 4. It is also possible to provide the substrate supply storage module 2 and the resin supply module 4 as one module, and to mount one molding module 3A in the X direction on the module. Further, other molding modules 3B may be mounted in the molding module 3A. Thereby, the molding modules 3A, 3B, ... can be increased or decreased in accordance with the production method or the production amount. Therefore, the structure of the resin molding apparatus 1 can be optimized, and productivity can be improved.

Further, in the present embodiment, the configuration in which the resin molding apparatus 1 includes the substrate supply storage module 2, the four molding modules 3A, 3B, 3C, and 3D and the resin supply module 4 has been described. The resin molding apparatus is not limited to such a configuration, and may be a device that includes at least a molding die, a resin injection mechanism that ejects a fluid resin, and a mold clamping mechanism that molds a molding die and has a function of performing resin molding.

[Embodiment 2]

(Structure of resin injection unit)

The second embodiment of the resin injection unit used in the resin molding apparatus 1 will be described with reference to Fig. 5 . The difference from the first embodiment is that more nozzles and side-by-side flow paths are provided in the resin injection portion.

As shown in FIG. 5(b), the resin injection portion 46 includes a flow path member 47, and the flow path member 47 includes a plurality of nozzles 48 arranged side by side. FIG. 5 shows a case where four nozzles 48 are provided in the flow path member 47. Not limited to this, it is also possible to provide more than five nozzles 48, and it is also possible to provide two or three nozzles.

The flow path member 47 is provided with a resin inflow port 40 into which the liquid resin 25 is supplied, and a branch flow path 41 extending from the resin inflow port 40 toward the both sides in the horizontal direction. A plurality of side-by-side flow paths 42a branched from the branch flow path 41 and extending in the vertical direction are arranged side by side in each of the nozzles 48. Resin injection ports 37 are provided at the front ends of the side-by-side flow passages 42a. The nozzle 48 can also be configured to be replaceable with respect to the flow path member 47 for replacement. It is possible to select a nozzle having a different diameter or length corresponding to the product or the use. Further, if a detachable nozzle is attached to the front end of each of the side-by-side flow paths 42a, the rotating body 45 can be used in common for a plurality of types of nozzles.

A rotating shaft 49 as a rotatable interlocking member is provided in each of the parallel flow passages 42a of the nozzles 48. A rotating shaft 45 having a spiral groove 44 is fitted into each of the rotating shafts 49. The rotating body 45 is formed of a screw, a rotor, or the like. The rotating body 45 is a rotating body that rotates together with the rotating shaft 49. Each of the rotating bodies 45 is fitted into the rotating shaft 49 such that the directions of the spiral grooves 44 are the same in the same direction. Thereby, each of the rotating bodies 45 rotates in the same direction integrally with the rotating shaft 49. Each of the rotating shafts 49 is supported in the vertical direction by the upper surface of the flow path member 47 and the support member 50.

Further, the shape of the groove may be a plurality of linear grooves (see FIG. 4) described in the first embodiment, or may be a plurality of curved grooves. Further, as described in the first embodiment, a hole may be used instead of the groove.

As shown in FIG. 5( a ), at one end of each of the rotating shafts 49 (the upper end in FIG. 5( b )), a pulley 51 (rotating plate, interlocking mechanism) as a rotating plate that is an interlocking mechanism is connected. A conveyor belt 52 (an interlocking mechanism) that is an interlocking mechanism that is in contact with the outer circumference of each of the pulleys 51 and rotatable is provided to surround each of the pulleys 51. By rotating the respective rotating bodies 45 in the same direction, the respective pulleys 51 are rotated in the same direction as the rotating body 45 via the rotating shaft 49. The respective pulleys 51 are rotated in the same direction to rotate the conveyor belt 52. The outer diameter of each pulley 51 can be arbitrarily set.

(Operation of resin injection section)

The operation of ejecting the liquid resin 25 from the resin ejecting portion 46 will be described with reference to Fig. 5 . As shown in FIG. 5( b ), the liquid resin 25 supplied to the resin injection portion 46 branches from the resin inflow port 40 to the branch channels 41 on both sides. The branch flow path 41 is filled with the liquid resin 25 flowing in the branch. The liquid resin 25 flows from the branch flow path 41 to the parallel flow path 42a formed in each of the nozzles 48, respectively. The rotating bodies 45 that are fitted into the respective rotating shafts 49 are disposed in the respective side-by-side flow passages 42a such that the directions of the spiral grooves 44 are respectively the same direction. Thereby, the force to rotate the respective rotating bodies 45 in the same direction is applied by the resin pressure of the liquid resin 25. Therefore, the liquid resin 25 flows through each of the parallel flow passages 42a and passes through the respective rotary bodies 45, whereby the rotary body 45 rotates in the same direction integrally with the rotary shaft 49.

As shown in FIG. 5( a ), since each of the rotating bodies 45 rotates in the same direction integrally with the rotating shaft 49 , each of the pulleys 51 also rotates in the same direction as the rotating shaft 49 and the rotating body 45 . Since each of the pulleys 51 rotates in the same direction, the conveyor belt 52 is rotated along the outer circumference of each of the pulleys 51 by the frictional force of the respective pulleys 51 and the conveyor belt 52. Thereby, the conveyor belt 52 rotates along the outer circumference of the pulley 51 at a constant speed.

By rotating the belt 52 at a constant speed, the conveyor belt 52 causes the respective pulleys 51 to rotate in the same direction at the same speed. Each of the pulleys 51 is rotated in the same direction at the same speed, so that the respective rotating bodies 45 are rotated in the same direction at the same speed via the rotating shaft 49. Therefore, each of the rotating bodies 45 rotates in the same direction at the same speed in synchronization with the rotational speed of the conveyor belt 52. Thereby, the liquid resin 25 of the same flow rate can be sent out from each of the rotating bodies 45. Since each of the rotating bodies 45 rotates in conjunction with the rotation speed of the conveyor belt 52, the rotating body 45 functions as a resin measuring unit that uniformly discharges the liquid resin 25.

The liquid resin 25 uniformly fed from each of the rotating bodies 45 is ejected from the respective resin ejection ports 37 into the cavity. Therefore, the liquid resin 25 having the same flow rate can be uniformly supplied from the four nozzles 48 to the respective cavities.

(Effect)

In the present embodiment, the resin supply module has a configuration in which the flow path member 47 includes a plurality of side-by-side flow passages 42a arranged side by side, and the rotary body 45 is disposed in each of the parallel flow passages 42a, and the interlocking mechanism includes a rotary shaft 49. The respective rotating bodies 45 are disposed in the side-by-side flow path 42a; and the pulley 51 is a rotating plate that is coupled to the rotating shaft 49.

According to this configuration, it is possible to easily reduce the variation in the injection amount of the liquid resin 25 ejected from the plurality of ejection ports regardless of the number of ejection ports.

Further, in the present embodiment, the resin supply module has a configuration in which the interlocking mechanism further includes a conveyor belt 52 for connecting the pulleys 51 corresponding to the plurality of rotating bodies 45, and each of the rotating bodies 45 has a spiral groove 44 having the same direction.

According to this configuration, the variation in the injection amount of the liquid resin 25 ejected from the plurality of ejection ports can be reliably and easily reduced regardless of the number of ejection ports.

More specifically, according to the present embodiment, a plurality of nozzles 48 that eject the liquid resin 25 are provided in the resin ejecting portion 46 of the dispenser 18. Rotating shafts 49 that are rotatable are provided in the side-by-side flow passages 42a provided in the respective nozzles 48, respectively. A rotating shaft 45 having a spiral groove 44 is fitted into each of the rotating shafts 49. A pulley 51 is connected to one end of each of the rotating shafts 49. Each of the rotating bodies 45 is fitted into the rotating shaft 49 such that the directions of the spiral grooves 44 are the same in the same direction. Therefore, the rotating body 45, the rotating shaft 49, and the pulley 51 are integrally rotated in the same direction by the resin pressure of the liquid resin 25. Since each of the pulleys 51 rotates in the same direction, the conveyor belt 52 rotates along the outer circumference of each of the pulleys 51 at a constant speed.

By rotating the conveyor belt 52 at a constant speed, the pulley 51, the rotating shaft 49 and the rotating body 45 integrally rotate in the same direction at the same speed in synchronization with the rotational speed of the conveyor belt 52. Since the respective rotating bodies 45 are rotated in the same direction at the same speed, the liquid resin 25 of the same flow rate can be uniformly sent through the spiral grooves 44 of the rotating body 45. Each of the rotating bodies 45 is rotated in the same direction at the same speed, and each of the rotating bodies 45 functions as a resin measuring unit that uniformly discharges the liquid resin 25. Therefore, the liquid resin 25 having the same flow rate can be uniformly supplied from the resin injection port 37 to the respective cavities 16 via the respective rotary bodies 45.

According to the present embodiment, the resin ejection portion 46 is provided with a plurality of nozzles 48 that eject the liquid resin 25. A rotating body 45 having a spiral groove 44 is provided in each of the plurality of nozzles 48. Since each of the rotating bodies 45 rotates in the same direction at the same speed in synchronization with the rotational speed of the conveyor belt 52, the rotary body 45 uniformly feeds the liquid resin 25. Therefore, even when a plurality of cavities are provided, the liquid resin 25 can be uniformly supplied to the respective cavities.

According to the present embodiment, since the plurality of rotating bodies 45 are synchronously rotated in synchronization, each of the rotating bodies 45 functions as a resin measuring unit that uniformly discharges the liquid resin 25. Therefore, it is possible to construct a resin metering portion which is very simple in structure and which suppresses cost. Further, the rotating body 45 can be replaced in correspondence with the liquid resin. The optimum rotating body 45 can be used in accordance with the type, viscosity, specific gravity, and the like of the liquid resin. Therefore, a wide variety of liquid resins can be handled with a very simple structure.

[Embodiment 3]

(Structure of resin injection unit)

The third embodiment of the resin injection unit used in the resin molding apparatus 1 will be described with reference to Fig. 6 . The difference from Embodiment 2 is that instead of using a combination of a pulley and a conveyor belt, a combination of gears is used to rotate each of the rotating bodies 45 in the same direction at the same speed.

As shown in FIG. 6(b), the configurations of the resin ejecting portion 46, the flow path member 47, the nozzle 48, the rotating body 45, the rotating shaft 49, the support member 50, and the like are completely the same as those of the second embodiment, and thus the description thereof is omitted.

As shown in FIG. 6(a), at one end of each of the rotating shafts 49 (the upper end in FIG. 6(b)), a gear 53 (that is, a rotating plate and an interlocking mechanism) as an interlocking mechanism is connected. Other gears 54 (interlocking mechanisms) as interlocking mechanisms are respectively disposed between the adjacent gears 53 and the gears 53 and engaged with the respective gears 53. Both the gear 53 and the gear 54 are spur gears. The adjacent gear 53 and gear 54 are respectively rotated in opposite directions by being engaged with each other. The gear ratio of the gear 53 to the gear 54 can be arbitrarily set.

(Operation of resin injection section)

The operation of ejecting the liquid resin 25 from the resin ejecting portion 46 will be described with reference to Fig. 6 . Similarly to the second embodiment, the liquid resin 25 flows from the branch flow path 41 through the parallel flow paths 42a, whereby the rotary body 45 rotates in the same direction integrally with the rotary shaft 49.

As shown in FIG. 6( a ), since each of the rotating bodies 45 rotates in the same direction integrally with the rotating shaft 49 , the gears 53 connected to the respective rotating shafts 49 also rotate in the same direction as the rotating shaft 49 . Each of the gears 53 rotates in a clockwise direction. Since each of the gears 53 rotates in the clockwise direction, the gears 54 rotate in the counterclockwise direction in contrast thereto. Since the gear ratio of the gear 53 and the gear 54 is set to be constant, the gear 53 and the gear 54 are respectively rotated in opposite directions from each other at a constant speed. Therefore, the respective gears 53 rotate in the same direction at a constant speed, and the respective gears 54 rotate in opposite directions at a constant speed.

Each of the rotating bodies 45 is rotated in the same direction at the same speed via the rotating shaft 49 by the respective gears 53 rotating in the same direction at the same speed. Therefore, the rotating body 45 rotates in the same direction at the same speed in synchronization with the rotational speed of each of the gears 53. Thereby, the liquid resin 25 of the same flow rate can be sent out from each of the rotating bodies 45. Since each of the rotating bodies 45 rotates in synchronization with the rotational speed of the gear 53 , the rotating body 45 functions as a resin measuring unit that uniformly sends out the liquid resin 25 .

The liquid resin 25 uniformly fed from each of the rotating bodies 45 is ejected from the respective resin ejection ports 37 into the cavity. Therefore, the liquid resin 25 having the same flow rate can be uniformly supplied from the four nozzles 48 to the respective cavities.

(Effect)

In the present embodiment, the resin supply module has a configuration in which the flow path member 47 includes a plurality of side-by-side flow passages 42a arranged side by side, and the rotary body 45 is disposed in each of the parallel flow passages 42a, and the interlocking mechanism includes a rotary shaft 49. The respective rotating bodies 45 are disposed in the side-by-side flow path 42a; and the gears 53, which are rotating plates connected to the rotating shaft 49.

According to this configuration, it is possible to easily reduce the variation in the injection amount of the liquid resin 25 ejected from the plurality of ejection ports regardless of the number of ejection ports.

Further, in the present embodiment, the resin supply module has a configuration in which the interlocking mechanism further includes a gear 54 that is engaged with the two gears of the gear 53 corresponding to the adjacent rotating body 45, and each of the rotating bodies 45 has a direction. The same spiral groove 44.

According to this configuration, the variation in the injection amount of the liquid resin 25 ejected from the plurality of ejection ports can be reliably and easily reduced regardless of the number of ejection ports.

More specifically, according to the present embodiment, a plurality of nozzles 48 that eject the liquid resin 25 are provided in the resin ejecting portion 46. Rotating shafts 49 that are rotatable are provided in the side-by-side flow passages 42a, and a rotating body 45 having a spiral groove 44 is fitted into each of the rotating shafts 49. A gear 53 is connected to one end of each of the rotating shafts 49. Other gears 54 are respectively disposed between the adjacent gears 53 and the gears 53 and engaged with the respective gears 53. Since the gear ratio of the gear 53 and the gear 54 is set to be constant, the respective gears 53 rotate in the same direction at a constant speed, and the respective gears 54 rotate in opposite directions at a constant speed.

The rotating body 45 rotates in the same direction at the same speed in synchronization with the rotational speed of each of the gears 53. Since the respective rotating bodies 45 are rotated in the same direction at the same speed, the liquid resin 25 of the same flow rate can be uniformly sent through the spiral grooves 44 of the rotating body 45. Each of the rotating bodies 45 is rotated in the same direction at the same speed, and each of the rotating bodies 45 functions as a resin measuring unit that uniformly discharges the liquid resin 25. Therefore, the liquid resin 25 having the same flow rate can be uniformly supplied from the resin injection port 37 to the respective cavities 16 via the respective rotary bodies 45.

(Modification of Embodiment 3)

The modification of the third embodiment can be configured such that the gear 54 is omitted and the adjacent gears 53 are directly engaged with each other. In the configuration of this modification, the adjacent gear 53 and gear 53 are respectively rotated in directions opposite to each other. Therefore, the spiral grooves of the adjacent rotating bodies 45 may be disposed such that the directions are opposite to each other. The adjacent rotating bodies 45 rotate in the opposite directions at the same speed in synchronization with the rotational speeds of the respective gears 53. Thereby, the liquid resin 25 can be uniformly sent out from each of the rotating bodies 45. In this modification, the same operational effects as those of the above-described third embodiment can be obtained.

[Embodiment 4]

(Modification of resin ejection unit)

A modification of Embodiments 1 to 3 of the resin injection unit used in the resin molding apparatus 1 will be described with reference to Fig. 7 . The difference from the first to third embodiments is that an electric motor that is a rotating mechanism that assists in rotating the rotating body 45 is provided outside. For convenience of explanation, the illustration of the support member 50 is omitted in (b) and (c) of FIG. 7 .

As shown in FIG. 7(a), in the resin ejecting portion 19, a motor 55 as a rotating mechanism is coupled to the rotating shaft 43. As the motor 55, for example, a servo motor, a stepping motor, or the like can be used. When the liquid resin 25 is a liquid resin having a high viscosity, since the flow rate of the liquid resin 25 is slow, the driving force (resin pressure) for rotating the rotating body 45 is insufficient. In this case, the rotating body 45 is rotated by the auxiliary use of the motor 55. Thereby, the rotating body 45 is rotated at a constant speed, and the liquid resin 25 can be stably flowed.

In (a) of FIG. 7, the rotating shaft 43 provided in the resin injection portion 19 and the motor 55 are directly connected. Not limited to this, a combination of a belt and a pulley, a combination of a pinion and a gear, a combination of a chain and a sprocket, and the like may be used between the rotating shaft 43 and the motor 55. Thereby, the rotational speed of the rotating shaft 43 and the rotating body 45 can be adjusted in accordance with the rotational speed of the motor 55. Therefore, the speed at which the liquid resin 25 flows can be optimized in accordance with the type, viscosity, specific gravity, and the like of the liquid resin 25.

As shown in FIG. 7(b), the resin injection portion 46 is connected to the pulley 56 at the front end of the motor 55. The pulley 56 is connected to each of the pulleys 51 provided in the resin injection portion 46 via a conveyor belt 52. The conveyor belt 52 is rotated via the pulley 56 by the rotation of the motor 55. The rotating shaft 49 and the rotating body 45 are rotated by the rotation of the conveyor belt 52. The rotational speed of the rotary shaft 49 and the rotary shaft 45 can be adjusted by adjusting the diameter of the pulley 56 connected to the motor 55 and the diameter of each of the pulleys 51 connected to the rotary shaft 49 of the resin injection portion 46. Therefore, the flow velocity of the liquid resin 25 can be optimized in accordance with the type, viscosity, specific gravity, and the like of the liquid resin 25.

As shown in FIG. 7(c), the resin injection portion 46 is connected to a gear 57 (rotation mechanism) at the front end of the motor 55. A gear 57 connected to the motor 55 and a gear 53 connected to the rotary shaft 49 of the resin injection portion 46 are engaged. By rotating the motor 55 in the counterclockwise direction, the gear 57 is rotated in the counterclockwise direction, and the gear 53 is rotated in the clockwise direction. The rotational speed of the rotary shaft 49 and the rotary body 45 can be adjusted by adjusting the gear ratio of the gear 57 connected to the motor 55 and the gear 53 connected to the rotary shaft 49 of the resin injection portion 46. Therefore, the flow velocity of the liquid resin 25 can be optimized in accordance with the type, viscosity, specific gravity, and the like of the liquid resin 25.

The rotational speed of the rotating shaft 49 and the rotating body 45 can be adjusted, for example, by using a combination of a pinion gear, a crown gear, a spur gear, or the like connected to the motor 55.

In each of the embodiments, a configuration in which a through portion for passing through a rotating shaft and a groove portion or a hole portion are formed in the cylindrical member as the rotating body 45 has been described. The rotating body is not limited to this configuration. For example, the rotating body may have a structure in which a through portion and a groove portion or a hole portion for penetrating the rotating shaft are formed in a drum having a thick central portion, a drum portion having a central portion, or a conical shape. Regardless of the shape of the rotating body, the rotating body can be rotated by matching the shape of the branch flow path with the shape of the rotating body.

In each of the embodiments, the liquid resin 25 is supplied to the plurality of cavities by providing a plurality of nozzles in the resin ejecting portion. When a plurality of nozzles are used, there is a possibility that clogging of the liquid resin 25 occurs at a certain nozzle. Since the load for flowing the liquid resin 25 at the time of generating the clogging of the liquid resin 25 is large, the load torque to be applied to the servo motor 31 of the dispenser 18 is increased. Therefore, the clogging of the liquid resin 25 can be detected by monitoring the load torque to be applied to the servo motor 31. Thereby, even when a plurality of nozzles are used, it is possible to easily find out whether or not the dispenser 18 is abnormal.

In each of the embodiments, a combination of the servo motor 31 and the ball screw 32 is used as the resin delivery mechanism 28. Not limited to this, a combination of a stepping motor and a ball screw, a uniaxial eccentric screw method, or a feeding mechanism such as an air cylinder can be used.

In each of the embodiments, a case where a plurality of cavities 16 are provided in the lower mold 14 is shown. Not limited to this, as a modification, the dispenser 18 in each embodiment can be applied even when a cavity having a large area is provided. In this case, since the liquid resin 25 can be simultaneously ejected from a plurality of nozzles to a large-area cavity, the liquid resin 25 can be uniformly supplied in a short time.

In each of the embodiments, a single-liquid type dispenser 18 using a liquid resin 25 which is prepared by mixing a main agent and a curing agent in advance is shown. Not limited to this, even when a two-liquid mixing type dispenser is used, the same effect can be obtained by using the resin injection portion in each embodiment, and the two-liquid mixing type dispenser is actually used. The main agent and the hardener are mixed in a dispenser for use.

In each of the embodiments, an example in which the cavity 16 provided in the lower mold 14 is used as the accommodating portion and the liquid resin 25 is supplied to the cavity 16 has been described. In addition to the cavity, the housing portion may be any one of the following housing portions.

First, the accommodating portion is a space including the upper surface of the substrate, that is, a space including a wafer (a semiconductor wafer, a wafer of an electronic component such as a semiconductor non-semiconductor wafer, etc.) mounted on the upper surface of the substrate. The liquid resin 25 is supplied so as to cover the wafer mounted on the upper surface of the substrate. In this case, the electrical connection between the wafer and the substrate is preferably performed by flip chip bonding.

Second, the accommodating portion is a space including an upper surface of a semiconductor substrate such as a ruthenium wafer. The liquid resin 25 is supplied so as to cover a functional portion such as a semiconductor circuit formed on a semiconductor substrate. In this case, it is preferable to form a bump on the upper surface of the semiconductor substrate.

Third, the accommodating portion is a space containing the upper surface of the film which should be finally accommodated in the cavity of the molding die. The accommodating portion at this time is, for example, a concave portion formed by recessing the film. The liquid resin 25 is supplied into a recess formed by recessing the film. The purpose of the film is, for example, an improvement in mold release property, a transfer of a shape formed by unevenness on the surface of the film, and a transfer of a pattern formed on the film in advance. The liquid resin contained in the concave portion of the film is transported together with the film using an appropriate transport mechanism and finally the liquid resin is supplied into the cavity of the molding die.

In either of the first to third cases, the liquid resin 25 accommodated in the accommodating portion is finally supplied and housed inside the cavity of the molding die, and is hardened inside the cavity.

In any of the first to third cases, the liquid resin 25 can be supplied to the accommodating portion outside the pair of opposed molding dies, and the component including at least the accommodating portion can be transported between the molding dies.

In each of the embodiments, a resin molding apparatus and a resin molding method used for resin-sealing a semiconductor wafer have been described. The resin-encapsulated article may be a semiconductor wafer such as an IC or a transistor, or may be a non-semiconductor wafer. The present invention can be applied to resin encapsulation of one or a plurality of wafers mounted on a substrate such as a lead frame, a printed substrate, or a ceramic substrate by a curing resin.

Further, the present invention is not limited to the case where the electronic component is resin-sealed, and the optical component or other resin product such as a lens, a reflector (reflector), a light guide plate, or an optical module is manufactured by resin molding.

The present invention is not limited to the above-described embodiments, and may be arbitrarily and appropriately combined or changed, or selectively employed, as needed within the scope of the gist of the invention.

1: Resin molding device 2: substrate supply storage module 3A, 3B, 3C, 3D: molding module 4: resin supply module 5: package front substrate 6: package front substrate supply portion 7: package rear substrate 8: after packaging Substrate accommodating portion 9: Loader 10: Unloader 11: Guide rails 12, 13: Moving mechanism 14: Lower mold 15: Clamping mechanism 16: Cavity 17: Resin conveying mechanism 18: Dispenser 19, 46: Resin spraying portion 20: moving mechanism 21: vacuuming mechanism 22: control unit 23: wafer 24: upper mold 25: liquid resin 26: cured resin 27: molded product 28: resin delivery mechanism 29: syringe 30: resin transfer unit 31: servo motor 32: Ball screw 33: Slider 34: Pull rod 35: Plunger 36: Encoder 37: Resin injection ports 38, 47: Flow path members 39, 48: Nozzle 40: Resin flow inlet 41: Branch flow path 42: Resin flow Road 42a: side-by-side flow passages 43, 49: rotary shaft 44: spiral groove 44a: linear groove 45: rotary body 50: support member 51: pulley 52: conveyor belt 53: gear 54: gear 55: motor 56: pulley 57: gear

FIG. 1 is a plan view showing a schematic configuration of an apparatus in a resin molding apparatus according to Embodiment 1 of the present invention. (a) to (c) of FIG. 2 are schematic cross-sectional views showing a process of resin-packaging a wafer mounted on a substrate in the resin molding apparatus of the first embodiment. (a) of FIG. 3 is a schematic view showing a dispenser used in the resin molding apparatus of the first embodiment, and (b) is a schematic view showing a resin injection unit used in the first embodiment, and (c) is ( b) AA line cross-sectional view. (a) of FIG. 4 is a schematic view showing a modification of the resin ejecting portion used in the first embodiment, and (b) is a cross-sectional view taken along line B-B of (a). (a) of FIG. 5 is a plan view showing a resin ejecting portion used in the second embodiment of the present invention, and (b) is a cross-sectional view taken along line C-C of (a). (a) of FIG. 6 is a plan view showing a resin ejecting portion used in the third embodiment of the present invention, and (b) is a cross-sectional view taken along line D-D of (a). FIG. 7 is a schematic cross-sectional view showing a modification of each of the resin ejecting portions shown in Embodiments 1 to 3 of the present invention.

18: dispenser 19: resin ejection unit 25: liquid resin 28: resin delivery mechanism 29: syringe 30: resin transfer unit 31: servo motor 32: ball screw 33: slider 34: tie rod 35: plunger 36: code 37: resin injection port 38: flow path member 39: nozzle 40: resin flow inlet 41: branch flow path 42: resin flow path 43: rotary shaft 44: spiral groove 45: rotary body

Claims (14)

A resin molding apparatus comprising: a molding die in which a cavity is provided in at least one of an upper die and a lower die disposed opposite to each other; and a resin ejecting mechanism that ejects the fluidity in order to supply a fluid resin to the cavity a mold; and a mold clamping mechanism for clamping the mold; the resin injection mechanism includes: a flow path member having a branch flow path branched between the flow inlet and the injection port of the fluid resin; and a rotating body configured Each of the branch flow passages is rotatable in association with the passage of the fluid resin, and an interlocking mechanism for rotating the respective rotating bodies disposed in the branch flow passages in conjunction with each other. The resin molding apparatus according to claim 1, wherein the branch flow path is branched in such a manner as to extend on opposite sides of the uniaxial axis, and the interlocking mechanism is two corresponding to the branch flow path. A rotating shaft common to the rotating body; and the two rotating bodies are cylindrical members having spiral grooves having opposite directions to each other. The resin molding apparatus according to claim 1, wherein the branch flow path includes a plurality of side-by-side flow passages arranged side by side; the rotating body is disposed in each of the side-by-side flow passages; the linkage mechanism comprises: a rotating shaft, Each of the rotating bodies disposed in the side-by-side flow path; and a rotating plate coupled to the rotating shaft. The resin molding apparatus according to claim 3, wherein the rotating plate is a pulley, and the linking mechanism includes a conveyor belt for coupling the pulley corresponding to the plurality of rotating bodies; each of the rotating bodies has the same direction a cylindrical member of a spiral groove. The resin molding apparatus of claim 3, wherein the rotating plate is a first gear, the first gear corresponding to the adjacent rotating body is configured to be engaged with each other; the adjacent rotating body has A cylindrical member of a spiral groove oriented in opposite directions to each other. The resin molding apparatus of claim 3, wherein the rotating plate is a first gear, the linkage mechanism includes a second gear, and the second gear is configured to correspond to two adjacent rotating bodies The first gear is engaged; each of the rotating bodies is a tubular member having a spiral groove having the same direction. The resin molding apparatus according to any one of claims 1 to 6, wherein the resin molding apparatus includes a rotation mechanism that applies a rotational force to the rotating body. The resin molding apparatus according to any one of claims 1 to 6, wherein the resin molding apparatus comprises at least one molding module having the molding die and the clamping mechanism; Modules and other forming modules can be loaded and unloaded. A resin molding method comprising the steps of: a resin spraying step of using a molding die provided with a cavity on at least one of an upper mold and a lower mold disposed opposite to each other, and in order to supply a fluid resin to the cavity Spraying the fluid resin; clamping the mold to mold the mold having the fluid resin; and in the resin spraying step, rotating the rotating bodies disposed in each of the branch channels to rotate The fluid resin passes through each of the rotating bodies, and the branch flow path branches between the inflow port of the fluid resin and the ejection port. The resin molding method according to claim 9, wherein two of the branch flow paths are branched in such a manner as to extend on opposite sides of each other on a uniaxial axis; and the two rotating bodies are spiral grooves having directions opposite to each other. The tubular member; the two rotating bodies that are common to the branch flow passage are used to rotate the two rotating bodies in conjunction with each other. The resin molding method according to claim 9, wherein the branch flow path includes a plurality of side-by-side flow passages arranged side by side; the rotary body is disposed in each of the side-by-side flow passages; and the resin molding method is connected to the rotation The rotating plates on the shaft rotate in conjunction, wherein the rotating shaft is disposed in each of the rotating bodies in the side-by-side flow path. A spraying device for a fluid material, comprising: a flow path member having a branch flow path branched between an inflow port and a jet port of the fluid material; a rotating body disposed in each of the branch channels and accompanied by the flow The material is rotatable by passage of the material; and the interlocking mechanism is configured to rotate the respective rotating bodies disposed in the branch flow path. The injection device of the fluid material according to claim 12, wherein two branch flow paths are branched in such a manner as to extend on opposite sides of each other on a single axis; the linkage mechanism is corresponding to the branch flow path Two rotating shafts common to the rotating body; two of the rotating bodies are cylindrical members having spiral grooves having opposite directions to each other. The spraying device of the fluid material according to claim 12, wherein the branch flow path comprises a plurality of side-by-side flow passages arranged side by side; the rotating body is disposed in each of the side-by-side flow passages, the linkage mechanism comprising: A rotating shaft is disposed in each of the rotating bodies in the side-by-side flow path; and a rotating plate is coupled to the rotating shaft.