TW201536511A - Resin molding apparatus and resin molding method - Google Patents

Abstract

In a resin molding apparatus, liquid resin is ejected by supplying compressed air to a spray nozzle. A resin supply mouth 14, a resin ejecting mouth 15 and an air supply mouth 16 are arranged on a spray nozzle 6 installed at the front end of a distributer 1. The resin supply mouth 14 is connected with the resin ejecting mouth 15 through a resin passageway 22a extended along a horizontal direction and a resin passageway 22b extended along a vertical direction in a manner of being orthogonal to the resin passageway 22a. By means of a pressure P1 greater than a resin pushing pressure P0, the compressed air is supplied from a compressor 7 to the air supply mouth 16, so as to prevent the liquid resin 2 from entering the air supply mouth 16. By means of a pressure P2 greater than P1, the compressed air is ejected to the liquid resin 2 stored in the resin passageway 22b. As a result, the liquid resin 2 retained in the resin passageway 22b is squeezed out from the resin ejecting mouth 15, thereby supplying a specific amount of liquid resin 2 to a mold cavity 21.

Description

Resin forming device and resin forming method

The present invention relates to a resin molding apparatus and a resin molding method for using a liquid resin to a transistor, an integrated circuit (IC), and a light emitting diode (Light Emitting Diode: A wafer-shaped electronic component (hereinafter referred to as "wafer" as appropriate) such as LED) is resin-sealed. In the present application, the term "liquid" means that it is liquid at room temperature and has fluidity, regardless of the degree of fluidity, in other words, the degree of viscosity.

Conventionally, a liquid resin having a thermosetting property and a light-transmissive liquid resin such as a polyoxyxylene resin or an epoxy resin is used, and a wafer containing an optical element such as an LED mounted on a substrate is resin-sealed by a sealing resin containing a curing resin. As a technique of resin sealing, a resin molding technique such as compression molding or transfer molding is used. In the resin molding process, a liquid resin containing a curing agent or the like as an adjuvant is mixed with a liquid resin as a main component, and the mixed liquid resin is heated to perform resin molding. In the following, all the resins which are liquid at room temperature and have fluidity, such as a liquid resin obtained by mixing a main component and a curing agent, and a liquid resin containing an additive such as a fluorescent material, are simply referred to as "liquid resin".

In the resin sealing using a liquid resin, the liquid resin is supplied from a nozzle attached to the tip end of the dispenser which is a resin supply mechanism to a cavity provided in the lower mold. Corresponding to shaped articles And determine the size or shape of the cavity. Therefore, the supply amount of the liquid resin is determined so as to fill the cavity volume. It is important to stably supply the liquid resin to the cavity.

However, the type or viscosity of the liquid resin used depending on the product is various. Further, even if the discharge of the dispenser is completed, the liquid resin may remain as a residual resin in the discharge port of the nozzle due to the surface tension of the liquid resin. At the discharge port of the nozzle, the tensile force caused by the surface tension of the liquid resin acts upward, and if the tensile force is greater than the gravity for dropping the liquid resin, the liquid resin remains as a residual resin and remains below the discharge port. The surface tension varies depending on the size of the discharge port or the viscosity of the liquid resin. If a force greater than the surface tension is not applied, the liquid resin cannot be completely supplied. Especially for the use of high viscosity liquid resins, for example with 50Pa. In the case of a liquid resin having a viscosity of s or more, the surface tension is large, and it is difficult to stably supply a specific amount of the liquid resin.

If the residual resin remains below the discharge port of the nozzle, a specific amount of the liquid resin cannot be supplied to the cavity, and the amount of supply may be uneven. Especially in the case of using a highly viscous liquid resin, the residual resin easily remains. There is also a case where the residual resin gradually falls to the cavity as time passes, but it takes time until the supply is completed. Further, there is a problem in that if the supply time is prolonged, a part of the liquid resin which has been supplied to the cavity starts to harden. Therefore, it is important to stably supply a specific amount of the liquid resin to the cavity in a short time.

In the cream solder coating apparatus in which the coating amount of the liquid coating material is constant, it has been proposed that "the second nozzle or the side nozzle is provided in the peripheral portion of the first nozzle, and the gas is ejected to the second nozzle or the side nozzle, and the discharge is performed. A cream solder coating device in which a material is cut in the process to remove a residual material at a tip end portion of the nozzle (see, for example, paragraph [0008] of Patent Document 1, FIG. 1, FIG. 3, and FIG. 4).

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Publication No. 04-309460

However, the cream solder coating apparatus disclosed in Patent Document 1 causes the following problems. As shown in FIG. 1(A) of Patent Document 1, the second nozzle 23 is integrally attached to the outer peripheral portion of the first nozzle 6a. The output port 23b of the second nozzle 23 is disposed in the vicinity of the periphery of the output port 6b of the first nozzle 6a, and causes the operating gas B to flow in the direction in which the residual material 43 is blown. However, this configuration has a problem in that the operating gas B cannot be sufficiently brought into contact with the residual material 43 from the output port 23b of the second nozzle 23.

Further, as shown in FIG. 1(B) of Patent Document 1, the side nozzle 29 is provided such that the operating gas B comes into contact with the cream solder 8 under the first nozzle 6a. In this case, there is a problem that the residual material 43 which is lower than the contact position of the active gas B can be blown off, but the residual material 43 remains in the vicinity of the periphery of the output port 6b of the first nozzle 6a. In any of the cases of FIGS. 1(A) and (B), the residual material 43 cannot be completely blown from the output port 6b of the first nozzle 6a. Therefore, it is difficult to stably drop the discharge material to perform uniform coating.

The present invention provides a resin molding apparatus and a resin molding method, in which a high-pressure gas is supplied to a nozzle for discharging a liquid resin, and a high-pressure gas is directly sprayed to a liquid resin. Thereby, the liquid resin to be sent can be completely supplied.

In order to solve the above problems, the resin molding apparatus of the present invention includes: an upper mold; a lower mold that is disposed to face the upper mold; and a cavity that is provided in at least one of the upper mold and the lower mold; and a housing portion; The liquid resin which is hardened in the cavity to be a hardened resin; the resin supply mechanism supplies the liquid resin to the accommodating portion; and the mold clamping mechanism which has at least the forming die of the upper mold and the lower mold In the resin molding apparatus, the resin molding apparatus is provided with a resin supply port provided in a resin supply mechanism and supplied with a liquid resin, and a resin passage connected to the resin supply port and along the resin molded product. a resin discharge port that is connected to the resin passage and that discharges the liquid resin to the accommodating portion, and a pressing mechanism that presses the liquid resin stored in the resin supply mechanism to the resin discharge port by the resin pressing force; The gas supply mechanism injects the high-pressure gas into the liquid resin accumulated in the resin supply means in the second direction intersecting the first direction; the first gas supply port Provided in the resin supply means and supplied with the high-pressure gas; and an entry prevention means for preventing the liquid resin from entering the high-pressure gas supply means via the first gas supply port at the first gas supply port; The high-pressure gas of the first pressure is sprayed to at least a part of the liquid resin accumulated in the resin passage, whereby the liquid resin is supplied to the accommodating portion.

Further, in the resin molding apparatus of the present invention, the entry preventing means is a high pressure gas having a second pressure; the second pressure is greater than the resin pressing force; and the first pressure is greater than the second pressure.

Further, in the resin molding apparatus of the present invention, in the resin molding apparatus, the entry prevention means is a valve; and the first pressure is greater than the resin pressing force.

Further, the resin molding apparatus of the present invention is characterized in that the resin molding apparatus includes at least a second gas supply port that is provided in a resin supply mechanism and supplies a high-pressure gas; The high-pressure gas having the third pressure lower than the first pressure is injected from the second gas supply port to the liquid resin accumulated in a part of the resin passage.

Moreover, in the resin molding apparatus of the present invention, the cured resin is a sealing resin that covers a wafer mounted on the substrate.

Further, in the resin molding apparatus of the present invention, the resin molding apparatus includes: a supply module that supplies the liquid resin to the resin supply mechanism; and at least one molding module that has a molding die and a mold holder The mechanism is capable of loading and unloading the supply module and a forming module; and one forming module can be loaded and unloaded relative to the other forming modules.

In order to solve the above problems, the resin molding method of the present invention is a resin molding method for molding a molded article containing a cured resin using a resin molding apparatus, the resin molding apparatus comprising: an upper mold; and a lower mold facing the upper mold a mold cavity provided at least one of an upper mold and a lower mold; a housing portion that accommodates a liquid resin that is cured in the cavity to be a hardened resin; and a resin supply mechanism that supplies the liquid resin to the above a accommodating portion; and a mold clamping mechanism that sandwiches at least a molding die having an upper die and a lower die; wherein the resin molding method is characterized by the step of pressing a liquid resin by a resin pressing force to pass along The resin passage extending in the first direction ejects the liquid resin from the resin discharge port to the accommodating portion, and the high-pressure gas having the first pressure greater than the resin urging force is injected from the first gas supply port to at least the accumulating gas using the high-pressure gas supply mechanism a liquid resin that is a part of the resin passage, thereby supplying the liquid resin to the accommodating portion; and preventing the liquid from being pressed by the resin pressing force To the high pressure resin enters the gas supply mechanism to the first gas supply port.

Further, in the resin molding method of the present invention, in the resin molding method, in the step of preventing entry, the pressure is applied to the resin from the first gas supply port. The liquid resin injects a high pressure gas having a second pressure which is greater than the resin pressing force and smaller than the first pressure.

Moreover, in the resin molding method of the present invention, in the resin molding method, the valve provided in the first gas supply port is closed in the step of preventing entry.

Further, in the resin molding method of the present invention, in the step of supplying the liquid resin, the high pressure gas having the third pressure lower than the first pressure is injected from the second gas supply port to the resin molding method. A liquid resin accumulated in a part of the resin passage.

Further, in the resin molding method of the present invention, in the resin molding method, the cured resin is a sealing resin that covers a wafer mounted on the substrate.

Further, in the resin molding method of the present invention, the resin molding method includes a step of preparing a supply module that supplies a liquid resin to a resin supply mechanism, and a preparation of at least one molding module In the step, the at least one forming module has a forming die and a mold clamping mechanism; the supply module and a forming module are detachable; and a forming module can be loaded and unloaded relative to the other forming modules.

According to the invention, the resin molding apparatus includes a resin supply mechanism that supplies a liquid resin, a pressing mechanism that presses a liquid resin accumulated in the resin supply mechanism, and a high pressure gas supply mechanism that injects high pressure gas to the storage. a liquid resin in the resin supply mechanism; and an entry prevention mechanism that prevents the liquid resin from entering the high pressure gas supply mechanism. The high-pressure gas having the first pressure higher than the resin pressing pressure is sprayed onto the liquid resin accumulated in a part of the resin passage provided in the resin supply mechanism, thereby supplying the liquid resin. Thereby, a specific amount of the liquid resin can be stably supplied to the accommodating portion in a short time.

1‧‧‧Distributor

2‧‧‧Liquid resin

3‧‧‧Repository Department

4‧‧‧Measuring delivery mechanism (pushing mechanism)

5‧‧‧Resin Transfer Department

6‧‧‧Nozzle (resin supply mechanism)

7‧‧‧Compressor (high pressure gas supply mechanism)

8‧‧‧Nylon tube

9‧‧‧Electrical pneumatic regulator

10‧‧‧Servo motor

11‧‧‧Ball screw

12‧‧‧Ball nuts

13‧‧‧Plunger

14‧‧‧ resin supply port

15‧‧‧Resin spray

16‧‧‧Air supply port (1st gas supply port)

17‧‧‧Upper mold (forming die)

18‧‧‧Down mold (forming die)

19‧‧‧ wafer

20‧‧‧ Sealing the front substrate (substrate)

21‧‧‧ cavity (housing department)

22, 22a, 22b‧‧‧ resin pathway

23‧‧‧Air access

24‧‧‧Resin pathway

25‧‧‧Compressed air (into the prevention mechanism, high pressure gas)

26‧‧‧Residual resin

27‧‧‧Compressed air (high pressure gas)

28a, 28b, 28c‧‧‧ air supply port (second gas supply port)

29a, 29b, 29c‧‧‧ air passage

30‧‧‧Compressed air (high pressure gas)

31‧‧‧Resin direction change component

32‧‧‧Resin supply port

33‧‧‧Resin delivery

34, 34a, 34b‧‧‧ resin pathway

35‧‧‧Resin forming device

36‧‧‧Substrate supply/storage module

37A, 37B, 37C, 37D‧‧‧ forming modules

38‧‧‧Liquid resin supply module (supply module)

39‧‧‧ Sealed front substrate supply unit

40‧‧‧Sealed substrate

41‧‧‧Sealed substrate storage unit

42‧‧‧Loader

43‧‧‧Unloader

44‧‧‧ Track

45‧‧‧Mold clamping mechanism

46‧‧‧Mobile agencies

47‧‧‧vacuum mechanism

48‧‧‧Control Department

P0‧‧‧ resin push pressure

P1‧‧‧Compressed air pressure (2nd pressure)

P2‧‧‧Compressed air pressure (1st pressure)

P3‧‧‧Compressed air pressure (3rd pressure)

Fig. 1 is a schematic view showing a first embodiment of a resin supply mechanism in the resin molding apparatus of the present invention. Fig. 1(a) is a schematic partial cross-sectional view showing a state in which a liquid resin is supplied to a cavity of a lower mold by a resin supply mechanism, and Fig. 1(b) is a cross-sectional view showing the nozzle.

2(a) to 2(d) are schematic cross-sectional views showing a process of supplying a liquid resin to a cavity by the resin supply mechanism shown in Fig. 1.

Fig. 3 is a schematic view showing a second embodiment of a resin supply mechanism in the resin molding apparatus of the present invention. Fig. 3(a) is a plan view showing the nozzle, and Fig. 3(b) is a cross-sectional view taken along line A-A of Fig. 3(a).

Fig. 4 is a schematic view showing a third embodiment of a resin supply mechanism in the resin molding apparatus of the present invention. 4(a) is a schematic cross-sectional view showing a nozzle portion, and FIG. 4(b) is a schematic cross-sectional view showing a resin supply mechanism.

Fig. 5 is a plan view showing the outline of the apparatus in the fourth embodiment of the resin molding apparatus of the present invention.

As shown in Fig. 1, a resin supply port 14, a resin discharge port 15, and an air supply port 16 are provided in a nozzle 6 attached to the tip end of the dispenser 1. The resin supply port 14 is connected to the resin discharge port 15 through the resin passage 22a extending in the horizontal direction and the resin passage 22b extending in the vertical direction orthogonal to the resin passage 22a. The compressed air is supplied from the compressor 7 to the air supply port 16 by the pressure P1 larger than the resin pressing force P0, and the liquid resin 2 is prevented from entering the air supply port 16. After the liquid resin 2 is ejected from the resin discharge port 15, the pressure P2 greater than P1 is used, The compressed air is injected into the liquid resin 2 accumulated in the resin passage 22b, whereby the liquid resin 2 remaining in the resin passage 22b is extruded from the resin discharge port 15 to supply a specific amount of the liquid resin 2 to the cavity 21. .

In addition, the phrase "the liquid resin 2 is ejected to a specific portion (for example, the cavity 21)" in the present application means "the liquid resin 2 is ejected from a specific opening to a specific portion", and the "liquid" Whether or not the resin 2" has reached the specific portion is irrelevant. On the other hand, the phrase "the liquid resin 2 is supplied to a specific portion (for example, the cavity 21)" means the operation of "the liquid resin 2 reaches a specific portion".

[Example 1]

The first embodiment of the resin supply mechanism of the resin molding apparatus of the present invention will be described with reference to Figs. 1 to 2 . For the sake of easy understanding, any of the drawings in the present application are appropriately omitted or exaggerated and then patterned. The same components are denoted by the same reference numerals, and the description thereof will be appropriately omitted.

The dispenser 1 which is a resin supply mechanism shown in Fig. 1(a) is a horizontal type distributor which is disposed in the horizontal direction. The dispenser 1 includes a reservoir 3 that stores a liquid resin 2, a metering and delivery mechanism 4 that measures and delivers a specific amount of the liquid resin 2, a resin transfer unit 5 that transfers the liquid resin 2 that is sent out, and a nozzle 6. The discharge portion of the liquid resin 2 to be transferred is discharged.

The compressor 7 generates a pressurizing mechanism for supplying a high-pressure gas such as compressed air to the nozzle 6. The compressor 7 is connected to the nozzle 6 through a flexible resin tube 8 such as a nylon tube. An electropneumatic regulator 9 for controlling the pressure of the compressed air supplied from the compressor 7 is provided between the compressor 7 and the nozzle 6. It is not limited to compressed air, and it is also possible to compress a gas that can be obtained in a workshop such as nitrogen.

The liquid resin 2 transferred from the container (not shown) in which the liquid resin 2 is stored is stored in the reservoir 3 of the dispenser 1. One end of the reservoir 3 is connected to the metering and delivery mechanism 4. For example, the servo motor 10, the ball screw 11, and the ball nut 12 are provided in the metering and dispensing mechanism 4 to deliver a specific amount of the liquid resin 2. A plunger 13 is provided in the reservoir 3, and the plunger 13 is attached to the tip end of the ball screw 11 to press the liquid resin 2. The other end of the reservoir 3 is connected to one end of the resin transfer portion 5. The other end of the resin transfer portion 5 is connected to the nozzle 6. The nozzle 6 is provided with a resin supply port 14 that is connected to the other end of the resin transfer unit 5 as a supply port of the liquid resin 2, a resin discharge port 15 that serves as a discharge port of the supplied liquid resin 2, and The resin pipe 8 is an air supply port 16 of a supply port of compressed air supplied from the compressor 7.

As shown in Fig. 1(a), an upper mold 17 and a lower mold 18 are provided in the resin molding apparatus. The upper mold 17 and the lower mold 18 together constitute a forming mold. For example, the sealing front substrate 20 on which the wafer 19 is mounted on the substrate is fixed to the upper mold 17 by being sandwiched or adsorbed. A cavity 21 is provided in the lower mold 18, and the cavity 21 serves as a space for accommodating the wafer 19 mounted on the front substrate 20 to form a hardened resin. The liquid resin 2 is supplied from the nozzle 6 of the dispenser 1 to the cavity 21 as a housing portion, and a hardened resin is formed corresponding to the shape of the cavity 21.

As shown in FIG. 1(b), a resin supply port 14 is provided on the side surface of the nozzle 6, a resin discharge port 15 is provided on the bottom surface of the nozzle 6, and an air supply port 16 is provided on the top surface of the nozzle 6. The resin passage 22 that connects the resin supply port 14 and the resin discharge port 15 includes a resin passage 22a that extends in the horizontal direction (−Y direction) from the resin supply port 14 and a resin passage 22b that leads from the resin passage 22a along the lead Extending in the vertical direction (-Z direction). Therefore, the resin supply port 14 is connected to the resin discharge port 15 via the resin passage 22a extending in the horizontal direction and the resin passage 22b extending in the vertical direction from the resin passage 22a. Connecting the air supply port 16 and the resin passage 22b The gas passage 23 is provided from the air supply port 16 in the vertical direction (-Z direction). Therefore, the air supply port 16 is connected to the resin discharge port 15 through the air passage 23 and the resin passage 22b.

The operation of the dispenser 1 of the present invention will be described with reference to Figs. 1 and 2 . As shown in FIG. 1(a), in the dispenser 1, the liquid resin 2 accumulated is sent from the reservoir 3 to the resin transfer unit 5 by using the metering and dispensing mechanism 4. In the metering and dispensing mechanism 4, the servo motor 10 is used to rotate the ball screw 11, whereby the plunger 13 is advanced. The liquid resin 2 is pressed by the plunger 13, and a specific amount of the liquid resin 2 is sent out from the reservoir 3 to the resin transfer portion 5. By controlling the rotational speed of the servo motor 10, the amount of movement (stroke) of the plunger 13 can be controlled. Thereby, the amount of the liquid resin 2 to be delivered can be accurately controlled.

The mechanism and operation of ejecting the liquid resin 2 from the nozzle 6 provided in the dispenser 1 will be described with reference to Figs. 2(a) to 2(d). Fig. 2(a) shows a state before the liquid resin 2 is fed to the nozzle 6. The resin passage 24 provided in the resin transfer portion 5 in the horizontal direction communicates with the resin passage 22a provided in the nozzle 6, and the resin passage 22b extends in the -Z direction in the vertical direction. The liquid resin 2 is sequentially ejected from the resin discharge port 15 into the cavity 21 (see FIG. 1) via the resin passages 24, 22a, and 22b.

Fig. 2 (b) shows a state in which the liquid resin 2 is discharged from the resin discharge port 15 of the nozzle 6 directly downward. First, the liquid resin 2 is pressed by the metering and dispensing mechanism 4 (see FIG. 1(a)). For example, the resin pressing force for pressing the liquid resin 2 is set to P0 (kg/cm ² ). The liquid resin 2 is pressed by the resin pressing pressure P0 (kg/m ² ) indicated by the arrow in the figure, and the liquid resin 2 is sent out from the reservoir 3 to the resin passage 24. Further, the liquid resin 2 is pushed, whereby the liquid resin 2 is injected from the resin passage 24 to the resin supply port 14 provided in the nozzle 6. Further, the liquid resin 2 is further pressed, and the resin passage 22a provided in the nozzle 6 in the horizontal direction and the resin passage 22b provided in the vertical direction are sequentially passed from the resin discharge port 15 to the cavity 21 (refer to Fig. 1 (a)) ejects the liquid resin 2.

In order to stably discharge the liquid resin 2 from the resin discharge port 15, it is necessary to prevent the liquid resin 2 injected into the resin passage 22a from entering the air supply port 16 via the air passage 23. Therefore, at the same time as the start of the discharge of the liquid resin 2, the compressed air 25 (indicated by an arrow in the drawing) is supplied from the compressor 7 (see Fig. 1 (a)) to the air supply port 16. The pressure of the compressed air 25 was set to P1 (kg/cm ² ) using an electro-pneumatic regulator 9. The pressure P1 (kg/cm ² ) of the compressed air 25 is set to be greater than the pressure of the resin pressing force P0 (kg/cm ² ). Compressed air 25 set to a pressure P1 (kg/cm ² ) is ejected from the air supply port 16 through the air passage 23 to the liquid resin 2 stored in the resin passage 22b. Since the pressure P1 of the compressed air 25 is larger than the resin pressing force P0, it is possible to prevent the liquid resin 2 from entering the air supply port 16 via the air passage 23. Further, the liquid resin 2 accumulated in the resin passage 22b receives a force in the vertical direction (-Z direction) due to the pressure P1 of the compressed air 25. Therefore, the liquid resin 2 is pressed by the resin pressing force P0 and the pressure P1 of the compressed air, and the liquid resin 2 can be discharged from the resin discharge port 15 directly downward through the resin passages 22a and 22b.

Fig. 2(c) shows a state in which the delivery of the liquid resin 2 by the servo motor 10 is completed. Since the delivery of the liquid resin 2 is completed, the resin pressing force becomes "0". The compressed air 25 is continuously supplied even after the delivery of the liquid resin 2 is completed. When the delivery of the liquid resin 2 is completed, as shown in Fig. 2(c), the liquid resin 2 is not completely supplied from the resin discharge port 15 to the cavity 21 (see Fig. 1 (a)), but as The residual resin 26 remains below the resin discharge port 15 . When the tensile force in the upward direction (+Z direction) caused by the surface tension of the liquid resin 2 is greater than the gravity of the liquid resin 2 and the force in the downward direction (-Z direction) caused by the pressure P1 of the compressed air 25 The liquid resin 2 remains as the residual resin 26 and remains below the resin discharge port 15 . Especially for the use of high viscosity liquid resin 2, for example with 50Pa. In the case of the liquid resin 2 having a viscosity of s or more, the surface tension is large, and the residual resin 26 is likely to remain. When the residual resin 26 remains, a specific amount of the liquid resin 2 is not supplied to the cavity 21, and thus molding failure occurs.

2(d) shows a state in which the liquid resin 2 accumulated in the resin passage 22b and the residual resin 26 remaining under the resin discharge port 15 are forcibly extruded by compressed air. Immediately after the completion of the delivery of the liquid resin 2, the pressure of the compressed air 27 (indicated by the arrow in the figure) supplied from the air supply port 16 is increased from P1 (kg/cm ² ) to P2 (kg/cm ² ). until. The pressure of the compressed air 27 is increased to P2 (kg/ in such a manner that the force applied in the downward direction (-Z direction) is greater than the tensile force in the upward direction (+Z direction) caused by the surface tension of the liquid resin 2. Cm ² ) so far. Thereby, the liquid resin 2 accumulated in the resin passage 22b and the residual resin 26 remaining under the resin discharge port 15 can be forcibly extruded from the resin discharge port 15 by the pressure P2 of the compressed air 27. Since the compressed air 27 of the pressure P2 is directly ejected to the liquid resin 2 accumulated in the resin passage 22b, the liquid resin 2 accumulated in the resin passage 22b and the residual resin 26 remaining under the resin discharge port 15 can be moved to the cavity. 21 fell. Therefore, the liquid resin 2 which has been discharged and supplied to the cavity 21, and the liquid resin 2 which is stored in the resin passage 22b by extrusion and the residual resin 26 remaining under the resin discharge port 15 are supplied to the cavity 21. The total amount of the liquid resin 2 corresponds to a specific amount of the liquid resin 2. This specific amount of the liquid resin 2 is supplied to the cavity 21.

Then, the upper mold 17 and the lower mold 18 shown in Fig. 1(a) are sandwiched. After the mold is sandwiched, the liquid resin 2 is heated to form a hardened resin. In this state, the wafer 19 mounted on the substrate 20 before sealing is sealed with a resin by hardening the resin. After the resin sealing is completed, the upper mold 17 and the lower mold 18 are opened. After the mold is opened, the sealed substrate is taken out. Thus, the resin sealing is completed.

According to the present embodiment, when the liquid resin 2 is ejected, the compressed air 25 is supplied to the nozzle 6 attached to the front end of the dispenser 1 using the compressor 7. Since the pressure P1 of the compressed air 25 is made larger than the resin pressing pressure P0 of the liquid resin 2, the liquid resin 2 can be prevented from entering the air supply port 16 from the resin supply port 14. In addition, by pressing the pressure of the compressed air 25 to the pressure P1 and pressing the liquid resin 2 stored in the resin passage 22b in the vertical direction, the liquid resin 2 can be supplied from the resin discharge port 15 to the cavity 21 .

Moreover, according to the present embodiment, the pressure of the compressed air supplied to the nozzle 6 using the electro-pneumatic regulator 9 can be controlled. Even when the liquid resin 2 remains as the residual resin 26 and remains below the resin discharge port 15 of the nozzle 6, the compressed air 27 can be used to force the pressure of the compressed air 27 from P1 to P2. The liquid resin 2 accumulated in the resin passage 22b and the residual resin 26 remaining under the resin discharge port 15 are dropped. Therefore, the residual resin 26 does not remain below the resin passage 22b and the resin discharge port 15, and a specific amount of the liquid resin 2 can be supplied to the cavity 21.

Further, according to the present embodiment, after the delivery of the liquid resin 2 is completed, the pressure of the compressed air supplied from the compressor 7 is increased from P1 to P2. Thereby, the residual resin 26 remaining in the liquid resin 2 of the resin passage 22b and the residual resin discharge port 15 can be forcibly dropped into the cavity 21. Thereby, a specific amount of the liquid resin 2 can be stably supplied to the cavity 21. Therefore, the quality of the resin molded article can be stabilized. Moreover, since it is not necessary to wait for the liquid resin 2 to naturally fall, the time for supplying the liquid resin 2 to the cavity 21 can be shortened. Therefore, the productivity of the resin molding apparatus can be improved.

Further, according to the present embodiment, the pressure of the compressed air supplied to the nozzle 6 can be performed using the electro-pneumatic regulator 9 regardless of the liquid resin 2 of the low viscosity to the high viscosity. control. The pressure of the compressed air can be increased to the necessary pressure in accordance with the viscosity of the liquid resin 2. Therefore, the liquid resin 2 stored in the resin passage 22b and the residual resin 26 remaining under the resin discharge port 15 can be surely supplied to the cavity 21 in accordance with the liquid resin 2 to be used.

Further, in the present embodiment, the compressed air 25 supplied from the air supply port 16 prevents the liquid resin 2 from entering the air supply port 16 via the air passage 23. Not limited to this, for example, the liquid resin supply port 16 can be prevented from entering the air supply port 16 by providing an opening/closing valve or a check valve or the like.

Further, in the present embodiment, a delivery mechanism (servo cylinder type) using a combination of the servo motor 10 and the ball screw 11 is shown as the metering and delivery mechanism 4. Not limited to this, a combination of a stepping motor and a ball screw, a uniaxial eccentric screw method, and an air cylinder can be used.

Further, in the present embodiment, the reservoir portion 3 and the nozzle 6 provided in the dispenser 1 are connected by the resin transfer portion 5. For example, when a liquid resin containing an additive such as a phosphor or a light diffusing agent is used, a static mixing member can be provided in the resin passage 24 in the resin transfer portion 5 in order to prevent precipitation of the phosphor or the light diffusing agent. Static mixer. Thereby, the phosphor or the light diffusing agent can be stirred together with the liquid resin. Therefore, the phosphor or the light diffusing agent is not precipitated, and the liquid resin can be supplied in a uniform state.

Moreover, in the present embodiment, the reservoir portion 3 and the nozzle 6 are connected through the resin transfer portion 5. Not limited to this, the reservoir 3 and the nozzle 6 can be directly connected. Thereby, the dispenser 1 itself can be miniaturized.

[Embodiment 2]

The resin supply mechanism of the resin molding apparatus of the present invention will be described with reference to Fig. 3 Example 2. The difference from the first embodiment is that in the nozzle 6, the air supply port is provided not only on the top surface of the nozzle 6, but also on the side surface. As shown in FIG. 3(a), for example, in addition to the air supply port 16 as the main body, the auxiliary air supply ports 28a, 28b, and 28c can be provided on the side surface of the nozzle 6. The air supply ports 28a, 28b, and 28c are connected to the resin passage 22b via air passages 29a, 29b, and 29c, respectively. A plurality of air supply ports can be provided on the side surface of the nozzle 6 as needed.

In FIG. 3(b), for example, the air passage 29b is provided in the horizontal direction (+Y direction) from the air supply port 28b. At a pressure P3 (kg/cm ² ), compressed air 30 (indicated by an arrow in the figure) is ejected from the air supply port 29b toward the resin passage 22b. The pressure P3 (kg/cm ² ) of the compressed air 30 is made smaller than the pressure P1 (kg/cm ² ) of the compressed air 25 supplied from the air supply port 16 and the resin pressing pressure P0 (kg/cm ² ). The pressure P3 of the compressed air 30 is added to the pressure P1 of the compressed air 25 that presses the liquid resin 2 and the resin pressing pressure P0 to increase the force applied in the vertical direction (-Z direction). Thus, the liquid resin 2 is discharged from the resin discharge port 15. Further, the compressed air 30 may be ejected from the resin passage 22b instead of the right side.

According to the present embodiment, in addition to the air supply port 16 as the main body, auxiliary air supply ports 28a, 28b, and 28c are provided on the side surface of the nozzle 6, and compressed air is ejected from a plurality of air supply ports to the resin. The liquid resin 2 of the passage 22b. Thereby, the force for pressing the liquid resin 2 accumulated in the resin passage 22b is increased, so that the discharge speed of discharging the liquid resin 2 from the resin discharge port 15 can be increased. Therefore, the time required to supply the liquid resin 2 to the cavity 21 shown in Fig. 1(a) can be shortened, and the productivity of the resin molding apparatus can be improved.

[Example 3]

A third embodiment of the resin supply mechanism of the resin molding apparatus of the present invention will be described with reference to Fig. 4 . The difference from the first embodiment is that: first, the metering and sending mechanism 4, the accumulating portion 3, and the tree The grease transfer unit 5 is disposed along the vertical direction. Second, between the resin transfer portion 5 and the nozzle 6, a resin direction changing member 31 that changes the flow direction of the liquid resin 2 is provided. As shown in FIG. 4( a ), the resin direction changing member 31 includes a resin supply port 32 and a resin delivery port 33 . The resin passage 34 that connects the resin supply port 32 and the resin delivery port 33 includes a resin passage 34a that extends in the vertical direction (-Z direction) from the resin supply port 32, and a resin passage 34b that follows the resin passage 34a. The horizontal direction (-Y direction) extends. Therefore, the resin supply port 32 is connected to the resin supply port 14 provided in the nozzle 6 via the resin passage 34a extending in the vertical direction and the resin passage 34b extending in the horizontal direction from the resin passage 34a. The liquid resin 2 supplied from the resin supply port 32 of the resin direction changing member 31 is sequentially discharged from the resin discharge port 15 via the resin passages 22a and 34b and the resin passages 22a and 22b of the nozzle 6.

As shown in Fig. 4 (b), the liquid resin 2 fed from the reservoir 3 of the dispenser 1 arranged in the vertical direction in the vertical direction (-Z direction) can sequentially pass through the resin transfer portion 5 and the resin direction. The changing member 31 and the nozzle 6 are discharged from the resin discharge port 15 directly downward. Thereby, the nozzle 6 and the resin direction changing member 31 can be used, and the dispenser 1 can be used as a vertical distributor arranged along the vertical direction.

In FIG. 4(b), a resin direction changing member 31 is provided between the resin transfer portion 5 of the horizontal distributor 1 shown in the first embodiment and the nozzle 6. Thereby, the horizontal distributor 1 arranged along the horizontal direction can be used as the vertical distributor 1 arranged along the vertical direction. When used as the vertical dispenser 1, the same effects as those of the horizontal distributor 1 shown in the first and second embodiments are also produced.

According to the present embodiment, by using the nozzle 6 and the resin direction changing member 31, the horizontal distributor 1 disposed in the horizontal direction can be used as the vertical distributor 1 disposed along the vertical direction. It is possible to use the same dispenser 1 as either of the horizontal distributor 1 or the vertical distributor 1 Kind of dispenser. When used as the horizontal type dispenser 1, the height of the resin forming apparatus can be reduced. When used as the vertical dispenser 1, the planar area of the resin forming apparatus can be reduced.

[Example 4]

An embodiment of the resin molding apparatus of the present invention will be described with reference to Fig. 5 . The resin molding apparatus 35 shown in FIG. 5 includes a substrate supply/storage module 36, four molding modules 37A, 37B, 37C, and 37D and a liquid resin supply module 38 as constituent elements. The substrate supply/storage module 36, the molding modules 37A, 37B, 37C, and 37D and the liquid resin supply module 38, which are constituent elements, can be detachably attached to and detachable from other components. For example, in a state in which the substrate supply/storage module 36 and the molding module 37A are mounted, the molding module 37B can be attached to the molding module 37A, and the liquid resin supply module 38 can be attached to the molding module 37B.

The substrate supply/storage module 36 is provided with a sealed front substrate supply portion 39 for supplying the sealed front substrate 20 and a sealed substrate storage portion 41 for storing the sealed substrate 40. A loader 42 and an unloader 43 are provided in the substrate supply/storage module 36, and the rails 44 supporting the loader 42 and the unloader 43 are disposed along the X direction. The loader 42 and the unloader 43 move along the track 44.

The loader 42 and the unloader 43 supported by the rails 44 move in the X direction between the substrate supply/storage module 36, the molding modules 37A, 37B, 37C, and 37D and the liquid resin supply module 38. Therefore, in a state where the substrate supply/storage module 36 and the molding module 37A are mounted, the loader 42 and the unloader 43 are arranged along the arrangement direction (X direction) of the substrate supply/storage module 36 and the molding module 37A. mobile.

Further, the loader 42 and the unloader 43 are moved in the Y direction. That is, the loader 42 and the unloader 43 move in the horizontal direction. Furthermore, in the present application, the terms horizontal and vertical include the direction in addition to the strict horizontal direction and the vertical direction. The situation is inclined so as not to hinder the movement of the constituent elements of the movement.

Each of the molding modules 37A, 37B, 37C, and 37D is provided with a lower mold 18 and a lower mold 17 disposed opposite to the lower mold 18 (see FIG. 1(a)). The upper mold 17 and the lower mold 18 constitute a forming mold. Each of the forming modules has a mold clamping mechanism 45 (a circular portion indicated by a two-dot chain line) that sandwiches and opens the upper mold 17 and the lower mold 18. The cavity 21 to which the liquid resin 2 is supplied is provided to the lower mold 18. The lower mold 18 and the upper mold 17 may be sandwiched and opened as long as they can move relative to each other. Further, the release film may be coated in such a manner as to cover the cavity 21.

The moving mechanism 46 is provided in the liquid resin supply module 38. The moving mechanism 46 is supported on the track 44 and moves along the track 44. Therefore, in a state where the liquid resin supply module 38 and the molding module 37D are mounted, the moving mechanism 46 moves along the arrangement direction (X direction) of the liquid resin supply module 38 and the molding module 37D.

A dispenser 1 as a resin supply mechanism is provided in the moving mechanism 46. The dispenser 1 is moved in the Y direction by the moving mechanism 46. Further, the moving mechanism 46 can also be moved in the Y direction. Any of the nozzles 6 shown in the first to third embodiments can be attached to the front end of the dispenser 1. The case of using a horizontal type distributor is shown in FIG. Not limited to this, it is also possible to use a vertical dispenser (refer to FIG. 4).

The liquid resin supply module 38 is provided with a vacuuming mechanism 47 which is in a state in which the upper mold 17 and the lower mold 18 of the forming modules 37A, 37B, 37C, and 37D are sandwiched. , forcibly pumping out the exhaust air. The liquid resin supply module 38 is provided with a control unit 48 that controls the overall operation of the resin molding apparatus 35. FIG. 5 shows a case where the vacuuming mechanism 47 and the control unit 48 are provided in the liquid resin supply module 38. Not limited to this, the vacuuming mechanism 47 and the control unit 48 may be provided in other modules.

In the present embodiment, the dispenser 1 itself is disposed in the horizontal direction, in other words, laterally. Thereby, the height of the resin molding device 35 can be reduced. The dispenser 1 itself can also be arranged in the vertical direction, in other words, longitudinally. Thereby, the planar area of the resin molding device 35 can be reduced.

Further, in the present embodiment, the four molding modules 37A, 37B, 37C, and 37D are arranged in the X direction and are mounted between the substrate supply/storage module 36 and the liquid resin supply module 38. The substrate supply/storage module 36 and the liquid resin supply module 38 may be one module, and one molding module 37A may be arranged in the X direction and attached to the module. Further, the forming modules 37A may be arranged in the X direction and attached to the one module, and the other forming modules 37B may be attached to the forming module 37A. Therefore, the configuration of the resin molding apparatus 35 can be optimized in accordance with the production form or the production amount, and productivity can be improved.

Furthermore, in the present embodiment, a resin molding apparatus and a resin molding method used for resin sealing a semiconductor wafer have been described. The resin sealing object may be a semiconductor wafer such as an IC or a transistor, or a passive component wafer. The present invention can be applied to resin sealing of one or a plurality of wafers mounted on a substrate such as a lead frame, a printed substrate, or a ceramic substrate by a curing resin.

Further, the present invention can be applied not only to the case where the electronic component is resin-sealed, but also in the case of manufacturing an optical component such as a lens, a reflector (reflector), a light guide plate, or an optical module, and other resin products by resin molding. .

In the present embodiment, a resin molding apparatus and a resin molding method using compression molding have been described. Further, the present invention can be applied to a resin molding apparatus and a resin molding method by transfer molding. In this case, the liquid resin is supplied to the cylindrical shape provided in the molding die. A resin accommodating portion having a space configuration (this portion is provided with a lifting member called a plunger below, and generally has a cylindrical resin material containing a solid resin and is called a pot).

In the present embodiment, an example has been described in which a cavity provided in a lower mold is used as a housing portion, and a liquid resin is supplied to the cavity. In addition to the cavity, the housing portion may be any one of the following housing portions. First, the accommodating portion is disposed on the lower mold (described above).

Second, the accommodating portion is a space including the upper surface of the substrate, that is, a space including a wafer (a wafer of a semiconductor, a wafer of a passive component such as a wafer) mounted on the upper surface of the substrate. The liquid resin is supplied so as to cover the wafer mounted on the upper surface of the substrate. In this case, it is preferred to electrically connect the wafer to the substrate by flip chip bonding.

Third, the accommodating portion is a space including an upper surface of a semiconductor substrate such as a germanium wafer. The liquid resin is supplied so as to cover a functional portion such as a semiconductor circuit formed on the semiconductor substrate. In this case, it is preferable to form a bump on the upper surface of the semiconductor substrate.

Fourth, the accommodating portion is a space containing the upper surface of the film which should be finally accommodated in the cavity of the molding die. In this case, the accommodating portion is, for example, a recess formed by recessing the film. The liquid resin is supplied to a recess formed by recessing the film. For the purpose of the film, for example, the mold release property is improved, the shape formed by the unevenness on the surface of the film is transferred, and the pattern formed in advance on the film is transferred. The liquid resin and film accommodated in the concave portion of the film are conveyed by an appropriate transfer mechanism, and finally, the liquid resin and the film are housed together in the cavity of the molding die.

In any of the first to fourth cases, the liquid resin accommodated in the accommodating portion is finally housed in the cavity of the molding die and is cured inside the cavity.

In any of the second to fourth cases, the liquid resin can be supplied to the accommodating portion on the outside of the pair of the forming dies, and at least the accommodating portion can be included. The elements are transferred between the forming dies.

Further, in each of the examples, a case is shown in which the nozzle 6 is provided with a resin discharge port 15 through which the liquid resin 2 is discharged. Not limited to this, it is also possible to provide a plurality of resin discharge ports 15. In this case, a plurality of resin passages connected from the resin supply port 14 to the respective resin discharge ports 15 are provided in the nozzle 6. An air supply port 16 for supplying compressed air is provided corresponding to the plurality of resin passages. The compressed air is sprayed from the respective air supply ports 16 to the liquid resin 2 accumulated in the resin passage, and the liquid resin 2 is discharged from each of the resin discharge ports 15. Thereby, the liquid resin 2 can be simultaneously supplied to the plurality of mold cavities provided.

Further, in each of the examples, a one-liquid type dispenser was used, and the one-liquid type dispenser used a liquid resin which was prepared by mixing a main agent and a curing agent in advance. Without being limited thereto, even in the case of actually using a dispenser in which a two-liquid mixing type of a main agent and a hardener is used in a dispenser, as long as the nozzle 6 in the embodiment is applied, the same is produced. effect.

The present invention is not limited to the above-described embodiments, and may be combined, changed, or selected as desired, without departing from the spirit and scope of the invention.

1‧‧‧Distributor

2‧‧‧Liquid resin

3‧‧‧Repository Department

4‧‧‧Measuring delivery mechanism (pushing mechanism)

5‧‧‧Resin Transfer Department

6‧‧‧Nozzle (resin supply mechanism)

7‧‧‧Compressor (high pressure gas supply mechanism)

8‧‧‧Nylon tube

9‧‧‧Electrical pneumatic regulator

10‧‧‧Servo motor

11‧‧‧Ball screw

12‧‧‧Ball nuts

13‧‧‧Plunger

14‧‧‧ resin supply port

15‧‧‧Resin spray

16‧‧‧Air supply port (1st gas supply port)

17‧‧‧Upper mold (forming die)

18‧‧‧Down mold (forming die)

19‧‧‧ wafer

20‧‧‧ Sealing the front substrate (substrate)

21‧‧‧ cavity (housing department)

22a, 22b‧‧‧ resin pathway

23‧‧‧Air access

P0‧‧‧ resin push pressure

P1‧‧‧Compressed air pressure (2nd pressure)

P2‧‧‧Compressed air pressure (1st pressure)

X, Y, Z‧‧ Direction

Claims (12)

A resin molding apparatus comprising: an upper mold; a lower mold disposed opposite to the upper mold; a cavity provided at at least one of the upper mold and the lower mold; and a housing portion to be accommodated in the above a liquid resin which is hardened in the cavity to be a hardened resin; a resin supply mechanism that supplies the liquid resin to the accommodating portion; and a mold clamping mechanism that has at least the forming die of the upper die and the lower die In the resin molding apparatus, the resin molding apparatus is provided with a resin supply port provided in the resin supply means and supplied with the liquid resin, and a resin passage connected to the resin supply port And extending in the first direction; the resin discharge port is connected to the resin passage and ejecting the liquid resin to the accommodating portion; and the pressing mechanism is pressed against the resin ejection port by the resin pressing force and stored in the resin a liquid resin of the supply mechanism; a high-pressure gas supply mechanism that accumulates in the tree along a second direction intersecting the first direction The liquid resin of the supply means injects the high-pressure gas; the first gas supply port is provided in the resin supply means and supplies the high-pressure gas; and the entry prevention means prevents the liquid resin from passing through the first gas supply port The first gas supply port enters the high-pressure gas supply means, and the high-pressure gas having a first pressure greater than the resin pressing pressure is sprayed onto the liquid resin which is at least a part of the resin passage. The liquid resin is supplied to the accommodating portion. The resin molding apparatus according to claim 1, wherein the entry prevention means is the high pressure gas having a second pressure; the second pressure is greater than the resin pressing pressure; and the first pressure is greater than the second pressure. The resin molding apparatus according to claim 1, wherein the entry prevention means is a valve; and the first pressure is greater than the resin pressing force. The resin molding apparatus according to claim 1, further comprising: at least a second gas supply port provided in the resin supply means and supplying a high pressure gas; and the high pressure gas having a third pressure lower than the first pressure from the above The second gas supply port is sprayed to the liquid resin accumulated in a part of the resin passage. The resin molding apparatus according to claim 1, wherein the curing resin is a sealing resin that covers a wafer mounted on the substrate. The resin molding apparatus according to claim 1, further comprising: a supply module that supplies the liquid resin to the resin supply mechanism; and at least one molding module that has the molding die and the mold The mechanism is capable of loading and unloading the one of the forming modules and the one forming module; and the one forming module is detachable from the other forming modules. A resin molding method for forming a molded article containing a cured resin by using a resin molding apparatus, the resin molding apparatus comprising: an upper mold; a lower mold disposed opposite to the upper mold; and a cavity At least one of the upper mold and the lower mold; the accommodating portion accommodating the liquid resin which is cured in the cavity to be the cured resin; and the resin supply mechanism that supplies the liquid resin to the a accommodating portion; and a mold clamping mechanism that sandwiches at least the upper mold and the lower mold; the resin molding method is characterized by the following steps: The liquid resin is pressed by the resin pressing force to eject the liquid resin from the resin discharge port to the accommodating portion via the resin passage extending in the first direction, and the resin is pushed by the high pressure gas supply mechanism The high-pressure gas of the first pressure of the pressure is ejected from the first gas supply port to the liquid resin stored in at least a part of the resin passage, thereby supplying the liquid resin to the accommodating portion; The liquid resin pressed by the resin pressing force enters the high pressure gas supply means at the first gas supply port. The resin molding method according to claim 7, wherein in the step of preventing the entry, the liquid resin is pressed from the first gas supply port to the liquid resin having the second pressure. In the high pressure gas, the second pressure is greater than the resin pressing force and smaller than the first pressure. The resin molding method according to claim 7, wherein in the step of preventing entry, the valve provided in the first gas supply port is closed. The resin molding method according to claim 7, wherein in the step of supplying the liquid resin, a high-pressure gas having a third pressure lower than the first pressure is injected from the second gas supply port to the above-mentioned The above liquid resin is a part of the resin passage. The resin molding method according to claim 7, wherein the hardening resin is a sealing resin that covers a wafer mounted on the substrate. The resin molding method according to any one of claims 7 to 11, further comprising: a step of preparing a supply module that supplies the liquid resin to the resin supply mechanism; and preparing at least one molding In the step of the module, the at least one forming module has the forming die and the die clamping mechanism; the supply module and the one forming module are detachable; The above one forming module can be attached and detached with respect to other forming modules.