JPH04309460A - Cream solder applying device - Google Patents
Cream solder applying deviceInfo
- Publication number
- JPH04309460A JPH04309460A JP3071587A JP7158791A JPH04309460A JP H04309460 A JPH04309460 A JP H04309460A JP 3071587 A JP3071587 A JP 3071587A JP 7158791 A JP7158791 A JP 7158791A JP H04309460 A JPH04309460 A JP H04309460A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- output port
- cream solder
- solder material
- discharged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 47
- 239000006071 cream Substances 0.000 title claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 38
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 25
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 239000003638 chemical reducing agent Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000005484 gravity Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Coating Apparatus (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明はクリーム状のはんだ液を
プリント基板のランドに秤量塗布し回路部品を実装する
クリームはんだ塗布装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cream solder applicator for applying a measured amount of a creamy solder liquid onto the lands of a printed circuit board to mount circuit components thereon.
【０００２】0002
【従来の技術】従来、この種の塗布装置は低粘度の液体
を塗布するのに利用されていたものが、近年高粘度のク
リームはんだの塗布にも利用されつつある。2. Description of the Related Art Conventionally, this type of applicator has been used to apply low viscosity liquid, but in recent years it has also been used to apply high viscosity cream solder.
【０００３】図５に従来のクリームはんだ塗布装置の構
成を示す。図に示すように、コンプレッサから送られた
圧縮空気は減圧器３１で減圧され、圧縮空気の通路を開
閉するバルブとして働く開閉器３２を経て、はんだ容器
となるバレル３３に送られる。バレル３３は入口部を密
閉する蓋３５と空気圧によりクリームはんだ３８を押圧
するプランジャ３４とで構成され、下端にはノズル３６
を接続している。また矢印Ａは空気の流れ方向を示し、
この空気の流れは制御手段４２で開閉される開閉器３２
により制御される。FIG. 5 shows the configuration of a conventional cream solder applicator. As shown in the figure, compressed air sent from a compressor is reduced in pressure by a pressure reducer 31, and sent to a barrel 33, which serves as a solder container, through a switch 32 that functions as a valve that opens and closes a passage for the compressed air. The barrel 33 is composed of a lid 35 that seals the inlet, a plunger 34 that presses cream solder 38 using air pressure, and a nozzle 36 at the lower end.
are connected. Also, arrow A indicates the direction of air flow,
This air flow is controlled by a switch 32 which is opened and closed by a control means 42.
controlled by
【０００４】以上のように構成されたクリームはんだ塗
布装置について、以下にその動作を説明する。コンプレ
ッサで加圧され減圧器３１で減圧された空気圧は、開閉
器３２が開になるとバレル３３中のプランジャ３４を加
圧する。プランジャ３４で押圧されたクリームはんだ３
８はノズル先端３６ａより吐出される。しかし、開閉器
２の開時間が一定になるように制御しても、ノズル先端
３６ａより吐出され、被加工物４０に塗布されるクリー
ムはんだ３８は必ずしも一定量にはならない。その理由
を図６（Ａ），（Ｂ）で説明する。The operation of the cream solder applicator constructed as described above will be explained below. The air pressure pressurized by the compressor and reduced by the pressure reducer 31 pressurizes the plunger 34 in the barrel 33 when the switch 32 is opened. Cream solder 3 pressed by plunger 34
8 is discharged from the nozzle tip 36a. However, even if the opening time of the switch 2 is controlled to be constant, the amount of cream solder 38 that is discharged from the nozzle tip 36a and applied to the workpiece 40 is not necessarily constant. The reason for this will be explained with reference to FIGS. 6(A) and 6(B).
【０００５】図６（Ａ）はクリームはんだ３８が吐出し
ている最中の図で、ノズル３６よりはんだ材料３８が吐
出される。吐出後の材料３９はノズル先端外壁での表面
張力をＦＯ（ノズル先端外径Ｄに比例する力），ノズル
先端内壁での表面張力をＦ１（ノズル先端内径ｄに比例
する力），吐出後の材料３９の重力をＧ１とすると、Ｇ
１とＦ０＋Ｆ１がつりあっている。その後吐出量が増え
、吐出材料３８の重力Ｇ１がＦ０＋Ｆ１より大になると
吐出材料３９はノズルより落下する。開閉器３２が閉の
状態で、かつ吐出後の材料３９が落下したときのノズル
先端部の状態を図６（Ｂ）に示す。このときは残った吐
出材料４３の重力よりＦ０＋Ｆ１が大きくなるためノズ
ル先端には残留材料４３がのこる。この残留材料４３の
量は常に一定ではない。したがって、開閉器３２の開時
間に比例した量が常に被加工物４０に塗布されることに
はならない。FIG. 6(A) is a diagram showing the cream solder 38 being discharged, and the solder material 38 is being discharged from the nozzle 36. The material 39 after being discharged has a surface tension on the outer wall of the nozzle tip as FO (a force proportional to the outer diameter D of the nozzle tip), a surface tension on the inner wall of the nozzle tip as F1 (a force proportional to the inner diameter d of the nozzle tip), and a force on the inner wall of the nozzle tip as F1 (a force proportional to the inner diameter d of the nozzle tip). If the gravity of material 39 is G1, then G
1 and F0+F1 are balanced. Thereafter, the discharge amount increases and when the gravity G1 of the discharged material 38 becomes greater than F0+F1, the discharged material 39 falls from the nozzle. FIG. 6(B) shows the state of the nozzle tip when the switch 32 is closed and the discharged material 39 falls. At this time, since F0+F1 becomes larger than the gravity of the remaining discharged material 43, the remaining material 43 remains at the tip of the nozzle. The amount of this residual material 43 is not always constant. Therefore, the amount proportional to the opening time of the switch 32 is not always applied to the workpiece 40.
【０００６】[0006]
【発明が解決しようとする課題】このような従来の構成
では、図６（Ａ），（Ｂ）で説明したように開閉器３２
の開時間に比例した量の吐出材料を常に被加工物へ塗布
することは困難になる。すなわち（１）ノズル先端部で
の残留材料４３の量だけ吐出量がばらつく。（２）図６
（Ａ）に示したように、塗布量はＦ０，Ｆ１とＧ１との
バランスにより変動し、被加工物４０への付着量は、そ
のときどきにより異なる。被加工物４０が、もしプリン
ト基板であれば、ランドへのはんだ塗布量が変動するこ
とになり、その後に加熱してはんだずけしたとき、はん
だボール，ブリッジ，はんだオープンなどの不良が発生
する。[Problems to be Solved by the Invention] In such a conventional configuration, as explained in FIGS. 6(A) and 6(B), the switch 32
It becomes difficult to always apply an amount of discharged material to the workpiece in proportion to the opening time of the machine. That is, (1) the discharge amount varies by the amount of residual material 43 at the nozzle tip. (2) Figure 6
As shown in (A), the amount of coating varies depending on the balance between F0, F1, and G1, and the amount of coating on the workpiece 40 varies depending on the time. If the workpiece 40 is a printed circuit board, the amount of solder applied to the land will vary, and when it is subsequently heated and soldered, defects such as solder balls, bridges, and solder opens will occur. .
【０００７】本発明はこのような課題を解決するもので
、塗布材料の塗布量を常に一定にするクリームはんだ塗
布装置を提供することを目的とするものである。[0007] The present invention has been made to solve these problems, and it is an object of the present invention to provide a cream solder coating device that can always keep the amount of coating material constant.
【０００８】[0008]
【課題を解決するための手段】この目的を達成するため
に本発明の塗布装置は、第１ノズル周辺部に第２ノズル
やサイド・ノズルを設け、前記第２ノズルやサイド・ノ
ズルに気体を噴射し、吐出中の材料をせん断してノズル
先端部での残留材料をなくす構成となっている。吐出材
料がクリームはんだのときは、作動ガスはクリームはん
だの酸化を防ぐため窒素や希ガスなどを不活性ガスを使
用するのが望ましい。[Means for Solving the Problems] In order to achieve this object, the coating device of the present invention is provided with a second nozzle and a side nozzle around the first nozzle, and a gas is supplied to the second nozzle and the side nozzle. The structure is such that the material is injected and the material being discharged is sheared to eliminate any remaining material at the tip of the nozzle. When the discharge material is cream solder, it is desirable to use an inert gas such as nitrogen or a rare gas as the working gas to prevent oxidation of the cream solder.
【０００９】[0009]
【作用】この構成により、吐出後の材料に第２ノズルや
サイド・ノズルからの空気やガスなどによるせん断力が
加わりノズル先端部での残留材料は減少する。その結果
、開閉器の開時間に比例した量の吐出材料を正確に被加
工物上に塗布することが可能となる。また、開閉器が開
いているときでも噴射される風圧により表面張力Ｆ０，
Ｆ１が減じられ、吐出材料の重力Ｇ１が支配的となって
吐出材料が落下し、均一な塗布が可能となる。[Operation] With this configuration, shearing force due to air, gas, etc. from the second nozzle or side nozzle is applied to the discharged material, reducing the amount of material remaining at the tip of the nozzle. As a result, it becomes possible to accurately apply the discharged material onto the workpiece in an amount proportional to the opening time of the switch. In addition, even when the switch is open, the surface tension F0,
F1 is reduced, the gravity G1 of the discharged material becomes dominant, the discharged material falls, and uniform application becomes possible.
【００１０】0010
【実施例】本発明の一実施例のクリームはんだ塗布装置
を図面を参照しながら説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS A cream solder applicator according to an embodiment of the present invention will be described with reference to the drawings.
【００１１】（実施例１）図１（Ａ）に本発明のクリー
ムはんだ塗布装置の構成を示す。図中、第２減圧器１，
第２開閉器２，第２制御手段１２，バレル３，プランジ
ャ４，第１ノズル６ａ，クリームはんだ８は従来例と同
一のものであり、説明を省略する。Ａはコンプレッサで
発生した圧縮空気の流れを示す。なお、コンプレッサ２
８は空気を加圧する手段であれば何でもよい。つぎに、
本発明の一実施例のはんだ塗布装置の吐出ノズル近傍の
構成を説明する。Ｚはクリームはんだの吐出方向、Ｒは
Ｚ軸に９０度の角度の内方向のベクトルをしめす。作動
ガスボンベ２０（窒素ガス，アルゴンガス，ヘリュウム
ガス，窒素＋水素ガス等のクリームはんだをシールドす
るガスを充填した容器）から発生するガス圧は第１減圧
器２１，第１開閉器２２，第１制御手段２４で制御され
る第１開閉器２２を経て作動ガスＢとして第２ノズル２
３に至る。第１ノズル６ａの入口部は内径Ｗ１を有し、
第１ノズル出力口は内径ｄを有する。第２ノズル２３は
第１ノズル６ａの外周部に一体となって取り付けられて
いる。第２ノズルの出力口２３ｂは第１ノズルの出力口
６ｂの周囲近傍に設けられ、図６に示した残留材料４３
を切り放す方向に作動ガスＢを流す構成になっている。
作動ガスボンベ２０より出たガスＢは第１減圧器２１で
減圧され、第１制御手段２４により第１開閉器２２のバ
ルブを開閉制御し、第１開閉器２２が開の時、作動ガス
Ｂは第２ノズル入口端２３ａに導かれ、第２ノズル出力
口２３ｂよりＢはノズル外に排出される。なお、作動ガ
スボンベ２０の代わりにコンプレッサ２０で発生した空
気圧を用いてもよい。作動ガスＢはガス流ＲまたはＲと
クリームハンダの流れＺとの合成ベクトル方向に噴射す
るよう第２ノズル２３の先端を加工する。(Embodiment 1) FIG. 1A shows the structure of a cream solder applicator according to the present invention. In the figure, the second pressure reducer 1,
The second switch 2, the second control means 12, the barrel 3, the plunger 4, the first nozzle 6a, and the cream solder 8 are the same as those in the conventional example, and their explanation will be omitted. A shows the flow of compressed air generated by the compressor. In addition, compressor 2
8 may be any means as long as it pressurizes air. next,
The configuration near the discharge nozzle of the solder applicator according to one embodiment of the present invention will be described. Z indicates the discharge direction of cream solder, and R indicates an inward vector at a 90 degree angle to the Z axis. The gas pressure generated from the working gas cylinder 20 (container filled with gas for shielding cream solder such as nitrogen gas, argon gas, helium gas, nitrogen + hydrogen gas) is transferred to the first pressure reducer 21, the first switch 22, and the first switch. The working gas B is passed through the first switch 22 controlled by the control means 24 to the second nozzle 2.
3. The inlet portion of the first nozzle 6a has an inner diameter W1,
The first nozzle output port has an inner diameter d. The second nozzle 23 is integrally attached to the outer circumference of the first nozzle 6a. The output port 23b of the second nozzle is provided near the periphery of the output port 6b of the first nozzle, and the residual material 43 shown in FIG.
The working gas B is configured to flow in the direction of cutting off. Gas B discharged from the working gas cylinder 20 is depressurized by the first pressure reducer 21, and the first control means 24 controls opening and closing of the valve of the first switch 22. When the first switch 22 is open, the working gas B is B is guided to the second nozzle inlet end 23a and is discharged to the outside of the nozzle from the second nozzle output port 23b. Note that air pressure generated by the compressor 20 may be used instead of the working gas cylinder 20. The tip of the second nozzle 23 is processed so that the working gas B is injected in the direction of the gas flow R or the composite vector of R and the cream solder flow Z.
【００１２】（実施例２）図１（Ｂ）は第１ノズル６ａ
から分離されたサイドノズル２９を設置するサイド・ノ
ズル方式をしめす。この方式は第１ノズル下方でクリー
ムハンダ８に作動ガスＢが当るようサイドノズル２９を
設けるものである。図２に第１ノズル６ａと第２ノズル
２３の制御シーケンスをしめす。図２（Ａ）は第２開閉
器２の動作を示し、図２（Ｂ）は第１開閉器１の動作を
示す。図で横軸は時間を示し、０＜ｔ１＜ｔ２−Ｔ１＜
ｔ２＜ｔ２＋Ｔ２の関係にある。縦軸は第２開閉器２と
第１開閉器２２の開区間を示す。すなわち、クリームは
んだ８が吐出してから作動ガスＢをながし、図６（Ａ）
に示す表面張力Ｆ０，Ｆ１を作動ガスＢにより低減する
働きをさせるとともに、第２開閉器２が閉になってから
図６（Ｂ）に示すように残留材料４３をすべて落下させ
てからＴ２時間後に第１開閉器２２を閉にする。なお、
Ｔ２は０でもよく、Ｔ１は２−ｔ１時間でもよい。(Embodiment 2) FIG. 1(B) shows the first nozzle 6a
This shows a side nozzle method in which a side nozzle 29 is installed separated from the main body. In this method, a side nozzle 29 is provided so that the working gas B hits the cream solder 8 below the first nozzle. FIG. 2 shows a control sequence for the first nozzle 6a and the second nozzle 23. 2(A) shows the operation of the second switch 2, and FIG. 2(B) shows the operation of the first switch 1. In the figure, the horizontal axis indicates time, 0<t1<t2-T1<
The relationship is t2<t2+T2. The vertical axis indicates the open section of the second switch 2 and the first switch 22. That is, after the cream solder 8 is discharged, the working gas B is flowed, and as shown in FIG. 6(A)
The working gas B acts to reduce the surface tensions F0 and F1 shown in FIG. Afterwards, the first switch 22 is closed. In addition,
T2 may be 0, and T1 may be 2-t1 time.
【００１３】（実施例３）図３に第３の実施例を示す。
第１ノズル６ｂの先端部にピンホール３０をあけ、第２
ノズル入口端２３ｃよりの作動ガスＢをピンホール３０
より第１ノズルの先端部に流入し、図６（Ｂ）に示す残
留材料４３を切断し、残留材料４３が残らないようにす
る。そうして第２ノズル出力口２３ｄより作動ガスＢを
排出する。(Embodiment 3) FIG. 3 shows a third embodiment. A pinhole 30 is made at the tip of the first nozzle 6b, and a second
The working gas B from the nozzle inlet end 23c is passed through the pinhole 30.
It flows into the tip of the first nozzle and cuts off the residual material 43 shown in FIG. 6(B) so that no residual material 43 remains. The working gas B is then discharged from the second nozzle output port 23d.
【００１４】（実施例４）図４は第４の実施例である第
２ノズル２３ｆの断面図で第２ノズル入口端２３ｅの形
状を示したものである。作動ガスＢが第１ノズル６ｃの
外周を旋回するように、第２ノズル入口端２３ｅは第２
ノズル２３ｆの内周の接線にそって配設されている。こ
の旋回流により残留材料４３の切断効果もより増大する
。(Embodiment 4) FIG. 4 is a sectional view of a second nozzle 23f according to a fourth embodiment, showing the shape of the second nozzle inlet end 23e. The second nozzle inlet end 23e is connected to the second nozzle so that the working gas B swirls around the outer periphery of the first nozzle 6c.
It is arranged along the tangent to the inner circumference of the nozzle 23f. This swirling flow also further increases the cutting effect on the residual material 43.
【００１５】[0015]
【発明の効果】以上の実施例の説明からも明らかなよう
に本発明によれば、以下の効果が得られる。Effects of the Invention As is clear from the description of the embodiments above, according to the present invention, the following effects can be obtained.
【００１６】（１）第２開閉器の開時間（ｔ２−ｔ１）
に比例した吐出量の塗布が可能で、被加工物への塗布量
が一定となり、残留材料が殆どない。(1) Opening time of the second switch (t2-t1)
It is possible to apply at a discharge rate proportional to , the amount of application to the workpiece is constant, and there is almost no residual material.
【００１７】（２）吐出材料（クリームはんだ）の塗布
量が一定のため、例えばプリント基板に設けられたラン
ドからはみでるクリームはんだがなく、はんだブリッヂ
、はんだボールのない正確なはんだずけが可能である。(2) Since the applied amount of the discharged material (cream solder) is constant, there is no cream solder protruding from, for example, a land provided on a printed circuit board, and accurate soldering is possible without solder bridges or solder balls. .
【００１８】（３）窒素ガス，希ガスを作動ガスとして
用いているためクリームはんだの酸化がない。(3) Since nitrogen gas and rare gas are used as the working gas, there is no oxidation of the cream solder.
【図１】（Ａ）は本発明の第１の実施例のはんだ塗布装
置の構成図
（Ｂ）は同第２の実施例の要部拡大断面図FIG. 1 (A) is a block diagram of a solder applicator according to a first embodiment of the present invention; (B) is an enlarged cross-sectional view of essential parts of a second embodiment of the present invention;
【図２】（Ａ
）は同はんだ塗布装置の第２開閉器の動作シーケンスを
示す図
（Ｂ）は同はんだ塗布装置の第１開閉器の動作シーケン
スを示す図[Figure 2] (A
) is a diagram showing the operation sequence of the second switch of the same solder application device (B) is a diagram showing the operation sequence of the first switch of the same solder application device
【図３】同第３の実施例の要部拡大断面図[Fig. 3] Enlarged sectional view of main parts of the third embodiment
【図４】図第
４の実施例の要部拡大断面図[Fig. 4] Enlarged sectional view of main parts of the fourth embodiment
【図５】従来のはんだ塗布
装置の構成図[Figure 5] Configuration diagram of a conventional solder applicator
【図６】（Ａ）は同塗布工程中のクリーム
はんだの状態を示す断面図
（Ｂ）は同塗布終了後のクリームはんだの状態を示す断
面図[Fig. 6] (A) is a cross-sectional view showing the state of cream solder during the same application process. (B) is a cross-sectional view showing the state of cream solder after the same application is completed.
２ 第２開閉器
３ バレル
４ プランジャ
６ａ，６ｂ，６ｃ 第１ノズル
６ｂ 第１ノズル出力口
２２ 第１開閉器
２３ 第２ノズル
２３ａ，２３ｃ，２３ｅ 第２ノズル入口端２３
ｂ，２３ｄ，２３ｆ 第２ノズル出力口２９
サイドノズル
３０ ピンホール
Ｂ 作動ガス2 Second switch 3 Barrel 4 Plunger 6a, 6b, 6c First nozzle 6b First nozzle output port 22 First switch 23 Second nozzle 23a, 23c, 23e Second nozzle inlet end 23
b, 23d, 23f Second nozzle output port 29
Side nozzle 30 Pinhole B Working gas
Claims (2)
出材料に圧力を加えバレル内でピストンの役割をはたす
プランジャと、前記プランジャに空気を送るバレル入口
部と、前記バレルの他端にノズルの入口部内径がノズル
他端出力口の内径よりも広い第１ノズルを設け、前記第
１ノズルの外周部に第２ノズルを設け、前記第２ノズル
の内壁は第１ノズルの外壁を兼ね、前記第２ノズルの入
口端と出力口以外は第２ノズルの外壁で密閉されていて
、前記第２ノズルの出力口は第１ノズルの出力口近傍に
設置され、前記第２ノズルの入口端から圧入された気体
を第１ノズルからの前記吐出材料の吐出を推進する方向
に噴射するよう第２ノズル出力口を配設したクリームは
んだ塗布装置。1. A barrel that encloses a discharge material, a plunger that applies pressure to the discharge material and acts as a piston within the barrel, a barrel inlet that sends air to the plunger, and a nozzle at the other end of the barrel. a first nozzle whose inlet part has an inner diameter wider than the inner diameter of the output port at the other end of the nozzle; a second nozzle is provided on the outer periphery of the first nozzle; the inner wall of the second nozzle also serves as the outer wall of the first nozzle; The second nozzle except for the inlet end and the output port is sealed by the outer wall of the second nozzle, and the output port of the second nozzle is installed near the output port of the first nozzle, and is press-fitted from the inlet end of the second nozzle. A cream solder applicator is provided with a second nozzle output port so as to inject the discharged gas in a direction that promotes discharge of the discharged material from the first nozzle.
設け、前記サイドノズルの出力口を第１ノズルの近傍に
設け、吐出材料の吐出を推進する方向に前記サイドノズ
ルから気体を噴射する請求項１記載のクリームはんだ塗
布装置。2. A side nozzle is provided in the periphery of the first nozzle, an output port of the side nozzle is provided near the first nozzle, and gas is injected from the side nozzle in a direction that promotes the discharge of the discharged material. Item 1. Cream solder applicator according to item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3071587A JPH04309460A (en) | 1991-04-04 | 1991-04-04 | Cream solder applying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3071587A JPH04309460A (en) | 1991-04-04 | 1991-04-04 | Cream solder applying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04309460A true JPH04309460A (en) | 1992-11-02 |
Family
ID=13464962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3071587A Pending JPH04309460A (en) | 1991-04-04 | 1991-04-04 | Cream solder applying device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04309460A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11179265A (en) * | 1997-09-18 | 1999-07-06 | Sez Semiconductor Equip Zubehoer Fuer Die Halbleiterfertigung Gmbh | Antidripping device |
| US7401744B2 (en) | 2001-04-27 | 2008-07-22 | Mydata Automation Ab | Jetting device and a method of jetting device |
| KR20150113831A (en) | 2014-03-31 | 2015-10-08 | 토와 가부시기가이샤 | Resin molding apparatus and resin molding method |
| CN106029279A (en) * | 2014-02-27 | 2016-10-12 | 富士机械制造株式会社 | Solder supply device and solder supply method |
| CN106029278A (en) * | 2014-02-26 | 2016-10-12 | 富士机械制造株式会社 | Solder delivery system |
| WO2019032417A1 (en) * | 2017-08-08 | 2019-02-14 | Illinois Tool Works Inc. | Tin paste nozzle, work-bench and tin paste feeding apparatus |
| CN109392298A (en) * | 2017-08-08 | 2019-02-26 | 伊利诺斯工具制品有限公司 | Tin cream nozzle, workbench and automatic tin cream adding device |
-
1991
- 1991-04-04 JP JP3071587A patent/JPH04309460A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11179265A (en) * | 1997-09-18 | 1999-07-06 | Sez Semiconductor Equip Zubehoer Fuer Die Halbleiterfertigung Gmbh | Antidripping device |
| US7401744B2 (en) | 2001-04-27 | 2008-07-22 | Mydata Automation Ab | Jetting device and a method of jetting device |
| CN106029278A (en) * | 2014-02-26 | 2016-10-12 | 富士机械制造株式会社 | Solder delivery system |
| EP3112071A4 (en) * | 2014-02-26 | 2018-01-03 | Fuji Machine Mfg. Co., Ltd. | Solder delivery system |
| CN106029279A (en) * | 2014-02-27 | 2016-10-12 | 富士机械制造株式会社 | Solder supply device and solder supply method |
| EP3112070A4 (en) * | 2014-02-27 | 2017-12-27 | Fuji Machine Mfg. Co., Ltd. | Solder supply device and solder supply method |
| US10399169B2 (en) | 2014-02-27 | 2019-09-03 | Fuji Corporation | Solder supply device and solder supply method |
| KR20150113831A (en) | 2014-03-31 | 2015-10-08 | 토와 가부시기가이샤 | Resin molding apparatus and resin molding method |
| WO2019032417A1 (en) * | 2017-08-08 | 2019-02-14 | Illinois Tool Works Inc. | Tin paste nozzle, work-bench and tin paste feeding apparatus |
| CN109392298A (en) * | 2017-08-08 | 2019-02-26 | 伊利诺斯工具制品有限公司 | Tin cream nozzle, workbench and automatic tin cream adding device |
| CN109392298B (en) * | 2017-08-08 | 2021-10-01 | 伊利诺斯工具制品有限公司 | Solder paste nozzle, workbench and solder paste adding device |
| TWI768086B (en) * | 2017-08-08 | 2022-06-21 | 美商伊利諾工具工程公司 | Tin paste nozzle, work-bench and tin paste feeding apparatus |
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