KR102054292B1 - Discharging apparatus, discharging method, resin molding apparatus, and method for producing resin molded product - Google Patents

Abstract

The time required for the step of discharging fluid resin such as liquid resin is shortened. The dispenser 15 as a discharge device includes a mechanism including at least a syringe 20 as a storage unit for storing the liquid resin 32 as the flowable resin, and a plunger 27 as an extrusion mechanism for pushing the liquid resin 32; , A discharger 17 connected to the syringe 20 to discharge the liquid resin 32, an elastically deformable tube 36 mounted on the discharger 17, and a clamper movable by inserting the tube 36. 18 and a control unit 31 for controlling the amount of movement of the clamper 18 are provided.

Description

Dispensing apparatus, discharging method, resin molding apparatus and manufacturing method of resin molded article {DISCHARGING APPARATUS, DISCHARGING METHOD, RESIN MOLDING APPARATUS, AND METHOD FOR PRODUCING RESIN MOLDED PRODUCT}

The present invention relates to a discharge device for discharging fluid resin such as liquid resin to a discharge object, a discharge method, a resin molding device, and a method for producing a resin molded article.

Conventionally, the semiconductor chip attached to the board | substrate is resin-sealed using solid resin, such as granular resin and sheet-like resin, or liquid resin. For example, Patent Literature 1 discloses a technique of sealing a resin using liquid resin and discharging the liquid resin to the substrate from a nozzle attached to the tip of the dispenser using a dispenser which is a discharge device of liquid resin. have. And as shown in FIGS. 3-6 of patent document 1, it is proposed to measure the weight of the board | substrate before and behind liquid resin discharge using a weighing apparatus. The weight of the resin discharged can be calculated by measuring the weight of the substrate before and after the discharge. If the discharge resin weight is in the allowable range, the process proceeds to the next step. When the discharge resin weight is out of the allowable value range, the correction resin discharge amount (= target discharge resin weight-discharge resin weight) is calculated to perform further discharge.

Japanese Unexamined Patent Publication No. 2003-165133

However, the discharge device disclosed in Patent Document 1 has the following problems. In the case of using the liquid resin, the liquid leakage of the liquid resin may occur from the discharge port of the nozzle at the time when the discharge of the liquid resin is stopped. In particular, when a high viscosity liquid resin is used, a liquid leakage phenomenon occurs remarkably. The liquid resin in the liquid leakage state sags downward from the discharge port as residual resin. When a liquid leakage phenomenon occurs, it waits until the residual resin falls naturally and the liquid leakage state is eliminated. Therefore, the liquid leakage elimination time becomes long depending on the properties of the resin or the curing progress state, so that a large amount of time may be required before the liquid resin discharging step is completed. In order to measure the weight of the substrate after discharging the liquid resin, it is necessary to wait until the discharging step of the liquid resin is completed. Therefore, a large amount of time is required to determine whether the target discharge resin weight has been discharged, and the productivity of the discharge device is significantly reduced.

The present invention solves the above problems, and provides a discharge device, a discharge method, a resin molding device, and a method for producing a resin molded article, which can shorten the time required for a discharge step of a fluid resin such as a liquid resin. For the purpose of

In order to solve the said subject, the discharge apparatus which concerns on this invention is a storage part which stores a fluid resin, the extrusion mechanism which pushes out a fluid resin, the discharge part connected to a storage part, and discharges fluid resin, and a discharge part, An elastically deformable tube mounted therein, a clamper movable by inserting the tube, and a control unit for controlling the amount of movement of the clamper.

In order to solve the said subject, the discharge method which concerns on this invention pushes out a fluid resin discharged from the elastically deformable tube mounted in the discharge part connected to the storage part by pushing the fluid resin stored in the storage part. The process and the extracting process of extracting the residual resin which remain | survives in a tube by clamping a tube by a clamper and moving a clamper downward.

According to this invention, the time required for the discharge process of fluid resins, such as liquid resin, can be shortened.

1 is a plan view showing an outline of an apparatus in the resin molding apparatus of Embodiment 1. FIG.
FIG.2 (a) is a schematic plan view of the dispenser used by the resin molding apparatus shown in FIG. 1, (b) is an enlarged view of the discharge part shown to (a).
FIG. 3A is a cross-sectional view taken along a line AA of the dispenser shown in FIG. 2, and FIG.
Fig.4 (a)-(d) is schematic sectional drawing which shows the operation | movement which discharges liquid resin using the dispenser shown in FIG. 2, and the operation | movement which pulls out residual resin in a tube.
5 (a) to 5 (c) are schematic cross-sectional views showing a step of resin molding using the resin molding apparatus shown in FIG.
6 (a) to 6 (b) are schematic cross-sectional views showing modifications of the dispenser used in the second embodiment.
7 (a) to 7 (c) are schematic cross-sectional views showing modifications and operations of the dispenser used in the third embodiment.
8 (A) to (C) are schematic views each showing the resin amount of the liquid resin remaining in the syringe in the conventional dispenser.
9A to 9C are schematic diagrams each illustrating the resin amounts of the liquid resin remaining in the syringe of the dispenser of the present invention.
10 (a) to 10 (c) are schematic diagrams showing the stroke amounts for moving the clamper in accordance with the resin amount of the liquid resin remaining in the syringe using the dispenser shown in the first embodiment in the fourth embodiment.
FIG. 11 is a plan view showing an outline of an apparatus in the resin molding apparatus of Embodiment 5. FIG.
12 (a) to 12 (d) are schematic cross-sectional views showing a step of discharging a liquid resin onto a release film using the resin molding apparatus shown in FIG. 11.
It is a schematic diagram which shows the liquid resin state discharged on the release film, (a) is a top view, (b) is CC sectional drawing.
FIG.14 (a)-(c) are schematic sectional drawing which shows the process of supplying liquid molding on the mold release film shown to FIG. 13, and resin molding.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment which concerns on this invention is described with reference to drawings. In this application document, in order to make it clear in any drawing, it abbreviate | omits or exaggerates suitably and is drawn typically. About the same component, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably. In addition, in this application document, the term "liquid phase" means a liquid phase and fluidity at normal temperature, and the level of fluidity, that is, the degree of viscosity is not considered. In addition, in this application document, a "resin molded article" means the product which contains the resin part at least resin-molded, and the chip | tip attached to the board | substrate mentioned later is resin-molded by the shaping | molding die, and the sealing of the resin-sealed form is completed. A representation of a concept involving a substrate.

Embodiment 1

(Configuration of Resin Molding Device)

The structure of the resin molding apparatus of Embodiment 1 which concerns on this invention is demonstrated with reference to FIG. The resin molding apparatus 1 shown in FIG. 1 is a resin molding apparatus using the compression molding method. In Embodiment 1, when the board | substrate with a semiconductor chip is resin-molded, the case where liquid resin which is fluid resin is used as a resin material is shown, for example. Moreover, as a "substrate", general boards, such as a glass epoxy board | substrate, a ceramic board | substrate, a resin board | substrate, and a metal board | substrate, a lead frame, etc. are mentioned.

The resin molding apparatus 1 is provided with the board | substrate supply and storage module 2, three shaping | molding modules 3A, 3B, and 3C, and the resin supply module 4 as a component, respectively. The board | substrate supply and storage module 2 which is a component, the shaping | molding module 3A, 3B, 3C, and the resin supply module 4 can be mutually detached with respect to another component, and can also be exchanged. have.

In the board | substrate supply and storage module 2, the board | substrate supply part 6 which supplies the board | substrate 5 before sealing, the sealed board | substrate storage part 8 which accommodates the sealed board 7, and the board | substrate before sealing The board | substrate mounting part 9 which delivers the 5 and the sealed board | substrate 7, and the board | substrate conveyance mechanism 10 which conveys the board | substrate 5 before sealing and the sealed board | substrate 7 are provided. The predetermined position S1 is a position to wait in the state where the substrate transfer mechanism 10 does not operate.

Each shaping | molding module 3A, 3B, 3C is provided with the lower mold | type 11 which can be elevated, and the upper mold | type (not shown, see FIG. 5) arrange | positioned facing the lower mold | type 11. The upper mold | type and the lower mold | type 11 combine and comprise a shaping | molding die. Each shaping | molding module 3A, 3B, 3C has the frame clamping mechanism 12 which frame-fastens and mold-opens the upper mold | type and the lower mold | type 11 (circular part shown by the dashed-dotted line of FIG. 2). A cavity 13, which is a space where liquid resin, which is a resin material, is supplied and cured, is provided in the lower mold 11. The lower mold | type 11 is provided with the release film supply mechanism 14 which supplies a mold release film of a long length form. In addition, although the structure provided with the cavity 13 in the lower mold | type 11 is demonstrated here, a cavity may be provided in an upper mold | type and may be provided in both an upper mold | type and a lower mold | type.

The resin supply module 4 is provided with a dispenser 15 which is a discharge device for discharging liquid resin to a molding die (cavity 13) and a resin conveyance mechanism 16 for conveying the dispenser 15. The dispenser 15 has a discharge portion 17 for discharging the liquid resin at the tip portion. The discharge part 17 is provided with a clamper 18 which is movable by inserting an elastically deformable tube (see FIGS. 2 to 3) attached to the discharge part 17. The structure of the dispenser 15, the discharge part 17, and the clamper 18 is demonstrated in detail in the part which mentions FIGS. The predetermined position R1 is a position to wait in a state where the resin conveyance mechanism 16 (including the dispenser 15) does not operate.

The dispenser 15 shown in FIG. 1 is a one-liquid type | mold dispenser which uses the liquid resin to which the main body and the hardening | curing agent were mixed previously. As the subject, for example, a thermosetting silicone resin or epoxy resin is used. When discharging a liquid resin, the two-liquid mixing type dispenser which mixes a main material and a hardening | curing agent can also be used.

The resin supply module 4 is provided with a control unit CTL for controlling the operation of the resin molding apparatus 1. The control unit CTL controls the conveyance of the pre-sealing substrate 5 and the sealed substrate 7, the conveyance of the dispenser 15, the discharge of the liquid resin, the heating of the molding die, the opening and closing of the molding die, and the like. In other words, the control unit CTL controls the respective operations in the substrate supply and storage module 2, the molding modules 3A, 3B, and 3C, and the resin supply module 4.

The position where the control part CTL is arrange | positioned may be anywhere, and you may arrange | position in at least one of the board | substrate supply and storage module 2, the shaping | molding module 3A, 3B, 3C, and the resin supply module 4, It can also be placed outside. Moreover, the control part CTL can also be comprised as a some control part which isolate | separated at least one part corresponding to the operation used as a control object.

(Configuration of the Dispenser)

With reference to FIGS. 2-3, the structure of the dispenser 15 used in the resin molding apparatus 1 shown in FIG. 1 is demonstrated. As shown in FIG. 2, the dispenser 15 includes an extrusion mechanism 19 for pushing the liquid resin, a syringe 20 for storing the liquid resin, and a connecting portion 21 for connecting the syringe 20 and the nozzle. ) And a nozzle 22 for discharging the liquid resin. The dispenser 15 is integrally formed by connecting the extrusion mechanism 19, the syringe 20, the connecting portion 21, and the nozzle 22. The syringe 20 or the nozzle 22 can be replaced with another syringe or nozzle corresponding to each use.

The extrusion mechanism 19 is equipped with a servo motor 23, a ball screw 24 rotated by the servo motor 23, and a ball screw nut (not shown), and a slider for converting rotational motion into linear motion ( 25, a rod 26 fixed to the tip of the slider 25 and having an insertion hole therein, and a plunger 27 attached to the tip of the rod 26. The ball screw 24 is supported by the ball screw bearing 28. The slider 25 moves to a Y direction along the guide rail 29 provided in the base of the extrusion mechanism 19, for example. As the servo motor 23 rotates, the plunger 27 moves in the Y direction through the ball screw 24, the slider 25, and the rod 26, respectively.

The servo motor 23 is a motor capable of controlling the rotation of the motor. The servo motor 23 has the encoder 30 which is a rotation detector which monitors rotation of a motor. The encoder 30 detects the rotation angle and rotation speed of the servo motor 23 and feeds back to the control unit 31. The control unit 31 controls the rotation of the servo motor 23 based on the feedback signal from the encoder 30. By controlling the rotation of the servo motor 23, the position control, the speed control, the torque control, etc. of the plunger 27 can be performed with high precision. In addition, the control part 31 may be assembled with the control part CTL of the resin molding apparatus 1 shown in FIG. 1, and may be provided independently from the control part CTL.

The syringe 20 in which the liquid resin 32 is stored is connected to the extrusion mechanism 19 by the syringe mounting screw 33. The plunger 27 is inserted into the syringe 20 so that the outer diameter of the plunger 27 and the inner diameter of the syringe 20 coincide. O-rings (not shown) which are sealing materials are mounted around the plunger 27. By controlling the rotation of the servo motor 23, the movement amount (stroke amount) of the plunger 27 is controlled. The discharge amount of the liquid resin 32 discharged from the dispenser 15 (discharge part 17) is set by the product of the internal cross-sectional area of the syringe 20 and the movement amount of the plunger 27. By replacing the syringe 20, the resin amount of the liquid resin 32 stored in the dispenser 15 can be arbitrarily set.

As shown in FIG.2 (b), FIG.3, the discharge part 17 is provided with the nozzle 22 which has the discharge opening 34, the joint 35 attached to the discharge opening 34, and the joint 35. As shown in FIG. An elastically deformable tube 36 is fitted. As the material of the joint 35, for example, polyethylene having heat resistance, polypropylene, polyvinylidene fluoride (PVDF: PolyVinylidene DiFluoride) and the like are used. As the tube 36, silicone rubber, fluorine rubber, etc. which have flexibility and heat resistance are used, for example.

As shown in FIG.2 (a) and FIG.3, in the dispenser 15, the clamper 18 which can move the tube 36 in both sides of the tube 36 is provided. The clamper 18 is constituted by a pair of roller support members 37 and 38. The roller support member 37 is, for example, one rod-shaped member 37a along the Y direction, two rod-shaped members 37b connected to both ends of the rod-shaped member 37a and along the X direction, and It is comprised by the two rod-shaped members 37c connected to each rod-shaped member 37b along the Z direction. Similarly, the roller support member 38 is connected to one rod-shaped member 38a along the Y direction, two rod-shaped members 38b connected to both ends of the rod-shaped member 38a and along the X direction, respectively. It is connected to the rod-shaped member 38b of and comprised by the two rod-shaped member 38c along a Z direction.

The rollers 39 and 40 are rotatably mounted to the roller support members 37 and 38 constituting the clamper 18, respectively. That is, the rollers 39 and 40 are rotatably supported by the roller support members 37 and 38, respectively. The roller 39 is fitted to the rod-shaped member 37a constituting the clamper 18, moved in the X direction by the rod-shaped member 37b, and moved in the Z direction by the rod-shaped member 37c. Similarly, the roller 40 is fitted to the rod-shaped member 38a constituting the clamper 18, moved in the X direction by the rod-shaped member 38b, and moved in the Z direction by the rod-shaped member 38c. do.

As shown in FIG. 3, the two rod-shaped members 37c constituting the clamper 18 are connected to the connecting member 41. The connection member 41 is connected to the movement mechanism 42 which moves the roller support member 37 to an X direction, and is connected to the movement mechanism 43 which moves the roller support member 37 to a Z direction. . Similarly, the two rod-shaped members 38c constituting the clamper 18 are connected to the connecting member 44. The connection member 44 is connected to the movement mechanism 45 which moves the roller support member 38 to an X direction, and is connected to the movement mechanism 46 which moves the roller support member 38 to a Z direction. .

The movement mechanisms 42, 43, 45, 46 are comprised by the combination of a drive source and a transmission member. For example, a combination of a servo motor and a ball screw, a combination of a hydraulic cylinder and a rod is used as the moving mechanism. In addition, the movement mechanism is not limited to the said structure, What is necessary is just a structure which can move the roller support members 37 and 38 to a X direction and a Z direction, respectively.

As shown in FIG. 2 (a) and FIG. 3, the liquid resin 32 stored in the syringe 20 is pushed out by the plunger 27, and the resin passage 47 and the nozzle (formed in the connecting portion 21). It discharges downward from the discharge part 17 via the discharge port 34 formed in 22, and the tube 36 fitted in the joint 35, respectively.

(Discharge Method of Liquid Resin and Manufacturing Method of Resin Molded Article)

Hereinafter, the operation | movement of the resin molding apparatus 1 containing the dispenser 15 which is a discharge apparatus is served, and the discharge method of a liquid resin and the manufacturing method of a resin molded article are demonstrated. After describing the discharging method using the dispenser 15, the manufacturing method of the resin molded article using the whole resin molding apparatus 1 is described.

(Discharge method (pushing step and extracting step) of liquid resin)

With reference to FIGS. 2-4, the process of pushing out the liquid resin 32 in the dispenser 15, and the process of extracting the residual resin which remains in the tube 36 by the clamper 18, ie, pushing out liquid resin The discharge method (discharge step) including the step and the extraction step will be described.

As shown in Fig. 2A, in the pushing out step, the plunger 27 is -Y through the ball screw 24, the slider 25, and the rod 26 by rotating the servo motor 23. To move in the direction of By moving the plunger 27 in the -Y direction, the liquid resin 32 stored in the syringe 20 is pressurized, and the liquid resin 32 is pushed in the -Y direction.

As shown to FIG. 3, FIG. 4 (a), the liquid resin 32 pushed out by the plunger 27 is discharge part 17 via the connection part 21, the nozzle 22, and the tube 36, respectively. ) Is discharged downward from the tip of the tube 36.

By discharging the dispenser 15 (starting the pushing operation of the plunger 27), the liquid resin is discharged from the discharge unit 17 (the tip of the tube 36) to the discharge target. As the plunger 27 pressurizes the liquid resin 32, pressure is applied to the liquid resin 32 in the syringe 20, and the resin pressure of the liquid resin 32 is increased. Even if the discharge of the dispenser 15 is stopped (the pushing operation of the plunger 27 is stopped), the liquid resin 32 in the syringe 20 maintains a state where the resin pressure is high. Until the resin pressure of the liquid resin 32 in the syringe 20 reaches atmospheric pressure, the liquid resin is discharged from the discharge portion 17 to the discharge object by the resin pressure of the liquid resin 32. As a so-called liquid leak phenomenon, the liquid resin is poured from the discharge portion 17 onto the discharge object (discharge continues).

In order to make the extraction process in the discharge process of a liquid resin easy to understand, as shown in FIG.4 (a), in the state immediately after stopping the pushing operation of the plunger 27, in the syringe 20 for convenience. The liquid resin stored in the liquid resin 32 and the tube 36 remaining in the stored liquid resin is called the liquid leakage resin 49 in which the liquid resin struck from the tip of the residual resin 48 and the tube 36.

With reference to FIGS. 4A to 4D, by using the clamper 18 provided in the discharge portion 17 of the dispenser 15, the residual resin 48 and the tube remaining in the tube 36 are retained. The extraction process of extracting the liquid leakage resin 49 struck from the tip of (36) and completing the discharge at an early stage will be described.

First, as shown in Fig. 4A, the discharge of the dispenser 15 is stopped (the pushing operation of the plunger 27 is stopped), and a liquid leak phenomenon occurs, for example, the plunger ( After 5 seconds of stopping the pushing operation of 27), the clamper 18 is lowered to a predetermined position outside the tube 36. Specifically, the rollers 39 and 40 are moved out of the tube 36 by lowering the roller supporting members 37 and 38 using the moving mechanisms 43 and 46 (see FIG. 3 (b)). It stops at a predetermined position.

Next, as shown in FIG.4 (b), the tube 36 is clamped by the clamper 18 from both sides. Specifically, the roller supporting member 37 is moved in the -X direction using the moving mechanism 42 (see FIG. 3 (b)), and the moving mechanism 45 (see FIG. 3 (b)) is further moved. To move the roller support member 38 in the + X direction. As a result, the tube 36 is sandwiched between both sides by the roller 39 and the roller 40, thereby preventing passage of the liquid resin (residual resin 48) in the tube 36.

Next, as shown in Fig. 4 (c), the clamper 18 is lowered by a predetermined stroke amount while the tube 36 is sandwiched from both sides by the clamper 18 (rollers 39 and 40). . Specifically, the roller support members 37 and 38 are lowered using the movement mechanisms 43 and 46 (refer FIG. 3 (b)). While the tube 36 is sandwiched by the rollers 39 and 40, the rollers 39 and 40 are lowered while being rotated. As a result, the residual resin 48 remaining below the position where the tube 36 is sandwiched by the rollers 39 and 40 and the liquid leaking resin 49 sagging from the tip of the tube 36 are clamped by the clamper 18. Is forcibly pulled by

By the process of extracting the liquid resin by the clamper 18, for example, when using a low viscosity liquid resin, the residual resin remaining in the tube 36 by lowering the clamper 18 ( 48 and almost all of the liquid leaking resin 49 sagging from the tip of the tube 36 can be taken out. In addition, when using a high viscosity liquid resin, as shown in FIG.4 (c), some residual resin 50 of a drooping state may remain. However, since the residual resin 50 in this drooped state falls in a short time, such a large time is not lost. The liquid resin can be discharged early by performing the step of extracting the liquid resin by the clamper 18. As described above, the discharging step can be completed.

In addition, after the state where the residual resin 50 in the drooped state leads to the discharge object is eliminated, a dish-shaped resin receiving member is disposed under the residual resin 50 in the drooped state, and the drooped state by the resin receiving member In a state where the residual resin 50 is received, the dispenser 15 may be moved relatively to the discharge object as described later.

Next, as shown in FIG. 4 (d), the clamper 18 is separated from the tube 36 and returned to its original position. As a result, the tube 36 opens from the elastically deformed state and returns to the initial state. Over time, the tube 36 returns to the initial state filled by the liquid resin 32. In the vicinity of the lower end of the tube 36, there may be a space where the liquid resin 32 does not exist due to the surface tension of the liquid resin 32.

(Method for producing resin molded article)

With reference to FIG. 1, FIG. 5, the manufacturing method of the resin molded article in the case of resin-sealing the semiconductor chip mounted in the board | substrate in the resin molding apparatus 1 is demonstrated. The case where the shaping | molding module 3B is used as an operation | movement of the resin molding apparatus 1 is demonstrated.

First, as shown in FIG. 1, the encapsulation board | substrate 5 with which the some semiconductor chip 51 (refer FIG. 5 (a)) is mounted is sealed with the surface on which the semiconductor chip 51 is mounted below. The board | substrate 5 before sealing is sent from the board | substrate supply part 6 to the board | substrate mounting part 9. Next, the board | substrate conveyance mechanism 10 is moved from the predetermined position S1 to -Y direction, and the board | substrate 5 before sealing is received from the board | substrate mounting part 9. The board | substrate conveyance mechanism 10 is returned to predetermined position S1.

Next, the board | substrate conveyance mechanism 10 is moved to + X direction to the predetermined position M1 of the shaping | molding module 3B, for example. Next, in the shaping | molding module 3B, the board | substrate conveyance mechanism 10 is moved to -Y direction, and it stops at the predetermined position C1 above the lower mold | type 11. Next, the substrate transfer mechanism 10 is raised to fix the substrate 5 before sealing to the mold surface of the upper mold 52 by suction or a clamper (see FIG. 5 (a)). The upper mold 52 and the lower mold 11 combine to form a mold 53. The board | substrate conveyance mechanism 10 is returned to the predetermined position S1 of the board | substrate supply and storage module 2.

Next, in the shaping | molding module 3B, the mold release film 54 (refer FIG. 5 (a)) of a long length shape is supplied to the lower mold | type 11 from the mold release film supply mechanism 14. Next, the release film 54 is adsorbed along the mold surface of the cavity 13 by the adsorption mechanism (not shown) provided in the lower die 11.

Next, the dispenser 15 is moved in the -X direction to the predetermined position M1 of the shaping | molding module 3B using the resin conveyance mechanism 16. Next, in the molding module 3B, the resin conveyance mechanism 16 is moved in the -Y direction to stop the dispenser 15 at the predetermined position C1 above the lower mold 11 (Fig. 5 (a)). Reference).

As shown in FIG. 5A, the dispenser 15 is disposed at a predetermined position between the upper mold 52 and the lower mold 11 by the resin conveyance mechanism 16. The liquid resin 32 is discharged to the cavity 13 from the discharge portion 17 provided at the tip of the dispenser 15. In this case, the cavity 13 of the lower mold 11 is a discharge object from which the liquid resin 32 is discharged. The residual resin 48 in the tube 36 attached to the discharge part 17 and the sagging liquid leaking resin 49 from the tip of the tube 36 are pulled out by the clamper 18 (see FIG. 4). By this discharge process, liquid resin can be discharged to the cavity 13 early. The dispenser 15 is returned to the predetermined position M1 using the resin conveyance mechanism 16.

Next, as shown in Fig. 5 (b), the liquid resin 32 is heated and melted to produce a flowable resin 55 having a reduced viscosity. The lower mold | type 11 is raised using the frame clamping mechanism 12 (refer FIG. 1), and the upper mold | type 52 and the lower mold | type 11 are frame-tightened. By frame fastening, the semiconductor chip 51 attached to the board | substrate 5 before sealing is immersed in the fluid resin 55 produced in the cavity 13. At this time, predetermined | prescribed resin pressure can be applied to the fluid resin 55 in the cavity 13 using the cavity bottom member (not shown) provided in the lower die 11.

In the process of tightening the frame, the inside of the cavity 13 may be sucked using a vacuum forming mechanism (not shown). As a result, air remaining in the cavity 13, bubbles contained in the flowable resin 55, and the like are discharged to the outside of the molding die 53. In addition, the cavity 13 is set in a predetermined vacuum degree.

Next, using the heater (not shown) provided in the lower mold | type 11, the fluid resin 55 is heated for the time required in order to harden the fluid resin 55. FIG. The flowable resin 55 is cured to form the cured resin 56. Thereby, the semiconductor chip 51 attached to the board | substrate 5 before sealing is resin-sealed by the cured resin 56 shape | molded corresponding to the shape of the cavity 13. In this way, the resin molding step can be performed.

Next, as shown in FIG.5 (c), after hardening the fluid resin 55, the upper mold | type 52 and the lower mold | type 11 are opened using the mold clamping mechanism 12. Then, as shown to FIG. A resin molded product 57 (sealed substrate 7) sealed with resin is fixed to the mold surface of the upper mold 52.

Next, the board | substrate conveyance mechanism 10 is moved from the predetermined position S1 of the board | substrate supply and storage module 2 to the predetermined position C1 above the lower mold 11, and the sealing board 7 is received. Next, the board | substrate conveyance mechanism 10 is moved and the sealed board | substrate 7 is handed over to the board | substrate mounting part 9. The sealed substrate 7 is stored in the sealed substrate storage portion 8 from the substrate mounting portion 9. In this step, resin sealing is completed.

In addition, each of the cut | disconnected areas may become a product by cutting | disconnecting the resin molded article 57 (sealed completed board | substrate 7) for every area | region in which the semiconductor chip 51 was mounted. In addition, by cutting a part of the area where the semiconductor chip 51 is mounted, a part of the area may be a product. In addition, the resin molded article 57 itself may be one product.

(Action effect)

The dispenser 15, which is the discharge device of the present embodiment, includes at least a syringe 20, which is a storage unit for storing the liquid resin 32, which is a flowable resin, and a plunger 27, which is an extrusion mechanism for pushing the liquid resin 32. A mechanism, including a discharge portion 17 connected to the syringe 20 to discharge the liquid resin 32, an elastically deformable tube 36 mounted on the discharge portion 17, and a tube 36. The clamper 18 which can be inserted and moved, and the control part 31 which controls the movement amount of the clamper 18 are comprised.

With such a configuration, the residual residue remaining in the tube 36 by inserting the tube 36 mounted on the discharge portion 17 of the dispenser 15 into the clamper 18 and lowering the clamper 18 is lowered. The resin 48 can be forcibly pulled out by the clamper 18. Thereby, liquid resin can be discharged early from the discharge part 17 of the dispenser 15. FIG. That is, the time required for the discharging step of the fluid resin such as liquid resin can be shortened. Therefore, productivity of the resin molded article manufactured by performing the discharge process of fluid resin can be improved.

The discharge method of this embodiment is elastically deformable attached to the discharge part 17 connected to the syringe 20 by pushing out the liquid resin 32 which is the fluid resin stored in the syringe 20 which is a storage part. The extrusion step of discharging the liquid resin 32 from the tube 36 and the tube 36 are fitted by the clamper 18 to move the clamper 18 downward, thereby remaining in the tube 36. And extracting, which extracts the remaining resin 48 to be extracted.

According to this method, the residual resin remaining in the tube 36 by inserting the tube 36 attached to the discharge portion 17 of the dispenser 15 into the clamper 18 and lowering the clamper 18 ( 48 can be forcibly pulled out by the clamper 18. Thereby, liquid resin can be discharged early from the discharge part 17 of the dispenser 15. FIG. That is, the time required for the discharging step of the fluid resin such as liquid resin can be shortened. Therefore, the productivity of the resin molded article manufactured by discharging fluid resin can be improved.

According to this embodiment, the tube 36 which can be elastically deformed is attached to the discharge part 17 of the dispenser 15. As shown in FIG. Both sides of the tube 36 are provided with a clamper 18 which is movable by inserting the tube 36. Even if a liquid leakage phenomenon occurs from the discharge portion 17 of the dispenser 15, the residual resin 48 remaining in the tube 36 by lowering the clamper 18 by inserting the tube 36 into the clamper 18. ) And the liquid leaking resin 49 drooping from the tip of the tube 36 can be forcibly pulled out by the clamper 18.

According to the present embodiment, the liquid resin remaining in the discharge portion 17 of the dispenser 15 sags instead of naturally falling, and is forcibly pulled out using the clamper 18. Thereby, time to discharge liquid resin can be shortened. Therefore, the production efficiency of the dispenser 15 can be improved. In addition, the productivity of the resin molding apparatus 1 can be improved.

According to this embodiment, the residual resin 48 remaining in the tube 36 and the liquid leaking resin 49 drooping from the tip of the tube 36 are forcibly pulled out by the clamper 18, and are required for the discharge step. This can shorten the time. As a result, by allowing the liquid leaking resin 49 to stand, it can be suppressed that the liquid leaking resin 49 is scattered to urea parts and the like around the cavity 13 that is the discharge target. Therefore, contamination of the resin molding apparatus 1 by the scattered resin can be suppressed. Moreover, it can suppress that scattered resin hardens | cures and the malfunction of the resin molding apparatus 1 generate | occur | produces.

According to this embodiment, the liquid resin can be discharged to the cavity 13 early, without leaving the liquid leakage resin 49 for a long time using the clamper 18. Therefore, the dispersion | variation in the distribution of the liquid resin supplied in the cavity 13, and the variation in thickness can be suppressed. Thereby, the dispersion | variation in the resin thickness of the resin molded article 57 by resin sealing can be reduced. In addition, the occurrence of appearance defects such as flow marks can also be reduced.

In the present embodiment, after the dispenser 15 stops the discharge operation (the plunger 27 stops the pushing operation), the clamper 18 sandwiches the tube 36 and the remaining resin 48 in the tube 36. ) Is shown. In addition to this, the clamper 18 may insert the tube 36 at the same time as the plunger 27 stops the pushing operation, and a while before the plunger 27 stops the pushing operation. You may perform in a step.

In addition, in this embodiment, the structure provided with the board | substrate supply and storage module 2, three shaping | molding modules 3A, 3B, 3C, and the resin supply module 4 as the resin molding apparatus 1 is demonstrated. did. The resin molding apparatus is not limited to this configuration, and may be a device having at least a molding die, a discharge device for discharging liquid resin, and a mold clamping mechanism for clamping the molding die, and having a function of resin molding.

Embodiment 2

(Modification 1 of the dispenser)

With reference to FIG. 6, the dispenser used in Embodiment 2 is demonstrated. The difference from Embodiment 1 is that the structure of the clamper is changed in the dispenser. Since the other structure is the same as that of Embodiment 1, the same component attaches | subjects the same code | symbol and abbreviate | omits description.

As shown in FIG. 6, in the dispenser 58, clampers 59 are provided on both sides of the tube 36 to move the tube 36. The clamper 59 is comprised by a pair of roller support members 60 and 61. The roller supporting member 60 is connected to one rod-shaped member 60a along the Y direction, one rod-shaped member 60b along the X direction and connected to one end of the rod-shaped member 60a, and a rod-shaped member. It is comprised by the one rod-shaped member 60c connected to 60b and along a Z direction. Similarly, the roller support member 61 is connected to one rod-shaped member 61a along the Y direction, one rod-shaped member 61b along the X direction by being connected to one end of the rod-shaped member 61a, and a rod. It is comprised by the one rod-shaped member 61c connected to the shape member 61b along the Z direction.

As in the first embodiment, the rollers 39 and 40 are rotatably mounted to the roller supporting members 60 and 61 constituting the clamper 59, respectively. That is, the rollers 39 and 40 are rotatably supported by the roller support members 60 and 61, respectively. The roller 39 is fitted to the rod-shaped member 60a constituting the clamper 59, moved in the X direction by the rod-shaped member 60b, and moved in the Z direction by the rod-shaped member 60c. Similarly, the roller 40 is fitted to the rod-shaped member 61a constituting the clamper 59, moved in the X direction by the rod-shaped member 61b, and moved in the Z direction by the rod-shaped member 61c. do.

One rod-shaped member 60c constituting the clamper 59 is connected to the connecting member 62. The connection member 62 is connected to the movement mechanism 42 which moves the roller support member 60 to an X direction, and is connected to the movement mechanism 43 which moves the roller support member 60 to a Z direction. . Similarly, one rod-shaped member 61c constituting the clamper 59 is connected to the connecting member 63. The connection member 63 is connected to the movement mechanism 45 which moves the roller support member 61 to an X direction, and is connected to the movement mechanism 46 which moves the roller support member 61 to a Z direction. .

The operation | movement which clamps the tube 36 from both sides by the clamper 59, and lowers | turns while rotating the rollers 39 and 40 is the same as that of Embodiment 1. As shown in FIG. Therefore, similarly to Embodiment 1, the residual resin 48 remaining in the tube 36 can be forcibly pulled out by the clamper 59. Thereby, liquid resin can be discharged early from the discharge part 17 of the dispenser 58. FIG.

According to the present embodiment, in the dispenser 58, the roller supporting members 60 and 61 constituting the clamper 59 are each formed by one rod-shaped member 60a, 60b, 60c and 61a, 61b, 61c. Configure. Therefore, the structure of the clamper 59 can be simplified more, and the cost of the dispenser 58 can be reduced.

In this embodiment, in the dispenser 58, the roller support members 60 and 61 (specifically, the rollers 39 and 40) which comprise the clamper 59 are arrange | positioned in parallel, and the tube 36 is provided in both sides. I put it in). Not only this, but the tube 36 can also be pinched by the roller support member (roller) opened to both sides about the support point like scissors. With such a configuration, the operation of the clamper can be simplified and the movement mechanism of the clamper can be simplified more.

Embodiment 3

(Modification 2 of the dispenser)

With reference to FIG. 7, the dispenser used in Embodiment 3 is demonstrated. The difference from Embodiment 1 is that in the dispenser, a roller supporting member and a roller are provided on one side with respect to the clamper, and a fixing plate fixed to the discharge portion is provided on the other side. Since the other structure is the same as that of Embodiment 1, the same component attaches | subjects the same code | symbol and abbreviate | omits description.

As shown in FIG. 7, in the dispenser 64, the discharge part 65 includes a nozzle 22 having a discharge port 34, a joint 35 attached to the discharge port 34, and a joint 35. An elastically deformable tube (36) fitted thereto and a fixed plate (66) fixed to the nozzle (22). The stationary plate 66 and the tube 36 are in contact with each other and disposed in the discharge part 65.

On the opposite side of the fixing plate 66, a clamper 67 which is movable by inserting the tube 36 is provided. The clamper 67 is comprised using the same thing as the roller support member 37 shown in Embodiment 1. FIG. The roller support member 37 is one rod-shaped member 37a along the Y direction, two rod-shaped members 37b connected to both ends of the rod-shaped member 37a and along the X direction, and each bar. It is comprised by the two rod-shaped members 37c connected to the shape member 37b along the Z direction. In addition, the fixed plate 66 may be considered to act as a clamper.

The roller 39 is rotatably mounted to the roller support member 37 constituting the clamper 67. That is, the roller 39 is rotatably supported by the roller support member 37. The roller 39 is fitted to the rod-shaped member 37a constituting the clamper 67, moved in the X direction by the rod-shaped member 37b, and moved in the Z direction by the rod-shaped member 37c. Since the structure and operation | movement of the connection member 41 and the movement mechanisms 42 and 43 are the same as that of Embodiment 1, description is abbreviate | omitted.

With reference to FIG.7 (c), the process of taking out the residual resin which remains in the tube 36 by the clamper 67 is demonstrated. First, the clamper 67 is lowered to the predetermined position outside the tube 36 using the moving mechanism 43. Next, the clamper 67 is moved in the -X direction using the moving mechanism 42, and the tube 36 is fitted by the clamper 67 (roller 39) and the fixing plate 66. Next, the clamper 67 is lowered while the tube 36 is sandwiched by the clamper 67 and the fixing plate 66. As a result, the residual resin remaining below the position where the tube 36 is inserted by the roller 39 and the tip of the tube 36 Forcibly pull out the sagging liquid leaking resin.

According to this embodiment, in the dispenser 64, the clamping plate 67 which fixes the fixed plate 66 to the discharge part 65, and inserts the tube 36 on the opposite side to the fixed plate 66 is provided. By clamping the tube 36 by the fixing plate 66 and the clamper 67 and lowering the roller 39 while rotating, the residual resin remaining in the tube 36 is forcibly pulled out by the clamper 67. Can be. Thereby, liquid resin can be discharged early from the discharge part 65 of the dispenser 64. FIG.

According to this embodiment, in the dispenser 64, the clamper 67 which can move the fixed plate 66 and the tube 36 to the discharge part 65 is provided. Since the clamper 67 is provided only on one side, the number of moving mechanisms can be reduced by half compared with the first embodiment. Therefore, the structure of the clamper mechanism containing a clamper can be simplified further, and the cost of the dispenser 64 can be further reduced.

Embodiment 4

In Embodiment 4, in the said embodiment, the structure which controls the movement amount which moves a clamper by a control part corresponding to the residual amount of fluid resin in a storage part is demonstrated. In addition, in the extraction process, a method of controlling the amount of movement of the clamper in accordance with the remaining amount of the flowable resin in the storage unit will be described.

In addition, in the said embodiment, when discharge is performed about a some discharge object, the case where a series of extrusion process and an extraction process are repeated multiple times is demonstrated. Here, the control part controls the movement amount which moves a clamper by the control part corresponding to the residual amount of the fluid resin in a storage part. The storage amount of the flowable resin in the storage portion is an amount corresponding to the plurality of discharge objects, and the amount of movement of the clamper by the control unit is different from at least two of the plurality of discharge objects.

(Comparative Example)

Prior to the description of the present embodiment, the variation of the discharge resin amount in the conventional dispenser will be described as a comparative example.

In the conventional dispenser, when the amount of discharge resin after a certain time from the start of discharge was examined, the amount of discharge resin discharged to the discharge object was different corresponding to the resin amount of the liquid resin in the syringe.

This phenomenon will be described with reference to FIG. 8. As shown in FIG. 8, the tube 36 and the clamper 18 are not provided in the conventional dispenser. FIG. 8 (A) is a state in which the value of the resin amount of the liquid resin 32 remaining in the syringe 20 is larger than that of the other, and FIG. 8 (B) shows the liquid resin remaining in the syringe 20 ( The value of the amount of resin of 32) is in the intermediate state compared with another, and FIG. 8 (C) is a state where the value of the amount of resin of the liquid resin 32 remaining in the syringe 20 is small compared with another.

In any of FIGS. 8A to 8C, the plunger 27 is pushed out by the same amount of movement, and the liquid resin 32 in the syringe 20 is discharged from the discharge port of the discharge unit 17, so that time is sufficient. When it passes, the resin amount corresponding to the movement amount of the plunger 27 is discharged.

However, after the pushing operation stop of the plunger 27, the amount of discharge resin after a relatively short time elapsed was examined. For example, in the case of Figs. 8 (A) to (C), (A) is the most. It became less, (C) was the most, and (B) was among them.

This phenomenon is considered as follows. For example, in any of the states of FIGS. 8A to 8C, when the plunger 27 is pushed out by the same amount of movement, the liquid resin 32 in the syringe 20 is compressed, and the syringe 20 There is a stress inside. This stress is reduced by discharging the liquid resin 32 from the discharge port of the discharge part 17. Even if the push-out operation of the plunger 27 is stopped, since the liquid resin 32 tries to return to its original state from the compressed state, the resin discharge from the discharge unit 17 continues.

Here, the time until the compressed liquid resin 32 returns to its original state, that is, the time until the stress in the syringe 20 generated by the pushing action of the plunger 27 is released, is determined by the syringe ( It depends on the resin amount of the liquid resin 32 remaining in 20). This time is, for example, in the case of Figs. 8A to 8C, where (A) is longest, (C) is shortest, and (B) is between them.

Therefore, at a predetermined time from the start of the pushing operation of the plunger 27 to the time before the stress in the syringe 20 generated by this operation disappears, from the discharge port of the discharge portion 17 The resin amount of the liquid resin 32 discharged also depends on the resin amount of the liquid resin 32 remaining in the syringe 20. In the case of the discharge resin amount in this fixed time, for example, in the case of Figs. 8 (A) to (C), (A) is the smallest, (C) is the largest, and (B) is between them. Becomes

As described above, when the conventional dispenser of the comparative example is used, even if the moving amount of the plunger 27 in the pushing operation of the plunger 27 is set constant, the actual amount of discharge resin is the liquid resin in the syringe 20. It turned out that it depends on the remaining amount of (32). And since a liquid leakage phenomenon generate | occur | produces, it turns out that it takes a considerable time to discharge the set discharge amount (weight). As described above, when a conventional dispenser is used, it takes a long time to discharge the set discharge amount of the set liquid resin.

(Preliminary experiment)

Next, with reference to FIGS. 9-10 as a preliminary experiment, even if the resin amount of the liquid resin 32 which remains in the syringe 20 is changed, for example using the dispenser 15 shown in FIG. The method of discharging the constant discharge amount set from the discharge unit 17 at an early stage will be described.

As shown in Embodiment 1, the tube 36 attached to the discharge part 17 of the dispenser 15 is clamped by the clamper 18, and the clamper 18 is lowered to remain in the tube 36. The liquid leaking resin 49 sagging from the tip of the residual resin 48 and the tube 36 can be forcibly pulled out by the clamper 18.

However, as described with reference to FIG. 8, it was found that the discharge amount of the liquid resin discharged from the discharge portion 17 of the dispenser depends on the resin amount of the liquid resin 32 remaining in the syringe 20. . In this embodiment, the position where the tube 36 is fitted by the clamper 18 and the stroke for moving the clamper 18 correspond to the resin amount of the liquid resin 32 remaining in the syringe 20. By controlling the amount, a method of discharging the constant discharge amount set from the discharge unit 17 at an early stage will be described.

9-10, for example, in the dispenser 15, the value of the resin amount of the liquid resin 32 which remains in the syringe 20 is large compared with another state (A), the cylinder When the value of the resin amount of the liquid resin 32 remaining in the syringe 20 differs from that of the resin amount of the liquid resin 32 remaining in the paper 20, the value of the resin amount of the liquid resin 32 remaining in the syringe 20 is different. In comparison, a small state C, the clamper 18 is lowered corresponding to each position, and the position at which the tube 36 is fitted is adjusted, and the stroke amount for moving the clamper 18 is adjusted. 9A to 9C correspond to FIGS. 8A to 8C.

As shown in FIG. 10 (a), the clamper 18 is lowered to the position of P1 in the state A when the value of the resin amount of the liquid resin 32 remaining in the syringe 20 is larger than that of the other one. Insert the tube (36). In this state, the clamper 18 is lowered by a predetermined stroke amount L1 from the position of P1 to the position of P4 at the lower end of the tube 36, so that the residual resin 48 and the tube 36 remaining in the tube 36 remain. The liquid leaking resin 49 drooping from the tip is forcibly pulled out by the clamper 18.

Similarly, as shown in FIG. 10 (b), the clamper 18 is set to P2 in the intermediate state B as compared with the value of the resin amount of the liquid resin 32 remaining in the syringe 20. Lower the position to fit the tube 36. In this state, the clamper 18 is lowered by a predetermined stroke amount L2 from the position of P2 to the position of P4 at the lower end of the tube 36, and from the tip of the residual resin 48 and the tube 36 in the tube 36. The sagging liquid leaking resin 49 is forcibly pulled out by the clamper 18. In this case, the relationship between stroke amount L2 and L1 which lowers the clamper 18 becomes L2 <L1.

Similarly, as shown in FIG.10 (c), in the state (C) where the value of the amount of resin of the liquid resin 32 remaining in the syringe 20 is small compared with another, the clamper 18 is moved to the position of P3. Lower and fit tube 36. In this state, the clamper 18 is lowered by a predetermined stroke amount L3 from the position of P3 to the position of P4 at the lower end of the tube 36, and sags from the residual resin 48 and the tube 36 in the tube 36. The liquid leaking resin 49 is forcibly pulled out by the clamper 18. In this case, the relationship between stroke amount L3 which lowers the clamper 18, L2, and L1 becomes L3 <L2 <L1.

Here, the clamper 18 is moved by making the position P4 which stops the fall of the clamper 18 in the state which inserted the tube 36 the same, and changing the position which fits the tube 36 with the clamper 18. It is preferable to change the stroke amount to be made. As a result, the variation in the state after the extraction operation can be reduced, and a stable discharging step can be performed. Therefore, it becomes possible to discharge the fixed discharge amount (weight) set from the discharge part 17 of the dispenser 15 early. Thereby, even if the resin amount of the liquid resin 32 remaining in the syringe 20 changes, it is possible to stably discharge a constant discharge amount early.

(Device configuration)

In this embodiment, although any structure of the said Embodiments 1-3 can be employ | adopted, it demonstrates about the case where the dispenser 15 of Embodiment 1 is used in correspondence with description of preliminary experiment here.

The difference from Embodiment 1 in an apparatus structure is that the control part 31 (refer FIG. 2) respond | corresponds to the residual amount of the liquid resin 32 which is the fluid resin in the syringe 20 which is a storage part, and clamps the clamper 18. FIG. This is to control the amount of movement to move. In addition, the storage amount of the liquid resin 32 in the syringe 20 is an amount corresponding to a plurality of discharge objects, and the movement amount of the clamper 18 by the controller 31 is different with respect to at least two of the plurality of discharge objects. Also in a point, it differs from Embodiment 1.

(Discharge method of liquid resin)

The difference from Embodiment 1 in the discharge method of liquid resin is the clamper 18 which responds to the residual amount of the liquid resin 32 in the syringe 20 experimentally like the said preliminary experiment first, for example. Set the movement amount to move).

Subsequently, when performing a discharge process with respect to a some discharge object, for example, similar to the said preliminary experiment, it responds to each other discharge object corresponding to FIGS. 9-10 (A), (B), (C), respectively. Discharge.

Since the liquid resin 32 is discharged to a plurality of discharge targets, the extrusion process and the extraction process of the liquid resin 32 are repeated a plurality of times. At this time, for example, similarly to the preliminary experiment, the stroke amount of the clamper 18 in the plurality of extraction processes is changed in correspondence with FIGS. 9 to 10 (A), (B) and (C). .

In the case where the amount of discharge resin is controlled with high precision, the stroke amount of the clamper 18 may be different for each discharge object, that is, for each discharge process. If precision is not required for the control of the amount of discharge resin, at least two discharge targets, i.e., at least two discharge processes, do not change the stroke amount of the clamper 18 for each discharge target, that is, for each discharge process. The stroke amount of the clamper 18 may be different.

In addition, about the manufacturing method of a resin molded article, it is basically the same as that of Embodiment 1, and what is necessary is just to perform the several times discharge process corresponding to a some discharge object as demonstrated here. At this time, the number which performs a resin molding process can be made the same as the number which carries out a discharge process, or the number of objects to be discharged.

In this embodiment, the movement amount which moves a clamper is controlled corresponding to the residual amount of fluid resin in the syringe which is a storage part. Further, the storage amount, which is the remaining amount of the flowable resin in the syringe, which is the storage unit, becomes an amount corresponding to the plurality of discharge objects, and the amount of movement of the clamper by the control unit is different for at least two of the plurality of discharge objects.

In the present embodiment, the amount of movement of the clamper is controlled in response to the remaining amount of the flowable resin in the syringe which is the storage part. In addition, the extrusion process and the extraction process are repeated a plurality of times, and the amount of movement of the clamper is varied for at least two of the plurality of extraction processes.

In more detail, according to this embodiment, the clamper which mounts the tube 36 which can elastically deform to the discharge part 17 of the dispenser 15, and fits the tube 36 to both sides of the tube 36 is movable ( 18) prepare. By the amount of resin of the liquid resin 32 remaining in the syringe 20, the stroke amounts L1, L2 for moving the clampers 18 to the positions P1, P2, P3, and the clamper 18, in which the tube 36 is fitted, Control L3 respectively. By these things, even if the resin amount of the liquid resin 32 remaining in the syringe 20 changes, it is possible to discharge a certain liquid resin from the discharge unit 17. Therefore, a certain liquid resin can be stably discharged from the discharge part 17 early, without depending on the resin amount of the liquid resin 32 remaining in the syringe 20. That is, in addition to being able to shorten the time required for the step of discharging the flowable resin such as liquid resin, the discharge amount of the flowable resin can be increased with high precision. Therefore, the productivity and the stability of the quality of the resin molded article manufactured by discharging fluid resin can be improved.

In the present embodiment, the resin amount of the liquid resin 32 remaining in the syringe 20 is divided into three stages (A), (B), and (C), and the clamper 18 divides the tube 36. Stroke amounts L1, L2, and L3 for moving the fitting positions P1, P2, P3 and the clamper 18 were divided and controlled in three stages, respectively. In addition to this, the clamper 18 further divides the resin amount of the liquid resin 32 remaining in the syringe 20 in correspondence with the storage amount of the liquid resin stored in the syringe 20. The position where the tube 36 is fitted and the stroke amount for moving the clamper 18 may be controlled more finely.

In addition, the inlet diameter and length of the tube 36 attached to the discharge part 17 of the dispenser 15 can be set arbitrarily. If the inlet diameter of the tube 36 is large, the liquid resin can be discharged early. By reducing the inlet diameter of the tube 36 and lengthening the length of the tube 36 to increase the stroke amount for moving the clamper 18, it becomes possible to control the volume pressing the tube 36 with higher accuracy. . Therefore, the discharge amount of the liquid resin to discharge can be controlled more accurately. The inlet diameter and the length of the tube 36 can be optimized in consideration of the productivity, corresponding to the viscosity and the discharge amount of the liquid resin.

Embodiment 5

With reference to FIGS. 11-14, the structure of the resin molding apparatus of Embodiment 5, and the manufacturing method of a resin molded article are demonstrated. The difference from the resin molding apparatus 1 of Embodiment 1 is that the object to be resin-molded is a wafer of circular shape, and liquid resin is discharged to a discharge object, and liquid resin is supplied from a discharge object to a shaping | molding die. Since the other structure and operation are the same as that of Embodiment 1, the same component attaches | subjects the same code | symbol and omits description.

(Configuration of Resin Molding Device)

With reference to FIG. 11, the structure of the resin molding apparatus of Embodiment 5 is demonstrated. As shown in FIG. 11, the resin molding apparatus 68 uses the wafer supply and storage module 69, the three shaping | molding modules 3A, 3B, and 3C, and the resin supply module 4 as components, respectively. Equipped. The components of the wafer supply / storage module 69, the molding modules 3A, 3B, and 3C, and the resin supply module 4, which are components, can be detached from each other and can be exchanged with respect to other components. have.

The wafer supply / storage module 69 includes a pre-sealing wafer supply unit 71 for supplying the pre-sealing wafer 70, a sealed wafer storage unit 73 for accommodating the sealed wafer 72, and a wafer before sealing. The wafer mounting part 74 which delivers the 70 and the sealed wafer 72 and the wafer conveyance mechanism 75 which conveys the before-sealing wafer 70 and the sealed wafer 72 are provided. As the wafer before sealing, for example, a wafer in which a plurality of semiconductor chips are mounted on a wafer serving as a supporting member, a wafer on which a semiconductor front step (diffusion step and a wiring step) is completed, and a wafer on which a semiconductor front step is completed, are rewired. Formed wafers and the like.

Each shaping | molding module 3A, 3B, 3C is provided with the lower die 11 which can be elevated, and the upper die 52 (refer FIG. 14) arrange | positioned facing the lower die 11. The upper mold 52 and the lower mold 11 combine to form a mold 53. Each shaping | molding module 3A, 3B, 3C has the frame clamping mechanism 12 which mold-fastens and mold-opens the upper mold | type 52 and the lower mold | type 11 (circular part shown by the dashed-dotted line of FIG. 2). The lower mold 11 is provided with a circular cavity 76 which becomes a space where the liquid resin is supplied and cured.

The resin supply module 4 is provided with a release film supply mechanism 78 for supplying a release film (see FIG. 12) to the table 77 and the table 77. On the release film supplied to the table 77, the resin accommodating frame 79 which has a circular through hole is mounted. The release film and the resin accommodating frame 79 are united, and a resin accommodating part (refer FIG. 12) which accommodates the liquid resin discharged from the dispenser 15 (refer FIG. 2) is comprised. The resin supply module 4 is provided with a dispenser 15 for discharging liquid resin to the resin accommodating portion, a moving mechanism 80 for moving the dispenser 15, and a resin conveying mechanism 81 for conveying the resin accommodating portion. The dispenser 15 is the same as the dispenser shown in the first embodiment. Like the first embodiment, the clamper 18 is provided in the discharge portion 17 of the dispenser 15. In this embodiment, the release film or resin accommodating part mounted in the table 77 becomes a discharge object in which liquid resin is discharged.

As the release film supply mechanism 78, a release film supply mechanism for supplying a long-length (roll state) release film to the table 77 or a release film cut in a short length shape to the table 77 is provided. A release film supply mechanism is used.

The wafer supply and storage module 69 is provided with a control unit CTL for controlling the operation of the resin molding apparatus 68. The control unit CTL controls the transfer of the wafer 70 and the sealed wafer 72 before sealing, the movement of the dispenser 15 and the discharge of the liquid resin, the heating of the mold, and the opening and closing of the mold.

(Method for producing resin molded article)

With reference to FIGS. 12-14, the liquid resin is discharged to the resin accommodating part (release film) which is a discharge object, and the method of manufacturing a resin molded article by supplying the liquid resin discharged to a molding die to a molding die is demonstrated.

First, as shown in FIG. 12 (a), from the release film supply mechanism 78 (see FIG. 11), for example, a long length-shaped release film 82 is supplied to the table 77, and predetermined Cut to size. Next, the resin receiving frame 79 having the circular through hole 83 is mounted on the release film 82. In this state, the release film 82 and the resin accommodating frame 79 are united, and the resin accommodating part 84 which accommodates liquid resin is comprised. Next, the dispenser 15 is moved to the predetermined position above the resin container 84 using the moving mechanism 80. In this case, although the case where the dispenser 15 is moved above the resin accommodating part 84 using the movement mechanism 80 is shown, you may move the table 77 below the dispenser 15. FIG. What is necessary is just a structure which moves the dispenser 15 and the resin accommodating part 84 relatively.

Next, as shown in FIG. 12 (b), the liquid resin 85 is directed from the resin discharge portion 17 (tube 36) of the dispenser 15 toward the resin containing portion 84 (release film 82). ) Is discharged. The liquid resin 85 is discharged into the through hole 83 of the resin accommodating portion 84. As the pattern shape for discharging the liquid resin 85, for example, as shown in FIG. 13A, the liquid resin 85 is discharged in a spiral pattern shape so as to correspond to the circular through hole 83. It is desirable to.

In this case, the liquid resin 85 is discharged in a spiral shape from the central portion toward the outer peripheral portion. On the contrary, the liquid resin 85 may be discharged in a spiral shape from the outer peripheral portion toward the center portion.

The pattern shape which discharges the liquid resin 85 is not limited to the spiral pattern shape. In addition, it can set arbitrarily corresponding to the shape of the through-hole 83 which the resin accommodating part 84 has, such as a concentric shape and a scattered dot. It is preferable that the liquid resin 85 is a pattern shape arrange | positioned as evenly as possible in the resin accommodating part 84.

Next, as shown in Fig. 12 (c), the discharge of the dispenser 15 is stopped (the pushing operation of the plunger 27 is stopped), and then, the discharge portion 17 of the dispenser 15 is mounted. The residual resin 48 in the tube 36 and the liquid leaking resin 49 struck from the tip of the tube 36 are pulled out using the clamper 18 (see FIG. 4). On the release film 82, the liquid resin 85 discharged in spiral shape is arrange | positioned (refer FIG. 13 (a)). In this case, the resin accommodation part 84 whose bottom surface is comprised by the release film 82 becomes a discharge object.

Next, as shown in FIG.12 (d), the release film 82 is adsorb | sucked to the resin accommodating frame 79 by the adsorption | suction groove (not shown) provided in the bottom surface of the resin accommodating frame 79. Then, as shown to FIG. Using the resin conveyance mechanism 81, the table 77 provides the resin accommodating part 79 of the state in which the resin accommodating frame 79, the release film 82, and the liquid resin 85 discharged in the spiral form were integrated. Lift from

Next, as shown in Fig. 14 (a), the wafer 70 before sealing is mounted on the mold surface of the upper die 52 using the wafer transfer mechanism 75 (see Fig. 11). It is fixed by suction or clamper. Next, the resin container 84 is conveyed to a predetermined position between the upper mold 52 and the lower mold 11 using the resin conveyance mechanism 81. In the resin accommodating part 84, the liquid resin 85 is accommodated in the through-hole 83 closed by the resin accommodating frame 79 and the release film 82. As shown in FIG. Next, the resin conveyance mechanism 81 is lowered and the resin accommodating part 84 is mounted on the lower die 11. In this state, the spiral liquid resin 85 discharged onto the release film 82 is disposed above the cavity 76.

Next, as shown in FIG.14 (b), the release film 82 is adsorb | sucked along the mold surface of the cavity 76 by the adsorption mechanism (not shown) provided in the lower mold 11. As shown in FIG. As a result, the release film 82 and the liquid resin 85 are collectively supplied to the cavity 76. Next, using the heater (not shown) provided in the lower mold 11, the liquid resin 85 is heated and melted to produce a flowable resin 87 having a reduced viscosity.

Next, as shown in FIG.14 (c), the lower mold | type 11 is raised by the frame clamping mechanism 12 (refer FIG. 11), and the upper mold | type 52 and the lower mold | die 11 are frame-tightened. By tightening the frame, the semiconductor chip 86 mounted on the wafer 70 before sealing is immersed in the fluid resin 87.

Next, using the heater provided in the lower mold 11, the fluid resin 87 is cured to form the cured resin 88. Thereby, the semiconductor chip 86 attached to the wafer 70 before sealing is resin-sealed by the cured resin 88 shape | molded corresponding to the shape of the cavity 76. FIG. In this step, a resin-sealed resin molded article 89 (sealed wafer 72) is manufactured. The resin molded article 89 is accommodated in the sealed wafer accommodating part 73 (refer FIG. 11) using the wafer conveyance mechanism 75 (refer FIG. 11).

According to this embodiment, the tube 36 which can be elastically deformed is attached to the discharge part 17 of the dispenser 15. As shown in FIG. Both sides of the tube 36 are provided with a clamper 18 which is movable by inserting the tube 36. By clamping the tube 36 into the clamper 18 and lowering the clamper 18, the residual resin remaining in the tube 36 and the liquid leaking resin sagging from the tip of the tube 36 are clamped by the clamper 18. It can be forcibly pulled out.

According to this embodiment, the liquid resin 85 is discharged to the resin container 84 (release film 82) which is a discharge object, and the liquid resin 85 accommodated in the resin container 84 is lower mold | type 11 It is supplied to the cavity 76 provided in this and resin molding is carried out. Since the liquid resin 85 is not directly discharged to the cavity 76, the liquid resin 85 discharged on the release film 82 is not affected by heat from a heater provided in the molding die. Therefore, while discharging the liquid resin 85 on the release film 82, it can suppress that the liquid resin 85 starts to harden | cure. Thereby, the dispersion | variation which hardens the liquid resin 85 discharged on the release film 82 can be suppressed, and the dispersion | variation in the resin thickness of a resin molded article can be reduced.

In each embodiment, liquid resin is discharged toward the discharge object from the discharge part provided in the dispenser. In Embodiment 1, the form which discharges the liquid resin 32 to the cavity 13 as the discharge object using the cavity 13 provided in the lower mold 11 was demonstrated. In Embodiment 5, the form which discharges the liquid resin 85 to the release film 82 was demonstrated using the release film 82 (resin accommodation part 84) mounted on the table 77 as a discharge object. .

As the discharge object, in addition to the cavity and the release film, the liquid resin can be discharged to a substrate on which a semiconductor chip is mounted, a wafer on which a semiconductor chip is mounted, a wafer on which a semiconductor front step is completed, and the like. In these cases, the discharge object in which liquid resin was discharged is supplied to a shaping | molding die, and resin molding is carried out. The liquid resin is melted in the cavity provided in the molding die and cured corresponding to the shape of the cavity.

In each embodiment, the one-liquid type | mold dispenser using the liquid resin produced by mixing a main body and a hardening | curing agent previously was shown. Not only this but when using the two-liquid mixing type dispenser which mixes a main material and a hardening | curing agent in a dispenser at the time of actual use, the effect similar to each embodiment is exhibited.

In each embodiment, the manufacturing method of the resin molding apparatus and resin molded article used when resin-sealing a semiconductor chip was demonstrated. The object to be sealed may be a semiconductor chip such as an IC or a transistor, a non-semiconductor chip that does not use a semiconductor, or a chip group in which a semiconductor chip and a non-semiconductor chip are mixed. The present invention can be applied to resin sealing of one or a plurality of chips mounted on a substrate, a wafer, or the like with a cured resin.

In addition, the present invention is not limited to the case where the electronic components are resin-sealed, and the present invention can be applied to manufacturing optical components such as lenses, reflectors (reflective plates), light guide plates, optical modules, and other resin molded articles by resin molding. Can be.

As described above, the discharge device of the above embodiment includes a storage unit for storing the fluid resin, an extrusion mechanism for pushing the fluid resin, a discharge part connected to the storage part for discharging the fluid resin, and an elasticity mounted in the discharge part. A deformable tube, a clamper movable by inserting the tube, and a control unit for controlling the amount of movement of the clamper are provided.

According to this structure, the residual resin remaining in the tube can be pulled out by the clamper by fitting the elastically deformable tube attached to the discharge part of the discharge device with the clamper and lowering the clamper. Therefore, the time required for the process of discharging fluid resin, such as liquid resin, can be shortened, and the productivity of the resin molded article manufactured by discharging fluid resin can be improved.

Moreover, in the discharge apparatus of the said embodiment, a control part is set as the structure which controls the movement amount which moves a clamper according to the residual amount of the fluid resin in a storage part.

According to this structure, even if the residual amount of the flowable resin remaining in the storage portion is changed, the constant flowable resin can be discharged. Therefore, high precision of the discharge amount of fluid resin can be aimed at, and the stability of the quality of the resin molded article manufactured by discharge of fluid resin can be improved.

In the discharge device of the above embodiment, the storage amount of the fluid resin in the storage unit is an amount corresponding to the plurality of discharge objects, and the amount of movement of the clamper by the controller is different in at least two of the plurality of discharge objects. Doing.

According to this structure, even if the residual amount of the fluid resin in a storage part changes, it can discharge a fixed fluid resin. Therefore, high precision of the discharge amount of fluid resin can be aimed at, and the stability of the quality of the resin molded article manufactured by discharge of fluid resin can be improved.

Moreover, in the discharge apparatus of the said embodiment, it is set as the structure which has the 1st drive mechanism which moves a clamper in a horizontal direction, and the 2nd drive mechanism which moves a clamper in a vertical direction.

According to this structure, a tube can be fitted by a clamper using a 1st drive mechanism. The clamper can be moved by a predetermined amount using the second drive mechanism. Therefore, residual resin remaining in the tube can be taken out by the clamper.

Moreover, in the discharge apparatus of the said embodiment, the clamper is equipped with the roller which rotates, and it is set as the structure which pulls out the residual resin which remains in a tube by rotating as the roller rotates in the state which clamped the tube.

According to this structure, the residual resin remaining in a tube can be taken out by falling as a roller rotates.

The resin molding apparatus of the said embodiment is made to comprise the said any one discharge apparatus.

According to this structure, the time required for the discharging process of fluid resin, such as liquid resin, can be shortened, and the productivity of the resin molded article manufactured by discharging fluid resin can be improved.

The discharging method of the above embodiment includes an extrusion process of discharging the fluid resin from the elastically deformable tube mounted on the discharge part connected to the storage part by pushing the fluid resin stored in the storage part, and the tube by the clamper. And a pulling-out step of extracting the residual resin remaining in the tube by inserting and moving the clamper downward.

According to this method, the fluid resin can be discharged early by the clamper. Therefore, the time required for the process of discharging fluid resin, such as liquid resin, can be shortened, and the productivity of the resin molded article manufactured by discharging fluid resin can be improved.

Moreover, the discharge method of the said embodiment controls the movement amount of a clamper according to the residual amount of the fluid resin in a storage part in an extraction process.

According to this method, even if the residual amount of the flowable resin remaining in the storage portion is changed, the constant flowable resin can be discharged. Therefore, high precision of the discharge amount of fluid resin can be aimed at, and the stability of the quality of the resin molded article manufactured by discharge of fluid resin can be improved.

In the discharge method of the above embodiment, the pushing step and the extracting step are repeated a plurality of times, and the amount of movement of the clamper is different for at least two of the plurality of extraction steps.

According to this method, even if the residual amount of the flowable resin in the storage portion is changed, the constant flowable resin can be discharged. Therefore, high precision of the discharge amount of fluid resin can be aimed at, and the stability of the quality of the resin molded article manufactured by discharge of fluid resin can be improved.

The manufacturing method of the resin molded article of the said embodiment includes the frame tightening process which frame-tightens a shaping | molding die in the state which the fluid resin discharged by the said any one discharge method was supplied to the shaping | molding die.

According to this method, a resin molded article can be manufactured stably and productivity can be improved.

This invention is not limited to each embodiment mentioned above, It can change, select suitably, and employ | adopt them suitably and suitably combining as needed within the range which does not deviate from the meaning of this invention.

1, 68: resin molding apparatus
2: Board supply / storage module
3A, 3B, 3C: Molded Module
4: resin supply module
5: substrate before sealing
6: Substrate supply before sealing
7: sealed finished substrate
8: Sealed Substrate Storage
9: Board Mount
10: substrate conveyance mechanism
11: lower mold
12: frame fasteners
13, 76: cavity (discharge object)
14: release film supply mechanism
15, 58, 64: dispenser (dispensing device)
16: resin conveying mechanism
17, 65: discharge part
18, 59, 67: clamper
19: extrusion apparatus
20: syringe (storage)
21: connection
22: nozzle
23: servo motor
24: ball screw
25: slider
26: load
27: plunger (extrusion mechanism)
28: ball screw bearing
29: guide rail
30: encoder
31: control unit
32, 85: liquid resin (fluid resin)
33: screw
34: discharge port
35: joint
36: tube
37, 38: roller support member
37a, 37b, 37c, 38a, 38b, 38c: rod-shaped member
39, 40: roller
41, 44: connection member
42, 45: moving mechanism (first moving mechanism)
43, 46: moving mechanism (second moving mechanism)
47: resin passage
48: residual resin
49: liquid leakage resin
50: Residual resin in the drooping state
51, 86: semiconductor chip
52: Pictograph
53: forming mold
54: release film
55, 87: fluid resin
56, 88: cured resin
57, 89: resin molded article
60, 61: roller support member
60a, 60b, 60c, 61a, 61b, 61c: rod-shaped member
62, 63: connection member
66: fixed plate
69: wafer supply and storage module
70: wafer before sealing
71: wafer supply before sealing
72: sealed wafer
73: sealed wafer storage portion
74: wafer mounting portion
75: wafer transfer mechanism
77: table
78: release film supply mechanism
79: resin receiving frame
80: moving mechanism
81: resin conveyance mechanism
82: release film (discharge object)
83: through hole
84: resin container (discharge object)
S1, R1, M1, C1: predetermined position
CTL: control
A, B, C: state of liquid resin in syringe
P1, P2, P3, P4: Position
L1, L2, L3: Stroke Amount (Movement Amount)

Claims (11)

A storage unit for storing the flowable resin,
An extrusion mechanism for pushing the fluid resin,
A discharge part connected to said storage part for discharging said fluid resin,
An elastically deformable tube mounted to the discharge part;
And a clamper movable by inserting the tube. The method of claim 1,
And a control unit for controlling the amount of movement of the clamper. The method of claim 2,
And the control unit controls a movement amount for moving the clamper in response to the remaining amount of the flowable resin in the storage unit. The method of claim 3, wherein
The storage amount of the fluid resin in the storage unit is an amount corresponding to a plurality of discharge targets,
The amount of movement of the clamper by the control unit is different with respect to at least two of the plurality of discharge objects. The method of claim 1,
A first drive mechanism for moving the clamper in a horizontal direction;
And a second drive mechanism for moving the clamper in the vertical direction. The method of claim 1,
The clamper has a rotating roller,
A discharge device for extracting residual resin remaining in the tube by rotating the roller while lowering the clamper while the tube is fitted. The resin molding apparatus provided with the ejection apparatus in any one of Claims 1-6. An extrusion process of discharging the fluid resin from an elastically deformable tube mounted on the discharge part connected to the storage part by pushing the fluid resin stored in the storage part;
And a pulling-out step of extracting the residual resin remaining in the tube by sandwiching the tube by the clamper and moving the clamper downward. The method of claim 8,
In the extracting step, the amount of movement of the clamper is controlled in accordance with the remaining amount of the flowable resin in the storage. The method of claim 8,
The ejecting method and the extracting process are repeated a plurality of times, and the amount of movement of the clamper is varied for at least two of the plurality of extracting processes. The manufacturing method of the resin molded article containing the process of carrying out resin molding in the state which the said fluid resin discharged by the discharge method as described in any one of Claims 8-10 was supplied to the shaping | molding die.

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