JP2004207257A - Dispenser nozzle for sealing semiconductor device and semiconductor device sealing apparatus using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dispenser nozzle that quickly puts a sealing resin at the outer periphery of a semiconductor device without using more precise control means and can relatively easily control the amount of the discharged sealing resin, and to provide a semiconductor device sealing apparatus using the dispenser nozzle. <P>SOLUTION: The dispenser nozzle for sealing the semiconductor device is disclosed. The dispenser nozzle is used for putting resin at the gap between a substrate and the semiconductor device generated by allowing the substrate to come into contact with the bump of the semiconductor device or a solder ball. The dispenser nozzle comprises a well for storing the resin, and a plurality of discharge ports that communicate with the resin well through a plurality of pipes each and are arranged along the outer periphery of the semiconductor device. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a dispenser nozzle used for sealing a gap between a substrate and a semiconductor device, a dispenser head equipped with the nozzle, a semiconductor device sealing apparatus having the nozzle, and a semiconductor device sealing method.
[0002]
[Prior art]
Generally, a semiconductor device such as a flip chip and a CSP is formed between a substrate (specifically, an electrode on the substrate) and a bump or a solder ball of the semiconductor device in contact with the substrate and the semiconductor device. Is filled with a sealing material. This gap is very narrow, so that the resin does not easily enter, and if bubbles or the like remain or mix, the performance of the semiconductor is greatly impaired in terms of electrical characteristics, mechanical strength, and the like.
[0003]
Therefore, various methods for filling the sealing resin have been studied. For example, a method utilizing a pressure difference as disclosed in JP-A-8-264587 is known. Japanese Patent Application Laid-Open No. 8-264587 discloses that after a substrate and a semiconductor device are brought into contact with each other, a liquid sealing resin is placed around the semiconductor device. A method is described in which the resin is filled in the gap between the substrate and the semiconductor device by returning.
[0004]
Generally, a semiconductor device sealing device called a dispenser device is used for disposing the liquid sealing resin. FIG. 10 is a schematic conceptual diagram for explaining a conventional dispenser device. The dispenser apparatus 600 includes a stage 650 on which the substrate 70 and a bump or a solder ball of the semiconductor device 72 are placed in contact with each other, a dispenser head 614 having a nozzle 612 for discharging a liquid sealing resin, and a dispenser head 614. Actuator 618 provided with a means (not shown) for controlling the elevation of the nozzle and a resin conduit (not shown) for supplying a liquid sealing resin to the nozzle 612, and a driving means (not shown) for supporting the elevation actuator 618 And an arm 620 that can move the dispenser head 614 in a three-dimensional direction.
[0005]
Generally, when the dispenser device 600 is used, the liquid sealing resin is disposed around the semiconductor device as follows. First, the dispenser head 614 is lowered by the lifting actuator 618 and the arm 620 to near one side of the outer periphery of the semiconductor device. Next, the liquid sealing resin in a resin tank (not shown) is discharged from the nozzle 612 of the dispenser head 614 through a resin conduit. Further, the arm 620 operates in accordance with the discharge of the liquid sealing resin.
[0006]
A method of arranging the liquid sealing resin with the movement of the arm 620 will be described with reference to FIG.
[0007]
FIG. 11 is a schematic view of a substrate 70 and a semiconductor device 72 for explaining a method of disposing a sealing resin when disposing a sealing resin using a conventional dispenser device as shown in FIG. First, as shown in FIG. 11A, the nozzle of the dispenser head is arranged near one side P of the outer periphery of the semiconductor device 72. Next, the sealing resin is discharged through the nozzle, and the arm of the dispenser device operates simultaneously with the discharge. In accordance with the operation of the arm, the dispenser head (and the nozzle) moves along the outer periphery of the semiconductor device 72, whereby the sealing resin 80 is arranged on the outer periphery of the semiconductor device 72 (FIG. 11B).
[0008]
However, such a dispenser device has various problems in terms of increasing production efficiency.
[0009]
In the dispenser apparatus, since the sealing resin is arranged by moving the dispenser head along the outer periphery of the semiconductor device, much time is required for sealing one semiconductor device. In addition, with the recent technological development, the structure of a semiconductor device tends to be more complicated and the size thereof has also been reduced. Therefore, in order to dispose the sealing resin using the above dispenser device, it is necessary to move the dispenser head to a target location of the semiconductor device more quickly and accurately. Therefore, a means for controlling the operation of the arm more precisely and at a higher speed is required.
[0010]
On the other hand, the material cost of the sealing resin itself tends to increase in recent years due to the addition of high functions from various points. Further, if the amount of the sealing resin disposed in the semiconductor device is excessive, there is a problem that the appearance of the finally manufactured semiconductor package is impaired and its reliability is lost. For this reason, in the conventional dispenser device, it is necessary to more accurately control the discharge amount while disposing the sealing resin along the outer periphery of the semiconductor device.
[0011]
[Problems to be solved by the invention]
The present invention has been made to solve the above problems, and an object thereof is to dispose a sealing resin on the outer periphery of a semiconductor device in a short time without using more precise control means, and to use a sealing resin. It is an object of the present invention to provide a dispenser nozzle and a semiconductor device sealing apparatus using the same, which can control the discharge amount of the dispenser relatively easily.
[0012]
[Means for Solving the Problems]
The present invention relates to a dispenser nozzle for disposing a resin in a gap between the substrate and the semiconductor device caused by the contact between the substrate and a bump or a solder ball of the semiconductor device, wherein the resin stores the resin. A nozzle; and a plurality of discharge ports respectively communicating with the resin reservoir through a plurality of resin tubes and arranged along an outer periphery of the semiconductor device.
[0013]
In a preferred embodiment, the plurality of resin tubes are provided so as to be inclined so as to discharge the resin in a direction from the outer periphery of the semiconductor device toward the outer periphery of the semiconductor device.
[0014]
The present invention is also a dispenser head used in an apparatus for arranging a resin in a gap between the substrate and the semiconductor device caused by the contact between the substrate and a bump or a solder ball of the semiconductor device, A nozzle having a resin reservoir for storing a resin, and a plurality of discharge ports respectively communicating with the resin reservoir through a plurality of resin pipes and arranged along an outer periphery of the semiconductor device; and a resin communicating with the resin reservoir. A jig body having a main tube;
[0015]
In a preferred embodiment, the jig main body includes a needle for controlling the flow of the resin in the resin main pipe.
[0016]
The present invention also provides a method for sealing a gap between a substrate and the semiconductor device, which is caused by contact between the substrate and a bump or a solder ball of the semiconductor device, by disposing a resin under reduced pressure and then under normal pressure. Device for performing
(A) a stage for placing the substrate;
(B) a nozzle having a resin reservoir for storing the resin, and a plurality of discharge ports respectively communicating with the resin reservoir through a plurality of resin pipes and disposed along the outer periphery of the semiconductor device; A dispenser head including a jig body having a communicating resin main pipe; and
(C) means for controlling elevation of the dispenser head;
An apparatus comprising:
[0017]
In a preferred embodiment, a cap is attached around the jig body of the dispenser head to form a sealed space between the dispenser head, the cap, and the stage, and the cap, the stage, and the dispenser head And exhaust means for exhausting the gas in the sealed space formed by the above.
[0018]
In a further preferred embodiment, the exhaust means is provided on a stage.
[0019]
The present invention is also a method for sealing a gap between the substrate and the semiconductor device, which is caused by the contact between the substrate and a bump or a solder ball of the semiconductor device, with a resin,
(A) arranging a substrate on which a bump or a solder ball of the semiconductor device abuts on a stage so as to form the gap;
(B) lowering the dispenser head on the stage, reducing the pressure in the gap, and disposing the resin toward the outer periphery of the semiconductor device;
(C) returning the gap to normal pressure;
(D) heating and curing the arranged resin;
Is included.
[0020]
In a preferred embodiment, in the step (b), a cap may be attached around a jig body of the dispenser head, and the dispenser head, the cap, and the stage may form a sealed space. And the stage and the dispenser head are provided with an exhaust means for exhausting gas in the sealed space formed by the dispenser head.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
The present invention will be described with reference to the drawings. In addition, the same reference numerals are given to the same members.
[0022]
FIG. 1 is a schematic sectional view illustrating an example of the dispenser nozzle of the present invention.
[0023]
In the dispenser nozzle 100 of the present invention, the nozzle cover 12 and the nozzle base 14 are fixed by means such as a screw 16. The nozzle cover 12 and the nozzle base 14 can be made of metal such as stainless steel and aluminum, but their materials are not particularly limited. Further, in the dispenser nozzle 100 of the present invention, a resin reservoir 18 is formed inside the dispenser nozzle 100 by a combination of the nozzle cover 12 and the nozzle base 14.
[0024]
The nozzle cover 12 includes a jig accommodating portion 20 that can be in close contact with an outer periphery of a jig body described later. The jig accommodating section 20 has an introduction pipe 22 at the center thereof, and a resin main pipe of a jig main body described later communicates with the resin reservoir 18 via the introduction pipe 22.
[0025]
The nozzle base 14 includes a plurality of resin tubes 26 having discharge ports 24 on the bottom surface. In FIG. 1, a distance L between one ejection port and another ejection port arranged on the opposite side corresponds to the length of one side of the semiconductor device. The nozzle base 14 preferably has an inclined surface 28 extending from the center of the resin reservoir 18 to the resin tube 26. Such an inclined surface 28 allows the liquid sealing resin to flow more smoothly from the center of the resin reservoir 18 toward the outer periphery.
[0026]
FIG. 2 is a bottom view of the nozzle base illustrating an example of the dispenser nozzle of the present invention. A plurality of discharge ports 24 provided in the nozzle base 14 are provided corresponding to the outer periphery of the semiconductor device requiring sealing. In FIG. 2, the plurality of ejection ports provided are arranged so as to be substantially square, but the arrangement manner is not limited. Depending on the outer periphery of the semiconductor device to be sealed, it may be arranged in another shape such as a rectangle. The size of the discharge port 24 is generally a circle having a diameter of 0.3 mm or less, preferably a diameter of 0.1 mm to 0.2 mm, and is appropriately determined by those skilled in the art depending on the viscosity of the liquid sealing resin to be discharged. Can be selected. The number of the discharge ports 24 is not particularly limited. This is because the number may vary depending on the size of the semiconductor device to be sealed. For example, when sealing a 10 mm square semiconductor device, 50 discharge ports with a diameter of 0.1 mm are provided at equal intervals on one side.
[0027]
The shape of each discharge port of the nozzle base 14 is not particularly limited. Depending on the viscosity of the liquid sealing resin used, for example, a combination of trapezoidal discharge ports 30 as shown in FIG. 3A, a rectangular discharge port as shown in FIG. A combination of the outlets 32 and a combination of the ejection ports 34 having an L-shaped shape as shown in FIG. 3C can be selected.
[0028]
FIG. 4 is a schematic sectional view for explaining another example of the dispenser nozzle of the present invention.
[0029]
In the dispenser nozzle 200 of the present invention shown in FIG. 4, the nozzle cover 12 'and the nozzle base 14' are fixed by means such as screws 16. The nozzle cover 12 'is the same as that shown in FIG.
[0030]
The nozzle base 14 'includes a plurality of resin tubes 26 having discharge ports 24 on the bottom surface. The position and arrangement of the discharge ports 24 on the bottom surface of the nozzle veil 14 'are the same as those in FIG. However, unlike FIG. 1, the resin tube 26 shown in FIG. 4 is provided at an angle θ in a direction from the outer periphery of the semiconductor device to be sealed toward the outer periphery of the semiconductor device. Although the magnitude of the inclination angle θ varies depending on the viscosity of the liquid sealing resin to be used, it is usually designed to be 45 ° to 90 °. By inclining the resin tube 26 at the angle θ in this manner, the liquid sealing resin to be discharged can be arranged without excessively spreading around the semiconductor device.
[0031]
The nozzle base 14 'also has a recess 36 between one outlet on the bottom surface and another outlet located on the opposite side, as shown in FIG. The depression 36 has a height H so as to include the semiconductor device to be sealed. The height H is designed to substantially match the thickness of the chip portion of the semiconductor device (excluding the height of bumps or solder balls). By designing such a height H, the discharge port 24 of the nozzle base 14 ′ is disposed near the gap between the semiconductor device and the substrate during sealing, so that Thus, the liquid sealing resin can be arranged without excessively spreading around the semiconductor device.
[0032]
The dispenser nozzle of the present invention is mounted on a jig body for a normal or specially designed dispenser device, and is used as a dispenser head.
[0033]
FIG. 5 is a schematic sectional view illustrating an example of a dispenser head in which the dispenser nozzle is attached to a jig main body.
[0034]
As shown in FIG. 5, a dispenser head 300 according to the present invention includes the dispenser nozzle 200 and a jig main body 250. The jig body 250 is fixed to the dispenser nozzle 200 by the packing 41 or other means as shown in FIG. Alternatively, the jig body 250 may be designed to have a size such that its outer periphery is in close contact with the jig accommodating portion 20 in the dispenser nozzle 200.
[0035]
The configuration of the dispenser nozzle 200 shown in FIG. 5 is the same as described above.
[0036]
The jig body 250 includes a resin main pipe 40 extending in the axial direction therein. The resin main pipe 40 communicates with the resin reservoir 18 via the introduction pipe 22 of the dispenser nozzle 200. The liquid sealing resin is introduced into the resin main pipe 40 from a resin storage tank (not shown) through any means, and is supplied to the resin reservoir 18 through the introduction pipe 22.
[0037]
Preferably, the supply of the liquid sealing resin is controlled by a resin needle 42 and a needle stopper 44 provided in the resin main pipe 40. The resin needle 42 is slidable in the axial direction of the jig main body 250. When the supply of the liquid sealing resin in the resin main tube 40 is stopped, the resin needle 42 descends, and the inside of the resin main tube 40 is closed by contact with the needle stopper 44. On the other hand, when supplying the liquid sealing resin in the resin main pipe 40, the resin needle 42 rises and separates from the needle stopper 44 to open the inside of the resin main pipe 42. With this opening, the liquid sealing resin passes through the inside of the resin main pipe 40 and is supplied to the resin reservoir 18 through the introduction pipe 22. The method of controlling the supply of the liquid sealing resin in the resin main pipe 40 is not limited to the above, and other means known to those skilled in the art may be used.
[0038]
The jig body used in the present invention is not limited to the above, and may be one used in a conventional dispenser device. When the conventional jig main body is used, the jig housing portion of the dispenser nozzle is designed to have a size capable of housing the outer periphery of the jig main body.
[0039]
FIG. 6 is a schematic cross-sectional view illustrating an example of the semiconductor device sealing device of the present invention including the dispenser head.
[0040]
The semiconductor device sealing apparatus 400 of the present invention includes a flat stage 50, a slide arm 52 to which the dispenser head 300 shown in FIG. 5 is attached, the slide arm 52 slidable, and the stage 50 and the slide arm 52. And a support arm 54 for supporting The stage 50 includes a temperature controller (not shown) for controlling the properties of the sealing resin as needed.
[0041]
The slide arm 52 is fixed to the upper end of the dispenser head 300 by means such as a screw. The slide arm 52 is attached to the support arm via means (not shown) for controlling the elevation of the dispenser head 300. As means for controlling such elevation, for example, there is a combination of a driving means such as a stepping motor and a control means capable of controlling the driving. The means for controlling the elevation may be any other means known to those skilled in the art.
[0042]
In the semiconductor device encapsulation apparatus of the present invention, a pattern camera is required to properly align the semiconductor device package 56 including the substrate 70 and the semiconductor device 72 disposed on the stage 50 with the dispenser head 300. (Not shown) is preferably provided separately.
[0043]
FIG. 7 is a schematic sectional view illustrating another example of the semiconductor device sealing device of the present invention.
[0044]
The semiconductor device sealing apparatus 500 of the present invention includes a flat stage 50, a slide arm 52 to which a dispenser head shown in FIG. 5 is attached, a slide arm 52 slidable, and a stage 50 and a slide arm 52. And a support arm 54 for supporting the The slide arm 52 is similar to that shown in FIG. The stage 50 includes a temperature controller (not shown) for controlling the properties of the sealing resin as needed.
[0045]
A cap 60 is attached to the dispenser head. The cap 60 is in close contact with the outer periphery of the dispenser head (preferably, the outer periphery of the jig body 250 as shown in FIG. 7) and completely covers the dispenser nozzle. The lower end of the cap 60 can be in close contact with the stage 50, and a seal member 61 such as silicone or rubber may be attached to the lower end as necessary to increase the degree of close contact with the stage 50. Good.
[0046]
As shown in FIG. 7, the lower end of the cap 60 is located lower than the lower end of the dispenser nozzle 200. With respect to the jig main body 250, the distance D, which is the difference between the position of the lower end of the cap 60 and the position of the lower end of the dispenser nozzle 200 in the height direction of the dispenser head, is set on the substrate 70 from the stage 50. It is attached at a position which is equal to or longer than the distance d which is the height to the semiconductor device 72 provided with the gap. The attachment of the cap 60 is performed by a method well known to those skilled in the art. In this manner, by attaching the cap 60 to the jig main body 250 at the above position, a sealed space can be formed between the cap 60, the dispenser nozzle 200, and the stage 50.
[0047]
An exhaust port 62 is provided on the stage 50. On the other hand, the exhaust port 62 is connected to a decompression pump (not shown) provided outside via a duct pipe 64.
[0048]
The exhaust port is located in a sealed space 66 formed between the cap 60, the dispenser nozzle 200, and the stage 50, and is separated from a portion where the substrate 70 is arranged so as not to be blocked by the substrate 70. (Refer to 62 shown in FIG. 8A). Alternatively, the exhaust port may be provided on the cap 60 side (62 'shown in FIG. 8B). In the present invention, it is preferable to provide the exhaust port 62 on the stage 50 as shown in FIG. 8A from the advantage that the exhaust port itself can be fixed at one place.
[0049]
Using the semiconductor device sealing device of the present invention, a semiconductor device and a substrate are sealed as follows. The sealing method of the present invention will be described with reference to FIG.
[0050]
FIG. 9 is a schematic diagram for explaining a step of sealing a gap between a semiconductor device and a substrate by using the semiconductor device sealing apparatus of the present invention shown in FIG.
[0051]
In the sealing method of the present invention, as shown in FIG. 9A, first, bumps or solder balls of the semiconductor device 72 are brought into contact with appropriate positions of the stage 50 in advance by a method known to those skilled in the art. Then, the substrate 70 having the gap formed therein is arranged using a pattern camera or the like. At this time, the substrate 70 does not block the exhaust port 62 provided on the stage 50.
[0052]
Next, as shown in FIG. 9B, the dispenser head 300 descends and is fixed at a position where it comes into contact with the semiconductor device 72. At this time, the cap 60 of the dispenser head 300 is in close contact with the stage 50 at the lower end thereof, whereby a sealed space is formed between the cap 60, the dispenser nozzle 200 and the stage 50. After the sealed space is formed, the space is reduced in pressure through the exhaust port 62. The degree of reduced pressure is not particularly limited, and can be appropriately set by those skilled in the art. The degree of pressure reduction in the sealed space is preferably 10 Torr or less, more preferably 5 Torr or less.
[0053]
Simultaneously with or after the pressure reduction, the resin needle 42 provided in the jig main body 250 rises, and the sealing resin 74 in the resin main pipe 40 flows toward the introduction pipe 22. Further, the sealing resin 74 enters the resin reservoir 18 through the introduction pipe 22 and is arranged from the discharge port of the resin pipe 26 toward the outer peripheral portion of the semiconductor device 72 (black arrow in FIG. 9B). ). Part of the sealing resin 74 also flows into a gap formed between the substrate 70 and the semiconductor device 72. A void made of air or the like may remain to some extent in the gap. The sealing resin 74 used in the present invention is a liquid sealing resin made of a general thermosetting resin used for sealing a semiconductor device, and its type is not particularly limited. The sealing resin 74 preferably has a certain degree of fluidity in order to flow through the inside of the pipe such as the resin main pipe 40 of the dispenser head 300.
[0054]
Next, as shown in FIG. 9C, the dispenser head 300 moves up, the dispenser head 200 separates from the semiconductor device 72, and at the same time, the lower end of the cap 60 separates from the stage 50. At this time, the decompression through the exhaust port 62 is also stopped. Thereby, the sealed space formed between the cap 60, the dispenser nozzle 200, and the stage 50 is opened to normal pressure. At this time, the gap between the substrate 70 and the semiconductor device 72 also returns to normal pressure, whereby voids (air) in the gap come out of the gap and are sealed near the outer periphery of the semiconductor device 72. The sealing resin is more sufficiently filled in the gap.
[0055]
After that, the sealing resin disposed in the gap between the substrate 70 and the semiconductor device 72 is heated and cured by a method known to those skilled in the art. The heating temperature and the heating time can be appropriately selected by those skilled in the art depending on the type of the sealing resin to be used, the size of the semiconductor device, and the like. Thus, as shown in FIG. 9D, the gap between the substrate 70 and the semiconductor device 72 is completely sealed with the sealing resin without leaving a void.
[0056]
In FIG. 9, a method of sealing a semiconductor device using the dispenser head 300 of the present invention including the cap 60 has been described. However, a dispenser head of the present invention without the cap 60 may be used. In this case, a depressurizing step and a step of returning to normal pressure can be adopted for the entire room in which the semiconductor device sealing apparatus 400 of the present invention is arranged as shown in FIG.
[0057]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to the dispenser nozzle of this invention, when filling a sealing part with the sealing resin in the clearance gap formed by the contact of a board | substrate and a bump or a solder ball of a semiconductor device, resin can be arrange | positioned in a shorter time. Also, by using a nozzle of an appropriate size according to the size of the semiconductor device, only a simpler control means is used without providing a means for controlling the subtle and high-speed operation of the nozzle in the dispenser device itself. can do. In addition, since the amount of the sealing resin to be disposed can be reduced to a smaller amount, the appearance of the semiconductor package due to the excessive resin arrangement can be maintained at a high quality.
[0058]
Further, according to the method for sealing a semiconductor device of the present invention, the sealing resin can be more sufficiently filled without leaving a void in a gap between a substrate and a bump or a solder ball of the semiconductor device. it can. By completely removing the voids, an excellent semiconductor package can be manufactured without causing a problem such as poor contact.
[Brief description of the drawings]
FIG. 1 is a schematic sectional view for explaining an example of a dispenser nozzle of the present invention.
FIG. 2 is a bottom view of a nozzle base illustrating an example of the dispenser nozzle of the present invention.
3A and 3B are diagrams for illustrating a modified example of the discharge port provided in the dispenser nozzle of the present invention, wherein FIG. 3A is a bottom view of a nozzle base having a trapezoidal discharge port, and FIG. It is a bottom view of the nozzle base which has a discharge opening, and (c) is a bottom view of the nozzle base which has a discharge opening formed in L shape.
FIG. 4 is a schematic sectional view for explaining another example of the dispenser nozzle of the present invention.
5 is a schematic cross-sectional view illustrating an example of the dispenser head of the present invention in which the dispenser nozzle shown in FIG. 4 is attached to a jig main body.
6 is a schematic cross-sectional view illustrating an example of the semiconductor device sealing device of the present invention including the dispenser head shown in FIG.
FIG. 7 is a schematic sectional view illustrating another example of the semiconductor device sealing device of the present invention.
FIG. 8 is a partial cross-sectional view for explaining an example of a position of an exhaust port provided in the semiconductor device sealing apparatus of the present invention in which a cap is attached to a dispenser head, and FIG. It is a figure in case a mouth is provided, and (b) is a figure in a case where an exhaust port is provided in a cap.
FIG. 9 is a schematic view for explaining a method of sealing a semiconductor device according to the present invention, wherein FIG. 9 (a) is a view for explaining a process in which a substrate and a semiconductor device are arranged on a stage; (B) is a diagram for explaining a step of disposing a sealing resin under reduced pressure in a gap formed by contact between a substrate and a bump or a solder ball of a semiconductor device; FIG. 9D is a view for explaining a step of releasing the reduced pressure state after disposing the sealing resin, and FIG. 10D is a view for explaining a step of finally manufacturing the semiconductor package by curing the sealing resin. FIG.
FIG. 10 is a schematic conceptual diagram for explaining a conventional semiconductor device sealing device (dispenser device).
FIG. 11 is a schematic view of a substrate and a semiconductor device for explaining a process in which a sealing resin is arranged with movement of an arm using the conventional semiconductor device sealing device shown in FIG. FIG. 2A is a top view of the substrate and the semiconductor device before the sealing resin is arranged, and FIG. 2B is a top view of the substrate and the semiconductor device after the sealing resin is arranged.
[Explanation of symbols]
Nozzle cover 12, 12 '
Nozzle base 14, 14 '
Screw 16
Resin reservoir 18
Jig storage unit 20
Introductory tube 22
Discharge ports 24, 30, 32, 34
Resin tube 26
Inclined surface 28
Hollow 36
Packing 41
Resin main pipe 40
Resin needle 42
Needle stopper 44
Stage 50, 650
Slide arm 52
Support arm 54
Semiconductor device package 56
Cap 60
Seal member 61
Exhaust port 62, 62 '
Duct pipe 64
Sealed space 66
Substrate 70
Semiconductor device 72
Sealing resin 74, 80
Dispenser nozzle 100, 200
Dispenser head 300, 614
Jig body 250
Semiconductor device sealing device 400, 500
Dispenser device 600
Nozzle 612
Elevating actuator 618
Arm 620

Claims (9)

A dispenser nozzle for disposing a resin in a gap between the substrate and the semiconductor device, which is generated by abutment of a substrate and a bump or a solder ball of the semiconductor device,
A resin reservoir for storing the resin;
A plurality of discharge ports respectively communicating with the resin reservoir through a plurality of resin tubes and arranged along an outer periphery of the semiconductor device;
A nozzle. 2. The nozzle according to claim 1, wherein the plurality of resin tubes are provided so as to be inclined so as to discharge the resin in a direction from the outer periphery of the semiconductor device toward the outer periphery of the semiconductor device. A dispenser head used in an apparatus for arranging a resin in a gap between the substrate and the semiconductor device caused by contact between a substrate and a bump or a solder ball of the semiconductor device,
A nozzle having a resin reservoir for storing the resin, and a plurality of discharge ports respectively communicating with the resin reservoir through a plurality of resin pipes and arranged along the outer periphery of the semiconductor device; and communicating with the resin reservoir. A jig body having a resin main pipe;
A head. The dispenser head according to claim 3, wherein the jig main body includes a needle for controlling the flow of the resin in the resin main pipe. A gap between the substrate and the semiconductor device, which is caused by the contact between the substrate and the bumps or solder balls of the semiconductor device, is provided with a resin under reduced pressure, and then sealed under normal pressure. So,
(A) a stage for placing the substrate;
(B) a nozzle having a resin reservoir for storing the resin, and a plurality of discharge ports respectively communicating with the resin reservoir through a plurality of resin pipes and disposed along the outer periphery of the semiconductor device; A dispenser head including a jig body having a communicating resin main pipe; and (c) means for controlling elevation of the dispenser head;
An apparatus comprising: A cap may be mounted around the jig body of the dispenser head to form a sealed space between the dispenser head, the cap, and the stage, and the seal formed by the cap, the stage, and the dispenser head. 6. The device according to claim 5, further comprising an exhaust means for exhausting the gas in the space. The apparatus according to claim 6, wherein the exhaust unit is provided on the stage. A method for sealing a gap between the substrate and the semiconductor device, which is caused by contact between the substrate and a bump or a solder ball of the semiconductor device, with a resin,
(A) arranging a substrate on which a bump or a solder ball of the semiconductor device abuts on a stage so as to form the gap;
(B) lowering the dispenser head according to claim 3 onto the stage, reducing the pressure in the gap, and disposing the resin toward the outer periphery of the semiconductor device;
(C) returning the gap to normal pressure; and (d) heating and curing the disposed resin;
A method comprising: In the step (b), a cap may be attached around the jig body of the dispenser head to form a sealed space between the dispenser head, the cap, and the stage, and the cap, the stage, and the dispenser head may be formed. 9. The method according to claim 8, wherein the method is performed in a state where exhaust means for exhausting the gas in the sealed space formed by the above is provided.

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