JP5134562B2 - Dispensing device - Google Patents

Description

  The present invention relates to a dispensing apparatus capable of filling an underfill agent such as a coating solution in a gap between a chip component such as an integrated circuit element and a substrate with a void dress.

  As an apparatus for filling an underfill agent such as a coating solution into a gap between a chip component such as a semiconductor chip and a substrate, a semiconductor manufacturing apparatus as shown in Patent Document 1 is known. The apparatus of Patent Document 1 includes a stage for mounting a chip component on a substrate, and a vacuum chamber for filling the substrate on which the chip component is mounted with an underfill agent. The substrate on which the chip components are mounted is transferred to a vacuum chamber. Then, the substrate on which the chip components are mounted in the vacuum chamber is filled with an underfill agent, and after a certain period of time, the vacuum chamber is exposed to atmospheric pressure. The inside of the vacuum chamber is provided with a dispensing device that fills the underfill agent, and is configured so that the dispensing device operates along the chip component and fills the underfill agent in a state of being kept in a vacuum state. Yes. Thus, since the underfill agent is filled in a vacuum state or a reduced pressure state, there is an advantage that the generation of bubbles in the underfill agent due to the entrainment of the atmosphere is small.

  On the other hand, a dispensing apparatus as described in Patent Document 2 is known for the purpose of controlling the underfill agent at high speed and precisely. The dispensing device of Patent Literature 2 includes a liquid storage unit that stores an underfill agent, and a needle valve that is attached to the liquid storage unit via a pipe. The underfill agent stored in the liquid reservoir is filled in the gap between the chip component and the substrate by being controlled at high speed and precisely from the discharge hole of the needle valve by the operation of the piston provided in the needle valve. Yes.

JP 2008-113045 A JP 2001-46936 A

  Therefore, by combining the underfill agent filling method using the vacuum chamber as described in Patent Document 1 and the dispensing apparatus as described in Patent Document 2, the underfill without air entrainment at high speed and precision. It is thought that the agent can be filled.

  However, since the dispensing device is assumed to be used in an atmospheric pressure state, there is a problem that the discharge amount and discharge position accuracy of the underfill agent discharged in a vacuum atmosphere formed in a vacuum chamber becomes unstable.

  In view of the above problems, an object of the present invention is to provide a dispensing apparatus that can accurately stabilize the discharge amount and discharge position accuracy of the underfill agent and fill the gap between the chip component and the substrate.

In order to solve the above problems, the invention described in claim 1
A dispensing device provided in a vacuum atmosphere formed in a vacuum chamber,
A cylinder, a piston moving in the cylinder, and a needle coupled to the piston ;
A configuration in which pre-Symbol needle is discharged from the discharge hole provided a coating solution to the tip of the needle valve by moving through the needle valve accumulated a coating solution,
One of the cylindrical chambers formed by partitioning the inside of the cylinder with the piston is connected to a vent opening that is open to the atmosphere, and the other cylindrical chamber is connected to a fluid pressure source that drives the piston via a switching valve. It is the dispensing apparatus characterized by the above-mentioned.

  According to the invention described in claim 1, since one of the cylindrical chambers partitioned by the piston of the cylinder is opened to the atmosphere, even if a dispensing device is provided in a vacuum atmosphere, The piston of the dispensing device can be operated. Therefore, the operation of the needle connected to the piston is the same as in the atmosphere, and the discharge amount and discharge position accuracy of the coating liquid discharged from the discharge hole provided at the tip of the needle valve is stabilized with high accuracy. The gap between the substrates can be filled.

It is a perspective view of the dispensing apparatus which concerns on embodiment of this invention. It is sectional drawing of the dispensing apparatus which concerns on embodiment of this invention. It is a flowchart of the dispensing method which concerns on embodiment of this invention.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic perspective view showing a state in which a dispensing apparatus 1 of the present invention is provided in a vacuum chamber 2. In FIG. 1, the installation surface (horizontal plane) of the vacuum chamber 2 is described as an XY plane, and the height direction is described as a Z direction.

  As shown in FIG. 1, the dispensing apparatus 1 is arranged at the upper center of the vacuum chamber 2, and the substrate 3 arranged at the lower part of the dispensing apparatus 1 is filled with an underfill agent 4 as a coating solution. . The substrate holding stage 5 holding the substrate 3 is movable in the XY directions in order to fill the predetermined portion of the substrate 3 with the underfill agent 4. The dispensing apparatus 1 may be configured to be movable in the XY directions. The dispensing apparatus 1 is configured to be movable in the Z direction in the vacuum chamber 2. A heater 6 is embedded in the holding surface of the substrate holding stage 5 so that the substrate 3 can be heated to a predetermined temperature.

  The underfill agent 4 corresponds to the coating solution of the present invention.

  The vacuum chamber 2 is provided with a movable wall 7 that opens and closes when the substrate 3 is taken in and out. The movable wall 7 may be provided for loading and unloading the substrate 3, or a single movable wall may be used for loading and unloading the substrate 3. When the substrate 3 is carried into the vacuum chamber 2, the movable wall 7 is tightened so that the pressure in the vacuum chamber 2 can be reduced from atmospheric pressure to 50 Pa. FIG. 1 shows a state in which the movable wall 7 is individually configured for loading and unloading. Further, in order to explain the inside of the vacuum chamber 2, the vacuum chamber 2 and the movable wall 7 in FIG.

  As described above, since the underfill agent 4 is filled in a vacuum atmosphere, the generation of bubbles in the underfill agent 4 due to air entrainment generated in the gap between the chip component 8 and the substrate 3 is small.

  In this embodiment, a mode in which the underfill agent 4 is filled after the chip component 8 is mounted on the substrate 3 will be described. However, the underfill agent 4 is applied to the substrate 3 on which the chip component 8 is not mounted. The form to apply | coat may be sufficient.

  Next, the configuration of the dispensing apparatus 1 will be described in detail with reference to FIG. FIG. 2 is a cross-sectional view showing the internal configuration of the dispensing apparatus 1. The horizontal direction in FIG. 2 will be described as the XY direction, and the vertical direction will be described as the Z direction. A part of the vacuum chamber 2 is indicated by hatching.

  As shown in FIG. 2, the dispensing apparatus 1 is connected to a flow path pipe 12 that guides the underfill agent 4 from the liquid storage unit 10 that stores the underfill agent 4 to the dispensing apparatus 1.

  The dispensing device 1 protrudes from a cylinder 13 and a piston 14 that can move in the cylinder 13 in the Z direction, a needle 15 that is connected to the lower part of the piston 14 and arranged in a bar shape in the Z direction and protrudes downward from the cylinder 13. The needle valve 16 covers the needle 15. The needle 15 moves in the Z direction in conjunction with the operation of the piston 14 inside the needle valve 16, and the lower side of the needle 15 passes through a nozzle 17 provided at the lower portion of the needle valve 16. The needle valve 16 is configured such that the underfill agent 4 supplied from the flow path pipe 12 is filled between the needle 15 and the inner wall of the needle valve 16. A sealing material 18 is provided on the upper portion of the needle valve 16, and the needle 15 is connected to the piston 14 through a hole in the sealing material 18.

  In the cylinder 13, cylinder chambers 19 and 25 are formed vertically via a piston 14, and a spring 20 is installed between the inner wall of the cylinder 13 and the piston 14 in the upper cylinder chamber 19. A hole 30 is provided in the side surface of the cylindrical chamber 19. The hole 30 and the ventilation port 31 provided in the vacuum chamber 2 are connected via a ventilation pipe 26. Thereby, the cylinder chamber 19 becomes an atmospheric atmosphere.

  A hole 32 is provided in the side surface of the lower cylinder chamber 25 of the piston 14, and a switching valve 28 provided outside the vacuum chamber 2 is connected to the hole 32 via a pressurizing pipe 27. A pressurizing pump 29 is connected to the switching valve 28, and the fluid pressurized by the pressurizing pump 29 is supplied to the cylinder chamber 25 via the pressurizing pipe 27 by turning on the switching valve 28. Yes. When the switching valve 28 is turned OFF, the fluid supplied to the cylinder chamber 25 is discharged from the discharge port 33 provided in the switching valve 28. In the present embodiment, the fluid supplied to the cylinder chamber 25 is a gas, and the pressurization pump 29 and the switching valve 28 will be described as a pneumatic device intended for gas (for example, air).

  The pressurizing pump 29 corresponds to the fluid pressure source of the present invention.

  When the suction and discharge of the fluid in the cylinder chamber 25 is controlled by the switching valve 28, the piston 14 can be operated in the Z direction by the balance between the spring force of the spring 20 provided in the cylinder chamber 19 and the pressure in the cylinder chamber 25. . By the operation of the piston 14, the needle 15 connected to the piston 14 moves up and down, and the underfill agent 4 is discharged from the nozzle 17 provided in the needle valve 16 downward in the Z direction.

  The environment of the cylinder chambers 19 and 25 for operating the piston 14 is the atmospheric atmosphere because the dispensing device 1 is connected to the outside of the vacuum chamber 2 by the ventilation pipe 26 even in a vacuum atmosphere covered with the vacuum chamber 2. It will be the same as under the environment. Therefore, the underfill agent 4 can be discharged with high accuracy and high speed under the same conditions as the atmospheric pressure atmosphere.

  A predetermined pressure is applied to the underfill agent 4 supplied to the liquid storage unit 10 by a plunger 21 provided in the liquid storage unit 10. The nozzle 17 provided in the needle valve 16 is heated by a nozzle heater 23.

  Next, a dispensing method for filling the substrate 3 with the underfill agent 4 using the dispensing apparatus 1 of the present invention will be described. FIG. 3 is a flowchart for filling the underfill agent 4.

  First, the underfill agent 4 is supplied to the liquid storage unit 10 provided inside the vacuum chamber 2. Further, the substrate 3 on which the chip component 8 is mounted is sucked and held on the substrate holding stage 5 of the vacuum chamber 2 by opening and closing the movable wall 7 (step SP01).

  Next, the movable wall 7 is closed and the vacuum chamber 2 is depressurized so that the pressure is from atmospheric pressure to 50 Pa. The heater 6 embedded in the substrate holding stage 5 is turned on to heat the substrate 3 from about 60 degrees to 100 degrees. The nozzle heater 23 of the dispensing apparatus 1 is turned on to heat the nozzle 17 from about 60 degrees to 100 degrees (step SP02).

  Next, the substrate holding stage 5 is moved in the X and Y directions to control the filling position of the predetermined underfill agent 4 below the nozzle 17 of the dispensing apparatus 1, and then the dispensing apparatus 1 is moved downward in the Z direction. Let By sucking and discharging the fluid in the cylinder chamber 25 of the cylinder 13 of the dispensing apparatus 1, the underfill agent 4 is discharged from the nozzle 17 by a precise amount at a high speed, and filled in a predetermined position on the substrate 3 (step SP03).

  Next, when the filling of the underfill agent 4 at a predetermined position of the substrate 3 is completed, the vacuum chamber 2 is kept in a reduced pressure state until the curing of the underfill agent 4 is completed. When the curing is completed, the vacuum chamber 2 is opened to the atmosphere, the movable wall 7 is opened, and the substrate 3 is taken out. The underfill agent 4 filled in the substrate 3 is satisfactorily filled in the gap between the chip component and the substrate 3 without rupture of bubbles (step SP04).

  Although an example in which the underfill agent 4 is used as the coating liquid has been described in the present embodiment, the present invention can also be applied to the case where the coating liquid is drawn with a silver nanopaste on the substrate 3.

  Further, the liquid storage unit 10 may be provided outside the vacuum chamber 2. Further, the cylinder chamber 19 of the cylinder 13 may be disposed below the piston 14 and the cylinder chamber 25 may be disposed above.

  The fluid supplied to the cylinder chamber 25 may be a liquid. In the case of liquid (for example, oil), the pressurizing pump 29 and the switching valve 28 use hydraulic equipment for the liquid.

DESCRIPTION OF SYMBOLS 1 Dispensing apparatus 2 Vacuum chamber 3 Substrate 4 Underfill agent 5 Substrate holding stage 6 Heater 7 Movable wall 8 Chip component 12 Channel piping 13 Cylinder 14 Piston 15 Needle 16 Needle valve 17 Nozzle 18 Sealing material 19 Cylinder chamber 20 Spring 21 Plunger 23 Nozzle heater 25 Cylinder chamber 26 Ventilation piping 27 Pressurization piping 28 Switching valve 29 Pressurization pump 30 Hole 31 Ventilation port 32 Hole 33 Discharge port

Claims (1)

A dispensing device provided in a vacuum atmosphere formed in a vacuum chamber,
A cylinder, a piston moving in the cylinder, and a needle coupled to the piston ;
A configuration in which pre-Symbol needle is discharged from the discharge hole provided a coating solution to the tip of the needle valve by moving through the needle valve accumulated a coating solution,
One of the cylindrical chambers formed by partitioning the inside of the cylinder with the piston is connected to a vent opening that is open to the atmosphere, and the other cylindrical chamber is connected to a fluid pressure source that drives the piston via a switching valve. Dispensing device characterized by that.

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