CN115458419A - Automatic glue pouring line and method for IGBT power module - Google Patents
Automatic glue pouring line and method for IGBT power module Download PDFInfo
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- CN115458419A CN115458419A CN202211175801.2A CN202211175801A CN115458419A CN 115458419 A CN115458419 A CN 115458419A CN 202211175801 A CN202211175801 A CN 202211175801A CN 115458419 A CN115458419 A CN 115458419A
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- 239000003292 glue Substances 0.000 title claims abstract description 83
- 238000000034 method Methods 0.000 title claims abstract description 19
- 230000007246 mechanism Effects 0.000 claims abstract description 184
- 239000000428 dust Substances 0.000 claims abstract description 59
- 238000011084 recovery Methods 0.000 claims abstract description 49
- 238000001514 detection method Methods 0.000 claims abstract description 42
- 238000004140 cleaning Methods 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 20
- 238000004064 recycling Methods 0.000 claims abstract description 12
- 238000007711 solidification Methods 0.000 claims abstract description 6
- 230000008023 solidification Effects 0.000 claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 claims abstract description 4
- 238000003860 storage Methods 0.000 claims description 56
- 238000001816 cooling Methods 0.000 claims description 32
- 230000017525 heat dissipation Effects 0.000 claims description 23
- 230000005540 biological transmission Effects 0.000 claims description 16
- 238000003825 pressing Methods 0.000 claims description 11
- 238000007599 discharging Methods 0.000 claims description 10
- 230000007723 transport mechanism Effects 0.000 claims description 10
- 230000000007 visual effect Effects 0.000 claims description 8
- 230000033001 locomotion Effects 0.000 claims description 6
- 230000000670 limiting effect Effects 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 5
- 239000002918 waste heat Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000009423 ventilation Methods 0.000 claims 1
- 239000011800 void material Substances 0.000 abstract description 2
- 230000002829 reductive effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 238000005056 compaction Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Automatic Assembly (AREA)
Abstract
The invention discloses an automatic glue filling line and a method for an IGBT power module, wherein the automatic glue filling line comprises an ion dust removal feeding mechanism, a glue filling curing mechanism, an upper cover assembling mechanism, a product unloading mechanism and a tray recycling mechanism; the ion removes dust feed mechanism includes cleaning device, transportation axle mechanism and ejection of compact area, cleaning device connects the one end port and the transportation axle mechanism in ion removes dust feed mechanism's play material area, the transportation other end port in a material area is connected to encapsulating solidification mechanism, encapsulating solidification mechanism is connected with upper cover closed assembly mechanism, upper cover closed assembly mechanism opposite side intercommunication product off line mechanism, tray recovery mechanism connects the product off line mechanism and leads to the play material area of ion removes dust feed mechanism, further integrate original automation flow, it is few to guarantee that whole assembly line occupies the resource, high work efficiency, the input human cost is low, there are good detection and dust removal procedure, the finished product safety and the quality of production are guaranteed, reduce the product void ratio, resource material utilizes the maximize.
Description
Technical Field
The invention relates to the field of glue filling of IGBT (insulated gate bipolar transistor) modules of power devices, in particular to an automatic glue filling line and method for the IGBT power modules.
Background
The IGBT module has the advantages of high working frequency of the MOSFET, low voltage drive and conduction loss of the BJT and high working voltage, is widely applied to emerging industries such as new energy automobiles, rail transit, smart grids and the like at present, and is a key component for realizing industrial automation, energy conservation and consumption reduction.
How to realize the insulativity among the chip, the device and the bonding wire in the power module is a key factor for ensuring the reliable operation of the power device, and aiming at the technical difficulties of long glue pouring and curing time and high voidage of the chip module, the automatic glue pouring wire is researched and developed, so that the high-quality glue pouring of the chip pin, the bottom of the bonding wire, the edge of the shell and other complex positions is ensured, and the voidage after curing is reduced.
The utility model discloses a detection and packing that prior art's IGBT module encapsulating flow line all reaches semi-automatization through equipment, but the circulation between each project is through artifical manual operation, circulation speed is inefficiency slowly, workman operating time is long, the condition of encapsulating or cooling time do not well control can also appear sometimes, the while material loading is the first step of whole encapsulating line, the module is infected by factors such as external dust and static easily in the transportation, prior art's loading attachment is very simple, only play the transportation to the module, can't guarantee the safety and the cleanness of module, it is big to add unexpected hidden danger when carrying out at the back, the qualification rate of IGBT module is low, and the tray weight of IGBT module is great, if not stack in the layering can lead to extrudeing mutually and cause the damage, the flat space area that stacks, current cooling apparatus can only accomplish to carry out the large tracts of land cooling apparatus and cools off to a plurality of trays of keeping flat, the working range of cooling apparatus is too big leads to the energy consumption height, some IGBT modules receive external force easily to cause the stitch position in the transportation and influence, the workman can avoid leaking when operation and inspection, the tray also can not in time also has a large amount of the difficult to carry out the integrated utilization ratio of the manual work of the line, so improve the problem of the automation of the problem of not-by the automation of the improvement, so the problem of the encapsulation and the automation of the integrated utilization rate of the problem of the integrated utilization of the automation of the overhead of the encapsulation and the improvement of the automation of the integrated line of the problem of the automation of the transportation.
Disclosure of Invention
The invention aims to solve the technical problems and provides an automatic glue pouring line and a method for an IGBT power module.
The technical scheme adopted by the invention for solving the technical problems is as follows: an automatic glue filling line for an IGBT power module comprises an ion dust removal feeding mechanism, a glue filling curing mechanism, an upper cover assembling mechanism, a product unloading mechanism and a tray recycling mechanism; the ion dust removal feed mechanism comprises a cleaning device, a conveying shaft mechanism and a discharge belt, the cleaning device is connected with one end port of the discharge belt of the ion dust removal feed mechanism and the conveying shaft mechanism, the glue filling and curing mechanism is connected with the other end port of the discharge belt, the glue filling and curing mechanism is connected with the upper cover assembling mechanism, the other side of the upper cover assembling mechanism is communicated with the product unloading mechanism, and the tray recovery mechanism is connected with the product unloading mechanism to be communicated with the discharge belt of the ion dust removal feed mechanism.
Preferably, the conveying shaft mechanism further comprises a moving frame and a grabbing structure, the grabbing structure is mounted on the moving frame and matched with the moving frame to realize the motion of the X, Z shaft, the feeding position of the ion dust removal feeding mechanism is used for conveying and feeding a feeding belt, the feeding belt is arranged behind the moving frame and the grabbing structure, and a feeding dust removal robot is further arranged in the center of the ion dust removal feeding mechanism; the ion dust removal feed mechanism is further provided with a to-be-removed dust area, the to-be-removed dust area is arranged around the conveying shaft mechanism, and the to-be-removed dust area comprises a tray outlet.
Preferably, the glue filling and curing mechanism comprises a glue filling and filling mechanism and a cooling and caching mechanism; the glue filling and filling mechanism comprises a glue filling machine and a dryer, the glue filling machine is connected with a discharge belt at the tail end of the ion dust removal feeding mechanism, and the dryer is connected with the glue filling machine; cooling buffer memory mechanism includes first buffer memory case and second buffer memory case, and first buffer memory case includes vertical heat radiation structure, cooling fan and vent, and second buffer memory case includes the vertical storage structure, and drying-machine, vertical heat radiation structure and vertical storage structure pass through the conveyer belt to be connected, and the conveyer belt leads out from the vertical storage structure to close the dress mechanism with the upper cover and be connected, and the top of first buffer memory case and second buffer memory case all is equipped with drive structure and heat exchanger.
Preferably, the upper cover assembling mechanism comprises an upper cover loading frame, an upper cover assembling station and an assembling robot, the upper cover assembling station comprises an exchange station, a detection station, an upper cover station and a pressing station, the exchange station, the detection station, the upper cover station and the pressing station are arranged in four directions of the wheel disc, the stations are the exchange station, the detection station, the upper cover station and the pressing station in sequence, the upper cover loading frame is arranged on the outer side of the upper cover station, and a visual detection module is arranged between the upper cover station and the upper cover loading frame; the assembling robot comprises a four-axis assembling robot and a six-axis assembling robot, the four-axis assembling robot is installed between the upper cover feeding frame and the upper cover station, and the six-axis assembling robot is installed between the NG buffer structure and the exchange station; the upper cover assembling mechanism further comprises an NG buffer structure, and the NG buffer structure is arranged on the outer side of the exchange station.
Preferably, produce a offline mechanism and include tray transport mechanism and offline transport vehicle, tray transport mechanism includes diaxon clamping platform and clamping device, clamping device installs at diaxon clamping platform, diaxon clamping platform removes for X axle and Z axle, diaxon clamping platform is last to stride whole product offline mechanism on the X axle, clamping device is last to be equipped with centre gripping cylinder and grip block, a material loading transport vehicle that offline transport vehicle and empty tray that is used for laying the vacant tray went up the line is established and is supplied tray transport mechanism to call in tray transport mechanism the place ahead, tray transport mechanism closes the mechanism with the upper cover and passes through the conveyer belt and connect the transportation tray.
Preferably, the tray recovery mechanism comprises a recovery frame, a storage frame and a recovery belt, one end of the recovery belt is connected with the recovery frame, and the other end of the recovery belt is connected with the storage frame; the storage rack comprises a conveying port on the upper side, a disc outlet on the lower side and a storage structure, the disc outlet is connected with the middle part of the storage structure, and the conveying port is connected with the top of the storage structure; the recycling frame comprises a plate inlet, a vertical conveying platform and a conveying port, the vertical conveying platform conveys a tray of the plate inlet to the conveying port, and two ends of the recycling belt are connected with the conveying ports of the recycling frame and the storage frame.
Preferably, the ion dust removal feeding mechanism and the product unloading mechanism are both provided with a transport vehicle parking area and a transport vehicle fixing device, and the transport vehicle fixing device is installed in the transport vehicle parking area.
Preferably, the length of the recovery belt can be adjusted according to the length of the production line, and a plurality of support frames are arranged below the recovery belt.
A working method of an automatic glue filling line of an IGBT power module specifically comprises the following steps:
the method comprises the following steps: pushing the transport trolley loaded with the IGBT module tray to a transport trolley parking area of an ion dust removal feeding mechanism, guiding the transport trolley to enter the transport trolley by an inner guide wheel in the transport trolley parking area and fixing the transport trolley by a transport trolley fixing device, transporting the tray on the transport trolley to the lower part of a grabbing structure through a feeding belt, aligning the grabbing structure to the position right above the tray by a moving frame through a limiting rod at the feeding belt, and moving the grabbing structure downwards to the tray through an air cylinder and clamping the tray to a to-be-dust-removed area;
step two: the method comprises the following steps that a loading and dedusting robot clamps an IGBT module on a tray of a to-be-dedusted area and places the IGBT module on a cleaning device, a plurality of IGBT modules are placed on the cleaning device, after the cleaning device cleans the IGBT modules, the cleaned IGBT modules are moved into an empty tray on a material discharging belt by the loading and dedusting robot and conveyed to a glue pouring and curing mechanism by the material discharging belt, the loading and dedusting robot simultaneously transfers the IGBT module newly placed in the to-be-dedusted area to the cleaning device for dedusting, and the empty tray with the IGBT modules clamped by the loading and dedusting robot is output from a tray outlet;
step three: the IGBT module tray is conveyed to a glue filling machine by a discharge belt for glue filling, the IGBT module tray with the glue is conveyed to a dryer for high-temperature solidification of the glue after the glue filling is finished, then the IGBT module with the glue is conveyed to a first cache box for cooling and heat dissipation, a vertical heat dissipation structure in the first cache box enables the tray with the IGBT module to be linked with a top transmission structure through two side support plates to be layered and vertically stacked through a lifting hook, a cooling fan blows air to the tray on the vertical heat dissipation structure for cooling, blown air flow rises when being heated, and the air flow is led out from a vent at the opposite side of the first cache box cooling fan and a heat dissipation cover above the first cache box cooling fan;
step four: the tray after being cooled by the fan in the first cache box is conveyed to a second cache box, the vertical storage structure of the second cache box is linked with a top transmission structure through supporting plates on two sides to be stacked in a layered mode, the tray with the second cache box cannot be immediately conveyed to an upper cover assembling mechanism, when needed, the tray is opened to start transportation, the tray is stored in the second cache box for a long time, and meanwhile, waste heat is dissipated through a top heat dissipation cover;
step five: when a tray in a second cache box is taken to the upper cover assembling mechanism, the tray is conveyed to the rear side of an exchange station of the upper cover assembling mechanism by a conveying belt, a six-axis assembling robot near the exchange station clamps and places IGBT modules on the tray to the exchange station, a flatness detection module below the exchange station detects the flatness of the placement of the IGBT modules, the upper cover assembling station rotates after the detection is finished, the IGBT modules on the exchange station rotate to the detection station, a second IGBT module is placed on the exchange station by the six-axis assembling robot, the first IGBT module completes the detection of pins and the glue filling degree at the detection station, the upper cover rotates to the upper cover station, the upper cover is conveyed to an upper cover area by the upper cover assembling rack, the upper cover is placed on a visual detection module to detect the position of the upper cover by the four-axis assembling robot, the upper cover is moved to the IGBT module of the upper cover station by the four-axis assembling robot, then rotates to a compaction station, a servo motor and a servo press of the compaction station compress the upper cover and the IGBT module and then transfer the cache module back to the exchange station, the six-axis assembling robot moves the upper cover onto the IGBT module to the exchange station, and the exchange station to move the off-line of the IGBT module into the exchange station, and the off-line of the exchange station to complete the off-line packaging mechanism;
step six: the conveying belt penetrates through the middle of the part unloading mechanism, the two-shaft clamping platform on the rear side of the conveying line controls the clamping device to clamp and place the tray loaded with the IGBT modules on the conveying belt onto a transport trolley in a transport trolley parking area, and the conveying belt is placed on an empty tray from the loading transport trolley to continue tray loading.
Preferably, the steps one to five are carried out and simultaneously comprise:
step A: tray recovery mechanism will roll off production line transport vechicle empty tray send into the frame of retrieving the frame through advancing the dish mouth in, upwards transport to the delivery port and get into the retrieval area by retrieving the vertical transportation platform in the frame, empty tray arrives the delivery port of storing the frame upside through retrieving the area transportation, the tray is accomplished the stratiform through the link gear who stores structure and store the structure and is piled up, transport the tray to the clean IGBT module sabot on the ejection of compact area supplies out the material area from going out the dish mouth when needs are got and is used.
The invention has the beneficial effects that:
1. the original automatic flow is further integrated, the whole assembly line is ensured to occupy less resources, the working efficiency is high, the input labor cost is low, good detection and dust removal procedures are provided, the safety and the quality of the produced finished product are ensured, the void ratio of the product is reduced, the unqualified product is cached, the resource recovery and utilization are convenient, and the utilization maximization of resource materials is realized;
2. the method comprises the following steps that a feeding and dedusting robot is used for clamping IGBT modules in an ion dedusting and feeding mechanism, the feeding and dedusting robot can clamp at least 2 IGBT modules at one time, the efficiency is improved, the time waste is prevented, a cleaning device comprises at least two dedusting covers and loading discs corresponding to the dedusting covers in number, the loading discs are of a bottom sliding type structure, the loading discs slide to the feeding and dedusting robot when the IGBT modules are received and when the IGBT modules are cleaned, the loading discs return to the dedusting covers after the IGBT modules are received for cleaning and dedusting, sliding is easier and labor-saving, a conveying shaft mechanism is formed by transversely arranging a plurality of roll shafts, the trays on a conveying trolley are conveyed to a position where a grabbing structure can grab through a belt and a motor, the matching among the mechanisms is tight, the discharging belt is the last step of the product, and other conveying mechanisms or storage mechanisms can be connected subsequently;
3. the first buffer box and the second buffer box are both provided with a multilayer structure, so that trays for loading IGBT modules are vertically stored, the horizontal storage area is greatly reduced, the tops of the first buffer box and the second buffer box are both provided with a top cover, vertical heat dissipation structures and vertical storage structures for preventing vertical dust from falling onto the trays and the IGBT modules respectively comprise two mounting plates, a plurality of layers of lifting hooks are arranged on the mounting plates, rollers are arranged on the lifting hooks, the trays enter the lifting hooks from the rollers, the buckles at the tail ends of the lifting hooks are fastened with the trays for fixing, the mounting plates are controlled by a lifting motor to vertically move, all the trays can sequentially enter each layer of lifting hooks reaching the mounting plates to achieve the purpose of vertical placement, the storage and the uniform cooling are convenient, when a plurality of rollers are arranged, the trays can be conveyed more smoothly and effectively, and the trays are prevented from inclining;
4. the length of the specific recovery belt and the number of the support frames can be flexibly increased and decreased according to the occupied space length of the specific step line, and the application range is wider;
5. the motor group in the storage structure and the middle tray frame, the tray frame includes driving chain and mounting panel, the mounting panel passes through driving chain and motor unit connection motion, the driving chain comprises a plurality of chain links series connection, the mounting panel is arranged by a plurality of rectangular gaskets and is constituteed, the chain link of driving chain is connected respectively with the rectangular gasket of mounting panel, the chain link makes the structure refine with rectangular gasket, also make the activity flexibility of whole storage structure better, be equipped with the tray groove of laying the tray on rectangular gasket, vertical transport platform includes lift track and clamping part, vertical transport platform is fixed with the one side of clamping part, the lift track is connected to the clamping part another side and is provided power by elevator motor and reciprocates on the lift track, the rolling motor that still is equipped with roll area and roll area on vertical transport platform is used for carrying and accepting the tray, rational in infrastructure is clear, the tray transport speed is fast and each partial transportation connection is effectual.
Drawings
FIG. 1 is a schematic structural view of the entire assembly line mechanism of the present invention;
FIG. 2 is a schematic structural view of the charging and recovery part of the ion dust removal charging mechanism of the present invention;
FIG. 3 is a schematic diagram of the configuration of the top of the second cache box of the overall pipeline mechanism of the present invention;
FIG. 4 is a schematic view of the structure of the vertical heat dissipation structure enlarged from the interior of FIG. 1A of the whole assembly line mechanism of the present invention;
FIG. 5 is a schematic structural view of the vertical storage structure of the entire in-line mechanism of the present invention;
FIG. 6 is an enlarged structural schematic view of an upper cover assembling station at B of FIG. 1 of the whole assembly line mechanism of the invention;
FIG. 7 is a schematic view of the product take-off-line mechanism of the overall in-line mechanism of the present invention;
FIG. 8 is a schematic view of the construction of the recovery frame of the entire line mechanism of the present invention;
fig. 9 is a schematic structural view of the storage rack of the entire line mechanism of the present invention.
In the figure: 1. an ion dust removal feeding mechanism, 11, a conveying shaft mechanism, 12, a discharging belt, 13, a moving frame, 14, a grabbing structure, 15, a feeding dust removal robot, 16, a to-be-removed dust area, 2, a glue pouring and curing mechanism, 21, a glue pouring and filling mechanism, 211, a glue pouring machine, 212, a dryer, 22, a cooling cache mechanism, 221, a first cache box, 2211, a vertical heat dissipation structure, 2212, a cooling fan, 2213, a vent, 222, a second cache box, 2221, a vertical storage structure, 223, a transmission structure, 224, a heat dissipation cover, 23, a feeding belt, 3, an upper cover assembling mechanism, 31, an upper cover loading frame, 32, an upper cover assembling station, 321, an exchange station, 322 and a detection station, 323, an upper cover station, 324, a pressing station, 325, a visual detection module, 33, a combined robot, 331, a four-axis combined robot, 332, a six-axis combined robot, 34, an NG buffer structure, 4, a product offline mechanism, 41, a tray transportation mechanism, 411, a two-axis clamping platform, 412, a clamping device, 42, an offline transportation vehicle, 43, a feeding transportation vehicle, 5, a tray recovery mechanism, 51, a recovery frame, 511, a tray inlet, 512, a vertical transportation platform, 52, a storage frame, 521, a tray outlet, 522, a storage structure, 53, a recovery belt, 54, a transportation port, 55, a support frame, 6, a cleaning device, 7, a transportation vehicle parking area, 71 and a transportation vehicle fixing device.
Detailed Description
The present invention will be further described with reference to the drawings and embodiments.
As shown in fig. 1-9, the automatic glue filling line for the IGBT power module according to the present invention includes an ion dust removal feeding mechanism 1, a glue filling curing mechanism 2, an upper cover assembling mechanism 3, a product unloading mechanism 4, and a tray recovery mechanism 5; the invention integrates a semi-closed loop type assembly line of the ion dust removal feeding mechanism 1, the glue filling and curing mechanism 2, the upper cover assembling mechanism 3, the product unloading mechanism 4 and the tray recovery mechanism 5, has high glue filling completion degree, less occupied space, multiple functions of robots between mechanisms, compact structure and low energy consumption, in the ion dust removal feeding mechanism 1, a feeding and dust removal robot 15 is used for clamping IGBT modules, the feeding and dust removal robot 15 can clamp at least 2 IGBT modules at one time, the efficiency is improved, the time waste is prevented, the cleaning device 6 comprises at least two dust hoods and loading discs corresponding to the number of the dust hoods, the loading discs adopt a bottom sliding type structure, when the IGBT module is received and cleaned, the IGBT module slides to the loading dust removal robot 15, after the IGBT module is received, the IGBT module returns to the dust removal cover for cleaning and dust removal, the bottom of the loading disc is provided with a slide rail, the sliding is easier and more labor-saving, the conveying shaft mechanism 11 is formed by transversely arranging a plurality of roll shafts, the belt and the motor drive the uniform rotation, the tray on the transport trolley is conveyed to the position where the grabbing structure 14 can grab, the matching between the mechanisms is tight, the material discharging belt 14 is the last step of the product, and other transmission mechanisms or storage mechanisms can be connected subsequently.
The transport shaft mechanism 11 further comprises a moving frame 13 and a grabbing structure 14, the grabbing structure 14 is installed on the moving frame 13 and matched with the moving frame to achieve motion of a X, Z shaft, a feeding belt 23 is used for transporting and feeding materials at the feeding position of the ion dust removal feeding mechanism 1, the feeding belt 23 is arranged behind the moving frame 13 and the grabbing structure 14, a tray clamp is arranged at the bottom of the grabbing structure 14, a clamping block and a clamping cylinder for clamping are also arranged on the tray clamp, the clamping force is large, the tray is prevented from falling off, a limiting rod arranged on the transport shaft mechanism 11 is used for positioning and limiting the position of the tray clamp and the actual position of the tray on the transport shaft mechanism 11, the tray clamp and the tray are ensured to correspond in position, the clamping is more convenient, and a feeding dust removal robot 15 is further arranged at the center of the ion dust removal feeding mechanism 1; the ion dust removal feeding mechanism 1 is further provided with a to-be-removed dust area 16, the to-be-removed dust area 16 is arranged around the conveying shaft mechanism 11, the to-be-removed dust area 16 comprises a tray outlet, the tray outlet and the to-be-removed dust area 16 are horizontally and vertically arranged, the space utilization area is increased, and meanwhile, an independent transmission motor is arranged, and transmission power is sufficient.
The glue filling and solidifying mechanism 2 comprises a glue filling and filling mechanism 21 and a cooling cache mechanism 22; the glue filling and filling mechanism 21 comprises a glue filling machine 211 and a dryer 212, the glue filling machine 211 is connected with the discharge belt 12 at the tail end of the ion dust removal feeding mechanism 1, and the dryer 212 is connected with the glue filling machine 211; the glue filling machine 211 controls the three-dimensional precise moving platform to drive the glue filling mixing glue filling head to move according to a preset track of the IGBT module structure in a vacuum environment, the glue filling amount is precisely controlled through a metering pump in the glue filling process, the IGBT module glue filling is completed, and then the IGBT module glue filling machine is conveyed to the dryer 212 to be cured at high temperature; the cooling buffer mechanism 22 comprises a first buffer box 221 and a second buffer box 222, the first buffer box 221 comprises a vertical heat dissipation structure 2211, a cooling fan 2212 and a vent 2213, the second buffer box 222 comprises a vertical storage structure 2221, the dryer 212, the vertical heat dissipation structure 2211 and the vertical storage structure 2221 are connected through a conveyer belt, the conveyer belt passes out of the vertical storage structure 2221 and is connected with the upper cover assembling mechanism 3, the tops of the first buffer box 221 and the second buffer box 222 are respectively provided with a transmission structure 223 and a heat dissipation cover 224, the first buffer box 221 is used for buffering and cooling the IGBT module transported from the dryer 212 for the first time, the second buffer box 222 is used for storing the IGBT module transported from the first buffer box 221, the first buffer box 221 and the second buffer box 222 are both provided with a multilayer structure, the tray that makes loading IGBT module is perpendicular storage, greatly reduced the horizontal storage area, and the top of first buffer case 221 and second buffer case 222 all has the block, can prevent that perpendicular dust from falling to perpendicular heat radiation structure 2211 and perpendicular storage structure 2221 all include two mounting panels on tray and the IGBT module, and put a plurality of layers of lifting hook on the mounting panel, be equipped with the gyro wheel on the lifting hook, the tray gets into the lifting hook from the gyro wheel, the buckle lock tray of lifting hook tail end is fixed, elevator motor control mounting panel vertical movement, make all trays can get into in proper order and reach the purpose that each layer lifting hook of mounting panel reached perpendicular placing, conveniently store and the unified cooling, when being equipped with a plurality of gyro wheels, can more level and more smoothly effectual transport the tray, prevent that the tray from inclining.
The upper cover assembling mechanism 3 comprises an upper cover assembling frame 31, an upper cover assembling station 32 and an assembling robot 33, wherein the upper cover assembling station 32 comprises an exchange station 321, a detection station 322, an upper cover station 323 and a pressing station 324, the exchange station 321, the detection station 322, the upper cover station 323 and the pressing station 324 are arranged at four positions of the wheel disc, the stations are the exchange station 321, the detection station 322, the upper cover station 323 and the pressing station 324 in sequence, the upper cover assembling frame 31 is arranged at the outer side of the upper cover station 323, and a visual detection module 325 is arranged between the upper cover station 323 and the upper cover assembling frame 31; the multi-assembling robot 33 includes a four-axis multi-assembling robot 331 and a six-axis multi-assembling robot 332, the four-axis multi-assembling robot 331 is installed between the upper cover loading frame 31 and the upper cover station 323, and the six-axis multi-assembling robot 332 is installed between the NG buffer structure 34 and the exchange station 321; the upper cover assembling mechanism 3 further comprises an NG buffer structure 34, the NG buffer structure 34 is arranged on the outer side of the exchange station 321, the IGBT module is placed on the exchange station 321 from a conveying belt by a six-axis assembling robot 332 firstly, the flatness is determined to be qualified or not by detecting distances from all positions at the bottom of the IGBT module through a flatness detection sensor in the exchange station 321, after the detection is finished, the wheel disc rotates to enable the turntable below the exchange station 321 to rotate to the detection station 322, meanwhile, a next IGBT module is continuously placed at the exchange station 321 to improve the efficiency, the detection station 322 utilizes line laser scanning to achieve positioning detection on the glue filling height and the pin position of the IGBT module, the wheel disc continues to rotate to enable the IGBT module of the detection station 322 to reach the upper cover station 323, the four-axis assembling robot 331 near the upper cover station 323 can install the upper cover onto the IGBT module from an upper cover area, then the turntable moves to the position below the pressing station 324 to fasten the upper cover, finally, the rotary disc returns to the exchange station 321, the six-axis assembling robot 332 takes out qualified products or transfers the NG products to the buffer structure 34, the visual detection module to visually locate the upper cover before the upper cover to be installed, and the upper cover can be installed, and the movement path can ensure the precision.
The product offline mechanism 4 comprises a tray conveying mechanism 41 and an offline transport vehicle 42, the tray conveying mechanism 41 comprises a two-axis clamping platform 411 and a clamping device 412, the clamping device 412 is installed on the two-axis clamping platform 411, the two-axis clamping platform 411 is moved along an X axis and a Z axis, the two-axis clamping platform 411 transversely spans the whole product offline mechanism 4 on the X axis, a clamping cylinder and a clamping block are arranged on the clamping device 412, the offline transport vehicle 42 for placing empty trays and a feeding transport vehicle 43 for feeding the empty trays are arranged in front of the tray conveying mechanism 41 to be called by the tray conveying mechanism 41, the tray conveying mechanism 41 and the upper cover assembling mechanism 3 are connected with a conveying belt to convey the trays, and the outer side of the product offline mechanism 4 is further provided with a plastic sucking disc feeding area.
The tray recovery mechanism 5 comprises a recovery frame 51, a storage frame 52 and a recovery belt 53, wherein one end of the recovery belt 53 is connected with the recovery frame 51, and the other end of the recovery belt 53 is connected with the storage frame 52; the storage rack 52 comprises a conveying opening 54 at the upper side, a disk outlet 521 at the lower side and a storage structure 522, wherein the disk outlet 521 is connected with the middle part of the storage structure 522, and the conveying opening 54 is connected with the top part of the storage structure 522; the recycling frame 51 comprises a tray inlet 511, a vertical conveying platform 512 and a conveying port 54, the vertical conveying platform 512 conveys trays in the tray inlet 511 to the conveying port 54, two ends of the recycling belt 53 are connected with the recycling frame 51 and the conveying port 54 of the storage frame 52, the storage structure 522 comprises a motor set which drives the middle tray frame to move in an up-and-down linkage mode and the middle tray frame, the tray frame comprises a transmission chain and a mounting plate, the mounting plate is connected with the motor set through the transmission chain and moves in a connected mode, the transmission chain is formed by connecting a plurality of chain links in series, the mounting plate is formed by arranging a plurality of strip gaskets, the chain links of the transmission chain are respectively connected with the strip gaskets of the mounting plate, the chain links and the strip gaskets are used for refining the structure and enable the whole storage structure to have better activity flexibility, tray grooves for placing the trays are formed in the strip gaskets, the vertical conveying platform 512 comprises a lifting track and a clamping portion, the vertical conveying platform 512 is fixed with one surface of the clamping portion, the other surface of the clamping portion is connected with the lifting track and powered by the lifting motor to move up and down on the lifting track, the vertical conveying platform 512 is further provided with rolling motors for conveying and receiving the trays, the rolling belt, the transport speed is reasonable and clear transport effect of the transport tray transport is good.
All be equipped with transport vechicle parking area 7 and transport vechicle fixing device 71 on the line mechanism 4 under ion dust removal feed mechanism 1 and product, transport vechicle fixing device 71 is installed in transport vechicle parking area 7, the leading wheel that the both sides of transport vechicle fixing device 71 set up for the level, the leading wheel is equipped with a plurality ofly, the leading wheel gets into with the contact guide travelling bogie of travelling bogie side, and the outer port of transport vechicle fixing device 71 is equipped with the buckle, carry out the lock to the travelling bogie afterbody after the travelling bogie gets into completely, prevent that the travelling bogie from sliding.
The length of recovery area 53 can be adjusted according to assembly line length, and the below of recovery area 53 is equipped with a plurality of support frames 55, and the length of specific recovery area 53 and the quantity of support frame 55 can be according to the land occupation length of specific step line nimble increase and reduction, and application scope is wider.
A working method of an automatic glue filling line of an IGBT power module specifically comprises the following steps:
the method comprises the following steps: pushing the transport trolley loaded with the IGBT module tray to a transport trolley parking area 7 of the ion dust removal feeding mechanism 1, guiding a guide wheel in the transport trolley parking area 7 to guide the transport trolley to enter and fix the transport trolley through a transport trolley fixing device 71, transporting the tray on the transport trolley to the lower part of a grabbing structure 14 through a material feeding belt 23, aligning the grabbing structure 14 to the position right above the tray through a limiting rod at the position of the material feeding belt 23 by a moving frame 13, and moving the grabbing structure 14 downwards to the position of the tray through an air cylinder and clamping the tray to a region 16 to be dedusted;
step two: the feeding and dedusting robot 15 clamps the IGBT modules on the tray of the area to be dedusted out and places the IGBT modules on the cleaning device 6, a plurality of IGBT modules are placed on the cleaning device 6, after the cleaning device 6 finishes cleaning the IGBT modules, the cleaned IGBT modules are moved into the empty tray on the discharging belt 12 by the feeding and dedusting robot 15 and are conveyed to the glue pouring and solidifying mechanism 2 by the discharging belt 12, the feeding and dedusting robot 15 simultaneously transfers the IGBT modules newly placed in the area to be dedusted 16 to the cleaning device 6 for dedusting, and the empty tray with the IGBT modules clamped by the feeding and dedusting robot 15 is output from the outlet of the tray;
step three: the IGBT module tray is conveyed to a glue filling machine 211 by a discharge belt for glue filling, the IGBT module tray with glue is conveyed to a dryer 212 for high-temperature curing of the glue after the glue filling is finished, then the IGBT module with glue is conveyed to a first cache box 221 for cooling and heat dissipation, the tray provided with the IGBT module is linked with a top transmission structure 223 through two side support plates to form a layer shape and vertically stacked through a lifting hook, a cooling fan 2212 performs blowing cooling on the tray on the vertical cooling structure 2211, blown air flow rises by heating, and the air flow passes through a vent 2213 on the opposite side of the first cache box 221 cooling fan 2212 and a heat dissipation cover 224 above the vent 2213;
step four: the trays cooled by the fan in the first cache box 221 are conveyed to the second cache box 222, the vertical storage structure 2221 of the second cache box 222 is linked with the top transmission structure 223 through the supporting plates at two sides to be stacked in a layered manner, the trays in the second cache box 222 cannot be immediately conveyed to the upper cover assembling mechanism 3, the trays are opened to start transportation when needed, the trays are stored in the second cache box 222 for a long time, and meanwhile, waste heat is dissipated through the top heat dissipation cover 224;
step five: when the tray in the second cache box 222 is taken to the upper cover assembling mechanism 3, the tray is conveyed to the rear side of the exchange station 321 of the upper cover assembling mechanism 3 by a conveying belt, the IGBT module on the tray is clamped to the exchange station 321 by a six-axis assembling robot 332 near the exchange station 321, the flatness detection module below the exchange station detects the flatness of the placed IGBT module, after the detection is finished, the upper cover assembling station 32 rotates, the IGBT module on the exchange station 321 rotates to the detection station 322, the six-axis assembling robot 332 places a second IGBT module on the exchange station 321, the first IGBT module completes the detection of the pin and the glue filling degree at the detection station 322, the upper cover rotates to the upper cover station 323, the upper cover is conveyed to the upper cover area by the upper cover assembling frame 31, the four-axis assembling robot 331 is placed at the upper cover position detected by the visual detection module 325, then the four-axis assembling robot 331 moves the upper cover 323 to the IGBT module of the upper cover station, then rotates to the upper cover 324 to be pressed to the cache station 324, the servo motor and the servo monitor 324 move the upper cover and the servo monitor, the servo press moves the upper cover 34 to detect the position of the IGBT module, the improper laser exchanging station 321, and the exchanging station 321 detects the improper product, and the improper switching of the IGBT module replacement station including the replacement station 321 by the laser, the improper filling machine, the replacement station 321 and the improper filling machine detects the unqualified product, the defective product, the replacement station 321 and the replacement station 321;
step six: the conveyer belt passes through the middle part of the product unloading mechanism 4, the two-shaft clamping platform 411 at the rear side of the conveyer belt controls the clamping device 412 to clamp and place the tray loaded with the IGBT module on the conveyer belt on the transport trolley of the transport trolley parking area 7, and the empty tray is placed on the conveyer belt from the feeding transport trolley 43 to be continuously palletized.
The steps from the first step to the fifth step are carried out and simultaneously comprise:
step A: the tray recovery mechanism 5 sends the empty tray of the offline transport vehicle 42 into the frame body of the recovery frame 51 through the tray inlet 511, the empty tray is upwards conveyed to the conveying port 54 through the vertical conveying platform 512 in the frame body of the recovery frame 51 to enter the recovery belt 53, the empty tray is conveyed to the conveying port 54 on the upper side of the storage frame 52 through the recovery belt 53, the tray is stacked in a layered mode through the linkage mechanism of the storage structure 522 and the storage structure 522, when the tray needs to be taken, the tray is conveyed to the cleaned IGBT module tray on the discharging belt 12 from the tray outlet 521, and the tray recovery mechanism 5 runs through the working process of the whole assembly line.
The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The utility model provides an automatic encapsulating line of IGBT power module which characterized in that: comprises an ion dust removal feeding mechanism (1), a glue pouring and curing mechanism (2), an upper cover assembling mechanism (3), a product unloading mechanism (4) and a tray recycling mechanism (5);
ion dust removal feed mechanism (1) is including cleaning device (6), transportation axle mechanism (11) and ejection of compact area (12), one end port and transportation axle mechanism (11) of ejection of compact area (12) of cleaning device (6) connection ion dust removal feed mechanism (1), the transportation other end port in ejection of compact area (12) is connected in encapsulating solidification mechanism (2), encapsulating solidification mechanism (2) are connected with upper cover closed assembly mechanism (3), upper cover closed assembly mechanism (3) opposite side intercommunication product off-line mechanism (4), tray recovery mechanism (5) are connected product off-line mechanism (4) and are led to ejection of compact area (12) of ion dust removal feed mechanism (1).
2. The IGBT power module automation glue filling line of claim 1, characterized in that: the conveying shaft mechanism (11) further comprises a moving frame (13) and a grabbing structure (14), the grabbing structure (14) is installed on the moving frame (13) and matched with the moving frame to achieve movement of a X, Z shaft, a feeding belt (23) is arranged at the feeding position of the ion dust removal feeding mechanism (1) to convey and feed, the feeding belt (23) is arranged behind the moving frame (13) and the grabbing structure (14), and a feeding dust removal robot (15) is further arranged in the center of the ion dust removal feeding mechanism (1);
the ion dedusting and feeding mechanism (1) is further provided with a to-be-dedusted area (16), the to-be-dedusted area (16) is arranged around the conveying shaft mechanism (11), and the to-be-dedusted area (16) comprises a tray outlet.
3. The IGBT power module automation glue filling line of claim 1, characterized in that: the glue pouring and solidifying mechanism (2) comprises a glue pouring and filling mechanism (21) and a cooling buffer mechanism (22);
the glue filling and filling mechanism (21) comprises a glue filling machine (211) and a dryer (212), the glue filling machine (211) is connected with a discharge belt (12) at the tail end of the ion dust removal and feeding mechanism (1), and the dryer (212) is connected with the glue filling machine (211);
the cooling cache mechanism (22) comprises a first cache box (221) and a second cache box (222), the first cache box (221) comprises a vertical heat dissipation structure (2211), a cooling fan (2212) and a ventilation opening (2213), the second cache box (222) comprises a vertical storage structure (2221), the dryer (212), the vertical heat dissipation structure (2211) and the vertical storage structure (2221) are connected through a conveying belt, the conveying belt is led out from the vertical storage structure (2221) to be connected with the upper cover assembling mechanism (3), and the tops of the first cache box (221) and the second cache box (222) are respectively provided with a transmission structure (223) and a heat dissipation cover (224).
4. The IGBT power module automation glue filling line of claim 1, characterized in that: the upper cover assembling mechanism (3) comprises an upper cover assembling work station (31), an upper cover assembling work station (32) and an assembling robot (33), wherein the upper cover assembling work station (32) comprises an exchange work station (321), a detection work station (322), an upper cover work station (323) and a pressing work station (324), the exchange work station (321), the detection work station (322), the upper cover work station (323) and the pressing work station (324) are arranged at four positions of the wheel disc, the work stations are the exchange work station (321), the detection work station (322), the upper cover work station (323) and the pressing work station (324) in sequence, the upper cover assembling work station (31) is arranged at the outer side of the upper cover work station (323), and a visual detection module (325) is arranged between the upper cover work station (323) and the upper cover assembling work station (31);
the assembling robot (33) comprises a four-axis assembling robot (331) and a six-axis assembling robot (332), wherein the four-axis assembling robot (331) is installed between the upper cover feeding frame (31) and the upper cover station (323), and the six-axis assembling robot (332) is installed between the NG buffer structure (34) and the exchange station (321);
the upper cover assembling mechanism (3) further comprises an NG cache structure (34), and the NG cache structure (34) is arranged on the outer side of the exchange station (321).
5. The automatic encapsulating line of IGBT power module of claim 1, characterized in that: product offline mechanism (4) include tray transport mechanism (41), offline transport vehicle (42) and material loading transport vehicle (43), tray transport mechanism (41) include diaxon clamping platform (411) and clamping device (412), clamping device (412) are installed at diaxon clamping platform (411), diaxon clamping platform (411) are X axle and Z axle removal, diaxon clamping platform (411) are gone up at X axle and are striden whole product offline mechanism (4), be equipped with centre gripping cylinder and grip block on clamping device (412), material loading transport vehicle (43) that offline transport vehicle (42) and the empty tray that are used for laying the vacant tray were gone up the line are established and are supplied tray transport mechanism (41) the place ahead to call in tray transport mechanism (41), tray transport mechanism (41) and upper cover are closed dress mechanism (3) and are passed through the transportation area and are connected the transportation tray.
6. The IGBT power module automation glue filling line of claim 1, characterized in that: the tray recovery mechanism (5) comprises a recovery frame (51), a storage frame (52) and a recovery belt (53), one end of the recovery belt (53) is connected with the recovery frame (51), and the other end of the recovery belt is connected with the storage frame (52);
the storage rack (52) comprises a conveying opening (54) at the upper side, a tray outlet (521) at the lower side and a storage structure (522), the tray outlet (521) is connected with the middle part of the storage structure (522), and the conveying opening (54) is connected with the top part of the storage structure (522);
the recycling rack (51) comprises a tray inlet (511), a vertical conveying platform (512) and a conveying port (54), the tray of the tray inlet (511) is conveyed to the conveying port (54) by the vertical conveying platform (512), and two ends of a recycling belt (53) are connected with the conveying ports (54) of the recycling rack (51) and the storage rack (52).
7. The IGBT power module automation glue filling line of claim 1, characterized in that: the ion dust removal feeding mechanism (1) and the product unloading mechanism (4) are provided with a transport vehicle parking area (7) and a transport vehicle fixing device (71), and the transport vehicle fixing device (71) is installed in the transport vehicle parking area (7).
8. The IGBT power module automation glue filling line of claim 1, characterized in that: the length of the recovery belt (53) can be adjusted according to the length of the production line, and a plurality of support frames (55) are arranged below the recovery belt (53).
9. The working method of the IGBT power module automatic glue filling line is characterized in that: the method specifically comprises the following steps:
the method comprises the following steps: pushing the transport trolley loaded with the IGBT module tray to a transport trolley parking area (7) of an ion dust removal feeding mechanism (1), guiding the transport trolley to enter the transport trolley parking area (7) through an inner guide wheel of the transport trolley parking area (7) and fixing the transport trolley through a transport trolley fixing device (71), transporting the tray on the transport trolley to the lower part of a grabbing structure (14) through a material loading belt (23), aligning the grabbing structure (14) to the position right above the tray through a limiting rod at the material loading belt (23) by a moving frame (13), and moving the grabbing structure (14) downwards to the tray through a cylinder and clamping the tray to a to-be-removed dust area (16);
step two: the method comprises the following steps that a loading and dedusting robot (15) clamps IGBT modules on a tray of a to-be-dedusted area out and places the IGBT modules on a cleaning device (6), a plurality of IGBT modules are placed on the cleaning device (6), after the cleaning device (6) cleans the IGBT modules, the cleaned IGBT modules are moved into empty trays on a material outlet belt (12) by the loading and dedusting robot (15) and are conveyed to a step structure of a glue pouring and curing mechanism (2) by the material outlet belt (12), the loading and dedusting robot (15) simultaneously transfers the IGBT modules newly placed in the to-be-dedusted area (16) to the cleaning device (6) for dedusting, and the empty trays with the IGBT modules clamped by the loading and dedusting robot (15) are output from a tray outlet;
step three: the IGBT module tray is conveyed to a glue filling machine (211) by a discharge belt for glue filling, the IGBT module tray with the glue is conveyed to a dryer (212) for high-temperature solidification of the glue after the glue filling is finished, then the IGBT module with the glue is conveyed to a first cache box (221) for cooling and heat dissipation, the tray provided with the IGBT module is linked through two side support plates and a top transmission structure (223) to form a layer shape and is vertically stacked through a lifting hook by a vertical heat dissipation structure (2211) in the first cache box (221), a cooling fan (2212) blows and cools the tray on the vertical heat dissipation structure (2211), blown air flow rises by heating, and the air flow passes through a vent (2213) at the opposite side of the cooling fan (2212) of the first cache box (221) and a heat dissipation cover (224) above the vent;
step four: the trays subjected to fan cooling in the first cache box (221) are conveyed to the second cache box (222), the vertical storage structures (2221) of the second cache box (222) are linked with the top transmission structures (223) through the supporting plates at two sides to be stacked in a layered mode, the trays in the second cache box (222) cannot be immediately conveyed to the upper cover assembling mechanism (3), the trays are opened to start transportation when needed, the trays are stored in the second cache box (222) for a long time, and meanwhile, waste heat is dissipated through the top heat dissipation cover (224);
step five: when a tray in the second cache box (222) is taken to the upper cover assembling mechanism (3), the tray is conveyed to the rear side of an exchange station (321) of the upper cover assembling mechanism (3) by a conveying belt, a six-axis assembling robot (332) near the exchange station (321) clamps and places IGBT modules on the tray to the exchange station (321), a flatness detection module below the exchange station detects flatness of placement of the IGBT modules, after detection, the upper cover assembling station (32) rotates, the IGBT modules on the exchange station (321) rotate to a detection station (322), the six-axis assembling robot (332) places a second IGBT module on the exchange station (321), a first IGBT module completes detection of stitches and glue filling degree at the detection station (322), the upper cover rotates to the upper cover station (323), an upper cover is conveyed to an upper cover area by an upper cover loading frame (31), the four-axis assembling robot (331) is placed at a visual detection module (325), then the upper cover moves out of the upper cover assembling robot (331) to press, the upper cover module (324) and a servo monitor presses the IGBT modules (324) to press the upper cover assembly station (321) and press the IGBT modules, and the servo monitor presses the upper cover module (324) to press the exchange station (321), and placing the unqualified product into an NG cache structure (34);
step six: the conveying belt penetrates through the middle of the part unloading mechanism (4), the two-shaft clamping platform (411) at the rear side of the conveying line controls the clamping device (412) to clamp and place the tray loaded with the IGBT modules on the conveying belt onto a conveying trolley of the conveying trolley parking area (7), and the conveying belt is placed on an empty tray from the loading conveying trolley (43) to continue to be loaded with trays.
10. The working method of the IGBT power module automatic glue filling line according to claim 9, characterized in that: the steps from the first step to the fifth step are carried out and simultaneously comprise:
step A: the tray recovery mechanism (5) sends empty trays of the offline transport vehicle (42) into a frame body of a recovery frame (51) through a tray inlet (511), the empty trays are upwards conveyed to a conveying port (54) through a vertical conveying platform (512) in the frame body of the recovery frame (51) to enter a recovery belt (53), the empty trays are conveyed to the conveying port (54) on the upper side of a storage frame (52) through the recovery belt (53), the trays complete layered stacking through a linkage mechanism of a storage structure (522) and a storage structure (522), and the trays are conveyed to a discharging belt (12) from a tray outlet (521) to supply clean IGBT module trays on the discharging belt (12) when the trays are required to be taken.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211175801.2A CN115458419A (en) | 2022-09-26 | 2022-09-26 | Automatic glue pouring line and method for IGBT power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211175801.2A CN115458419A (en) | 2022-09-26 | 2022-09-26 | Automatic glue pouring line and method for IGBT power module |
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| Publication Number | Publication Date |
|---|---|
| CN115458419A true CN115458419A (en) | 2022-12-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211175801.2A Pending CN115458419A (en) | 2022-09-26 | 2022-09-26 | Automatic glue pouring line and method for IGBT power module |
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| CN (1) | CN115458419A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116053174A (en) * | 2023-04-03 | 2023-05-02 | 长园半导体设备(珠海)有限公司 | Automatic gland device of IGBT module encapsulation |
| CN116764912A (en) * | 2023-06-30 | 2023-09-19 | 常州铭赛机器人科技股份有限公司 | UV curing device and use method thereof |
-
2022
- 2022-09-26 CN CN202211175801.2A patent/CN115458419A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116053174A (en) * | 2023-04-03 | 2023-05-02 | 长园半导体设备(珠海)有限公司 | Automatic gland device of IGBT module encapsulation |
| CN116053174B (en) * | 2023-04-03 | 2023-07-07 | 长园半导体设备(珠海)有限公司 | Automatic gland device of IGBT module encapsulation |
| CN116764912A (en) * | 2023-06-30 | 2023-09-19 | 常州铭赛机器人科技股份有限公司 | UV curing device and use method thereof |
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