JPS6365273U - - Google Patents

Info

Publication number
JPS6365273U
JPS6365273U JP15964186U JP15964186U JPS6365273U JP S6365273 U JPS6365273 U JP S6365273U JP 15964186 U JP15964186 U JP 15964186U JP 15964186 U JP15964186 U JP 15964186U JP S6365273 U JPS6365273 U JP S6365273U
Authority
JP
Japan
Prior art keywords
cap
heat sink
adhesive
integrated circuit
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15964186U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15964186U priority Critical patent/JPS6365273U/ja
Publication of JPS6365273U publication Critical patent/JPS6365273U/ja
Pending legal-status Critical Current

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  • Casings For Electric Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例を示す断面図、第
2図は従来の混成集積回路装置を示す断面図であ
る。 図中、1はキヤツプ、1aは穴、1bはストツ
パ、2は放熱板、3はセラミツク基板、4はリー
ド、5は接着剤である。尚、図中同一符号は同一
又は相当部分を示す。
FIG. 1 is a sectional view showing an embodiment of this invention, and FIG. 2 is a sectional view showing a conventional hybrid integrated circuit device. In the figure, 1 is a cap, 1a is a hole, 1b is a stopper, 2 is a heat sink, 3 is a ceramic substrate, 4 is a lead, and 5 is an adhesive. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外部リードを固着した基板を放熱板上に実装し
、この放熱板と、外部保護するためのキヤツプと
を接着剤にて接合するものにおいて、上記キヤツ
プのリード穴上部の内壁に凸状のストツパを設け
たことを特徴とする混成集積回路装置。
In a device in which a board with external leads fixed is mounted on a heat sink, and this heat sink and a cap for external protection are bonded with adhesive, a convex stopper is provided on the inner wall above the lead hole of the cap. A hybrid integrated circuit device characterized by:
JP15964186U 1986-10-17 1986-10-17 Pending JPS6365273U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15964186U JPS6365273U (en) 1986-10-17 1986-10-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15964186U JPS6365273U (en) 1986-10-17 1986-10-17

Publications (1)

Publication Number Publication Date
JPS6365273U true JPS6365273U (en) 1988-04-30

Family

ID=31084264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15964186U Pending JPS6365273U (en) 1986-10-17 1986-10-17

Country Status (1)

Country Link
JP (1) JPS6365273U (en)

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