JPS61177454U - - Google Patents

Info

Publication number
JPS61177454U
JPS61177454U JP1985060713U JP6071385U JPS61177454U JP S61177454 U JPS61177454 U JP S61177454U JP 1985060713 U JP1985060713 U JP 1985060713U JP 6071385 U JP6071385 U JP 6071385U JP S61177454 U JPS61177454 U JP S61177454U
Authority
JP
Japan
Prior art keywords
integrated circuit
case
heat sink
hybrid integrated
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985060713U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985060713U priority Critical patent/JPS61177454U/ja
Publication of JPS61177454U publication Critical patent/JPS61177454U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図および第2図は本考案の混成集積回路の
実施例の縦断面図である。 1……ケース、2……放熱板、3……アルミナ
セラミツクス基板、4……封止樹脂、5……発熱
部品。
1 and 2 are longitudinal sectional views of an embodiment of the hybrid integrated circuit of the present invention. 1... Case, 2... Heat sink, 3... Alumina ceramics substrate, 4... Sealing resin, 5... Heat generating component.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ケース内部に放熱板を有することを特徴とする
混成集積回路。
A hybrid integrated circuit characterized by having a heat sink inside the case.
JP1985060713U 1985-04-23 1985-04-23 Pending JPS61177454U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985060713U JPS61177454U (en) 1985-04-23 1985-04-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985060713U JPS61177454U (en) 1985-04-23 1985-04-23

Publications (1)

Publication Number Publication Date
JPS61177454U true JPS61177454U (en) 1986-11-05

Family

ID=30588318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985060713U Pending JPS61177454U (en) 1985-04-23 1985-04-23

Country Status (1)

Country Link
JP (1) JPS61177454U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598364U (en) * 1982-07-08 1984-01-19 宮武 昭典 strength training equipment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598364U (en) * 1982-07-08 1984-01-19 宮武 昭典 strength training equipment

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