JPS6245876U - - Google Patents
Info
- Publication number
- JPS6245876U JPS6245876U JP13762385U JP13762385U JPS6245876U JP S6245876 U JPS6245876 U JP S6245876U JP 13762385 U JP13762385 U JP 13762385U JP 13762385 U JP13762385 U JP 13762385U JP S6245876 U JPS6245876 U JP S6245876U
- Authority
- JP
- Japan
- Prior art keywords
- bonded
- component
- panel
- electronic device
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
第1図はこの考案の一実施例による接着部構造
を示す断面図、第2図は従来の接着部構造を示す
断面図である。
1はパネル、2はLEDキヤツプ、5は接着面
、7は溝、8はLEDキヤツプの穴。なお、図中
、同一符号は同一、又は相当部分を示す。
FIG. 1 is a sectional view showing a bonding structure according to an embodiment of this invention, and FIG. 2 is a sectional view showing a conventional bonding structure. 1 is the panel, 2 is the LED cap, 5 is the adhesive surface, 7 is the groove, and 8 is the hole in the LED cap. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
接着剤の流入溝を設けたことを特徴とする電子機
器筐体における接着部品構造。 A bonded component structure for an electronic device casing, characterized in that an inflow groove for surplus adhesive is provided on the bonding surface between a panel and a component bonded thereto.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13762385U JPS6245876U (en) | 1985-09-09 | 1985-09-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13762385U JPS6245876U (en) | 1985-09-09 | 1985-09-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6245876U true JPS6245876U (en) | 1987-03-19 |
Family
ID=31041850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13762385U Pending JPS6245876U (en) | 1985-09-09 | 1985-09-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6245876U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014187239A (en) * | 2013-03-25 | 2014-10-02 | Alps Electric Co Ltd | Glass composite, input device using glass composite, and electronic apparatus |
-
1985
- 1985-09-09 JP JP13762385U patent/JPS6245876U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014187239A (en) * | 2013-03-25 | 2014-10-02 | Alps Electric Co Ltd | Glass composite, input device using glass composite, and electronic apparatus |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6245876U (en) | ||
JPS5833620U (en) | composite panel | |
JPS60182134U (en) | Surface material | |
JPS58147250U (en) | package | |
JPS6384941U (en) | ||
JPS58133635U (en) | Rubber foot attachment device | |
JPS6132263U (en) | sink mounting device | |
JPS6365273U (en) | ||
JPS5838014U (en) | Fixing device between instrument case and cover | |
JPS5915941U (en) | sensor | |
JPS5840858U (en) | chip parts | |
JPS5918437U (en) | multi-terminal electronic components | |
JPS5950426U (en) | capacitor | |
JPH0317616U (en) | ||
JPS59146901U (en) | Square chip-shaped electronic components | |
JPS5942095U (en) | Heat sink mounting structure | |
JPS6357739U (en) | ||
JPS63102201U (en) | ||
JPS60103840U (en) | electronic components | |
JPS60150037U (en) | laminate | |
JPS5969317U (en) | House atrium structure | |
JPS59139323U (en) | decorative board | |
JPS6096810U (en) | electronic components | |
JPS6037612U (en) | nail | |
JPH0470738U (en) |