JPS6096810U - electronic components - Google Patents
electronic componentsInfo
- Publication number
- JPS6096810U JPS6096810U JP18959883U JP18959883U JPS6096810U JP S6096810 U JPS6096810 U JP S6096810U JP 18959883 U JP18959883 U JP 18959883U JP 18959883 U JP18959883 U JP 18959883U JP S6096810 U JPS6096810 U JP S6096810U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- electronic component
- type electronic
- chip
- showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のチップ型電子部品の構造を示す斜視図。
第２図は混成集積回路装置等の基板の所定位置に接着剤
を塗布した状態を示す断面図。第３図は接着剤の上から
従来のチップ型電子部品を搭載して所定の圧力で混成集
積回路装置等の基板に押し付けた後の状態を示す断面図
。第４図は本考案によるチップ型電子部品を接着剤の上
から搭載して所定の圧力で混成集積回路装置等の基板に
押し付けた後の状態を示す断面図。第５図は本考案によ
るチップ型電子部品の構造を示す斜視図。
１．１′・・・・・・電極部、２・・・・・・素子部、
３・・・・・・混成集積回路装置等の基板、４・・・・
・・接着剤、５゜５′・・・・・・接合電極面、６，６
′・・・・・・凹部。FIG. 1 is a perspective view showing the structure of a conventional chip-type electronic component. FIG. 2 is a sectional view showing a state in which an adhesive is applied to a predetermined position of a substrate such as a hybrid integrated circuit device. FIG. 3 is a sectional view showing a state after a conventional chip-type electronic component is mounted on an adhesive and pressed against a substrate of a hybrid integrated circuit device or the like with a predetermined pressure. FIG. 4 is a sectional view showing the state after the chip-type electronic component according to the present invention is mounted on an adhesive and pressed against a substrate of a hybrid integrated circuit device or the like with a predetermined pressure. FIG. 5 is a perspective view showing the structure of a chip-type electronic component according to the present invention. 1.1'... Electrode part, 2... Element part,
3... Substrate of hybrid integrated circuit device, etc., 4...
...Adhesive, 5゜5'...Bonding electrode surface, 6,6
'...Concavity.
Claims (1)
とも１つの凹部を設けたことを特徴とする電子部品。1. A chip-type electronic component, characterized in that at least one recess is provided in the vicinity of an electrode portion of an element portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18959883U JPS6096810U (en) | 1983-12-08 | 1983-12-08 | electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18959883U JPS6096810U (en) | 1983-12-08 | 1983-12-08 | electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6096810U true JPS6096810U (en) | 1985-07-02 |
Family
ID=30408738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18959883U Pending JPS6096810U (en) | 1983-12-08 | 1983-12-08 | electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6096810U (en) |
-
1983
- 1983-12-08 JP JP18959883U patent/JPS6096810U/en active Pending
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