JPS58144774U - Bonding structure of printed circuit board - Google Patents
Bonding structure of printed circuit boardInfo
- Publication number
- JPS58144774U JPS58144774U JP1982041547U JP4154782U JPS58144774U JP S58144774 U JPS58144774 U JP S58144774U JP 1982041547 U JP1982041547 U JP 1982041547U JP 4154782 U JP4154782 U JP 4154782U JP S58144774 U JPS58144774 U JP S58144774U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- bonding structure
- protrusion
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来例の接合構造を示す接合時の平面図で、第
2図は同側面図、第3図は本考案に係る接合構造の接合
前の状態を示す平面図で、第4図は同接合時の断面図、
第5図は本考案に係る信実流側の接合構造を示す接合前
の状態の斜視図で、第6図は同接合時の断面図、第7図
は更に他の実施例を示す接合前の状態の平面図で、第8
図は同接合時の平面図、第9図は同接合時の断面図を示
す。
1・・・プリント基板、3・・・突出部、4・・・フレ
キシブル基板、6・・・穴。FIG. 1 is a plan view of a conventional joining structure when it is joined, FIG. 2 is a side view of the same, FIG. 3 is a plan view of the joining structure according to the present invention before joining, and FIG. is a cross-sectional view of the same joint,
Fig. 5 is a perspective view of the joint structure on the Shinjitsu flow side according to the present invention before joining, Fig. 6 is a cross-sectional view of the same joining, and Fig. 7 shows still another embodiment before joining. In the top view of the state, the eighth
The figure shows a plan view of the same bonding, and FIG. 9 shows a sectional view of the same bonding. 1... Printed circuit board, 3... Protrusion, 4... Flexible board, 6... Hole.
Claims (1)
合するフレキシブル基板には上記の突出部と嵌合自在な
穴を形成してなるプリント基板の接合構造。。A printed circuit board bonding structure in which a printed circuit board is provided with a protrusion for positioning, and a flexible substrate to be bonded to the board is formed with a hole that can be freely fitted with the protrusion. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982041547U JPS58144774U (en) | 1982-03-24 | 1982-03-24 | Bonding structure of printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982041547U JPS58144774U (en) | 1982-03-24 | 1982-03-24 | Bonding structure of printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58144774U true JPS58144774U (en) | 1983-09-29 |
Family
ID=30052729
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1982041547U Pending JPS58144774U (en) | 1982-03-24 | 1982-03-24 | Bonding structure of printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58144774U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS578209U (en) * | 1980-06-16 | 1982-01-16 | ||
JPS5710456U (en) * | 1980-06-18 | 1982-01-20 |
-
1982
- 1982-03-24 JP JP1982041547U patent/JPS58144774U/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS578209U (en) * | 1980-06-16 | 1982-01-16 | ||
JPS5710456U (en) * | 1980-06-18 | 1982-01-20 |
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