JPH0279048U - - Google Patents
Info
- Publication number
- JPH0279048U JPH0279048U JP1988157918U JP15791888U JPH0279048U JP H0279048 U JPH0279048 U JP H0279048U JP 1988157918 U JP1988157918 U JP 1988157918U JP 15791888 U JP15791888 U JP 15791888U JP H0279048 U JPH0279048 U JP H0279048U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- mounting plate
- heat
- sink mounting
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の一実施例による放熱体取付
板とケースの接合を示す断面図、第２図は第１図
の部分拡大斜視図、第３図はこの考案の他の実施
例を示す部分拡大断面図、第４図は従来の半導体
装置の断面図、第５図は第４図の放熱体取付板と
ケースの接合部分拡大斜視図である。図において
、１は放熱体取付板、２は基板、１０はケース、
１２は接着剤である。なお、図中、同一符号は同
一、又は相当部分を示す。
Fig. 1 is a sectional view showing the connection between the heat sink mounting plate and the case according to one embodiment of this invention, Fig. 2 is a partially enlarged perspective view of Fig. 1, and Fig. 3 shows another embodiment of this invention. FIG. 4 is a sectional view of a conventional semiconductor device, and FIG. 5 is an enlarged perspective view of a joint between the heat sink mounting plate and the case in FIG. 4. In the figure, 1 is a heat sink mounting plate, 2 is a board, 10 is a case,
12 is an adhesive. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
、機器の電圧・電流制御に用いられる半導体装置
において、発熱部品より発生する熱を外部へ逃が
すための放熱体を取り付ける放熱体取付板に凹部
を、外部環境より内部を保護するために構成部品
を囲うケースの前記放熱体取付板に接合する凹部
に係合する凸部を設けたことを特徴とする半導体
装置。 In semiconductor devices that consist of multiple circuit components mounted on a board and are used to control the voltage and current of equipment, a recess is provided in the heat sink mounting plate to which the heat sink is attached to dissipate the heat generated by the heat generating components to the outside. 1. A semiconductor device comprising a convex portion that engages with a concave portion of a case surrounding component parts that is joined to the heat sink mounting plate in order to protect the inside from the external environment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988157918U JPH0279048U (en) | 1988-12-02 | 1988-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988157918U JPH0279048U (en) | 1988-12-02 | 1988-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0279048U true JPH0279048U (en) | 1990-06-18 |
Family
ID=31437778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988157918U Pending JPH0279048U (en) | 1988-12-02 | 1988-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0279048U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014220670A (en) * | 2013-05-09 | 2014-11-20 | パナソニック株式会社 | Speaker system and mobile body device using the same |
-
1988
- 1988-12-02 JP JP1988157918U patent/JPH0279048U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014220670A (en) * | 2013-05-09 | 2014-11-20 | パナソニック株式会社 | Speaker system and mobile body device using the same |
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