JPS5820598U - Packaging materials for semiconductor devices - Google Patents
Packaging materials for semiconductor devicesInfo
- Publication number
- JPS5820598U JPS5820598U JP11491881U JP11491881U JPS5820598U JP S5820598 U JPS5820598 U JP S5820598U JP 11491881 U JP11491881 U JP 11491881U JP 11491881 U JP11491881 U JP 11491881U JP S5820598 U JPS5820598 U JP S5820598U
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- heat
- semiconductor devices
- packaging materials
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は一部切除した平面図、第2図は一部拡大また側
面図、第3図は包装袋の平面図、第4図は他の具体例の
一部切除した平面図、第5図は一部切除した包装袋の平
面図、第6図、第7図は他の具体例の一部切除した平面
図である。
1・・・合成樹脂フィルム、2・・・熱接着予定部、3
・・・熱接着性合成樹脂層、4・・・金属蒸着層。Fig. 1 is a partially cutaway plan view, Fig. 2 is a partially enlarged side view, Fig. 3 is a plan view of the packaging bag, Fig. 4 is a partially cutaway plan view of another specific example, and Fig. 5 is a partially cutaway plan view. The figure is a partially cutaway plan view of the packaging bag, and FIGS. 6 and 7 are partially cutaway plan views of other specific examples. DESCRIPTION OF SYMBOLS 1... Synthetic resin film, 2... Area to be thermally bonded, 3
...Thermoadhesive synthetic resin layer, 4...Metal vapor deposition layer.
Claims (1)
接着性合成樹脂層3を形成し、前記熱接着性合成樹脂層
3の全表面と、前記熱接着性合成樹脂層3を形成した側
の前記合成樹脂フィルム1の全表面とに厚さ100°A
以下の透明な金属蒸着層4を形成してなる半導体バブバ
イス用包装材。A heat-adhesive synthetic resin layer 3 was formed on the heat-bonding area 2 on one side of the transparent synthetic resin film 1, and the heat-adhesive synthetic resin layer 3 was formed on the entire surface of the heat-adhesive synthetic resin layer 3. The entire surface of the synthetic resin film 1 on the side has a thickness of 100°A.
A packaging material for a semiconductor Babbice comprising the following transparent metal vapor deposited layer 4.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11491881U JPS5820598U (en) | 1981-07-31 | 1981-07-31 | Packaging materials for semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11491881U JPS5820598U (en) | 1981-07-31 | 1981-07-31 | Packaging materials for semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5820598U true JPS5820598U (en) | 1983-02-08 |
Family
ID=29909196
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11491881U Pending JPS5820598U (en) | 1981-07-31 | 1981-07-31 | Packaging materials for semiconductor devices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5820598U (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58110638U (en) * | 1982-01-20 | 1983-07-28 | コニカ株式会社 | Sheet film feeding device |
JPS58144351U (en) * | 1982-03-19 | 1983-09-29 | コニカ株式会社 | Sheet film separation and extraction device |
JPS6061227U (en) * | 1983-10-04 | 1985-04-27 | コニカ株式会社 | Film feeding device |
JPS61248831A (en) * | 1985-04-25 | 1986-11-06 | Kubota Ltd | Delivery device for sheetlike article |
JPS62182023A (en) * | 1986-02-07 | 1987-08-10 | 米原 隆 | Electroless dusting packaging method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5388953A (en) * | 1976-11-09 | 1978-08-04 | Minnesota Mining & Mfg | Material of bag for protecting electronic parts and bag made of said material |
-
1981
- 1981-07-31 JP JP11491881U patent/JPS5820598U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5388953A (en) * | 1976-11-09 | 1978-08-04 | Minnesota Mining & Mfg | Material of bag for protecting electronic parts and bag made of said material |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58110638U (en) * | 1982-01-20 | 1983-07-28 | コニカ株式会社 | Sheet film feeding device |
JPS58144351U (en) * | 1982-03-19 | 1983-09-29 | コニカ株式会社 | Sheet film separation and extraction device |
JPH0144504Y2 (en) * | 1982-03-19 | 1989-12-22 | ||
JPS6061227U (en) * | 1983-10-04 | 1985-04-27 | コニカ株式会社 | Film feeding device |
JPS61248831A (en) * | 1985-04-25 | 1986-11-06 | Kubota Ltd | Delivery device for sheetlike article |
JPS62182023A (en) * | 1986-02-07 | 1987-08-10 | 米原 隆 | Electroless dusting packaging method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5820598U (en) | Packaging materials for semiconductor devices | |
JPS6112726U (en) | Lid material | |
JPS59153119U (en) | packaging materials | |
JPS5814372U (en) | packaging | |
JPS58145835U (en) | Lid body | |
JPS581531U (en) | Laminated material for packaging | |
JPS587345U (en) | semiconductor equipment | |
JPS59155943U (en) | packaging bag | |
JPS60142934U (en) | packaging material | |
JPS58125168U (en) | sealed lid | |
JPS60154881U (en) | semiconductor x-ray detector | |
JPS63193846U (en) | ||
JPS59141067U (en) | Cushioning material for packaging | |
JPS60120948U (en) | Parts packaging tape | |
JPS5884232U (en) | Gas barrier packaging material | |
JPS58132839U (en) | temperature indicator | |
JPS59187442U (en) | nonwoven composite | |
JPS6123916U (en) | Pasting cloth for packs | |
JPS59117149U (en) | Beam lead type semiconductor device | |
JPH02142536U (en) | ||
JPS58116554U (en) | resealable packaging bags | |
JPS60144523U (en) | Body cover with air layer | |
JPS60163235U (en) | bag with sachet | |
JPS5976398U (en) | Etsuji decorative materials | |
JPS60175069U (en) | Film for covering articles |