JPS5820598U - Packaging materials for semiconductor devices - Google Patents

Packaging materials for semiconductor devices

Info

Publication number
JPS5820598U
JPS5820598U JP11491881U JP11491881U JPS5820598U JP S5820598 U JPS5820598 U JP S5820598U JP 11491881 U JP11491881 U JP 11491881U JP 11491881 U JP11491881 U JP 11491881U JP S5820598 U JPS5820598 U JP S5820598U
Authority
JP
Japan
Prior art keywords
synthetic resin
heat
semiconductor devices
packaging materials
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11491881U
Other languages
Japanese (ja)
Inventor
東都 正
Original Assignee
藤森工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 藤森工業株式会社 filed Critical 藤森工業株式会社
Priority to JP11491881U priority Critical patent/JPS5820598U/en
Publication of JPS5820598U publication Critical patent/JPS5820598U/en
Pending legal-status Critical Current

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  • Packaging Frangible Articles (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は一部切除した平面図、第2図は一部拡大また側
面図、第3図は包装袋の平面図、第4図は他の具体例の
一部切除した平面図、第5図は一部切除した包装袋の平
面図、第6図、第7図は他の具体例の一部切除した平面
図である。 1・・・合成樹脂フィルム、2・・・熱接着予定部、3
・・・熱接着性合成樹脂層、4・・・金属蒸着層。
Fig. 1 is a partially cutaway plan view, Fig. 2 is a partially enlarged side view, Fig. 3 is a plan view of the packaging bag, Fig. 4 is a partially cutaway plan view of another specific example, and Fig. 5 is a partially cutaway plan view. The figure is a partially cutaway plan view of the packaging bag, and FIGS. 6 and 7 are partially cutaway plan views of other specific examples. DESCRIPTION OF SYMBOLS 1... Synthetic resin film, 2... Area to be thermally bonded, 3
...Thermoadhesive synthetic resin layer, 4...Metal vapor deposition layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 透明な合成樹脂フィルム1の片面の熱接着予定部2に熱
接着性合成樹脂層3を形成し、前記熱接着性合成樹脂層
3の全表面と、前記熱接着性合成樹脂層3を形成した側
の前記合成樹脂フィルム1の全表面とに厚さ100°A
以下の透明な金属蒸着層4を形成してなる半導体バブバ
イス用包装材。
A heat-adhesive synthetic resin layer 3 was formed on the heat-bonding area 2 on one side of the transparent synthetic resin film 1, and the heat-adhesive synthetic resin layer 3 was formed on the entire surface of the heat-adhesive synthetic resin layer 3. The entire surface of the synthetic resin film 1 on the side has a thickness of 100°A.
A packaging material for a semiconductor Babbice comprising the following transparent metal vapor deposited layer 4.
JP11491881U 1981-07-31 1981-07-31 Packaging materials for semiconductor devices Pending JPS5820598U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11491881U JPS5820598U (en) 1981-07-31 1981-07-31 Packaging materials for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11491881U JPS5820598U (en) 1981-07-31 1981-07-31 Packaging materials for semiconductor devices

Publications (1)

Publication Number Publication Date
JPS5820598U true JPS5820598U (en) 1983-02-08

Family

ID=29909196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11491881U Pending JPS5820598U (en) 1981-07-31 1981-07-31 Packaging materials for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5820598U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58110638U (en) * 1982-01-20 1983-07-28 コニカ株式会社 Sheet film feeding device
JPS58144351U (en) * 1982-03-19 1983-09-29 コニカ株式会社 Sheet film separation and extraction device
JPS6061227U (en) * 1983-10-04 1985-04-27 コニカ株式会社 Film feeding device
JPS61248831A (en) * 1985-04-25 1986-11-06 Kubota Ltd Delivery device for sheetlike article
JPS62182023A (en) * 1986-02-07 1987-08-10 米原 隆 Electroless dusting packaging method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5388953A (en) * 1976-11-09 1978-08-04 Minnesota Mining & Mfg Material of bag for protecting electronic parts and bag made of said material

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5388953A (en) * 1976-11-09 1978-08-04 Minnesota Mining & Mfg Material of bag for protecting electronic parts and bag made of said material

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58110638U (en) * 1982-01-20 1983-07-28 コニカ株式会社 Sheet film feeding device
JPS58144351U (en) * 1982-03-19 1983-09-29 コニカ株式会社 Sheet film separation and extraction device
JPH0144504Y2 (en) * 1982-03-19 1989-12-22
JPS6061227U (en) * 1983-10-04 1985-04-27 コニカ株式会社 Film feeding device
JPS61248831A (en) * 1985-04-25 1986-11-06 Kubota Ltd Delivery device for sheetlike article
JPS62182023A (en) * 1986-02-07 1987-08-10 米原 隆 Electroless dusting packaging method

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