JPH01100455U - - Google Patents

Info

Publication number
JPH01100455U
JPH01100455U JP19687387U JP19687387U JPH01100455U JP H01100455 U JPH01100455 U JP H01100455U JP 19687387 U JP19687387 U JP 19687387U JP 19687387 U JP19687387 U JP 19687387U JP H01100455 U JPH01100455 U JP H01100455U
Authority
JP
Japan
Prior art keywords
leads
tip
ceramic base
ceramic
wide tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19687387U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19687387U priority Critical patent/JPH01100455U/ja
Publication of JPH01100455U publication Critical patent/JPH01100455U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は、それぞれ本考案の一実施
例及び従来例を一部破断して示す平面図である。 1……セラミツクベース、2……セラミツクキ
ヤツプ、3―1〜3―16,3―4′,3―5′
,3―12′,3―13′……リード、4……キ
ヤビテイ、5……チツプ、6―1〜6―4……切
欠き。
1 and 2 are partially cutaway plan views showing an embodiment of the present invention and a conventional example, respectively. 1... Ceramic base, 2... Ceramic cap, 3-1 to 3-16, 3-4', 3-5'
, 3-12', 3-13'... Lead, 4... Cavity, 5... Chip, 6-1 to 6-4... Notch.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] チツプを搭載するキヤビテイを備えたセラミツ
クベース及びセラミツクキヤツプで複数のリード
を間に挾んでガラス封止してなり、前記リードの
うち前記セラミツクベースの長辺部に配置された
先端幅広のものを有するサーデイツプ型半導体装
置において、前記先端幅広のリードの先端に切欠
きが設けられていることを特徴とするサーデイツ
プ型半導体装置。
A ceramic base with a cavity for mounting a chip and a ceramic cap with a plurality of leads sandwiched therebetween and sealed with glass, the leads having a wide tip disposed on a long side of the ceramic base. A third dip type semiconductor device, characterized in that a notch is provided at the tip of the lead having a wide tip.
JP19687387U 1987-12-24 1987-12-24 Pending JPH01100455U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19687387U JPH01100455U (en) 1987-12-24 1987-12-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19687387U JPH01100455U (en) 1987-12-24 1987-12-24

Publications (1)

Publication Number Publication Date
JPH01100455U true JPH01100455U (en) 1989-07-05

Family

ID=31487463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19687387U Pending JPH01100455U (en) 1987-12-24 1987-12-24

Country Status (1)

Country Link
JP (1) JPH01100455U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4838769B1 (en) * 1970-05-12 1973-11-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4838769B1 (en) * 1970-05-12 1973-11-20

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