JPH02137048U - - Google Patents
Info
- Publication number
- JPH02137048U JPH02137048U JP4372789U JP4372789U JPH02137048U JP H02137048 U JPH02137048 U JP H02137048U JP 4372789 U JP4372789 U JP 4372789U JP 4372789 U JP4372789 U JP 4372789U JP H02137048 U JPH02137048 U JP H02137048U
- Authority
- JP
- Japan
- Prior art keywords
- glass
- melting point
- ceramic base
- chip
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 239000005394 sealing glass Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Die Bonding (AREA)
Description
第１図及び第２図はそれぞれ本考案の第１及び
第２の実施例を示す断面図、第３図は従来のサー
デイツプＩＣを示す断面図である。
１……セラミツクベース、２……セラミツクキ
ヤツプ、３……リードフレーム、４……封止硝子
、４ａ，４ｂ……高融点硝子、５……ＩＣチツプ
、６……接着硝子、６ａ，６ｂ……中融点硝子、
７……ワイヤ、８……封止硝子、８ａ，８ｂ……
低融点硝子。
1 and 2 are sectional views showing first and second embodiments of the present invention, respectively, and FIG. 3 is a sectional view showing a conventional circuit deep IC. 1... Ceramic base, 2... Ceramic cap, 3... Lead frame, 4... Sealing glass, 4a, 4b... High melting point glass, 5... IC chip, 6... Adhesive glass, 6a, 6b... ...medium melting point glass,
7... Wire, 8... Sealing glass, 8a, 8b...
Low melting point glass.
Claims (1)
ベースと、前記ＩＣチツプの電極を外部へ導出す
るためのリードフレームと、前記セラミツクベー
スに被せるセラミツクキヤツプとを非晶質硝子で
気密封止するサーデイツプＩＣにおいて、セラミ
ツクベース側の封止硝子は高融点硝子、セラミツ
クキヤツプ側の封止硝子は低融点硝子、ＩＣチツ
プ固着用の接着硝子は前記二硝子の中間の融点を
有する硝子で構成されていることを特徴とするサ
ーデイツプＩＣ。 This ceramic base IC includes a ceramic base on which an IC chip is fixed with amorphous glass, a lead frame for leading the electrodes of the IC chip to the outside, and a ceramic cap that covers the ceramic base, hermetically sealed with amorphous glass. In the above, the sealing glass on the ceramic base side is made of high melting point glass, the sealing glass on the ceramic cap side is made of low melting point glass, and the adhesive glass for fixing the IC chip is made of glass having a melting point between the above two glasses. A third IC featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4372789U JPH02137048U (en) | 1989-04-14 | 1989-04-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4372789U JPH02137048U (en) | 1989-04-14 | 1989-04-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02137048U true JPH02137048U (en) | 1990-11-15 |
Family
ID=31556384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4372789U Pending JPH02137048U (en) | 1989-04-14 | 1989-04-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02137048U (en) |
-
1989
- 1989-04-14 JP JP4372789U patent/JPH02137048U/ja active Pending
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