JPS6327048U - - Google Patents
Info
- Publication number
- JPS6327048U JPS6327048U JP12070186U JP12070186U JPS6327048U JP S6327048 U JPS6327048 U JP S6327048U JP 12070186 U JP12070186 U JP 12070186U JP 12070186 U JP12070186 U JP 12070186U JP S6327048 U JPS6327048 U JP S6327048U
- Authority
- JP
- Japan
- Prior art keywords
- package
- transmitting window
- view
- plan
- eprom
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Non-Volatile Memory (AREA)
Description
第１図は本考案のパツケージの第１の実施例を
示す平面図、第２図はそのＡ―Ａ′断面図、第３
図は本考案の他の実施例を示す平面図、第４図は
そのＢ―Ｂ′断面図、第５図は従来のパツケージ
の平面図、第６図はそのＣ―Ｃ′断面図である。
１，１ａ，１ｂ……アルミナキヤツプ、２，２
ａ，２ｂ……紫外線透過窓、３……リードフレー
ム、４……低融点ガラス、５……アルミナ基板、
６……ＩＣチツプ、７……ボンデイングワイヤ。
Fig. 1 is a plan view showing a first embodiment of the package of the present invention, Fig. 2 is a sectional view taken along line AA', and Fig.
The figure is a plan view showing another embodiment of the present invention, FIG. 4 is a sectional view taken along line BB', FIG. 5 is a plan view of a conventional package, and FIG. 6 is a sectional view taken along line C-C'. . 1, 1a, 1b...Alumina cap, 2, 2
a, 2b...Ultraviolet transmission window, 3...Lead frame, 4...Low melting point glass, 5...Alumina substrate,
6...IC chip, 7...bonding wire.
Claims (1)
おいて、前記透過窓表面が、パツケージ表面より
凹んだ位置にあることを特徴とするＩＣパツケー
ジ。 An IC package for EPROM with an ultraviolet transmitting window, characterized in that the transmitting window surface is recessed from the package surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12070186U JPS6327048U (en) | 1986-08-05 | 1986-08-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12070186U JPS6327048U (en) | 1986-08-05 | 1986-08-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6327048U true JPS6327048U (en) | 1988-02-22 |
Family
ID=31009265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12070186U Pending JPS6327048U (en) | 1986-08-05 | 1986-08-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6327048U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04133447U (en) * | 1991-05-31 | 1992-12-11 | 京セラ株式会社 | semiconductor package |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5816550A (en) * | 1981-07-22 | 1983-01-31 | Hitachi Ltd | Semiconductor device |
-
1986
- 1986-08-05 JP JP12070186U patent/JPS6327048U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5816550A (en) * | 1981-07-22 | 1983-01-31 | Hitachi Ltd | Semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04133447U (en) * | 1991-05-31 | 1992-12-11 | 京セラ株式会社 | semiconductor package |