JPS63201334U - - Google Patents
Info
- Publication number
- JPS63201334U JPS63201334U JP9198087U JP9198087U JPS63201334U JP S63201334 U JPS63201334 U JP S63201334U JP 9198087 U JP9198087 U JP 9198087U JP 9198087 U JP9198087 U JP 9198087U JP S63201334 U JPS63201334 U JP S63201334U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- thin semiconductor
- sealing
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の実施例を示す薄形半導体装置
の平面図、第２図はその半導体装置のバンプ電極
の側面図、第３図は本考案の半導体装置の樹脂封
止状態を示す平面図、第４図は第３図の−線
断面図、第５図は従来の半導体装置の封止樹脂未
充填状態を示す平面図、第６図は従来の半導体装
置の封止樹脂過剰状態を示す平面図、第７図は第
６図の−線断面図である。
１１……半導体素子、１２……バンプ電極、１
３……ダミーバンプ電極、１４…接続端子、１５
……封止樹脂。
FIG. 1 is a plan view of a thin semiconductor device showing an embodiment of the present invention, FIG. 2 is a side view of a bump electrode of the semiconductor device, and FIG. 3 is a plane view showing the resin-sealed state of the semiconductor device of the present invention. 4 is a sectional view taken along the line -- in FIG. 3, FIG. 5 is a plan view showing a conventional semiconductor device in a state where the sealing resin is not filled, and FIG. 6 is a plan view showing a state in which the conventional semiconductor device is filled with sealing resin. The plan view shown in FIG. 7 is a sectional view taken along the - line in FIG. 6. 11...Semiconductor element, 12...Bump electrode, 1
3...Dummy bump electrode, 14...Connection terminal, 15
...Sealing resin.
Claims (1)
を設け樹脂封止するようにしたことを特徴とする
薄形半導体装置。 (2) 前記封止を行う樹脂はエポキシ樹脂である
ことを特徴とする実用新案登録請求の範囲第１項
記載の薄形半導体装置。 (3) 前記封止を行う樹脂はシリコン樹脂である
ことを特徴とする実用新案登録請求の範囲第１項
記載の薄形半導体装置。[Claims for Utility Model Registration] (1) A thin semiconductor device characterized in that dummy bump electrodes are provided at the four corners of the surface of a semiconductor element and sealed with resin. (2) The thin semiconductor device according to claim 1, wherein the resin for sealing is an epoxy resin. (3) The thin semiconductor device according to claim 1, wherein the resin for sealing is silicone resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9198087U JPS63201334U (en) | 1987-06-17 | 1987-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9198087U JPS63201334U (en) | 1987-06-17 | 1987-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63201334U true JPS63201334U (en) | 1988-12-26 |
Family
ID=30953260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9198087U Pending JPS63201334U (en) | 1987-06-17 | 1987-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63201334U (en) |
-
1987
- 1987-06-17 JP JP9198087U patent/JPS63201334U/ja active Pending
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