JPS58138352U - Lead terminal for semiconductor package - Google Patents

Lead terminal for semiconductor package

Info

Publication number
JPS58138352U
JPS58138352U JP3565182U JP3565182U JPS58138352U JP S58138352 U JPS58138352 U JP S58138352U JP 3565182 U JP3565182 U JP 3565182U JP 3565182 U JP3565182 U JP 3565182U JP S58138352 U JPS58138352 U JP S58138352U
Authority
JP
Japan
Prior art keywords
lead terminal
semiconductor package
sealing
bent
base body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3565182U
Other languages
Japanese (ja)
Inventor
時重　明
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to JP3565182U priority Critical patent/JPS58138352U/en
Publication of JPS58138352U publication Critical patent/JPS58138352U/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のリード端子を用いた半導体装置の封止状
態を説明するための分解斜視図、第２図は第１図に示し
た半導体装置の封止後の側断面図、第３図は本考案によ
る半導体パッケージ用のリード端子の一実施例を適用し
たリードフレームを示す平面図、第４図ＡおよびＢは本
考案によるリード端子を示す側面図および平面図である
。 １１・・・基体、１３・・・蓋体、１５，１５０・・・
リードフレーム、１７，１７０・・・リード端子、４１
・・・側端面、４３・・・切れ目。Fig. 1 is an exploded perspective view for explaining the sealed state of a semiconductor device using conventional lead terminals, Fig. 2 is a side sectional view of the semiconductor device shown in Fig. 1 after sealing, and Fig. 3 4 is a plan view showing a lead frame to which an embodiment of the lead terminal for a semiconductor package according to the present invention is applied, and FIGS. 4A and 4B are a side view and a plan view showing the lead terminal according to the present invention. 11...Base body, 13...Lid body, 15,150...
Lead frame, 17, 170... Lead terminal, 41
... Side end surface, 43... Cut.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基体と蓋体とで挟着され、該基体と蓋体とで封止された
半導体素子を外部回路に電気的に接続すると共に封止後
に折り曲げられる半導体パッケージ用のリード端子にお
いて、該リード端子を長手板状で形成し、封止後に折り
曲げるべき位置で且つ長手方向における両側端面の少な
くとも一方に切れ目を付けたことを特徴とする半導体パ
ッケージ用のリード端子。A lead terminal for a semiconductor package that is sandwiched between a base body and a lid body, electrically connects a semiconductor element sealed with the base body and lid body to an external circuit, and is bent after sealing. 1. A lead terminal for a semiconductor package, which is formed into a longitudinal plate shape and has a cut at a position to be bent after sealing and at least one of both end faces in the longitudinal direction.
JP3565182U 1982-03-12 1982-03-12 Lead terminal for semiconductor package Pending JPS58138352U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3565182U JPS58138352U (en) 1982-03-12 1982-03-12 Lead terminal for semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3565182U JPS58138352U (en) 1982-03-12 1982-03-12 Lead terminal for semiconductor package

Publications (1)

Publication Number Publication Date
JPS58138352U true JPS58138352U (en) 1983-09-17

Family

ID=30047112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3565182U Pending JPS58138352U (en) 1982-03-12 1982-03-12 Lead terminal for semiconductor package

Country Status (1)

Country Link
JP (1) JPS58138352U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62163352A (en) * 1986-01-14 1987-07-20 Toshiba Corp Semiconductor device
JP2006080350A (en) * 2004-09-10 2006-03-23 Denso Corp Semiconductor device, and mounting structure thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5240063A (en) * 1975-09-26 1977-03-28 Hitachi Ltd Lead frame
JPS5252370A (en) * 1976-08-27 1977-04-27 Hitachi Ltd Fabrication of glass-sealed semiconductor device
JPS5390868A (en) * 1977-01-21 1978-08-10 Hitachi Ltd Semiconductor device of glass ceramic package type

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5240063A (en) * 1975-09-26 1977-03-28 Hitachi Ltd Lead frame
JPS5252370A (en) * 1976-08-27 1977-04-27 Hitachi Ltd Fabrication of glass-sealed semiconductor device
JPS5390868A (en) * 1977-01-21 1978-08-10 Hitachi Ltd Semiconductor device of glass ceramic package type

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62163352A (en) * 1986-01-14 1987-07-20 Toshiba Corp Semiconductor device
JP2006080350A (en) * 2004-09-10 2006-03-23 Denso Corp Semiconductor device, and mounting structure thereof

Similar Documents

Publication Publication Date Title
JPS58138352U (en) Lead terminal for semiconductor package
JPS58140641U (en) Glass-sealed semiconductor package
JPS5877055U (en) Lead wire for circuit element airtight package
JPS59164251U (en) Lead frame for semiconductor devices
JPS609226U (en) Package for semiconductor mounting
JPS59111046U (en) Glass-sealed semiconductor package
JPS59101425U (en) electronic components
JPS58138342U (en) Glass-sealed semiconductor package
JPS62140744U (en)
JPS602847U (en) 2-terminal semiconductor device
JPS5983049U (en) Micro semiconductor device
JPS5937747U (en) semiconductor equipment
JPS60130650U (en) IC socket
JPS59151457U (en) semiconductor equipment
JPS58135945U (en) Glass-sealed semiconductor package
JPS58135946U (en) Glass-sealed semiconductor package
JPS6027454U (en) semiconductor equipment
JPS59176139U (en) Chip type electrolytic capacitor
JPS593556U (en) semiconductor equipment
JPS6066037U (en) Resin-encapsulated semiconductor device
JPS58170835U (en) semiconductor equipment
JPS60106339U (en) semiconductor equipment
JPS60112123U (en) airtight terminal
JPS5869956U (en) semiconductor package
JPS6092847U (en) semiconductor equipment