JPS5877055U - Lead wire for circuit element airtight package - Google Patents
Lead wire for circuit element airtight packageInfo
- Publication number
- JPS5877055U JPS5877055U JP17022481U JP17022481U JPS5877055U JP S5877055 U JPS5877055 U JP S5877055U JP 17022481 U JP17022481 U JP 17022481U JP 17022481 U JP17022481 U JP 17022481U JP S5877055 U JPS5877055 U JP S5877055U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- circuit element
- airtight package
- element airtight
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は気密パッケージの斜視図、第２図は従来のリー
ド線封着部の断面図、第３図は従来のリード線の斜視図
、第４図は本考案によるリード線の一実施例の部分斜視
図、第５図は本考案による他の実施例のリード線本体の
側面図、第６図は本考案によるリード線の封着部の断面
図である。
１・・・ベース、２・・・側壁、３・・・カバー、４・
・・リード線挿通孔、５・・・リード線本体、６・・・
絶縁材、７・・・プレート、４１・・・リード線本体、
４２・・・プレート、４３・・・突部、Ｌ・・・リード
線。Fig. 1 is a perspective view of an airtight package, Fig. 2 is a sectional view of a conventional lead wire sealing part, Fig. 3 is a perspective view of a conventional lead wire, and Fig. 4 is an embodiment of the lead wire according to the present invention. FIG. 5 is a side view of a lead wire body according to another embodiment of the present invention, and FIG. 6 is a sectional view of a sealed portion of the lead wire according to the present invention. 1...Base, 2...Side wall, 3...Cover, 4...
...Lead wire insertion hole, 5...Lead wire body, 6...
Insulating material, 7... Plate, 41... Lead wire body,
42...Plate, 43...Protrusion, L...Lead wire.
Claims (1)
一体化している回路素子気密パッケージ用リード線にお
いて、前記リード線本体は断面四角形であり、かつ対面
する２面に突部を備えていることを特徴とする回路素子
気密パッケージ用リード線。In a lead wire for a circuit element airtight package in which a plate is connected to one end of a plurality of lead wire bodies and integrated, the lead wire body has a rectangular cross section and has protrusions on two opposing sides. A lead wire for circuit element airtight packages featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17022481U JPS5877055U (en) | 1981-11-17 | 1981-11-17 | Lead wire for circuit element airtight package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17022481U JPS5877055U (en) | 1981-11-17 | 1981-11-17 | Lead wire for circuit element airtight package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5877055U true JPS5877055U (en) | 1983-05-24 |
Family
ID=29962186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17022481U Pending JPS5877055U (en) | 1981-11-17 | 1981-11-17 | Lead wire for circuit element airtight package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5877055U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54575A (en) * | 1977-06-03 | 1979-01-05 | Hitachi Ltd | Semiconductoe device |
-
1981
- 1981-11-17 JP JP17022481U patent/JPS5877055U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54575A (en) * | 1977-06-03 | 1979-01-05 | Hitachi Ltd | Semiconductoe device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5877055U (en) | Lead wire for circuit element airtight package | |
| JPS58138352U (en) | Lead terminal for semiconductor package | |
| JPS58123576U (en) | Lead wire for circuit element airtight package | |
| JPS60156753U (en) | Airtight package | |
| JPS5849855U (en) | sealed relay | |
| JPS5877056U (en) | Lead wire for circuit element airtight package | |
| JPS58191645U (en) | Semiconductor device package | |
| JPS5985583U (en) | airtight terminal | |
| JPS5885358U (en) | semiconductor package | |
| JPS5819523U (en) | Airtight package for circuit elements | |
| JPS58187148U (en) | Semiconductor encapsulation structure | |
| JPS60141150U (en) | Airtight package | |
| JPS58123575U (en) | airtight terminal | |
| JPS5868038U (en) | Airtight package for circuit elements | |
| JPS6046641U (en) | lamp | |
| JPS58140641U (en) | Glass-sealed semiconductor package | |
| JPS59109149U (en) | Package for semiconductors | |
| JPS58123572U (en) | airtight terminal | |
| JPS588950U (en) | semiconductor equipment | |
| JPS6127258U (en) | semiconductor equipment | |
| JPS5820539U (en) | Semiconductor integrated circuit device | |
| JPS59138237U (en) | semiconductor equipment | |
| JPS59134279U (en) | airtight terminal | |
| JPS5869956U (en) | semiconductor package | |
| JPS5937747U (en) | semiconductor equipment |