JPS60141150U - Airtight package - Google Patents
Airtight packageInfo
- Publication number
- JPS60141150U JPS60141150U JP2703984U JP2703984U JPS60141150U JP S60141150 U JPS60141150 U JP S60141150U JP 2703984 U JP2703984 U JP 2703984U JP 2703984 U JP2703984 U JP 2703984U JP S60141150 U JPS60141150 U JP S60141150U
- Authority
- JP
- Japan
- Prior art keywords
- airtight package
- circuit component
- airtight
- side wall
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の気密パッケージの斜視図、第2図は本考
案による気密パッケージの一実施例の斜−親図、第3図
は前記実施例の気密パッケージを積層したときの穴部付
近の断面図である。
1・・・・・・ベース、2・・・・・・側壁、3・・・
・・・リード線挿通孔、4・・・・・・リード線、5・
・・・・・絶縁材ト、6・・・・・・回路基板、7・・
・・・・カバー、訃・間ベース穴部、9・・・・・・、
カバー穴部。Fig. 1 is a perspective view of a conventional airtight package, Fig. 2 is a perspective view of an embodiment of the airtight package according to the present invention, and Fig. 3 is a perspective view of the vicinity of the hole when the airtight packages of the above embodiment are stacked. FIG. 1...Base, 2...Side wall, 3...
...Lead wire insertion hole, 4...Lead wire, 5.
...Insulating material, 6...Circuit board, 7...
...Cover, base hole part between ends, 9...
Cover hole.
Claims (2)
線挿通孔を穿設し、このリード線挿通孔にリード線を挿
通し、絶縁材で封着するととも゛ に、前記リード線に
回路部品を接続し、カバーを被せ、前記回路部品をベー
ス、側壁、カバーで構成される気密空間に封入した気密
パッケージにおいて、位置決め用穴部を、前記気密空間
の気密性を損なうことなく、気密パッケージの厚さ方向
に挿通ずるように設けたことを特徴とする気密パッケー
ジ。(1) A side wall is erected on the base, a plurality of lead wire insertion holes are formed in this side wall, the lead wires are inserted into the lead wire insertion holes, and the lead wires are sealed with an insulating material. In an airtight package in which a circuit component is connected to a circuit component, a cover is placed on the circuit component, and the circuit component is enclosed in an airtight space consisting of a base, a side wall, and a cover, the positioning hole is inserted without impairing the airtightness of the airtight space. An airtight package characterized by being inserted through the airtight package in the thickness direction.
を特徴とする実用新案登録請求の範囲第1項記載の気密
パッケージ。(2) The airtight package according to claim 1, wherein the positioning hole has an asymmetrical shape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2703984U JPS60141150U (en) | 1984-02-27 | 1984-02-27 | Airtight package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2703984U JPS60141150U (en) | 1984-02-27 | 1984-02-27 | Airtight package |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60141150U true JPS60141150U (en) | 1985-09-18 |
Family
ID=30523620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2703984U Pending JPS60141150U (en) | 1984-02-27 | 1984-02-27 | Airtight package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60141150U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4816755B1 (en) * | 1971-03-06 | 1973-05-24 |
-
1984
- 1984-02-27 JP JP2703984U patent/JPS60141150U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4816755B1 (en) * | 1971-03-06 | 1973-05-24 |
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