JPS5819523U - Airtight package for circuit elements - Google Patents
Airtight package for circuit elementsInfo
- Publication number
- JPS5819523U JPS5819523U JP11424781U JP11424781U JPS5819523U JP S5819523 U JPS5819523 U JP S5819523U JP 11424781 U JP11424781 U JP 11424781U JP 11424781 U JP11424781 U JP 11424781U JP S5819523 U JPS5819523 U JP S5819523U
- Authority
- JP
- Japan
- Prior art keywords
- base
- airtight package
- circuit elements
- cover
- sealing flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は回路素子用気密パッケージの一例を示す縦断面
図、第２図はカバーに接合する前の従来のベースの形状
を示す一部を拡大した縦断面図、第３図は本考案の回路
素子気密パッケージに用いるベースの実施例を示す一部
を拡大した縦断面図、第４図は第３図のベースを形成す
る絞り型の一例を示す縦断面図である。
１０・・・ベース、１２・・・リード線孔、１３・・・
絶縁材、１４・・・凹部、１５・・・皿状体、１６・・
・密接フランジ、１８・・・突条、２０・・・カバー、
２１・・・皿状体、２２・・・密接フランジ、３０・・
・気密空間、４０・・・回路素子、４１・・・リード線
。Fig. 1 is a longitudinal sectional view showing an example of an airtight package for circuit elements, Fig. 2 is a partially enlarged longitudinal sectional view showing the shape of a conventional base before being joined to a cover, and Fig. 3 is a longitudinal sectional view showing an example of an airtight package for circuit elements. FIG. 4 is a partially enlarged vertical cross-sectional view showing an embodiment of a base used in a circuit element airtight package, and FIG. 4 is a vertical cross-sectional view showing an example of a draw die forming the base of FIG. 10...Base, 12...Lead wire hole, 13...
Insulating material, 14... recess, 15... dish-shaped body, 16...
・Close flange, 18...projection, 20...cover,
21...Dish-shaped body, 22...Close flange, 30...
- Airtight space, 40...Circuit element, 41...Lead wire.
Claims (1)
封フランジを突出させたベースと、このベースの密封フ
ランジと当接する密封フランジを有し該ベースとの間に
気密空間を形成するカバーと、上記気密空間内に封入さ
れ上記絶縁材に挿通されたリード線に接続される回路素
子とからなり、上記ベースとカバーの密封フランジの少
なくとも一方に該フランジ形状に沿うプロジェクション
溶接用の突条を形成した回路素子用気密パッケージにお
いて、上記突条をベースまたはヨカバーのプレス絞り加
工時に同時に形成したことを特徴とする回路素子用気密
パッケージ。A base having a sealing flange protruding outward from the periphery of a dish-like body having a recess filled with an insulating material, and a cover having a sealing flange that abuts the sealing flange of the base and forming an airtight space between the base and the base. and a circuit element sealed in the airtight space and connected to a lead wire inserted through the insulating material, and at least one of the sealing flanges of the base and cover has a protrusion for projection welding that follows the shape of the flange. What is claimed is: 1. An airtight package for a circuit element, characterized in that the protrusion is formed at the same time as the base or the side cover is press-drawn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11424781U JPS5819523U (en) | 1981-07-31 | 1981-07-31 | Airtight package for circuit elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11424781U JPS5819523U (en) | 1981-07-31 | 1981-07-31 | Airtight package for circuit elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5819523U true JPS5819523U (en) | 1983-02-07 |
Family
ID=29908533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11424781U Pending JPS5819523U (en) | 1981-07-31 | 1981-07-31 | Airtight package for circuit elements |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5819523U (en) |
-
1981
- 1981-07-31 JP JP11424781U patent/JPS5819523U/en active Pending
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