JPS62140744U - - Google Patents

Info

Publication number
JPS62140744U
JPS62140744U JP2833486U JP2833486U JPS62140744U JP S62140744 U JPS62140744 U JP S62140744U JP 2833486 U JP2833486 U JP 2833486U JP 2833486 U JP2833486 U JP 2833486U JP S62140744 U JPS62140744 U JP S62140744U
Authority
JP
Japan
Prior art keywords
resin
heat dissipation
metal plate
semiconductor device
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2833486U
Other languages
Japanese (ja)
Other versions
JPH0412677Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986028334U priority Critical patent/JPH0412677Y2/ja
Publication of JPS62140744U publication Critical patent/JPS62140744U/ja
Application granted granted Critical
Publication of JPH0412677Y2 publication Critical patent/JPH0412677Y2/ja
Expired legal-status Critical Current

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ，ｂは従来の樹脂封止型半導体装置の
平面図、第１図ｂは同断面図、第２図は本考案実
施例の断面図、第３図、第４図は本考案の放熱用
金属板の実施例の正面図及び一部断面図である。
図において１はケース、１ａは外枠部樹脂、１ｂ
は放熱用金属板、１ｂ′，１ｂ″は突起、１ｃは
柱部、２は絶縁シート、３ａ，３ｂは電極板、４
は半導体素子、５はリード端子、６は封止樹脂で
ある。 1a and 1b are plan views of a conventional resin-sealed semiconductor device, FIG. 1b is a cross-sectional view of the same, FIG. 2 is a cross-sectional view of an embodiment of the present invention, and FIGS. FIG. 2 is a front view and a partially sectional view of an example of a heat dissipation metal plate.
In the figure, 1 is the case, 1a is the outer frame resin, 1b
1b', 1b'' are projections, 1c is a pillar, 2 is an insulating sheet, 3a, 3b is an electrode plate, 4
5 is a semiconductor element, 5 is a lead terminal, and 6 is a sealing resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電極間に半導体素子を固着して所要回路に接続
してリード端子を設けた半導体回路素体を底部が
放熱用金属板により形成された樹脂ケースに収納
し、これを樹脂封止するようにした樹脂封止型半
導体装置において、前記放熱用金属板の端部に突
起もしくは切欠部を設けて、前記樹脂ケースの外
枠部樹脂と放熱用金属板を一体に形成したことを
特徴とする樹脂封止型半導体装置。 A semiconductor circuit element, in which a semiconductor element is fixed between electrodes, connected to a required circuit, and lead terminals are provided, is housed in a resin case whose bottom part is formed of a metal plate for heat dissipation, and this is sealed with resin. A resin-sealed semiconductor device, characterized in that a protrusion or a notch is provided at an end of the heat dissipation metal plate, and the outer frame resin of the resin case and the heat dissipation metal plate are integrally formed. Stop type semiconductor device.
JP1986028334U 1986-02-28 1986-02-28 Expired JPH0412677Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986028334U JPH0412677Y2 (en) 1986-02-28 1986-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986028334U JPH0412677Y2 (en) 1986-02-28 1986-02-28

Publications (2)

Publication Number Publication Date
JPS62140744U true JPS62140744U (en) 1987-09-05
JPH0412677Y2 JPH0412677Y2 (en) 1992-03-26

Family

ID=30831194

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986028334U Expired JPH0412677Y2 (en) 1986-02-28 1986-02-28

Country Status (1)

Country Link
JP (1) JPH0412677Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018128005A1 (en) * 2017-01-06 2019-11-07 パナソニックＩｐマネジメント株式会社 Capacitor, capacitor unit, capacitor manufacturing method, and capacitor unit manufacturing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56158460A (en) * 1980-05-12 1981-12-07 Mitsubishi Electric Corp Resin sealed type semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56158460A (en) * 1980-05-12 1981-12-07 Mitsubishi Electric Corp Resin sealed type semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018128005A1 (en) * 2017-01-06 2019-11-07 パナソニックＩｐマネジメント株式会社 Capacitor, capacitor unit, capacitor manufacturing method, and capacitor unit manufacturing method

Also Published As

Publication number Publication date
JPH0412677Y2 (en) 1992-03-26

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