JPH02101544U - - Google Patents
Info
- Publication number
- JPH02101544U JPH02101544U JP903989U JP903989U JPH02101544U JP H02101544 U JPH02101544 U JP H02101544U JP 903989 U JP903989 U JP 903989U JP 903989 U JP903989 U JP 903989U JP H02101544 U JPH02101544 U JP H02101544U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cap
- sealed semiconductor
- view
- semiconductor pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000008188 pellet Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000009432 framing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の第１の実施例を示す断面図、
第２図は同じくその部分平面図、第３図は本考案
の第２の実施例を示す断面図、第４図は同じくそ
の部分平面図、第５図は従来の樹脂封止型半導体
装置の一例を示す断面図、第６図は同じくその部
分平面図である。
１……電気絶縁基板、２……半導体ペレツト、
３……樹脂枠、４……封止用樹脂、５……枠付け
用樹脂、６……ボンデイングワイヤ、７……半田
、８……外部リード、９，１９，３１……キヤツ
プ、１０，３２……キヤツプ付け樹脂、１１，１
２……開孔部。
FIG. 1 is a sectional view showing a first embodiment of the present invention;
FIG. 2 is a partial plan view of the same, FIG. 3 is a sectional view showing a second embodiment of the present invention, FIG. 4 is a partial plan view of the same, and FIG. 5 is a conventional resin-sealed semiconductor device. A sectional view showing an example, and FIG. 6 is a partial plan view thereof. 1... Electrical insulating substrate, 2... Semiconductor pellet,
3... Resin frame, 4... Sealing resin, 5... Framing resin, 6... Bonding wire, 7... Solder, 8... External lead, 9, 19, 31... Cap, 10, 32... Cap attaching resin, 11,1
2...opening part.
Claims (1)
方及び側方を覆うキヤツプを有する樹脂封止型半
導体装置において、前記キヤツプの半導体ペレツ
ト上方を除く周縁部に複数個の孔が開孔されてい
ることを特徴とする樹脂封止型半導体装置。 In a resin-sealed semiconductor device having a cap that covers the top and sides of an electrically insulating substrate on which a semiconductor pellet is mounted, a plurality of holes are formed in the peripheral edge of the cap except for the part above the semiconductor pellet. Characteristics of resin-sealed semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP903989U JPH02101544U (en) | 1989-01-27 | 1989-01-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP903989U JPH02101544U (en) | 1989-01-27 | 1989-01-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02101544U true JPH02101544U (en) | 1990-08-13 |
Family
ID=31215442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP903989U Pending JPH02101544U (en) | 1989-01-27 | 1989-01-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02101544U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02201941A (en) * | 1989-01-31 | 1990-08-10 | Oki Electric Ind Co Ltd | Semiconductor package |
-
1989
- 1989-01-27 JP JP903989U patent/JPH02101544U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02201941A (en) * | 1989-01-31 | 1990-08-10 | Oki Electric Ind Co Ltd | Semiconductor package |
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