JPS62180738U - - Google Patents
Info
- Publication number
- JPS62180738U JPS62180738U JP6784286U JP6784286U JPS62180738U JP S62180738 U JPS62180738 U JP S62180738U JP 6784286 U JP6784286 U JP 6784286U JP 6784286 U JP6784286 U JP 6784286U JP S62180738 U JPS62180738 U JP S62180738U
- Authority
- JP
- Japan
- Prior art keywords
- silicon diaphragm
- sensor
- pedestal
- integrated
- semiconductor pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000012790 adhesive layer Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図：本考案の一実施例断面図、第２図：本
考案の一実施例平面図、第３図：テープ基板の断
面図、第４図：従来例を示す図。
ここに、１：シリコンダイヤフラム、２：パツ
ド、３：外枠、４：入出力端子、５：パターン部
、６：ワイヤーボンデイング線、７：台座、８：
接着層、９：保護ケース、１０：接着層、１１：
ゲル状物質、１２：保護ケース開口部、１３：シ
リコンダイヤフラム、１４：パツド、１５：外枠
、１６：入出力端子、１７：パターン部、１８：
保護カバー、１９：接着層、２０：台座、２１：
ゲル状物質、２２：テープ基板、２３：穴部、２
４：ベースフイルム、２５：導体パターン、２６
：接着層、２７：フインガーリード、２８：バン
プ部、２９：ハンダ付部。
FIG. 1: A cross-sectional view of an embodiment of the present invention, FIG. 2: A plan view of an embodiment of the present invention, FIG. 3: A cross-sectional view of a tape substrate, and FIG. 4: A view showing a conventional example. Here, 1: silicon diaphragm, 2: pad, 3: outer frame, 4: input/output terminal, 5: pattern section, 6: wire bonding line, 7: pedestal, 8:
Adhesive layer, 9: Protective case, 10: Adhesive layer, 11:
Gel substance, 12: Protective case opening, 13: Silicon diaphragm, 14: Pad, 15: Outer frame, 16: Input/output terminal, 17: Pattern part, 18:
Protective cover, 19: Adhesive layer, 20: Pedestal, 21:
Gel substance, 22: Tape substrate, 23: Hole, 2
4: Base film, 25: Conductor pattern, 26
: Adhesive layer, 27: Finger lead, 28: Bump part, 29: Soldering part.
Claims (1)
シリコンダイヤフラム、シリコンダイヤフラムと
一体化された台座、外枠、センサーと外部回路と
の接続をするセンサー入出力端子より構成された
半導体圧力センサーにおいて、上記台座と一体化
されたシリコンダイヤフラムとセンサー入出力端
子との電機的接続をテープ基板でとり、シリコン
ダイヤフラム上の拡散抵抗形成面とセンサーへの
圧力印加方向とが相向き合わないようシリコンダ
イヤフラムを反転して設置したことを特徴とする
半導体圧力センサーの実装構造。 A semiconductor pressure sensor consisting of a silicon diaphragm with at least a bridge formed by a diffused resistance, a pedestal integrated with the silicon diaphragm, an outer frame, and a sensor input/output terminal for connecting the sensor to an external circuit, the pedestal and The integrated silicon diaphragm and sensor input/output terminals are electrically connected using a tape substrate, and the silicon diaphragm is installed upside down so that the diffused resistance forming surface on the silicon diaphragm and the direction of pressure application to the sensor do not face each other. A mounting structure of a semiconductor pressure sensor characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6784286U JPS62180738U (en) | 1986-05-06 | 1986-05-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6784286U JPS62180738U (en) | 1986-05-06 | 1986-05-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62180738U true JPS62180738U (en) | 1987-11-17 |
Family
ID=30907112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6784286U Pending JPS62180738U (en) | 1986-05-06 | 1986-05-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62180738U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015068800A (en) * | 2013-09-30 | 2015-04-13 | セイコーエプソン株式会社 | Pressure sensor, electronic device, and mobile body |
| JP2015513090A (en) * | 2012-03-09 | 2015-04-30 | エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ | Micromechanical measuring element and manufacturing method of micromechanical measuring element |
-
1986
- 1986-05-06 JP JP6784286U patent/JPS62180738U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015513090A (en) * | 2012-03-09 | 2015-04-30 | エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ | Micromechanical measuring element and manufacturing method of micromechanical measuring element |
| US9506831B2 (en) | 2012-03-09 | 2016-11-29 | Epcos Ag | Micromechanical measuring element and method for producing a micromechanical measuring element |
| JP2015068800A (en) * | 2013-09-30 | 2015-04-13 | セイコーエプソン株式会社 | Pressure sensor, electronic device, and mobile body |
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