JPS6430536U - - Google Patents

Info

Publication number
JPS6430536U
JPS6430536U JP1987124927U JP12492787U JPS6430536U JP S6430536 U JPS6430536 U JP S6430536U JP 1987124927 U JP1987124927 U JP 1987124927U JP 12492787 U JP12492787 U JP 12492787U JP S6430536 U JPS6430536 U JP S6430536U
Authority
JP
Japan
Prior art keywords
display
solder
semiconductor chip
alignment film
connection electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987124927U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987124927U priority Critical patent/JPS6430536U/ja
Publication of JPS6430536U publication Critical patent/JPS6430536U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/38—Effects and problems related to the device integration
    • H01L2924/384—Bump effects
    • H01L2924/3841—Solder bridging

Landscapes

  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例を示す断面図である。 １は表示用基板、２は表示領域、３は半導体チ
ツプ、４は実装領域、５は透明電極、６は配向膜
、７は導線、８は接続電極、９は半田バンプ、１
０は半田流出防止膜。 FIG. 1 is a sectional view showing an embodiment of the present invention. 1 is a display substrate, 2 is a display area, 3 is a semiconductor chip, 4 is a mounting area, 5 is a transparent electrode, 6 is an alignment film, 7 is a conductive wire, 8 is a connection electrode, 9 is a solder bump, 1
0 is a solder leakage prevention film.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表示用透明基板上に表示パターンを形成するた
めの表示領域と少なくとも１個以上の半導体チツ
プを固着するための複数の接続電極が形成された
実装領域とを備え、前記実装領域上の前記接続電
極に前記半導体チツプの半田バンプ電極がフエイ
スダウンボンデイング接続された表示用基板にお
いて、前記半導体チツプが固着される前記接続電
極の周囲を前記表示領域上に設けられる配向膜で
覆い前記配向膜を前記半田バンプ電極から流出す
る半田をせき止める半田流出防止膜とすることを
特徴とする表示用基板。 A display area for forming a display pattern on a display transparent substrate and a mounting area in which a plurality of connection electrodes for fixing at least one semiconductor chip are formed, and the connection electrode on the mounting area. In a display substrate to which solder bump electrodes of the semiconductor chip are connected by face-down bonding, the periphery of the connection electrode to which the semiconductor chip is fixed is covered with an alignment film provided on the display area, and the alignment film is bonded to the solder. A display substrate characterized by having a solder flow prevention film that dams up solder flowing out from bump electrodes.
JP1987124927U 1987-08-17 1987-08-17 Pending JPS6430536U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987124927U JPS6430536U (en) 1987-08-17 1987-08-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987124927U JPS6430536U (en) 1987-08-17 1987-08-17

Publications (1)

Publication Number Publication Date
JPS6430536U true JPS6430536U (en) 1989-02-23

Family

ID=31375079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987124927U Pending JPS6430536U (en) 1987-08-17 1987-08-17

Country Status (1)

Country Link
JP (1) JPS6430536U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6111132B2 (en) * 1979-08-07 1986-04-01 Kotobuki Sangyo

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6111132B2 (en) * 1979-08-07 1986-04-01 Kotobuki Sangyo

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