JPS647626A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS647626A JPS647626A JP16125187A JP16125187A JPS647626A JP S647626 A JPS647626 A JP S647626A JP 16125187 A JP16125187 A JP 16125187A JP 16125187 A JP16125187 A JP 16125187A JP S647626 A JPS647626 A JP S647626A
- Authority
- JP
- Japan
- Prior art keywords
- island
- wall
- lead frame
- chip
- peripheral edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To prevent a chip from being placed on an island in an extending and displacing state and to improve reliability by forming a wall protruding on an island surface on the peripheral edge of the island formed on a lead frame. CONSTITUTION:In a semiconductor device in which a semiconductor element chip is placed on an island 1 formed on a lead frame, a wall 3 protruding on the surface of an island 1 is formed on the peripheral edge of the island 1. For example, the island 1 formed as part of the lead frame is formed substantially in a rectangular shape, and the wall 3 protruding upward from the upper face of the island 1 is integrally formed with the peripheral edge. The wall 3 is formed by simultaneously bending the lead frame by pressing. The height of the wall 3 is formed to be larger than the thickness of an adhesive or eutectic metal in case of placing the chip, so that the wall 3 is high enough to contact the side face of the chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16125187A JPS647626A (en) | 1987-06-30 | 1987-06-30 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16125187A JPS647626A (en) | 1987-06-30 | 1987-06-30 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS647626A true JPS647626A (en) | 1989-01-11 |
Family
ID=15731532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16125187A Pending JPS647626A (en) | 1987-06-30 | 1987-06-30 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS647626A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0582084A2 (en) * | 1992-08-06 | 1994-02-09 | Motorola, Inc. | Semiconductor leadframe and package |
EP1552558A1 (en) * | 2002-10-09 | 2005-07-13 | Micronas GmbH | Support device for monolithically integrated circuits |
-
1987
- 1987-06-30 JP JP16125187A patent/JPS647626A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0582084A2 (en) * | 1992-08-06 | 1994-02-09 | Motorola, Inc. | Semiconductor leadframe and package |
EP0582084A3 (en) * | 1992-08-06 | 1994-07-27 | Motorola Inc | Semiconductor leadframe and package |
EP1552558A1 (en) * | 2002-10-09 | 2005-07-13 | Micronas GmbH | Support device for monolithically integrated circuits |
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