JPS553610A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS553610A
JPS553610A JP7419278A JP7419278A JPS553610A JP S553610 A JPS553610 A JP S553610A JP 7419278 A JP7419278 A JP 7419278A JP 7419278 A JP7419278 A JP 7419278A JP S553610 A JPS553610 A JP S553610A
Authority
JP
Japan
Prior art keywords
package
leads
base
ceramic
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7419278A
Other languages
Japanese (ja)
Inventor
Eiji Yamamoto
Wahei Kitamura
Hiroshi Tsuneno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7419278A priority Critical patent/JPS553610A/en
Publication of JPS553610A publication Critical patent/JPS553610A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To requlate the mounting position of leads, installed at the four corners on a ceramic package, in the level direction of the package by providing the leads with projections which engage the bottom surface of package.
CONSTITUTION: The ceramic package 10 is composed of a ceramic base 12, a ceramic frame 13 stacked on the base 12, and a cap 14 put on the frame 13. In this case, a large number of metalized layers 18 extending from the side to the bottom surfaces through the underneath of the frame 13 are disposed on the upper surface of base 12, and a semiconductor IC chip 22 is secured to a recess at the center of base 12 through the metalized layer 20. In the next step, respective electrodes on the chip 22 are coupled to the metalized layer 18 by use of bonding wires 26 and secured in a line at the side of package to the corresponding leads. In this constitution, the leads 16AW16D are provided with positioning projections 16b which, through punched holes 16a, can engage the bottom surface of package, thus accuring that the leads can be aligned in the level direction.
COPYRIGHT: (C)1980,JPO&Japio
JP7419278A 1978-06-21 1978-06-21 Semiconductor device Pending JPS553610A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7419278A JPS553610A (en) 1978-06-21 1978-06-21 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7419278A JPS553610A (en) 1978-06-21 1978-06-21 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS553610A true JPS553610A (en) 1980-01-11

Family

ID=13540057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7419278A Pending JPS553610A (en) 1978-06-21 1978-06-21 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS553610A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5810478U (en) * 1981-07-09 1983-01-22 日本電気株式会社 display panel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5810478U (en) * 1981-07-09 1983-01-22 日本電気株式会社 display panel

Similar Documents

Publication Publication Date Title
JPS641269A (en) Semiconductor device
JPS5563840A (en) Semiconductor integrated device
JPS5619639A (en) Semiconductor device
EP0399881A3 (en) Semiconductor device having two conductor layers and production method thereof
JPS553610A (en) Semiconductor device
EP0338213A3 (en) Semiconductor device with a metal package
JPS57107059A (en) Semiconductor package
JPS56148857A (en) Semiconductor device
JPS55165661A (en) Semiconductor device
CA2017080A1 (en) Semiconductor device package structure
JPS5887340U (en) Semiconductor device manufacturing equipment
JPS5290268A (en) Semiconductor device
JPS6361150U (en)
JPS5640268A (en) Semiconductor device
JPS593549U (en) semiconductor equipment
JPS53110371A (en) Ceramic package type semiconductor device
EP0081419A3 (en) High lead count hermetic mass bond integrated circuit carrier
JPS5561044A (en) Packaging device for semiconductor integrated circuit
JPS5354469A (en) Semiconductor integrated circuit
JPS6041728Y2 (en) semiconductor equipment
JPS55145360A (en) Semiconductor device
JPS5679455A (en) Semiconductor device
JPS5596658A (en) Semiconductor container
JPS5380182A (en) Semiconductor device
JPS57103322A (en) Sealing case for semiconductor device