JPS5561044A - Packaging device for semiconductor integrated circuit - Google Patents
Packaging device for semiconductor integrated circuitInfo
- Publication number
- JPS5561044A JPS5561044A JP13416178A JP13416178A JPS5561044A JP S5561044 A JPS5561044 A JP S5561044A JP 13416178 A JP13416178 A JP 13416178A JP 13416178 A JP13416178 A JP 13416178A JP S5561044 A JPS5561044 A JP S5561044A
- Authority
- JP
- Japan
- Prior art keywords
- terminal legs
- layer package
- 19aw19c
- constitution
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To package circuit block packages mounted with an IC in high density by building them up to integral junction and installing on a given position of a printed substrate.
CONSTITUTION: IC chips 16aW16c are mounted on holding parts 15aW15c for insulated substrates 14aW14c, terminals 17aW17c for wiring pattern and electrodes on each chip are connected with metallic wires 18aW18c and drawn out to terminal legs 19aW19c on the outside of substrates. The terminal legs are bent without coming in contact with each other, circuit block packages 13aW13c are built up, a chip holding part of the lowermost layer package is covered and sealed with the intermediate layer package, and the uppermost layer package is sealed with a cover 20. The three layers are junctioned integrally, the terminal legs 19aW19c are inserted and so connected in through holes 12aW12c on the printed substrate 11 respectively. This constitution may ensure a high density of packaging.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13416178A JPS5561044A (en) | 1978-10-30 | 1978-10-30 | Packaging device for semiconductor integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13416178A JPS5561044A (en) | 1978-10-30 | 1978-10-30 | Packaging device for semiconductor integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5561044A true JPS5561044A (en) | 1980-05-08 |
Family
ID=15121876
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13416178A Pending JPS5561044A (en) | 1978-10-30 | 1978-10-30 | Packaging device for semiconductor integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5561044A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4441119A (en) * | 1981-01-15 | 1984-04-03 | Mostek Corporation | Integrated circuit package |
US4682207A (en) * | 1982-03-17 | 1987-07-21 | Fujitsu Limited | Semiconductor device including leadless packages and a base plate for mounting the leadless packages |
US5754408A (en) * | 1995-11-29 | 1998-05-19 | Mitsubishi Semiconductor America, Inc. | Stackable double-density integrated circuit assemblies |
-
1978
- 1978-10-30 JP JP13416178A patent/JPS5561044A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4441119A (en) * | 1981-01-15 | 1984-04-03 | Mostek Corporation | Integrated circuit package |
US4682207A (en) * | 1982-03-17 | 1987-07-21 | Fujitsu Limited | Semiconductor device including leadless packages and a base plate for mounting the leadless packages |
US5754408A (en) * | 1995-11-29 | 1998-05-19 | Mitsubishi Semiconductor America, Inc. | Stackable double-density integrated circuit assemblies |
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