JPS5561044A - Packaging device for semiconductor integrated circuit - Google Patents

Packaging device for semiconductor integrated circuit

Info

Publication number
JPS5561044A
JPS5561044A JP13416178A JP13416178A JPS5561044A JP S5561044 A JPS5561044 A JP S5561044A JP 13416178 A JP13416178 A JP 13416178A JP 13416178 A JP13416178 A JP 13416178A JP S5561044 A JPS5561044 A JP S5561044A
Authority
JP
Japan
Prior art keywords
terminal legs
layer package
19aw19c
constitution
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13416178A
Other languages
Japanese (ja)
Inventor
Muneo Hatta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13416178A priority Critical patent/JPS5561044A/en
Publication of JPS5561044A publication Critical patent/JPS5561044A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To package circuit block packages mounted with an IC in high density by building them up to integral junction and installing on a given position of a printed substrate.
CONSTITUTION: IC chips 16aW16c are mounted on holding parts 15aW15c for insulated substrates 14aW14c, terminals 17aW17c for wiring pattern and electrodes on each chip are connected with metallic wires 18aW18c and drawn out to terminal legs 19aW19c on the outside of substrates. The terminal legs are bent without coming in contact with each other, circuit block packages 13aW13c are built up, a chip holding part of the lowermost layer package is covered and sealed with the intermediate layer package, and the uppermost layer package is sealed with a cover 20. The three layers are junctioned integrally, the terminal legs 19aW19c are inserted and so connected in through holes 12aW12c on the printed substrate 11 respectively. This constitution may ensure a high density of packaging.
COPYRIGHT: (C)1980,JPO&Japio
JP13416178A 1978-10-30 1978-10-30 Packaging device for semiconductor integrated circuit Pending JPS5561044A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13416178A JPS5561044A (en) 1978-10-30 1978-10-30 Packaging device for semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13416178A JPS5561044A (en) 1978-10-30 1978-10-30 Packaging device for semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS5561044A true JPS5561044A (en) 1980-05-08

Family

ID=15121876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13416178A Pending JPS5561044A (en) 1978-10-30 1978-10-30 Packaging device for semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS5561044A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4441119A (en) * 1981-01-15 1984-04-03 Mostek Corporation Integrated circuit package
US4682207A (en) * 1982-03-17 1987-07-21 Fujitsu Limited Semiconductor device including leadless packages and a base plate for mounting the leadless packages
US5754408A (en) * 1995-11-29 1998-05-19 Mitsubishi Semiconductor America, Inc. Stackable double-density integrated circuit assemblies

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4441119A (en) * 1981-01-15 1984-04-03 Mostek Corporation Integrated circuit package
US4682207A (en) * 1982-03-17 1987-07-21 Fujitsu Limited Semiconductor device including leadless packages and a base plate for mounting the leadless packages
US5754408A (en) * 1995-11-29 1998-05-19 Mitsubishi Semiconductor America, Inc. Stackable double-density integrated circuit assemblies

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