JPS57176752A - Brazing material and semiconductor device using the same - Google Patents

Brazing material and semiconductor device using the same

Info

Publication number
JPS57176752A
JPS57176752A JP6120781A JP6120781A JPS57176752A JP S57176752 A JPS57176752 A JP S57176752A JP 6120781 A JP6120781 A JP 6120781A JP 6120781 A JP6120781 A JP 6120781A JP S57176752 A JPS57176752 A JP S57176752A
Authority
JP
Japan
Prior art keywords
semiconductor device
brazing material
bonded
same
reliability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6120781A
Other languages
Japanese (ja)
Inventor
Yoshiaki Kawai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6120781A priority Critical patent/JPS57176752A/en
Publication of JPS57176752A publication Critical patent/JPS57176752A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To enhance the reliability of a semiconductor device by employing silver solder containing platinum as a brazing material for bonding a connector to a member to be connected. CONSTITUTION:A metallized layer 2 is formed on a base 6 of a ceramic plate, a semiconductor pellet 7 is mounted on the layer, a lead 5 is bonded with silver solder 9 containing approx. 1% of platinum, a package 12 is bonded with adhesive 11, and the pellet or the like is sealed. In this manner, metal can be rigidly bonded inexpensively to an oxide, thereby improving the reliability and reducing the production cost.
JP6120781A 1981-04-24 1981-04-24 Brazing material and semiconductor device using the same Pending JPS57176752A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6120781A JPS57176752A (en) 1981-04-24 1981-04-24 Brazing material and semiconductor device using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6120781A JPS57176752A (en) 1981-04-24 1981-04-24 Brazing material and semiconductor device using the same

Publications (1)

Publication Number Publication Date
JPS57176752A true JPS57176752A (en) 1982-10-30

Family

ID=13164507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6120781A Pending JPS57176752A (en) 1981-04-24 1981-04-24 Brazing material and semiconductor device using the same

Country Status (1)

Country Link
JP (1) JPS57176752A (en)

Similar Documents

Publication Publication Date Title
EP0977251A4 (en) Resin sealed semiconductor device and method for manufacturing the same
ES8707030A1 (en) Solder-bearing terminal.
JPS55111151A (en) Integrated circuit device
JPS57176752A (en) Brazing material and semiconductor device using the same
GB1398578A (en) Laminated lead frame
IE821840L (en) Silver filled glass
JPS5772336A (en) Semiconductor device
JPS55166941A (en) Semiconductor device
EP0081419A3 (en) High lead count hermetic mass bond integrated circuit carrier
JPS5567179A (en) Luminous display device
JPS54114975A (en) Semiconductor device
JPS575341A (en) Semiconductor device
JPS54102971A (en) Semiconductor device
JPS54102969A (en) Semiconductor device
JPS57121239A (en) Semiconductor device
SE7415064L (en)
JPS5790992A (en) Semiconductor laser device
JPS5742133A (en) Semiconductor device
JPS57165275A (en) Thermal head device
JPS6489356A (en) Hybrid integrated circuit
JPS57120352A (en) Semiconductor device
JPS5730354A (en) Enclosure for semiconductor device
JPS5758341A (en) Electronic parts with multiple metallayers
JPS57201053A (en) Sealing method for semiconductor device
JPS5732660A (en) Semiconductor device