JPS57176752A - Brazing material and semiconductor device using the same - Google Patents
Brazing material and semiconductor device using the sameInfo
- Publication number
- JPS57176752A JPS57176752A JP6120781A JP6120781A JPS57176752A JP S57176752 A JPS57176752 A JP S57176752A JP 6120781 A JP6120781 A JP 6120781A JP 6120781 A JP6120781 A JP 6120781A JP S57176752 A JPS57176752 A JP S57176752A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- brazing material
- bonded
- same
- reliability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To enhance the reliability of a semiconductor device by employing silver solder containing platinum as a brazing material for bonding a connector to a member to be connected. CONSTITUTION:A metallized layer 2 is formed on a base 6 of a ceramic plate, a semiconductor pellet 7 is mounted on the layer, a lead 5 is bonded with silver solder 9 containing approx. 1% of platinum, a package 12 is bonded with adhesive 11, and the pellet or the like is sealed. In this manner, metal can be rigidly bonded inexpensively to an oxide, thereby improving the reliability and reducing the production cost.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6120781A JPS57176752A (en) | 1981-04-24 | 1981-04-24 | Brazing material and semiconductor device using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6120781A JPS57176752A (en) | 1981-04-24 | 1981-04-24 | Brazing material and semiconductor device using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57176752A true JPS57176752A (en) | 1982-10-30 |
Family
ID=13164507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6120781A Pending JPS57176752A (en) | 1981-04-24 | 1981-04-24 | Brazing material and semiconductor device using the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57176752A (en) |
-
1981
- 1981-04-24 JP JP6120781A patent/JPS57176752A/en active Pending
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