JPS57201053A - Sealing method for semiconductor device - Google Patents

Sealing method for semiconductor device

Info

Publication number
JPS57201053A
JPS57201053A JP56086224A JP8622481A JPS57201053A JP S57201053 A JPS57201053 A JP S57201053A JP 56086224 A JP56086224 A JP 56086224A JP 8622481 A JP8622481 A JP 8622481A JP S57201053 A JPS57201053 A JP S57201053A
Authority
JP
Japan
Prior art keywords
substrate
semiconductor device
sealing method
sealing
resin substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56086224A
Other languages
Japanese (ja)
Inventor
Takao Mikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIHON DENKI AISHII MAIKON SYSTEM KK
NEC IC Microcomputer Systems Co Ltd
Original Assignee
NIHON DENKI AISHII MAIKON SYSTEM KK
NEC IC Microcomputer Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIHON DENKI AISHII MAIKON SYSTEM KK, NEC IC Microcomputer Systems Co Ltd filed Critical NIHON DENKI AISHII MAIKON SYSTEM KK
Priority to JP56086224A priority Critical patent/JPS57201053A/en
Publication of JPS57201053A publication Critical patent/JPS57201053A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To perform mass production and cost reduction of sealing a semiconductor element by bonding another circuit resin substrate to a substrate which carries the element and sealing them. CONSTITUTION:A semiconductor element 21 is placed on a circuit resin substrate 21, a circuit resin substrate 23 coated with an adhesive 24 is placed on the substrate 21 an die bonded to the substrate, and is sealed. In this manner, the element can be sealed in a mass production and the cost is reduced.
JP56086224A 1981-06-04 1981-06-04 Sealing method for semiconductor device Pending JPS57201053A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56086224A JPS57201053A (en) 1981-06-04 1981-06-04 Sealing method for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56086224A JPS57201053A (en) 1981-06-04 1981-06-04 Sealing method for semiconductor device

Publications (1)

Publication Number Publication Date
JPS57201053A true JPS57201053A (en) 1982-12-09

Family

ID=13880812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56086224A Pending JPS57201053A (en) 1981-06-04 1981-06-04 Sealing method for semiconductor device

Country Status (1)

Country Link
JP (1) JPS57201053A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5801074A (en) * 1996-02-20 1998-09-01 Kim; Jong Tae Method of making an air tight cavity in an assembly package

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5117669A (en) * 1974-08-05 1976-02-12 Matsushita Electric Ind Co Ltd HANDOTA ISOCHI

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5117669A (en) * 1974-08-05 1976-02-12 Matsushita Electric Ind Co Ltd HANDOTA ISOCHI

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5801074A (en) * 1996-02-20 1998-09-01 Kim; Jong Tae Method of making an air tight cavity in an assembly package

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