JPS57208149A - Resin-sealed type semiconductor device - Google Patents

Resin-sealed type semiconductor device

Info

Publication number
JPS57208149A
JPS57208149A JP9495281A JP9495281A JPS57208149A JP S57208149 A JPS57208149 A JP S57208149A JP 9495281 A JP9495281 A JP 9495281A JP 9495281 A JP9495281 A JP 9495281A JP S57208149 A JPS57208149 A JP S57208149A
Authority
JP
Japan
Prior art keywords
resin
substrate
periphery
stopper
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9495281A
Other languages
Japanese (ja)
Inventor
Hideo Sakane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9495281A priority Critical patent/JPS57208149A/en
Publication of JPS57208149A publication Critical patent/JPS57208149A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To reduce the internal stress of a semiconductor device due to a thermal stress by sealing between the periphery of a semiconductor substrate and the substrate, thereby providing resin stopper for preventing the resin for forming a resin sealing layer from entering the gap between a semiconductor chip and the substrate. CONSTITUTION:A resin stopper 5 surrounds the periphery of a semiconductor substrate 11, bonds the periphery of the substrate 11 to a substrate 2, and prevents the sealing resin from entering the gap 4 between a semiconductor chip 1 and the substrate 2. This stopper 5 is performed by fixing the periphery of the substrate 11 by the use of an epoxy resin bonding sheet of a B stage. Since the stopper 5 prevents the resin for forming a resin sealing layer 3 from entering the gap 4 between the chip 1 and the substrate 2 in this manner, the internal stress due to the thermal stress based on the difference of thermal expansion coefficients between the material of the chip 1 and the resin for forming the layer 3 can be reduced.
JP9495281A 1981-06-18 1981-06-18 Resin-sealed type semiconductor device Pending JPS57208149A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9495281A JPS57208149A (en) 1981-06-18 1981-06-18 Resin-sealed type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9495281A JPS57208149A (en) 1981-06-18 1981-06-18 Resin-sealed type semiconductor device

Publications (1)

Publication Number Publication Date
JPS57208149A true JPS57208149A (en) 1982-12-21

Family

ID=14124273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9495281A Pending JPS57208149A (en) 1981-06-18 1981-06-18 Resin-sealed type semiconductor device

Country Status (1)

Country Link
JP (1) JPS57208149A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61177738A (en) * 1985-01-28 1986-08-09 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Mutual connection body
JP2015099993A (en) * 2013-11-18 2015-05-28 ミツミ電機株式会社 Electronic component module and manufacturing method of the same
CN110072347A (en) * 2019-04-09 2019-07-30 南昌嘉研科技有限公司 A kind of safeguard structure and its processing method of chip bga

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61177738A (en) * 1985-01-28 1986-08-09 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Mutual connection body
JPH0222541B2 (en) * 1985-01-28 1990-05-18 Intaanashonaru Bijinesu Mashiinzu Corp
JP2015099993A (en) * 2013-11-18 2015-05-28 ミツミ電機株式会社 Electronic component module and manufacturing method of the same
CN110072347A (en) * 2019-04-09 2019-07-30 南昌嘉研科技有限公司 A kind of safeguard structure and its processing method of chip bga

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