JPS57114259A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57114259A
JPS57114259A JP100581A JP100581A JPS57114259A JP S57114259 A JPS57114259 A JP S57114259A JP 100581 A JP100581 A JP 100581A JP 100581 A JP100581 A JP 100581A JP S57114259 A JPS57114259 A JP S57114259A
Authority
JP
Japan
Prior art keywords
resin
film
pads
silicone
moisture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP100581A
Other languages
Japanese (ja)
Inventor
Takashi Okuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP100581A priority Critical patent/JPS57114259A/en
Publication of JPS57114259A publication Critical patent/JPS57114259A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent the erroneous operation of a semiconductor device due to alpha-particles emitted from resin and the corrosion of a metallic wire due to moisture by covering the surface of a semiconductor element with resin film such as silicone and polyimide or the like. CONSTITUTION:The overall surface of a semiconductor element 1 is covered with silicone resin in a thickness of 30-100mum. The silicone resin of the periphery including bonding pads 2, 3 is removed by using photoresist, and a silicone resin film 10 is formed. Further, a polyimide film may be formed on the film 0, and epoxy resin 9 is used to eventually seal the entirety. In this manner, an accident due to the difference of the hardness and the thermal expansion of the resin in the pads can be prevented, and an accident due to the entrance of radiation or moisture to the pads can also be eliminated.
JP100581A 1981-01-07 1981-01-07 Semiconductor device Pending JPS57114259A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP100581A JPS57114259A (en) 1981-01-07 1981-01-07 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP100581A JPS57114259A (en) 1981-01-07 1981-01-07 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57114259A true JPS57114259A (en) 1982-07-16

Family

ID=11489459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP100581A Pending JPS57114259A (en) 1981-01-07 1981-01-07 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57114259A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5987840A (en) * 1982-11-10 1984-05-21 Toray Silicone Co Ltd Semiconductor device
WO2016150582A1 (en) * 2015-03-20 2016-09-29 Robert Bosch Gmbh Electronics module comprising alpha-radiation protection for a transmission control unit and transmission control unit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5987840A (en) * 1982-11-10 1984-05-21 Toray Silicone Co Ltd Semiconductor device
WO1984002036A1 (en) * 1982-11-10 1984-05-24 Toray Silicone Co Semiconductor device
JPS6314499B2 (en) * 1982-11-10 1988-03-31 Toray Silicone Co
WO2016150582A1 (en) * 2015-03-20 2016-09-29 Robert Bosch Gmbh Electronics module comprising alpha-radiation protection for a transmission control unit and transmission control unit
CN107637186A (en) * 2015-03-20 2018-01-26 罗伯特·博世有限公司 Electronic apparatus module and transmission control units with the alpha ray protection for transmission control units

Similar Documents

Publication Publication Date Title
JPS56150830A (en) Semiconductor device
JPS57114259A (en) Semiconductor device
JPS5211767A (en) Semiconductor device
JPS5272572A (en) Semiconductor device
JPS554917A (en) Resin-enclosed semi-conductor device
JPS533165A (en) Wire bonding apparatus
JPS5739557A (en) Semiconductor device
JPS57210646A (en) Resin-sealed semiconductor device
JPS5710951A (en) Semiconductor device
JPS56165341A (en) Semiconductor device
JPS57211259A (en) Semiconductor device
JPS5414676A (en) Carrier tape and electronic parts using it
JPS56148852A (en) Semiconductor device
JPS54974A (en) Manufacture for semiconductor device
JPS53101980A (en) Semiconductor device
JPS5411690A (en) Semiconductor laser unit
JPS53117970A (en) Resin seal type semiconductor device
JPS5723254A (en) Semiconductor device
JPS5280780A (en) Semiconductor device
GB2000640A (en) Semiconductor device
JPS5571051A (en) Semiconductor device
JPS56125849A (en) Semiconductor device
JPS6469038A (en) Resin-sealed semiconductor device
JPS5598875A (en) Semiconductor device with photocell
JPS54578A (en) Resin seal semiconductor device