JPS57211259A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57211259A
JPS57211259A JP9689781A JP9689781A JPS57211259A JP S57211259 A JPS57211259 A JP S57211259A JP 9689781 A JP9689781 A JP 9689781A JP 9689781 A JP9689781 A JP 9689781A JP S57211259 A JPS57211259 A JP S57211259A
Authority
JP
Japan
Prior art keywords
resin
groove
heat radiation
fin
lead pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9689781A
Other languages
Japanese (ja)
Inventor
Iwao Yamazaki
Shigeki Takeo
Yoshio Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9689781A priority Critical patent/JPS57211259A/en
Publication of JPS57211259A publication Critical patent/JPS57211259A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To contrive the improvement in characteristics of heat radiation for the titled device by a method wherein a groove or a concaved part is provided at the prescribed position on the surface of molded resin, and a heat radiation fin is buried therein. CONSTITUTION:The groove 203 is provided in the direction of column of a lead pin 202 almost in the center part on the upper surface of the epoxy resin 201 wherein IC is enveloped, and the heat radiation fin 204 such as Al and the like is adhered to the groove 203. The internally generated heat is also radiated from the fin 204 in addition to a lead pin 202, the device is operated in a stabilized state, a gap is not generated between the resin and the pin, no crack develops in the resin, and high reliability can be secured. The fins may be formed on both sides of the surface of the resin or at the circular concave section and the like.
JP9689781A 1981-06-23 1981-06-23 Semiconductor device Pending JPS57211259A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9689781A JPS57211259A (en) 1981-06-23 1981-06-23 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9689781A JPS57211259A (en) 1981-06-23 1981-06-23 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57211259A true JPS57211259A (en) 1982-12-25

Family

ID=14177160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9689781A Pending JPS57211259A (en) 1981-06-23 1981-06-23 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57211259A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216283A (en) * 1990-05-03 1993-06-01 Motorola, Inc. Semiconductor device having an insertable heat sink and method for mounting the same
US5563773A (en) * 1991-11-15 1996-10-08 Kabushiki Kaisha Toshiba Semiconductor module having multiple insulation and wiring layers
US7273769B1 (en) * 2000-08-16 2007-09-25 Micron Technology, Inc. Method and apparatus for removing encapsulating material from a packaged microelectronic device
EP2166568A3 (en) * 2008-09-19 2010-10-06 Vestel Elektronik Sanayi ve Ticaret A.S. An integrated circuit

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216283A (en) * 1990-05-03 1993-06-01 Motorola, Inc. Semiconductor device having an insertable heat sink and method for mounting the same
US5563773A (en) * 1991-11-15 1996-10-08 Kabushiki Kaisha Toshiba Semiconductor module having multiple insulation and wiring layers
US7273769B1 (en) * 2000-08-16 2007-09-25 Micron Technology, Inc. Method and apparatus for removing encapsulating material from a packaged microelectronic device
EP2166568A3 (en) * 2008-09-19 2010-10-06 Vestel Elektronik Sanayi ve Ticaret A.S. An integrated circuit

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