JPS54113251A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS54113251A JPS54113251A JP1980578A JP1980578A JPS54113251A JP S54113251 A JPS54113251 A JP S54113251A JP 1980578 A JP1980578 A JP 1980578A JP 1980578 A JP1980578 A JP 1980578A JP S54113251 A JPS54113251 A JP S54113251A
- Authority
- JP
- Japan
- Prior art keywords
- stem
- vise
- mold
- hole
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE:To improve a quality and a reliability of devices by providing a cut part in the side face part of the stem which is placed between a vise hole for heat sink fitting and a mold. CONSTITUTION:Two cut grooves 8 which have a U-shaped section are formed vertically and symmetrically in respect to one vise hole in the side face part of stem 1 which is placed between mold part 2 and vise hole 3. It is desirable that grooves 8 are provided at distance l within distance L from the tip of mold part 2 to the center of vise hole 3. As a result, in case of fitting to heat sink 7, stress is absorbed because of the existence of cut groove 8 and is prevented from being transferred to stem 12 of the mold part 2 side, so that stem 1b cannot be deformed, and element breakage cannot occur, and quality can be improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980578A JPS54113251A (en) | 1978-02-24 | 1978-02-24 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980578A JPS54113251A (en) | 1978-02-24 | 1978-02-24 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54113251A true JPS54113251A (en) | 1979-09-04 |
Family
ID=12009542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1980578A Pending JPS54113251A (en) | 1978-02-24 | 1978-02-24 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54113251A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59169052U (en) * | 1983-04-27 | 1984-11-12 | 新電元工業株式会社 | Resin-sealed electronic components |
US4712127A (en) * | 1982-12-01 | 1987-12-08 | Sgs-Ates Componenti Elettronici Spa | High reliability metal and resin container for a semiconductor device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5327909A (en) * | 1976-08-26 | 1978-03-15 | Westinghouse Air Brake Co | Emergency exhaust valve for brake pipe |
-
1978
- 1978-02-24 JP JP1980578A patent/JPS54113251A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5327909A (en) * | 1976-08-26 | 1978-03-15 | Westinghouse Air Brake Co | Emergency exhaust valve for brake pipe |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4712127A (en) * | 1982-12-01 | 1987-12-08 | Sgs-Ates Componenti Elettronici Spa | High reliability metal and resin container for a semiconductor device |
JPS59169052U (en) * | 1983-04-27 | 1984-11-12 | 新電元工業株式会社 | Resin-sealed electronic components |
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