JPS54113251A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54113251A
JPS54113251A JP1980578A JP1980578A JPS54113251A JP S54113251 A JPS54113251 A JP S54113251A JP 1980578 A JP1980578 A JP 1980578A JP 1980578 A JP1980578 A JP 1980578A JP S54113251 A JPS54113251 A JP S54113251A
Authority
JP
Japan
Prior art keywords
stem
vise
mold
hole
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1980578A
Other languages
Japanese (ja)
Inventor
Joga Imai
Satoru Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1980578A priority Critical patent/JPS54113251A/en
Publication of JPS54113251A publication Critical patent/JPS54113251A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve a quality and a reliability of devices by providing a cut part in the side face part of the stem which is placed between a vise hole for heat sink fitting and a mold. CONSTITUTION:Two cut grooves 8 which have a U-shaped section are formed vertically and symmetrically in respect to one vise hole in the side face part of stem 1 which is placed between mold part 2 and vise hole 3. It is desirable that grooves 8 are provided at distance l within distance L from the tip of mold part 2 to the center of vise hole 3. As a result, in case of fitting to heat sink 7, stress is absorbed because of the existence of cut groove 8 and is prevented from being transferred to stem 12 of the mold part 2 side, so that stem 1b cannot be deformed, and element breakage cannot occur, and quality can be improved.
JP1980578A 1978-02-24 1978-02-24 Semiconductor device Pending JPS54113251A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980578A JPS54113251A (en) 1978-02-24 1978-02-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980578A JPS54113251A (en) 1978-02-24 1978-02-24 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS54113251A true JPS54113251A (en) 1979-09-04

Family

ID=12009542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980578A Pending JPS54113251A (en) 1978-02-24 1978-02-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54113251A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59169052U (en) * 1983-04-27 1984-11-12 新電元工業株式会社 Resin-sealed electronic components
US4712127A (en) * 1982-12-01 1987-12-08 Sgs-Ates Componenti Elettronici Spa High reliability metal and resin container for a semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5327909A (en) * 1976-08-26 1978-03-15 Westinghouse Air Brake Co Emergency exhaust valve for brake pipe

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5327909A (en) * 1976-08-26 1978-03-15 Westinghouse Air Brake Co Emergency exhaust valve for brake pipe

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4712127A (en) * 1982-12-01 1987-12-08 Sgs-Ates Componenti Elettronici Spa High reliability metal and resin container for a semiconductor device
JPS59169052U (en) * 1983-04-27 1984-11-12 新電元工業株式会社 Resin-sealed electronic components

Similar Documents

Publication Publication Date Title
TW364194B (en) Downset exposed die mount pad lead frame and package
JPS5386576A (en) Package for semiconductor element
JPS54113251A (en) Semiconductor device
JPS55160449A (en) Semiconductor device
JPS57155757A (en) Semiconductor device
JPS57197844A (en) Semiconductor device
JPS5433665A (en) Manufacture for resin sealed type semiconductor device and resin sealed metal mold
JPS57211259A (en) Semiconductor device
JPS53142877A (en) Manufacture for compound semiconductor device
JPS51121272A (en) Manufacturing method for semiconductor devices
JPS6450454A (en) Manufacture of lead frame and semiconductor device
JPS542068A (en) Manufacture for semiconductor device
JPS55138243A (en) Semiconductor device
JPS5385160A (en) Production of semiconductor device
JPS55157247A (en) Lead frame for semiconductor element
JPS545391A (en) Manufacture of semiconductor device
JPS5460564A (en) Resin mold semiconductor device
JPS6457740A (en) Resin sealed type semiconductor device
JPS5310279A (en) Mesa type semiconductor device
JPS57197836A (en) Manufacture of semiconductor device
JPS54578A (en) Resin seal semiconductor device
JPS5291377A (en) Semiconductor device assembling tool
JPS57201034A (en) Wiring method for circuit element
JPS53110383A (en) Manufacture of semiconductor device
JPS57197841A (en) Manufacture of semiconductor device