JPS6457740A - Resin sealed type semiconductor device - Google Patents
Resin sealed type semiconductor deviceInfo
- Publication number
- JPS6457740A JPS6457740A JP21560087A JP21560087A JPS6457740A JP S6457740 A JPS6457740 A JP S6457740A JP 21560087 A JP21560087 A JP 21560087A JP 21560087 A JP21560087 A JP 21560087A JP S6457740 A JPS6457740 A JP S6457740A
- Authority
- JP
- Japan
- Prior art keywords
- island
- semiconductor device
- side faces
- lateral groove
- resin section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To increase dielectric strength between an island for a semiconductor device and a mounting plate fitted by forming lateral groove sections to both side faces of a resin section in the semiconductor device and shaping the cutting planes of island support sections to the bases of the lateral groove sections. CONSTITUTION:Supporter cutting planes 2a are exposed from the bases of lateral groove sections 5 in both side faces of a resin section 3 in island supporters 2. A chip is placed onto an island, the resin section 3 is shaped, and the lateral groove sections 5 are formed to the side faces of the resin section 3 in the opposite direction of leads 1 so that the side faces of the island supporters 2 are exposed. When a fixing screw is inserted into a mounting hole 4 in the resin section 3 and the resin body is packaged to a radiator, an insulating distance between the island supporter 2 and the head section of the fixing screw is lengthened.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21560087A JPS6457740A (en) | 1987-08-28 | 1987-08-28 | Resin sealed type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21560087A JPS6457740A (en) | 1987-08-28 | 1987-08-28 | Resin sealed type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6457740A true JPS6457740A (en) | 1989-03-06 |
Family
ID=16675114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21560087A Pending JPS6457740A (en) | 1987-08-28 | 1987-08-28 | Resin sealed type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6457740A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5682571A (en) * | 1995-07-20 | 1997-10-28 | Eastman Kodak Company | Recyclable camera |
-
1987
- 1987-08-28 JP JP21560087A patent/JPS6457740A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5682571A (en) * | 1995-07-20 | 1997-10-28 | Eastman Kodak Company | Recyclable camera |
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