JPS6457740A - Resin sealed type semiconductor device - Google Patents

Resin sealed type semiconductor device

Info

Publication number
JPS6457740A
JPS6457740A JP21560087A JP21560087A JPS6457740A JP S6457740 A JPS6457740 A JP S6457740A JP 21560087 A JP21560087 A JP 21560087A JP 21560087 A JP21560087 A JP 21560087A JP S6457740 A JPS6457740 A JP S6457740A
Authority
JP
Japan
Prior art keywords
island
semiconductor device
side faces
lateral groove
resin section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21560087A
Other languages
Japanese (ja)
Inventor
Yasuyoshi Nakao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP21560087A priority Critical patent/JPS6457740A/en
Publication of JPS6457740A publication Critical patent/JPS6457740A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To increase dielectric strength between an island for a semiconductor device and a mounting plate fitted by forming lateral groove sections to both side faces of a resin section in the semiconductor device and shaping the cutting planes of island support sections to the bases of the lateral groove sections. CONSTITUTION:Supporter cutting planes 2a are exposed from the bases of lateral groove sections 5 in both side faces of a resin section 3 in island supporters 2. A chip is placed onto an island, the resin section 3 is shaped, and the lateral groove sections 5 are formed to the side faces of the resin section 3 in the opposite direction of leads 1 so that the side faces of the island supporters 2 are exposed. When a fixing screw is inserted into a mounting hole 4 in the resin section 3 and the resin body is packaged to a radiator, an insulating distance between the island supporter 2 and the head section of the fixing screw is lengthened.
JP21560087A 1987-08-28 1987-08-28 Resin sealed type semiconductor device Pending JPS6457740A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21560087A JPS6457740A (en) 1987-08-28 1987-08-28 Resin sealed type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21560087A JPS6457740A (en) 1987-08-28 1987-08-28 Resin sealed type semiconductor device

Publications (1)

Publication Number Publication Date
JPS6457740A true JPS6457740A (en) 1989-03-06

Family

ID=16675114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21560087A Pending JPS6457740A (en) 1987-08-28 1987-08-28 Resin sealed type semiconductor device

Country Status (1)

Country Link
JP (1) JPS6457740A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5682571A (en) * 1995-07-20 1997-10-28 Eastman Kodak Company Recyclable camera

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5682571A (en) * 1995-07-20 1997-10-28 Eastman Kodak Company Recyclable camera

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