JPS57197836A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS57197836A
JPS57197836A JP8330481A JP8330481A JPS57197836A JP S57197836 A JPS57197836 A JP S57197836A JP 8330481 A JP8330481 A JP 8330481A JP 8330481 A JP8330481 A JP 8330481A JP S57197836 A JPS57197836 A JP S57197836A
Authority
JP
Japan
Prior art keywords
groove
heat treatment
chip
thermal strain
slip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8330481A
Other languages
Japanese (ja)
Inventor
Yuji Furumura
Mikio Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP8330481A priority Critical patent/JPS57197836A/en
Publication of JPS57197836A publication Critical patent/JPS57197836A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To keep the slip line due to thermal strain in a process of heat treatment in a groove to eliminate the thermal strain, by forming a groove along a chip cut line scheduled on a wafer prior to the heat treatment of the semiconductor wafer. CONSTITUTION:The groove 3 is formed along a cut line scheduled on the semiconductor wafer 100 for required heat treatment to cause only the thermal strain accompanied by heat treatment with slip line. These slip lines 1 are all generated in the groove by this groove 3 not on each chip. Thus, the yield and quality as a chip is improved.
JP8330481A 1981-05-29 1981-05-29 Manufacture of semiconductor device Pending JPS57197836A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8330481A JPS57197836A (en) 1981-05-29 1981-05-29 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8330481A JPS57197836A (en) 1981-05-29 1981-05-29 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS57197836A true JPS57197836A (en) 1982-12-04

Family

ID=13798665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8330481A Pending JPS57197836A (en) 1981-05-29 1981-05-29 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57197836A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61247017A (en) * 1985-04-24 1986-11-04 Mitsubishi Electric Corp Preparation of semiconductor device
JPH0529454A (en) * 1991-07-19 1993-02-05 Seikosha Co Ltd Manufacture of semiconductor integrated circuit chip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61247017A (en) * 1985-04-24 1986-11-04 Mitsubishi Electric Corp Preparation of semiconductor device
JPH0529454A (en) * 1991-07-19 1993-02-05 Seikosha Co Ltd Manufacture of semiconductor integrated circuit chip

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