JPS59169052U - Resin-sealed electronic components - Google Patents
Resin-sealed electronic componentsInfo
- Publication number
- JPS59169052U JPS59169052U JP6369983U JP6369983U JPS59169052U JP S59169052 U JPS59169052 U JP S59169052U JP 6369983 U JP6369983 U JP 6369983U JP 6369983 U JP6369983 U JP 6369983U JP S59169052 U JPS59169052 U JP S59169052U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- electronic components
- sealed electronic
- electronic component
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図a、 bは従来装置の平面図及び正面図、第2
図は従来装置の取付説明図、第3図a、 bは本案実
施例装置の平面図及び正面図、第4図は本案実施例装置
の取付説明図である。Figures 1a and b are a plan view and front view of the conventional device;
3A and 3B are plan views and front views of the apparatus according to the present invention, and FIG. 4 is an explanatory view showing the installation of the apparatus according to the present invention.
Claims (2)
が樹脂封止されてなる樹脂封止型電子部品において、前
記金属板の樹脂封止部と取付部との間の少なくとも一方
に変形部を設けたことを特徴とする樹脂封止型電子部品
。(1) In a resin-sealed electronic component in which a metal plate has mounting portions at both ends and an electronic component is resin-sealed in the middle portion, at least A resin-sealed electronic component characterized by having a deformable portion on one side.
請求の範囲第1項記載の樹脂型電子部品。(2) The resin-type electronic component according to claim 1, wherein the deformed portion is a groove.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6369983U JPS59169052U (en) | 1983-04-27 | 1983-04-27 | Resin-sealed electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6369983U JPS59169052U (en) | 1983-04-27 | 1983-04-27 | Resin-sealed electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59169052U true JPS59169052U (en) | 1984-11-12 |
Family
ID=30193881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6369983U Pending JPS59169052U (en) | 1983-04-27 | 1983-04-27 | Resin-sealed electronic components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59169052U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54113251A (en) * | 1978-02-24 | 1979-09-04 | Hitachi Ltd | Semiconductor device |
-
1983
- 1983-04-27 JP JP6369983U patent/JPS59169052U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54113251A (en) * | 1978-02-24 | 1979-09-04 | Hitachi Ltd | Semiconductor device |
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